WO2009043752A1 - Method and device for adjusting measuring probes - Google Patents

Method and device for adjusting measuring probes Download PDF

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Publication number
WO2009043752A1
WO2009043752A1 PCT/EP2008/062609 EP2008062609W WO2009043752A1 WO 2009043752 A1 WO2009043752 A1 WO 2009043752A1 EP 2008062609 W EP2008062609 W EP 2008062609W WO 2009043752 A1 WO2009043752 A1 WO 2009043752A1
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WIPO (PCT)
Prior art keywords
measuring
needles
optical sensor
measuring needle
needle
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Application number
PCT/EP2008/062609
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German (de)
French (fr)
Inventor
Detlef Gerhard
Original Assignee
Siemens Aktiengesellschaft
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Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to EP08804535A priority Critical patent/EP2193381A1/en
Publication of WO2009043752A1 publication Critical patent/WO2009043752A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Definitions

  • the invention relates to a method and a device for adjusting measuring needles for the precise and simultaneous contacting of electrically to be tested components by means of several measuring needle tips.
  • the object to be tested is contacted with the measuring needle tips of a measuring instrument and the measurement is started.
  • One application of the measurement method is the wafer test. On a wafer, for example, a plurality of semiconductor devices, the so-called chips applied. Each chip has measuring points for the electrical measurement, so-called pads.
  • the measuring needles are placed on the pads provided for this purpose and then the function of the electronic component is checked.
  • the wafer is raised in such a way that the measuring needles of the measuring system electrically contact the pads of the measuring object.
  • the measuring needles are positioned in relation to the chip position and to the position of the chip matrix in such a way that it is possible to contact all chips of the wafer without errors.
  • the invention is based on the object to provide an automatic method and apparatus for adjusting measuring needles for contacting electronic assemblies.
  • the invention is based on the finding that the position of measuring needle tips or in general a group of measuring needles at a specific predeterminable time before the actual test procedures or after inserting a new measuring needle spider with a plurality of measuring needles using a two-dimensional camera system and by means of at least one actuator is first detectable, a malposition is recognizable and tracking in an optimal position is feasible.
  • a test procedure for at least one test procedure is the
  • Group of measuring needles optimally positioned and aligned. Optimal means that the movable measuring needles with the corresponding measuring needle tips sit simultaneously on the surface to be tested.
  • the measuring needle tips are illuminated substantially incidentally below the measuring station with incident light and their image is generated after transmission with corresponding mirror units in a camera, analyzed and examined with regard to a rotatory see defacement around the Z-axis.
  • the Z-axis is perpendicular to the surface to be tested.
  • the measuring arrangement is aligned with the measuring needle tips such that the arrangement for multiple testing is adjusted so that the measuring needles simultaneously touch the surface to be tested.
  • a specific electronic component which is present for example on a wafer, briefly approached with the measuring needles, briefly contacted and electrically checked. The corresponding process is repeated for all components lying next to one another on the wafer.
  • FIG. 1 a measuring needle spider with a measuring needle ring, on which measuring needles are applied;
  • Figure 2 a measuring plate with rotatably mounted therein
  • FIG. 3 shows a measuring setup for measuring the rotation about the z-axis.
  • FIG. 1 shows a measuring needle spider 1, which consists of a metal connecting ring 2, which receives measuring needles 3, the measuring needles 3 with their measuring needle tips 4 projecting into the inner region of the ring and projecting downwards.
  • the measuring needle tips 4 are aligned in a predetermined mutual arrangement, in particular the measuring needle tips 4 are as possible on a straight line.
  • the coordinate system 8 of the measuring needles is indicated in Figure 1, wherein the Z M - axis is perpendicular to the image plane and X M , Y M axes are in the image plane.
  • FIG. 2 shows the measuring spider 1, which is accommodated in a so-called measuring needle card 6, the coordinate system 8 of the measuring needles being indicated accordingly by broken lines.
  • the measuring needle card 6 is received in a measuring plate 7, the coordinate system 9 is shown with the coordinates Xp and Yp in Figure 2.
  • the metal connection ring 2 can be twisted together with the measuring needle card 6 relative to the measuring plate 7, as shown in FIG. This means a misalignment of the measuring needles when measuring the chips.
