WO2009040986A1 - プローブ針素材とそれを用いたプローブ針およびプローブカード、ならびに検査方法 - Google Patents
プローブ針素材とそれを用いたプローブ針およびプローブカード、ならびに検査方法 Download PDFInfo
- Publication number
- WO2009040986A1 WO2009040986A1 PCT/JP2008/002365 JP2008002365W WO2009040986A1 WO 2009040986 A1 WO2009040986 A1 WO 2009040986A1 JP 2008002365 W JP2008002365 W JP 2008002365W WO 2009040986 A1 WO2009040986 A1 WO 2009040986A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe needle
- boride
- carbide
- probe
- needle material
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Powder Metallurgy (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/680,124 US8324918B2 (en) | 2007-09-27 | 2008-08-29 | Probe needle material, probe needle and probe card each using the same, and inspection process |
JP2009534157A JP5364581B2 (ja) | 2007-09-27 | 2008-08-29 | プローブ針素材とそれを用いたプローブ針およびプローブカード、ならびに検査方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007251670 | 2007-09-27 | ||
JP2007-251670 | 2007-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009040986A1 true WO2009040986A1 (ja) | 2009-04-02 |
Family
ID=40510897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/002365 WO2009040986A1 (ja) | 2007-09-27 | 2008-08-29 | プローブ針素材とそれを用いたプローブ針およびプローブカード、ならびに検査方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8324918B2 (ja) |
JP (1) | JP5364581B2 (ja) |
WO (1) | WO2009040986A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016085133A (ja) * | 2014-10-27 | 2016-05-19 | 富士通セミコンダクター株式会社 | プローブ針、プローブカード、プローブ針の製造方法及びプローブ針の再生方法 |
CN105695838A (zh) * | 2016-02-17 | 2016-06-22 | 张霞 | 一种耐腐蚀手术刀刀柄及其制备方法 |
CN110373589A (zh) * | 2019-07-08 | 2019-10-25 | 中国科学院物理研究所 | W-Cr合金和包含W-Cr合金的纯自旋流器件 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2796576B1 (en) * | 2011-12-20 | 2021-10-06 | Kabushiki Kaisha Toshiba | Tungsten alloy sintered body, tungsten alloy part, discharge lamp, transmitting tube, and magnetron |
JP5868239B2 (ja) * | 2012-03-27 | 2016-02-24 | 株式会社日本マイクロニクス | プローブ及びプローブカード |
CN106783459B (zh) * | 2012-05-29 | 2019-02-26 | 株式会社东芝 | 钨合金部件、以及使用该钨合金部件的放电灯、发射管和磁控管 |
EP2871666B1 (en) * | 2012-07-03 | 2022-09-07 | Kabushiki Kaisha Toshiba | Tungsten alloy part, and discharge lamp using the same |
US9766269B2 (en) * | 2012-12-29 | 2017-09-19 | Power Probe TEK, LLC | Conductive test probe |
CN106086506A (zh) * | 2016-05-18 | 2016-11-09 | 来安县赛华管业有限公司 | 一种具有抑菌功效的饮用水管 |
US10705121B2 (en) * | 2018-02-06 | 2020-07-07 | Globalfoundries Inc. | Probe card continuity testing and cleaning fixture comprising highly purified tungsten |
EP3680102A1 (de) | 2019-01-11 | 2020-07-15 | Heraeus Deutschland GmbH & Co KG | Geschichtete ag/refraktärmetall-folie und verfahren zu deren herstellung |
EP3680101B1 (de) | 2019-01-11 | 2022-03-02 | Heraeus Deutschland GmbH & Co. KG | Geschichtete cu/refraktärmetall-folie und verfahren zu deren herstellung |
EP3862759B1 (de) | 2020-02-04 | 2022-05-11 | Heraeus Deutschland GmbH & Co. KG | Manteldraht und verfahren zur herstellung von manteldrähten |
EP3878986A1 (de) | 2020-03-12 | 2021-09-15 | Heraeus Deutschland GmbH & Co KG | Draht und band mit bornitrid-nanoröhren für elektrische kontaktierungen |
EP3960890A1 (de) | 2020-09-01 | 2022-03-02 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-ruthenium-legierung |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002005958A (ja) * | 2000-06-26 | 2002-01-09 | Tokyo Cathode Laboratory Co Ltd | プローブカード用測定針、プローブカード及び測定針形成方法 |
JP2002356732A (ja) * | 2001-05-29 | 2002-12-13 | Toshiba Corp | レニウムタングステン線、プローブピンおよびそれを具備する検査装置 |
JP2003023050A (ja) * | 2001-07-06 | 2003-01-24 | Mitsubishi Electric Corp | ウエハプローバー及び半導体装置のテスト方法 |
JP2005106690A (ja) * | 2003-09-30 | 2005-04-21 | National Institute For Materials Science | 電気特性測定用接合型プローブとその製造方法 |
JP2006102775A (ja) * | 2004-10-05 | 2006-04-20 | Nippon Tungsten Co Ltd | スポット溶接用電極 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0511062U (ja) * | 1991-07-23 | 1993-02-12 | セイコー電子部品株式会社 | プローブ針 |
US5867032A (en) * | 1995-11-30 | 1999-02-02 | Motorola, Inc. | Process for testing a semiconductor device |
JP2000119837A (ja) * | 1998-10-19 | 2000-04-25 | Toshiba Corp | 高強度タングステン系ピン |
-
2008
- 2008-08-29 WO PCT/JP2008/002365 patent/WO2009040986A1/ja active Application Filing
- 2008-08-29 JP JP2009534157A patent/JP5364581B2/ja active Active
- 2008-08-29 US US12/680,124 patent/US8324918B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002005958A (ja) * | 2000-06-26 | 2002-01-09 | Tokyo Cathode Laboratory Co Ltd | プローブカード用測定針、プローブカード及び測定針形成方法 |
JP2002356732A (ja) * | 2001-05-29 | 2002-12-13 | Toshiba Corp | レニウムタングステン線、プローブピンおよびそれを具備する検査装置 |
JP2003023050A (ja) * | 2001-07-06 | 2003-01-24 | Mitsubishi Electric Corp | ウエハプローバー及び半導体装置のテスト方法 |
JP2005106690A (ja) * | 2003-09-30 | 2005-04-21 | National Institute For Materials Science | 電気特性測定用接合型プローブとその製造方法 |
JP2006102775A (ja) * | 2004-10-05 | 2006-04-20 | Nippon Tungsten Co Ltd | スポット溶接用電極 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016085133A (ja) * | 2014-10-27 | 2016-05-19 | 富士通セミコンダクター株式会社 | プローブ針、プローブカード、プローブ針の製造方法及びプローブ針の再生方法 |
CN105695838A (zh) * | 2016-02-17 | 2016-06-22 | 张霞 | 一种耐腐蚀手术刀刀柄及其制备方法 |
CN110373589A (zh) * | 2019-07-08 | 2019-10-25 | 中国科学院物理研究所 | W-Cr合金和包含W-Cr合金的纯自旋流器件 |
CN110373589B (zh) * | 2019-07-08 | 2021-06-15 | 中国科学院物理研究所 | W-Cr合金和包含W-Cr合金的纯自旋流器件 |
Also Published As
Publication number | Publication date |
---|---|
US8324918B2 (en) | 2012-12-04 |
JPWO2009040986A1 (ja) | 2011-01-13 |
JP5364581B2 (ja) | 2013-12-11 |
US20100194415A1 (en) | 2010-08-05 |
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