WO2009036716A1 - Verfahren und anordnung zum erzeugen eines laserstrahls mit einem linienhaften strahlquerschnitt - Google Patents
Verfahren und anordnung zum erzeugen eines laserstrahls mit einem linienhaften strahlquerschnitt Download PDFInfo
- Publication number
- WO2009036716A1 WO2009036716A1 PCT/DE2008/001181 DE2008001181W WO2009036716A1 WO 2009036716 A1 WO2009036716 A1 WO 2009036716A1 DE 2008001181 W DE2008001181 W DE 2008001181W WO 2009036716 A1 WO2009036716 A1 WO 2009036716A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser beam
- axis
- imaging
- optics
- short
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000003384 imaging method Methods 0.000 claims abstract description 56
- 230000003287 optical effect Effects 0.000 claims abstract description 27
- 210000001747 pupil Anatomy 0.000 claims abstract description 22
- 238000009826 distribution Methods 0.000 claims description 5
- 101100235511 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) LHP1 gene Proteins 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 101100071481 Arabidopsis thaliana HSFA2 gene Proteins 0.000 abstract 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 10
- 239000000758 substrate Substances 0.000 description 7
- 101150063173 SAH1 gene Proteins 0.000 description 6
- 238000012634 optical imaging Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
- G02B27/0966—Cylindrical lenses
Definitions
- the laser beam is telecentrically imaged at least with respect to the long axis, i. H. the laser beam homogenized with respect to the long axis is imaged by means of a condenser optics in such a way that a beam path which can be assigned to the imaged laser beam and consists of partial beams oriented parallel to the propagation direction is formed,
- Cylinder lens arrangements are. Downstream of the cylindrical lens arrangements in the beam path, a condenser lens is provided for imaging the beam cross-section which is rectangular in the long axis.
- the following is a short axis homogenizer, which also provides a first arrangement of mutually parallel cylindrical lenses, followed in the beam path of a second array of parallel aligned cylindrical lenses, the axes of the cylindrical lenses of the short axis homogenizer are oriented orthogonal to the cylindrical lens axes of the long axis homogenizer.
- the focal points or lines of the respective first arrangement of cylindrical lenses are also located between the two cylindrical lens arrangements in the case of the short-axis homogenizer.
- a condenser lens and a field lens are subsequently provided, which image the beam cross section, which is homogenized in the short axis, into the region of a slit lens.
- an optical magnifying glass arrangement ensures a reduction in the beam cross-sectional shape in the short axis, and ultimately the laser beam, which is now linearly formed and homogenized in the beam cross section, is imaged onto the substrate surface coated with amorphous silicon. Further details can be found in the aforementioned US 2005/0035103 A1.
- a method for generating a laser beam with a linear beam cross section is characterized in that in the beam path for beam shaping and beam imaging of the laser beam cross section in the short axis at least two-stage optical imaging is performed with the one hand, a spatial Bridging the caused by the telecentric beam guidance long distance between the Kurzachsenhomogenisierer and an imaging plane is made possible, in which preferably is provided with the amorphous Si layer substrate, and on the other hand, an independent adjustment for the slope and line half width is created.
- the two-stage imaging is realized by two optical imaging branches arranged one after the other in the beam path, of which the first optical imaging branch consists of the cylindrical lens arrangements of the short axis homogenizer, a subsequent short axis condensing optics and a short axis field lens optical system following the beam path.
- the laser beam L emerging from an excimer laser is matched to the input aperture of a homogenizer H composed of a long-axis LAH and a short-axis homogenizer SAH by means of suitable imaging optics, for example a telephoto lens.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lenses (AREA)
- Laser Beam Processing (AREA)
- Recrystallisation Techniques (AREA)
- Microscoopes, Condenser (AREA)
- Lasers (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008801070697A CN101801586B (zh) | 2007-09-17 | 2008-07-18 | 用于产生具有线形射束横截面的激光射束的方法和装置 |
| KR1020107005492A KR101529344B1 (ko) | 2007-09-17 | 2008-07-18 | 선형 횡단면을 가진 레이저 빔의 생성 방법 및 장치 |
| JP2010524341A JP5548127B2 (ja) | 2007-09-17 | 2008-07-18 | 線状のビーム断面を有するレーザビームを生成するための方法及び構成 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007044298A DE102007044298B3 (de) | 2007-09-17 | 2007-09-17 | Verfahren und Anordnung zum Erzeugen eines Laserstrahls mit einem linienhaften Strahlquerschnitt |
| DE102007044298.1 | 2007-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009036716A1 true WO2009036716A1 (de) | 2009-03-26 |
Family
ID=40070896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2008/001181 WO2009036716A1 (de) | 2007-09-17 | 2008-07-18 | Verfahren und anordnung zum erzeugen eines laserstrahls mit einem linienhaften strahlquerschnitt |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5548127B2 (ja) |