  • FIG. 3 shows, in a side view, that the measuring plate 7 is oriented generally parallel to the workpiece carrier with a measuring object located thereon, for example a wafer 11.
  • FIG. 3 shows the overall measuring system, wherein a so-called measuring needle monitoring on the one hand monitors the system for rotational misalignments and thus takes into account data from a picture analysis.
  • the image analysis uses data from the optical sensor, in particular a two-dimensionally resolving camera 18, which is part of the optical sensor. Indicated is the coordinate system 8 of the measuring needles 3.
  • the object illumination happens here according to the reflected-light principle.
  • the optical sensor has a lighting 13, which the
  • Measuring needles 4 in the transmitted light system by means of a measuring beam 17 and a deflection mirror 14 in the camera 18.
  • the image analysis gives data regarding the check whether there is a twist or not.
  • a correction of the needles is made and achieved an accurate rotational alignment.
  • a two-dimensionally resolving CCD camera is used for optical imaging.
  • the illustration of the needles and their tips is done in the incident light principle.
  • a light source 13 illuminates the measuring needles 3 and their tips 4.
  • the light source can be operated by means of light-emitting diodes.
  • the chuck 12 is moved in such a way that the measuring needles are illuminated by means of the sensor according to the incident light principle and a rotation of a needle group occurs before the test procedure. Due to the automatic readjustment leave shorten the contact journeys during the inspection process. The chip surfaces and the measuring needles are less heavily loaded, resulting in the reduction of chip failures. Furthermore, the measuring needle wear is minimized.
  • the adjustment ranges are in the ⁇ m range.
  • At least one deflection mirror may be contained in the beam path of the optical sensor. Decisive for the parallel orientation is the surface, for example a wafer or an assembly.
  • a measuring needle spider 1 is supported on a measuring needle card 6 and the measuring needle card 6 is in turn mounted in a measuring plate 7.
  • the measuring needle spider 1 or the measuring needle card 6 is corrected in the rotational position.
  • a correction angle 15 for correcting an angle-related misalignment by means of an actuator 10 is taken into account in each case, so that in particular the measuring needle tips 4 are aligned in a coordinate system of the overall system in such a way that they can optimally be placed on components to be tested during test operations.
  • FIG. 3 shows the essential components of the optical sensor in the form of the illumination 13, an additional illumination 16 and 19, the camera 18 and the corresponding beam path 17, image processing being used for the adjustment of the measuring card 6 or of the measuring needle tips.
  • the optical sensor checks a malposition of the measuring needle tips, in particular below the measuring arrangement.
  • At least one deflecting mirror is used for imaging the measuring needle tips or larger parts of the measuring needles, which directly or indirectly is fixedly connected to the upper linear axis of the chuck drive is connected.
  • At least one deflection mirror can also be connected to the axis of rotation seated on the upper linear axis or to the chuck sitting thereon.
  • a deflecting mirror can alternatively be represented as a beam splitter. This allows additional illumination from another direction.
  • an additional light source which couples in via a deflecting mirror or beam splitter, is provided.
  • an optical sensor with integrated light source can also be used.
  • the gauge quality can be automatically assessed. Worn or damaged needles are detected in time. The electronic components are less burdened by these electrical testing operations.

Abstract

The invention relates to a method for automatically adjusting measuring probes (3) in relation to the surface of test samples, such as electronic components. Said measuring probes are driven in relation to the test sample in order to carry out electrical testing and after positioning and contacting carry out a corresponding electrical test. According to the method, the position of measuring probes (3) in a test system is identified by means of an optical sensor, an image processing operation identifies the incorrect positioning in terms of torsion of a group of measuring probes and if the incorrect positioning is substantial, a measuring probe spider (1) provided with several measuring probes is rotated into the correct position by means of an actuating mechanism (10).

Description

Beschreibungdescription
Verfahren und Vorrichtung zur Justierung von MessnadelnMethod and device for adjusting measuring needles
Die Erfindung betrifft ein Verfahren und eine Vorrichtung zur Justierung von Messnadeln zum genauen und gleichzeitigen Kontaktieren von elektrisch zu testenden Bauelementen mittels mehrerer Messnadelspitzen.The invention relates to a method and a device for adjusting measuring needles for the precise and simultaneous contacting of electrically to be tested components by means of several measuring needle tips.
