WO2009028890A3 - Chamber cover - Google Patents

Chamber cover Download PDF

Info

Publication number
WO2009028890A3
WO2009028890A3 PCT/KR2008/005061 KR2008005061W WO2009028890A3 WO 2009028890 A3 WO2009028890 A3 WO 2009028890A3 KR 2008005061 W KR2008005061 W KR 2008005061W WO 2009028890 A3 WO2009028890 A3 WO 2009028890A3
Authority
WO
WIPO (PCT)
Prior art keywords
chamber cover
plate
metal material
cover comprises
gas inlets
Prior art date
Application number
PCT/KR2008/005061
Other languages
French (fr)
Other versions
WO2009028890A2 (en
Inventor
Kil Ho Jung
Kyung Jun Kim
Sang Kyun Shim
Original Assignee
Lg Innotek Co Ltd
Kil Ho Jung
Kyung Jun Kim
Sang Kyun Shim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Innotek Co Ltd, Kil Ho Jung, Kyung Jun Kim, Sang Kyun Shim filed Critical Lg Innotek Co Ltd
Publication of WO2009028890A2 publication Critical patent/WO2009028890A2/en
Publication of WO2009028890A3 publication Critical patent/WO2009028890A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32467—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/16—Vessels
    • H01J2237/166—Sealing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Gas Exhaust Devices For Batteries (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)

Abstract

A chamber cover comprises a plate comprising metal material and one or more gas inlets formed on the plate.
PCT/KR2008/005061 2007-08-31 2008-08-28 Chamber cover WO2009028890A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070088343A KR100906906B1 (en) 2007-08-31 2007-08-31 Chamber cover
KR10-2007-0088343 2007-08-31

Publications (2)

Publication Number Publication Date
WO2009028890A2 WO2009028890A2 (en) 2009-03-05
WO2009028890A3 true WO2009028890A3 (en) 2009-04-23

Family

ID=40388028

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/005061 WO2009028890A2 (en) 2007-08-31 2008-08-28 Chamber cover

Country Status (2)

Country Link
KR (1) KR100906906B1 (en)
WO (1) WO2009028890A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020020071A (en) * 2000-09-07 2002-03-14 엄주성 Method and apparatus for helmet shell
US20050081605A1 (en) * 2003-10-20 2005-04-21 Kyoung-Hwan Chin Vacuum leakage detecting device for use in semiconductor manufacturing system
KR20060010125A (en) * 2004-07-27 2006-02-02 (주)아이씨디 Aluminum plasma chamber and method for manufacturing the same
US20060228571A1 (en) * 2003-01-14 2006-10-12 Tadahiro Ohmi Member of apparatus for plasma treatment, member of treating apparatus, apparatus for plasma treatment, treating apparatus and method of plasma treatment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100673389B1 (en) * 2004-06-03 2007-01-24 세메스 주식회사 Plasma treatment apparatus
KR101254342B1 (en) * 2006-10-17 2013-04-12 엘지전자 주식회사 Plasma generating device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020020071A (en) * 2000-09-07 2002-03-14 엄주성 Method and apparatus for helmet shell
US20060228571A1 (en) * 2003-01-14 2006-10-12 Tadahiro Ohmi Member of apparatus for plasma treatment, member of treating apparatus, apparatus for plasma treatment, treating apparatus and method of plasma treatment
US20050081605A1 (en) * 2003-10-20 2005-04-21 Kyoung-Hwan Chin Vacuum leakage detecting device for use in semiconductor manufacturing system
KR20060010125A (en) * 2004-07-27 2006-02-02 (주)아이씨디 Aluminum plasma chamber and method for manufacturing the same

Also Published As

Publication number Publication date
KR20090022735A (en) 2009-03-04
WO2009028890A2 (en) 2009-03-05
KR100906906B1 (en) 2009-07-08

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