WO2009031498A1 - Double-faced pressure-sensitive adhesive sheet - Google Patents

Double-faced pressure-sensitive adhesive sheet Download PDF

Info

Publication number
WO2009031498A1
WO2009031498A1 PCT/JP2008/065677 JP2008065677W WO2009031498A1 WO 2009031498 A1 WO2009031498 A1 WO 2009031498A1 JP 2008065677 W JP2008065677 W JP 2008065677W WO 2009031498 A1 WO2009031498 A1 WO 2009031498A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensitive adhesive
adhesive sheet
double
pressure
faced pressure
Prior art date
Application number
PCT/JP2008/065677
Other languages
French (fr)
Japanese (ja)
Inventor
Akihito Yamada
Takuo Nishida
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corporation filed Critical Lintec Corporation
Priority to KR1020107000673A priority Critical patent/KR101531727B1/en
Priority to CN2008801002524A priority patent/CN101766053B/en
Publication of WO2009031498A1 publication Critical patent/WO2009031498A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A double-faced pressure-sensitive adhesive sheet for use in fixing a removing member for removing a given gaseous ingredient present in a space in an EL element. The double-faced pressure-sensitive adhesive sheet comprises a base sheet and pressure-sensitive adhesive layers formed respectively on both sides thereof. Each pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive comprising a product of the crosslinking of an acrylic copolymer containing no carboxy group and comprising (A) units of an alkyl (meth)acrylate in which the alkyl has up to four carbon atoms and (B) units of an ethylenic monomer having a reactive functional group. This double-faced pressure-sensitive adhesive sheet is reduced in outgassing and has high tackiness. This adhesive sheet is used for fixing a removing member for removing a gaseous ingredient which is present in a space in an EL element and adversely influences the EL element.
PCT/JP2008/065677 2007-09-07 2008-09-01 Double-faced pressure-sensitive adhesive sheet WO2009031498A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020107000673A KR101531727B1 (en) 2007-09-07 2008-09-01 Double-faced pressure-sensitive adhesive sheet
CN2008801002524A CN101766053B (en) 2007-09-07 2008-09-01 Double-faced adhesive sheet

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-233087 2007-09-07
JP2007233087A JP5231774B2 (en) 2007-09-07 2007-09-07 Double-sided adhesive sheet

Publications (1)

Publication Number Publication Date
WO2009031498A1 true WO2009031498A1 (en) 2009-03-12

Family

ID=40428815

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065677 WO2009031498A1 (en) 2007-09-07 2008-09-01 Double-faced pressure-sensitive adhesive sheet

Country Status (5)

Country Link
JP (1) JP5231774B2 (en)
KR (1) KR101531727B1 (en)
CN (1) CN101766053B (en)
TW (1) TWI482833B (en)
WO (1) WO2009031498A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8487531B2 (en) 2010-12-24 2013-07-16 Samsung Display Co., Ltd. Encapsulation sheet, flat panel display device using the same, and method of manufacturing the flat panel display device
EP3410823A4 (en) * 2016-01-26 2019-10-23 Sumitomo Chemical Company, Limited Light-emitting device
CN115449307A (en) * 2022-09-23 2022-12-09 业泓科技(成都)有限公司 Laminated structure of adhesive
GB2624648A (en) * 2022-11-23 2024-05-29 Spandex Ltd Protective film assembly

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011042773A (en) * 2009-08-24 2011-03-03 K D K Kk Perforated film sheet
JP5520785B2 (en) * 2010-11-10 2014-06-11 日東電工株式会社 Insulating tape
JP5793783B2 (en) * 2011-12-28 2015-10-14 綜研化学株式会社 Adhesive composition for optical member, adhesive sheet using the same, optical member with adhesive layer, and flat panel display
JP6022236B2 (en) * 2012-06-28 2016-11-09 東レ・ダウコーニング株式会社 Coating agent, electrical / electronic device, and method for protecting metal part of electrical / electronic device
JP5968175B2 (en) * 2012-09-20 2016-08-10 リンテック株式会社 Double-sided adhesive sheet for electronic parts
JP6393052B2 (en) * 2014-03-20 2018-09-19 リンテック株式会社 Double-sided pressure-sensitive adhesive sheet and pressure-sensitive adhesive composition
CN104616604A (en) * 2015-03-04 2015-05-13 合肥华凌股份有限公司 LOGO luminous device and refrigerator
US11541639B2 (en) 2017-10-12 2023-01-03 Avery Dennison Corporation Low outgassing clean adhesive
JP2019156967A (en) * 2018-03-13 2019-09-19 日東電工株式会社 Semiconductor protective adhesive tape
US11912908B2 (en) 2018-12-28 2024-02-27 Nitto Denko Corporation Air-permeable adhesive sheet and breathable product