Zum elektrischen Testen von Baugruppen, Chips auf Wafern oder sonstigen elektronischen Komponenten wird das zu testende Objekt mit den Messnadelspitzen eines Messinstrumentes kontaktiert und die Messung gestartet. Eine Anwendungsmöglichkeit des Messverfahrens ist der Wafer-Test. Auf einem Wafer sind beispielsweise mehrere Halbleiterbauelemente, die sogenannten Chips aufgebracht. Jeder Chip besitzt Messstellen für die elektrische Messung, sogenannte Pads . Beim elektrischen Wafer-Test werden die Messnadeln auf die hierfür vorgesehenen Pads aufgesetzt und anschließend wird die Funktion des elekt- ronischen Bauteils geprüft. Zum Kontaktieren wird der Wafer derart angehoben, dass die Messnadeln des Messsystems die Pads des Messobjektes elektrisch kontaktieren. Die Messnadeln werden in Bezug zur Chiplage und zur Lage der Chipmatrix derart positioniert, dass ein fehlerfreies Kontaktieren sämtli- eher Chips des Wafers möglich ist.For electrical testing of assemblies, chips on wafers or other electronic components, the object to be tested is contacted with the measuring needle tips of a measuring instrument and the measurement is started. One application of the measurement method is the wafer test. On a wafer, for example, a plurality of semiconductor devices, the so-called chips applied. Each chip has measuring points for the electrical measurement, so-called pads. In the electrical wafer test, the measuring needles are placed on the pads provided for this purpose and then the function of the electronic component is checked. For contacting, the wafer is raised in such a way that the measuring needles of the measuring system electrically contact the pads of the measuring object. The measuring needles are positioned in relation to the chip position and to the position of the chip matrix in such a way that it is possible to contact all chips of the wafer without errors.
Bisher war es notwendig, dass ein Justierer nach definierten zeitlichen Intervallen oder vor jedem Prüfvorgang die sogenannten Messkarten mit darauf befindlichen Messspinnen mit entsprechenden Messnadeln unter einem Mikroskop justieren musste. Dabei ist zu beachten, dass die jeweiligen Messnadeln möglichst optimal auf den entsprechenden elektrischen Anschlussflecken, die Pads, ausgerichtet sein müssen, wenn das Messsystem mit den Messnadeln auf die zu prüfende elektroni- sehe Strukturen aufsetzt. Dabei entstehen beim Kontaktieren der Chips auf den Pads Nadelabdrücke. Diese Nadelabdrücke werden vom Justierer unter dem Mikroskop analysiert und gege- benenfalls wird der Justiervorgang bis zum Erreichen eines befriedigenden Messergebnisses wiederholt.Previously, it was necessary that an adjuster had to adjust the so-called measuring cards with measuring spiders located thereon with corresponding measuring needles under a microscope after defined time intervals or before each test procedure. It should be noted that the respective measuring needles as optimally as possible on the corresponding electrical pads, the pads must be aligned when the measuring system with the measuring needles touches on the electronic structures to be tested. This results in contacting the chips on the pads needleprints. These needleprints are analyzed and adjusted by the adjuster under a microscope. if necessary, the adjustment process is repeated until a satisfactory measurement result is achieved.
Der Erfindung liegt die Aufgabe zu Grunde, ein automatisches Verfahren und eine Vorrichtung zur Justierung von Messnadeln zur Kontaktierung von elektronischen Baugruppen bereitzustellen .The invention is based on the object to provide an automatic method and apparatus for adjusting measuring needles for contacting electronic assemblies.
Die Aufgabe wird die Merkmale des Anspruchs 1 oder durch die Merkmale des Anspruchs 8 gelöst.The object is achieved by the features of claim 1 or by the features of claim 8.