| KR (1) | KR101529344B1 (ja) |
| CN (1) | CN101801586B (ja) |
| DE (1) | DE102007044298B3 (ja) |
| WO (1) | WO2009036716A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9564322B1 (en) | 2015-11-13 | 2017-02-07 | Samsung Display Co., Ltd. | Method of excimer laser annealing |
| CN109477970A (zh) * | 2016-07-27 | 2019-03-15 | 通快激光有限责任公司 | 激光线照射 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010027196B4 (de) * | 2010-07-07 | 2012-03-08 | Carl Zeiss Laser Optics Gmbh | Optisches System zum Erzeugen eines Linienfokus sowie Vorrichtung zum Behandeln eines Substrats mit einem solchen optischen System |
| DE102010045620B4 (de) * | 2010-09-17 | 2016-09-01 | Limo Patentverwaltung Gmbh & Co. Kg | Vorrichtung zur Erzeugung einer linienförmigen Intensitätsverteilung in einer Arbeitsebene |
| KR101257827B1 (ko) * | 2012-09-20 | 2013-04-29 | (주)프로비전 | 라인형 레이저 빔 형성 장치 및 이를 이용한 터치 패널 제조 방법 |
| DE102012111098B4 (de) * | 2012-11-19 | 2016-03-03 | Scanlab Ag | Divergenzänderungsvorrichtung |
| DE102014213775B4 (de) * | 2014-07-15 | 2018-02-15 | Innolas Solutions Gmbh | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten |
| DE102015002537B4 (de) * | 2015-02-27 | 2017-11-09 | Innovavent Gmbh | Optisches System und optisches Verfahren zum Homogenisieren der Intensität von Laserstrahlung sowie Anlage zur Bearbeitung von Dünnfilmschichten |
| DE102017115964B4 (de) | 2017-07-14 | 2020-04-02 | LIMO GmbH | Vorrichtung zur Erzeugung einer linienförmigen Intensitätsverteilung einer Laserstrahlung |
| US11366331B2 (en) * | 2017-12-05 | 2022-06-21 | Panasonic Intellectual Property Management Co., Ltd. | Beam converting optical system and light source device |
| DE102018216940A1 (de) | 2018-10-02 | 2020-04-02 | 3D-Micromac Ag | Laserbearbeitungssystem |
| DE102019102511B4 (de) * | 2019-01-31 | 2020-08-20 | Trumpf Laser- Und Systemtechnik Gmbh | Lasersystem |
| DE102019206976B3 (de) * | 2019-05-14 | 2020-11-12 | Trumpf Laser Gmbh | Optisches System zum Erzeugen zweier Laserfokuslinien sowie Verfahren zum gleichzeitigen Bearbeiten zweier einander gegenüberliegender, paralleler Werkstückseiten eines Werkstücks |
| DE102019118676B4 (de) * | 2019-07-10 | 2021-10-21 | Innovavent Gmbh | Optisches System zur Homogenisierung der Intensität von Lichtstrahlung und Anlage zur Bearbeitung einer Halbleitermaterialschicht |
| DE102020130651B3 (de) | 2020-11-19 | 2022-05-05 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung zum Erzeugen einer definierten Laserbeleuchtung auf einer Arbeitsebene |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6215595B1 (en) * | 1996-02-06 | 2001-04-10 | Semiconductor Energy Laboratory Co., Ltd | Apparatus and method for laser radiation |
| US6583937B1 (en) * | 1998-11-30 | 2003-06-24 | Carl-Zeiss Stiftung | Illuminating system of a microlithographic projection exposure arrangement |
| JP2005079470A (ja) * | 2003-09-02 | 2005-03-24 | Nikon Corp | 照明光学系の調整方法、露光装置及び方法、並びにデバイス製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1072364C (zh) * | 1997-05-29 | 2001-10-03 | 中国科学院上海光学精密机械研究所 | 超精细结构的光学测量系统 |
| TW528879B (en) * | 2001-02-22 | 2003-04-21 | Ishikawajima Harima Heavy Ind | Illumination optical system and laser processor having the same |
| US7009140B2 (en) * | 2001-04-18 | 2006-03-07 | Cymer, Inc. | Laser thin film poly-silicon annealing optical system |
| KR100591404B1 (ko) * | 2002-08-13 | 2006-06-19 | 가부시끼가이샤 도시바 | 레이저 조사 방법 |
| WO2005085935A1 (de) * | 2004-03-06 | 2005-09-15 | Hentze-Lissotschenko Gmbh & Co. Kg | Vorrichtung zur homogenisierung von licht sowie anordnung zur beleuchtung oder fokussierung mit einer derartigen vorrichtung |
| JP2008524662A (ja) * | 2004-12-22 | 2008-07-10 | カール・ツアイス・レーザー・オプティクス・ゲーエムベーハー | 線ビームを生成するための光学照射系 |
| WO2007049525A1 (en) * | 2005-10-26 | 2007-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and manufacturing method of semiconductor device |
-
2007
- 2007-09-17 DE DE102007044298A patent/DE102007044298B3/de not_active Expired - Fee Related
-
2008
- 2008-07-18 CN CN2008801070697A patent/CN101801586B/zh not_active Expired - Fee Related
- 2008-07-18 WO PCT/DE2008/001181 patent/WO2009036716A1/de active Application Filing
- 2008-07-18 JP JP2010524341A patent/JP5548127B2/ja not_active Expired - Fee Related
- 2008-07-18 KR KR1020107005492A patent/KR101529344B1/ko active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6215595B1 (en) * | 1996-02-06 | 2001-04-10 | Semiconductor Energy Laboratory Co., Ltd | Apparatus and method for laser radiation |
| US6583937B1 (en) * | 1998-11-30 | 2003-06-24 | Carl-Zeiss Stiftung | Illuminating system of a microlithographic projection exposure arrangement |
| JP2005079470A (ja) * | 2003-09-02 | 2005-03-24 | Nikon Corp | 照明光学系の調整方法、露光装置及び方法、並びにデバイス製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9564322B1 (en) | 2015-11-13 | 2017-02-07 | Samsung Display Co., Ltd. | Method of excimer laser annealing |
| CN109477970A (zh) * | 2016-07-27 | 2019-03-15 | 通快激光有限责任公司 | 激光线照射 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100065326A (ko) | 2010-06-16 |
| CN101801586A (zh) | 2010-08-11 |
| DE102007044298B3 (de) | 2009-02-26 |
| JP2011501872A (ja) | 2011-01-13 |
| JP5548127B2 (ja) | 2014-07-16 |
| KR101529344B1 (ko) | 2015-06-16 |
| CN101801586B (zh) | 2013-12-11 |
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