WO2009041620A1 - 感光性樹脂組成物、該組成物を用いるパターンの製造法および電子デバイス - Google Patents

感光性樹脂組成物、該組成物を用いるパターンの製造法および電子デバイス Download PDF

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Publication number
WO2009041620A1
WO2009041620A1 PCT/JP2008/067497 JP2008067497W WO2009041620A1 WO 2009041620 A1 WO2009041620 A1 WO 2009041620A1 JP 2008067497 W JP2008067497 W JP 2008067497W WO 2009041620 A1 WO2009041620 A1 WO 2009041620A1
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WO
WIPO (PCT)
Prior art keywords
pattern
photosensitive resin
resin composition
electronic device
composition
Prior art date
Application number
PCT/JP2008/067497
Other languages
English (en)
French (fr)
Inventor
Yasufumi Watanabe
Kenichiro Sato
Original Assignee
Fujifilm Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corporation filed Critical Fujifilm Corporation
Publication of WO2009041620A1 publication Critical patent/WO2009041620A1/ja

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

　良好な、形状と特性のパターンを有する信頼性の高い電子デバイスを提供することができる、着色や膜強度の経時変化が少ない膜物性に優れる組成物として、（ａ）特定の繰り返し単位を含む樹脂、（ｂ）光照射によりスルホン酸を発生する化合物、及び（ｃ）アルコキシメチル基又はアシルオキシメチル基を窒素原子上に有する架橋剤を含有する感光性樹脂組成物、そして、該組成物を用いたパターンの製造法、および該パターンを有する電子デバイスを提供する。
PCT/JP2008/067497 2007-09-28 2008-09-26 感光性樹脂組成物、該組成物を用いるパターンの製造法および電子デバイス WO2009041620A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007256783A JP2009086356A (ja) 2007-09-28 2007-09-28 感光性樹脂組成物、該組成物を用いるパターンの製造法および電子デバイス
JP2007-256783 2007-09-28

Publications (1)

Publication Number Publication Date
WO2009041620A1 true WO2009041620A1 (ja) 2009-04-02

Family

ID=40511500

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067497 WO2009041620A1 (ja) 2007-09-28 2008-09-26 感光性樹脂組成物、該組成物を用いるパターンの製造法および電子デバイス

Country Status (2)

Country Link
JP (1) JP2009086356A (ja)
WO (1) WO2009041620A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101200140B1 (ko) * 2009-08-31 2012-11-12 금호석유화학 주식회사 포지티브형 감광성 조성물
JP2017025163A (ja) * 2015-07-17 2017-02-02 Jnc株式会社 樹脂溶液組成物およびポリイミドフィルム
JP7247867B2 (ja) * 2019-11-27 2023-03-29 信越化学工業株式会社 感光性ポリイミド樹脂組成物、パターン形成方法及び半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006133757A (ja) * 2004-10-07 2006-05-25 Shin Etsu Chem Co Ltd ポリイミド系光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜
JP2006349700A (ja) * 2005-05-18 2006-12-28 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造方法及び電子部品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006133757A (ja) * 2004-10-07 2006-05-25 Shin Etsu Chem Co Ltd ポリイミド系光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜
JP2006349700A (ja) * 2005-05-18 2006-12-28 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造方法及び電子部品

Also Published As

Publication number Publication date
JP2009086356A (ja) 2009-04-23

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