Der Erfindung liegt die Erkenntnis zu Grunde, dass die Lage von Messnadelspitzen oder allgemein einer Gruppe von Messnadeln zu einem bestimmten vorgebbaren Zeitpunkt vor den ei- gentlichen Testvorgängen oder nach dem Einsetzen einer neuen Messnadelspinne mit mehreren Messnadeln unter Einsatz eines zweidimensionalen Kamerasystems und mittels mindestens eines Stellantriebes zunächst erfassbar ist, eine Fehlstellung erkennbar ist und eine Nachführung in eine optimale Lage durch- führbar ist. Somit ist für mindestens ein Testvorgang dieThe invention is based on the finding that the position of measuring needle tips or in general a group of measuring needles at a specific predeterminable time before the actual test procedures or after inserting a new measuring needle spider with a plurality of measuring needles using a two-dimensional camera system and by means of at least one actuator is first detectable, a malposition is recognizable and tracking in an optimal position is feasible. Thus, for at least one test procedure is the
Gruppe von Messnadeln optimal positioniert und ausgerichtet. Optimal bedeutet, dass die beweglichen Messnadeln mit den entsprechenden Messnadelspitzen gleichzeitig auf die zu testende Oberfläche aufsetzen.Group of measuring needles optimally positioned and aligned. Optimal means that the movable measuring needles with the corresponding measuring needle tips sit simultaneously on the surface to be tested.
Die Messnadelspitzen werden im Wesentlichen unterhalb der Messstation mit Auflicht beleuchtet und deren Bild wird nach der Übertragung mit entsprechenden Spiegeleinheiten in einer Kamera erzeugt, analysiert und hinsichtlich einer rotatori- sehen Fehlstellung um die Z-Achse untersucht. Die Z-Achse steht dabei senkrecht zu der zu testenden Oberfläche. Mittels entsprechender Überwachung wird eine Messnadelkarte in einer vorhandenen rotatorischen Fehlstellung erkannt und in der Positionierung korrigiert, indem Sie um die Z-Achse gedreht wird.The measuring needle tips are illuminated substantially incidentally below the measuring station with incident light and their image is generated after transmission with corresponding mirror units in a camera, analyzed and examined with regard to a rotatory see defacement around the Z-axis. The Z-axis is perpendicular to the surface to be tested. By means of appropriate monitoring, a measuring needle card is detected in an existing rotary misalignment and corrected in the positioning by being rotated about the Z-axis.
Somit ist die Messanordnung mit den Messnadelspitzen derart ausgerichtet, dass die Anordnung für mehrere Prüfvorgänge justiert ist, so dass die Messnadeln gleichzeitig auf die zu prüfende Oberfläche aufsetzen. So wird ein bestimmtes elektronisches Bauteil, welches beispielsweise auf einen Wafer vorhanden ist, kurz mit den Messnadeln angefahren, kurz kon- taktiert und elektrisch überprüft. Der entsprechende Vorgang wiederholt sich für alle auf dem Wafer nebeneinander liegenden Bauelementen.Thus, the measuring arrangement is aligned with the measuring needle tips such that the arrangement for multiple testing is adjusted so that the measuring needles simultaneously touch the surface to be tested. Thus, a specific electronic component, which is present for example on a wafer, briefly approached with the measuring needles, briefly contacted and electrically checked. The corresponding process is repeated for all components lying next to one another on the wafer.
Im Folgenden wird anhand der schematischen Zeichnung die Er- findung beispielhaft erläutert. Dabei zeigenIn the following, the invention will be explained by way of example with reference to the schematic drawing. Show
Figur 1: eine Messnadelspinne mit einem Messnadelring, auf dem Messnadeln aufgebracht sind,FIG. 1: a measuring needle spider with a measuring needle ring, on which measuring needles are applied;
Figur 2: eine Messplatte mit darin verdrehbar gelagerterFigure 2: a measuring plate with rotatably mounted therein
Messnadelkarte und darin enthaltener Messnadelspinne,Measuring needle card and measuring needle spider contained therein,
Figur 3: einen Messaufbau zur Messung der Verdrehung um die z- Achse.FIG. 3 shows a measuring setup for measuring the rotation about the z-axis.
Figur 1 zeigt eine Messnadelspinne 1, die aus einem Metall- Anschlussring 2 besteht, der Messnadeln 3 aufnimmt, wobei die Messnadeln 3 mit ihren Messnadelspitzen 4 in den inneren Be- reich des Rings hineinragen und nach unten hervor stehen. Die Messnadelspitzen 4 sind in einer vorgegebenen gegenseitigen Anordnung ausgerichtet, insbesondere liegen die Messnadelspitzen 4 möglichst auf einer Geraden. Das Koordinatensystem 8 der Messnadeln ist in Figur 1 angedeutet, wobei die ZM- Achse senkrecht zur Bildebene steht und XM, YM-Achsen in der Bildebene liegen.FIG. 1 shows a measuring needle spider 1, which consists of a metal connecting ring 2, which receives measuring needles 3, the measuring needles 3 with their measuring needle tips 4 projecting into the inner region of the ring and projecting downwards. The measuring needle tips 4 are aligned in a predetermined mutual arrangement, in particular the measuring needle tips 4 are as possible on a straight line. The coordinate system 8 of the measuring needles is indicated in Figure 1, wherein the Z M - axis is perpendicular to the image plane and X M , Y M axes are in the image plane.