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1165499A (en) * 1997-08-22 1999-03-05 Nec Kansai Ltd Electroluminescent lamp and display device
JP2001345173A (en) * 2000-03-28 2001-12-14 Nitto Denko Corp Component for electroluminescent element and electroluminescent element containing it
JP2002367778A (en) * 2001-06-08 2002-12-20 Panac Co Ltd Laminated sheet for manufacturing process of organic electroluminescent display element
JP2005154531A (en) * 2003-11-25 2005-06-16 Lintec Corp Low gas-outing pressure-sensitive adhesive sheet
WO2006088179A1 (en) * 2005-02-21 2006-08-24 Kyodo Printing Co., Ltd. Adsorption film and organic el device
JP2007224129A (en) * 2006-02-23 2007-09-06 Panac Co Ltd Adhesive composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05105856A (en) * 1991-08-21 1993-04-27 Sekisui Chem Co Ltd Water-dispersible self-adhesive composition and self-adhesive tape, label, or sheet
JPH06340851A (en) * 1993-06-02 1994-12-13 Sekisui Chem Co Ltd Pressure-sensitive adhesive tape or sheet having thin metal layer
JPH11269439A (en) * 1998-03-25 1999-10-05 Dainippon Ink & Chem Inc High-adhesion re-releasable pressure-sensitive adhesive and high-adhesion re-releasable pressure-sensitive adhesive tape
JP4079659B2 (en) * 2002-03-11 2008-04-23 スリーエム イノベイティブ プロパティズ カンパニー Low outgas pressure sensitive adhesive composition and pressure sensitive adhesive sheet
JP2004061032A (en) * 2002-07-30 2004-02-26 Toyo Radiator Co Ltd Flat tube for heat exchanger having inner fin
AU2003280606A1 (en) * 2002-12-27 2004-07-29 Lintec Corporation Pressure sensitive adhesive sheet and method of manufacturing the adhesive sheet
JP2005187674A (en) * 2003-12-26 2005-07-14 Toyo Ink Mfg Co Ltd Adhesive composition and adhesive sheet using the same
JP5301779B2 (en) * 2006-02-14 2013-09-25 日本合成化学工業株式会社 Adhesive composition and adhesive sheet
JP5226232B2 (en) * 2007-03-15 2013-07-03 リンテック株式会社 Adhesive sheet

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1165499A (en) * 1997-08-22 1999-03-05 Nec Kansai Ltd Electroluminescent lamp and display device
JP2001345173A (en) * 2000-03-28 2001-12-14 Nitto Denko Corp Component for electroluminescent element and electroluminescent element containing it
JP2002367778A (en) * 2001-06-08 2002-12-20 Panac Co Ltd Laminated sheet for manufacturing process of organic electroluminescent display element
JP2005154531A (en) * 2003-11-25 2005-06-16 Lintec Corp Low gas-outing pressure-sensitive adhesive sheet
WO2006088179A1 (en) * 2005-02-21 2006-08-24 Kyodo Printing Co., Ltd. Adsorption film and organic el device
JP2007224129A (en) * 2006-02-23 2007-09-06 Panac Co Ltd Adhesive composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8487531B2 (en) 2010-12-24 2013-07-16 Samsung Display Co., Ltd. Encapsulation sheet, flat panel display device using the same, and method of manufacturing the flat panel display device
EP3410823A4 (en) * 2016-01-26 2019-10-23 Sumitomo Chemical Company, Limited Light-emitting device
CN115449307A (en) * 2022-09-23 2022-12-09 业泓科技(成都)有限公司 Laminated structure of adhesive
GB2624648A (en) * 2022-11-23 2024-05-29 Spandex Ltd Protective film assembly

Also Published As

Publication number Publication date
CN101766053A (en) 2010-06-30
JP5231774B2 (en) 2013-07-10
TWI482833B (en) 2015-05-01
CN101766053B (en) 2011-12-21
TW200918635A (en) 2009-05-01
JP2009062486A (en) 2009-03-26
KR20100066431A (en) 2010-06-17
KR101531727B1 (en) 2015-06-25

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