Figur 2 zeigt die Messspinne 1, die in einer so genannten Messnadelkarte 6 aufgenommen ist, wobei das Koordinatensystem 8 der Messnadeln durch unterbrochene Linien entsprechend angedeutet ist. Die Messnadelkarte 6 ist in einer Messplatte 7 aufgenommen, deren Koordinatensystem 9 mit den Koordinaten Xp und Yp in Figur 2 dargestellt ist. Der Metallanschlussring 2 kann zusammen mit der Messnadelkarte 6 gegenüber der Messplatte 7 verdreht sein, wie in Figur 2 dargestellt. Dies bedeutet eine Fehlstellung der Messnadeln beim Ausmessen der Chips.FIG. 2 shows the measuring spider 1, which is accommodated in a so-called measuring needle card 6, the coordinate system 8 of the measuring needles being indicated accordingly by broken lines. The measuring needle card 6 is received in a measuring plate 7, the coordinate system 9 is shown with the coordinates Xp and Yp in Figure 2. The metal connection ring 2 can be twisted together with the measuring needle card 6 relative to the measuring plate 7, as shown in FIG. This means a misalignment of the measuring needles when measuring the chips.
Eine Anordnung nach Figur 3 zeigt in der Seitenansicht, dass die Messplatte 7 allgemein parallel zum Werkstückträger mit darauf befindlichem Messobjekt, beispielsweise einem Wafer 11, ausgerichtet ist.An arrangement according to FIG. 3 shows, in a side view, that the measuring plate 7 is oriented generally parallel to the workpiece carrier with a measuring object located thereon, for example a wafer 11.
Figur 3 zeigt das Gesamtmesssystem, wobei eine sogenannte Messnadelüberwachung einerseits das System auf rotatorische Fehlstellungen überwacht und damit Daten von einer Bildanaly- se berücksichtigt. Die Bildanalyse greift auf Daten des optischen Sensors, insbesondere einer zweidimensional auflösenden Kamera 18, zurück, die Teil des optischen Sensors ist. Mit angedeutet ist das Koordinatensystem 8 der Messnadeln 3. Die Objektbeleuchtung geschieht hier nach dem Auflichtprinzip . Der optische Sensor weist eine Beleuchtung 13 auf, die dieFIG. 3 shows the overall measuring system, wherein a so-called measuring needle monitoring on the one hand monitors the system for rotational misalignments and thus takes into account data from a picture analysis. The image analysis uses data from the optical sensor, in particular a two-dimensionally resolving camera 18, which is part of the optical sensor. Indicated is the coordinate system 8 of the measuring needles 3. The object illumination happens here according to the reflected-light principle. The optical sensor has a lighting 13, which the
Messnadeln 4 im Durchlichtsystem mittels eines Messstrahls 17 und über einen Umlenkspiegel 14 in die Kamera 18 abbilden. Die Bildanalyse ergibt Daten hinsichtlich der Prüfung, ob eine Verdrehung vorliegt oder nicht.Measuring needles 4 in the transmitted light system by means of a measuring beam 17 and a deflection mirror 14 in the camera 18. The image analysis gives data regarding the check whether there is a twist or not.
Ausgehend von einer Fehlstellung in Form einer Verdrehung entsprechend Figur 2 wird eine Korrektur der Nadeln vorgenommen und eine genaue rotatorische Ausrichtung erzielt. Zur optischen Abbildung wird eine zweidimensional auflösende CCD- Kamera verwendet. Die Abbildung der Nadeln und deren Spitzen erfolgt im Auflichtprinzip . Hierzu beleuchtet eine Lichtquelle 13 die Messnadeln 3 und deren Spitzen 4. Die Lichtquelle kann mittels Licht emittierender Dioden betrieben werden.Starting from a misalignment in the form of a rotation corresponding to Figure 2, a correction of the needles is made and achieved an accurate rotational alignment. For optical imaging, a two-dimensionally resolving CCD camera is used. The illustration of the needles and their tips is done in the incident light principle. For this purpose, a light source 13 illuminates the measuring needles 3 and their tips 4. The light source can be operated by means of light-emitting diodes.
Der Chuck 12 wird derart verfahren, dass die Messnadeln mittels des Sensors nach dem Auflichtprinzip beleuchtet werden und eine Verdrehung einer Nadelgruppe geschieht vor dem Prüfvorgang. Aufgrund der automatischen Nachjustierung lassen sich die Kontaktfahrten während des PrüfVorgangs verkürzen. Die Chipoberflächen und die Messnadeln werden weniger stark belastet, was die Reduzierung von Chipausfällen zur Folge hat. Weiterhin wird der Messnadelverschleiß minimiert.The chuck 12 is moved in such a way that the measuring needles are illuminated by means of the sensor according to the incident light principle and a rotation of a needle group occurs before the test procedure. Due to the automatic readjustment leave shorten the contact journeys during the inspection process. The chip surfaces and the measuring needles are less heavily loaded, resulting in the reduction of chip failures. Furthermore, the measuring needle wear is minimized.
Die Verstellbereiche liegen im μm-Bereich. Im Strahlengang des optischen Sensors kann mindestens ein Umlenkspiegel enthalten sein. Maßgeblich für die parallele Ausrichtung ist die Oberfläche, beispielsweise eines Wafers oder eine Baugruppe.The adjustment ranges are in the μm range. At least one deflection mirror may be contained in the beam path of the optical sensor. Decisive for the parallel orientation is the surface, for example a wafer or an assembly.
Anhand der Figuren ist klar dargestellt, dass sich eine Messnadelspinne 1 an einer Messnadelkarte 6 abstützt und die Messnadelkarte 6 wiederum in eine Messplatte 7 eingebaut ist. Zur Justierung der Messnadellage insbesondere bezüglich einer Fehlstellung durch Verdrehung wird entweder die Messnadelspinne 1 oder die Messnadelkarte 6 in der Drehlage korrigiert .On the basis of the figures it is clearly shown that a measuring needle spider 1 is supported on a measuring needle card 6 and the measuring needle card 6 is in turn mounted in a measuring plate 7. For adjusting the measuring needle position, in particular with respect to a misalignment by rotation, either the measuring needle spider 1 or the measuring needle card 6 is corrected in the rotational position.
Entsprechend Figur 2 wird in jedem Fall ein Korrekturwinkel 15 zur Korrektur einer winkelbezogenen Fehlstellung mittels eines Stellantriebes 10 berücksichtigt, so dass insbesondere die Messnadelspitzen 4 in einem Koordinatensystem des übergreifenden Systems derart ausgerichtet sind, dass sie bei PrüfVorgängen optimal auf zu testende Bauelemente aufsetzen können.In accordance with FIG. 2, a correction angle 15 for correcting an angle-related misalignment by means of an actuator 10 is taken into account in each case, so that in particular the measuring needle tips 4 are aligned in a coordinate system of the overall system in such a way that they can optimally be placed on components to be tested during test operations.
In Figur 3 sind die wesentlichen Bestandteile des optischen Sensors in Form der Beleuchtung 13, einer zusätzlichen Beleuchtung 16 und 19, der Kamera 18 und dem entsprechenden Strahlengang 17 dargestellt, wobei eine Bildverarbeitung für die Justierung der Messkarte 6 beziehungsweise der Messnadelspitzen eingesetzt wird.FIG. 3 shows the essential components of the optical sensor in the form of the illumination 13, an additional illumination 16 and 19, the camera 18 and the corresponding beam path 17, image processing being used for the adjustment of the measuring card 6 or of the measuring needle tips.
Der optische Sensor prüft eine Fehlstellung der Messnadel- spitzen insbesondere unterhalb der Messanordnung. Zur Abbildung der Messnadelspitzen oder größerer Teile der Messnadeln wird mindestens ein Umlenkspiegel verwendet, welcher direkt oder indirekt fest mit der oberen Linearachse des Chuckan- triebs verbunden ist. Mindestens ein Umlenkspiegel kann auch mit der auf der oberen Linearachse sitzenden Rotationsachse oder dem hierauf sitzenden Chuck verbunden sein.The optical sensor checks a malposition of the measuring needle tips, in particular below the measuring arrangement. At least one deflecting mirror is used for imaging the measuring needle tips or larger parts of the measuring needles, which directly or indirectly is fixedly connected to the upper linear axis of the chuck drive is connected. At least one deflection mirror can also be connected to the axis of rotation seated on the upper linear axis or to the chuck sitting thereon.
Ein Umlenkspiegel kann alternativ als Strahlteiler dargestellt werden. Dies ermöglicht eine zusätzliche Beleuchtung aus einer weiteren Richtung.A deflecting mirror can alternatively be represented as a beam splitter. This allows additional illumination from another direction.
Zur weiteren Beleuchtung der Messnadel ist eine zusätzliche Lichtquelle, die über einen Umlenkspiegel oder Strahlteiler einkoppelt, vorgesehen. Anstelle eines Umlenkspiegels kann auch ein optischer Sensor mit integrierter Lichtquelle verwendet werden.For further illumination of the measuring needle, an additional light source, which couples in via a deflecting mirror or beam splitter, is provided. Instead of a deflecting mirror, an optical sensor with integrated light source can also be used.
Aufgrund automatisch einstellbaren Nadelpositionen kann sichergestellt werden, dass die Messnadeln im Rahmen der Kontaktfahrten bei den später auszuführenden Prüfverfahren beziehungsweise Kontaktfahrten auf die Pads treffen und nicht Regionen elektrisch kontaktieren, die nicht dafür vorgesehen sind. Zusätzlich kann die Messnadelqualität automatisch beurteilt werden. Verschlissene oder beschädigte Messnadeln werden rechtzeitig erkannt. Die elektronischen Bauelemente werden durch diese elektrischen Testvorgänge weniger belastet. Due to automatically adjustable needle positions, it can be ensured that the measuring needles make contact with the pads during the contact runs during the test procedures or contact runs to be carried out later and do not electrically contact regions that are not intended for this purpose. In addition, the gauge quality can be automatically assessed. Worn or damaged needles are detected in time. The electronic components are less burdened by these electrical testing operations.

Claims

Patentansprüche claims
1. Verfahren zur automatischen Justierung von Messnadeln (3) relativ zu Oberflächen von Prüflingen, wie elektronischen Bauelementen, wobei die Messnadeln zum elektrischen Prüfen relativ zum zu prüfenden Objekt verschoben werden und nach dem Aufsetzen und Kontaktieren entsprechend elektrisch prüfen, dadurch gekennzeichnet, dass - mittels eines optischen Sensors die Lage der Messnadeln (3) in einem Prüfsystem erkannt wird,A method for automatic adjustment of measuring needles (3) relative to surfaces of specimens, such as electronic components, wherein the measuring needles are moved for electrical testing relative to the object to be tested and electrically check accordingly after touchdown and contacting, characterized in that - means an optical sensor, the position of the measuring needles (3) is detected in a test system,
- eine Bildverarbeitung eine Fehlstellung hinsichtlich einer Verdrehung von Messnadeln ermittelt, und- An image processing determines a malposition with respect to a rotation of needles, and
- bei einer vorhandenen Fehlstellung eine mit den Messnadeln bestückte Messnadelspinne (1) mittels eines Stellantriebs in die korrekte Lage gedreht wird.- In an existing malposition one equipped with the measuring needles measuring needle spider (1) is rotated by means of an actuator in the correct position.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass der optische Sensor eine zweidi- mensional auflösende Kamera umfasst, insbesondere eine CCD- Kamera .2. The method according to claim 1, characterized in that the optical sensor comprises a two-dimensionally resolving camera, in particular a CCD camera.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass neben der Ausrichtung der Mess- nadeln (3) die Positionen der Messnadelspitzen (4) mit berücksichtigt wird.3. The method according to claim 1 or 2, characterized in that in addition to the orientation of the measuring needles (3), the positions of the measuring needle tips (4) is taken into account.
4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass der optische Sensor eine LED- Beleuchtung aufweist.4. The method according to any one of claims 1 to 3, characterized in that the optical sensor has an LED illumination.
5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass eine Beleuchtung für die Prüflinge mittels diffusem Licht geschieht.5. The method according to any one of claims 1 to 4, characterized in that illumination for the DUTs is done by means of diffused light.
6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass ein Objektträger derart verfahren wird, dass Justiervorgänge in einer Justierstation ablaufen .6. The method according to any one of claims 1 to 5, characterized in that a slide is moved in such a way that adjusting processes take place in an adjustment station.
7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass ein Justiervorgang vor jedem PrüfVorgang erfolgt.7. The method according to any one of claims 1 to 6, characterized in that an adjustment is carried out before each test procedure.
8. Vorrichtung zur automatischen Justierung von Messnadeln (3) relativ zu den Oberflächen von zu prüfenden Objekten, mit :8. Device for automatic adjustment of measuring needles (3) relative to the surfaces of objects to be tested, comprising:
- einem optischen Sensor (14, 18, 19) zur Lageerkennung von Messnadeln ( 6) ,an optical sensor (14, 18, 19) for detecting the position of measuring needles (6),
- einem Controller zur Justage der Messnadellage, und - einem Stellantrieb (10) zum Verstellen und/oder Verdrehen der Messnadeln (3), wobei der Sensor (18) und der Stellantrieb (10) an den Controller elektrisch angeschlossen sind,a controller for adjusting the measuring needle position, and an actuator (10) for adjusting and / or rotating the measuring needles (3), the sensor (18) and the actuator (10) being electrically connected to the controller,
- wobei der Stellantrieb (10) derart durch den Controller in Abhängigkeit des Ausgangs des optischen Sensors (18) an- steuerbar ist, dass die Messnadeln (3) in die optimale Lage und/oder in die optimale Position verschiebbar und/oder verdrehbar sind.- wherein the actuator (10) in such a manner controllable by the controller in response to the output of the optical sensor (18) that the measuring needles (3) in the optimal position and / or in the optimal position are displaced and / or rotated.
9. Vorrichtung nach Anspruch 8, wobei der optische Sensor (18) eine zweidimensionale aufzulösende Kamera aufweist.9. Apparatus according to claim 8, wherein the optical sensor (18) comprises a two-dimensional camera to be resolved.
10. Vorrichtung nach mindestens einem der Ansprüche 8 oder 9, wobei die Vorrichtung ferner eine Lichtquelle (13, 16) zur Beleuchtung der Messnadeln (3) aufweist.10. The device according to at least one of claims 8 or 9, wherein the device further comprises a light source (13, 16) for illuminating the measuring needles (3).
11. Vorrichtung nach mindestens einem der Ansprüche 8 bis 10, wobei die Vorrichtung ferner eine Messnadelspinne (1), die die Messnadeln (3) aufweist, eine Messnadelkarte (6), auf der die Messnadelspinne (1) angeordnet ist, und eine Messplatte (7) umfasst, auf der die Messnadelkarte (6) drehbar angeordnet ist, wobei die Messnadelspinne (1) und/oder die Messnadelkarte (6) durch den Stellantrieb (10) verdrehbar und/oder verstellbar sind. 11. The device according to at least one of claims 8 to 10, wherein the device further comprises a measuring needle spider (1), which has the measuring needles (3), a measuring needle card (6), on which the measuring needle spider (1) is arranged, and a measuring plate ( 7) on which the measuring needle card (6) is rotatably arranged, wherein the measuring needle spider (1) and / or the measuring needle card (6) by the actuator (10) are rotatable and / or adjustable.
12. Vorrichtung nach mindestens einem der Ansprüche 9 bis 11, wobei der Strahlengang (17) der Kamera (18) derart umgelenkt ist, dass die Messnadelspitzen (4) erfasst werden.12. The device according to at least one of claims 9 to 11, wherein the beam path (17) of the camera (18) is deflected such that the measuring needle tips (4) are detected.
13. Vorrichtung nach Anspruch 12, wobei die Umlenkung mindestens eines Spiegels (14) erfolgt. 13. The apparatus of claim 12, wherein the deflection of at least one mirror (14).
PCT/EP2008/062609 2007-09-28 2008-09-22 Method and device for adjusting measuring probes WO2009043752A1 (en)

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