WO2009028890A2

WO2009028890A2 - Chamber cover

Info

Publication number: WO2009028890A2
Application number: PCT/KR2008/005061
Authority: WO
Inventors: Kil Ho Jung; Kyung Jun Kim; Sang Kyun Shim
Original assignee: Lg Innotek Co., Ltd
Priority date: 2007-08-31
Filing date: 2008-08-28
Publication date: 2009-03-05
Also published as: KR20090022735A; KR100906906B1; WO2009028890A3

Abstract

A chamber cover comprises a plate comprising metal material and one or more gas inlets formed on the plate.

Description

Description CHAMBER COVER

Technical Field

[I] The present disclosure relates to a chamber cover. Background Art

[2] A semiconductor device is fabricated by selectively/repeatedly performing photolithography, etching, diffusing, chemical vapor deposition, ion implanting, and metal deposition processes.

[3] Among the processes, the etching, diffusion, and chemical vapor deposition processes are performed by injecting gas in an enclosed chamber under a predetermined atmosphere so that the process gas reacts on a wafer in the enclosed chamber.

[4] Most of the semiconductor fabrication processes are performed under a vacuum state.

Therefore, in order to precisely perform the semiconductor fabrication processes, the vacuum state must be accurately maintained.

[5] A vacuum leak detector is installed on most of the chambers to detect the vacuum state. Therefore, when the vacuum is released from the chamber, the vacuum leak detector detects this. However, even if the vacuum leak is detected, it is difficult to accurately find a location through which the vacuum leaks.

[6] Therefore, a user must check the vacuum leak while assembling and dissembling all of the parts through which the vacuum may possibly leak. To perform this, a flow flange of the chamber, on which a shower head is attached, must be opened and closed many times.

[7] Since the flow flange is formed of SUS containing chrome and nickel, a weight thereof is generally over 65kg. Accordingly, it is impossible to open and close the flow flange without the help of a machine. That is, the user must open and close the flow flange with the help of the machine.

[8] Particularly, a variety of equipments connected to the chamber must be assembled and dissembled to open and close the chamber. This is troublesome and time consuming. Disclosure of Invention

Technical Problem

[9] Embodiments provide a chamber cover.

[10] Embodiments also provide a chamber cover that can be used when a vacuum state of a chamber is checked.

Technical Solution

[I I] In an embodiment, a chamber cover comprises a plate comprising metal material and one or more gas inlets formed on the plate.

[12] The details of one or more embodiments are set forth in the accompanying drawings and the description below. Other features will be apparent from the description and drawings, and from the claims.

Advantageous Effects

[13] Embodiments can provide a chamber cover.

[14] Embodiments can provide a chamber cover that can be conveniently used when a vacuum state of a chamber is checked.

Brief Description of the Drawings

[15] Fig. 1 is a schematic view illustrating a semiconductor fabrication apparatus used in a semiconductor fabrication process.

[16] Fig. 2 is a view of a chamber cover according to an embodiment.

Mode for the Invention

[17] Reference will now be made in detail to the embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings.

[18] Fig. 1 is a schematic view illustrating a semiconductor fabrication apparatus used in a semiconductor fabrication process.

[19] Referring to Fig. 1, a semiconductor fabrication apparatus includes a chamber 10 in which at least one of deposition, plasma, diffusing, and chemical vapor deposition processes is performed, a gas supplying pipe 24 connected to an upper portion of the chamber 10, an air valve 26 that is installed on the gas supplying pipe 24 to supply or shut off gas, a mass flow controller 28 that is connected to the gas supplying pipe 24 at a rear end of the air valve 26 to control a flow rate of the gas, a shower head 14 that is installed on the upper portion of the chamber 10 to inject the gas into the chamber 10, a heater 16 that is installed on a lower portion of the chamber 10 to heat a wafer (not shown) to a predetermined temperature, a pumping line 18 connected to a lower end of the chamber 10, a pump 22 that is connected to the pumping line 18 to discharge the gas, and a sensor 21 and a controller 30 for detecting the vacuum leak.

[20] When helium gas is supplied around the chamber 10 in a state where the interior of the chamber 10 is vacuumed, the sensor 21 detects if the helium gas is introduced into the chamber 10 and discharged to the pumping line 18, thereby checking the vacuum leak of the chamber 10.

[21] The pump 22 removes unnecessary gas remaining in the chamber 10 to vacuum the chamber 10.

[22] When the semiconductor fabrication apparatus malfunctions or a predetermined period has elapsed, parts of the chamber 10 must be dissembled, cleaned, and reassembled. At this point, a gas leak state is inspected to check if there is a sealing problem between the assembled parts. [23] Particularly, doing the dissembling and reassembling of the flow flange having the shower head 14 and a plate 11 many times are troublesome and time-consuming. [24] Fig. 2 is a chamber cover according to an embodiment.

[25] A chamber cover in accordance with an embodiment is designed to be temporarily used to inspect the vacuum leak state of the semiconductor fabrication apparatus. The chamber cover includes a plate 40 and a gas inlet 42. [26] Although two or more gas inlets 42 may be provided, only one is provided in this embodiment. That is, the chamber cover is used to inspect the vacuum leak and thus it can perform its function even with only one gas inlet 42. [27] That is, after the vacuum leak state is checked by coupling the chamber cover to the chamber 10, when it is determined that no vacuum leak occurs, the chamber cover is separated from the chamber 10 and subsequently the flow flange including the shower head 14 and the plate 11 is coupled to the chamber 10. [28] Therefore, the vacuum leak occurring by the parts except for the flow flange can be inspected in a state where the chamber cover is coupled. [29] Since the chamber cover has a simpler structure than the flow flange and is lighter in weight than the flow flange, it can be conveniently used to inspect the vacuum leak. [30] A thickness tl of a plate 40 of the chamber cover may be 10-100 mm. A tensile strength and yield strength of the plate 40 may be respectively 13-17 kgf/cm² and 8-12 kgf/cm². [31] The plate is formed of metal material such as aluminum alloy that is relatively lighter in weight. For example, a weight of the plate may be 5-20 kg. Therefore, the user can separate the chamber cover from the chamber 10 without the help of the machine. [32] An O-ring 41 may be installed on an undersurface of the plate 40 to prevent the vacuum leak. [33] The gas inlet 42 is installed on the plate 40. A vacuum converter refining (VCR) type fitting may be used as the gas inlet 42. [34] In order to separate the chamber cover from the chamber 10 after inspecting the vacuum leak of the chamber 10, there is a need to release the vacuum state of the interior of the chamber 10. Therefore, nitrogen gas N₂ is injected through the gas inlet

42 to release the vacuum state of the interior of the chamber 10. [35] As described above, the limitations caused by opening and closing the flow flange many times to check the vacuum leak of the chamber can be solved by the chamber cover of the embodiment. [36] Since the chamber cover is designed to be lighter in weight and to be easily coupled to and separated from the chamber, the vacuum leak of the chamber can be effectively inspected using the chamber cover. [37] Although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art. Industrial Applicability

[38] The chamber cover of the embodiment can be used to inspect the vacuum leak of the chamber.

Claims

[ 1 ] A chamber cover comprising: a plate comprising metal material; and one or more gas inlets formed on the plate. [2] The chamber cover according to claim 1, wherein the plate is formed of aluminum alloy. [3] The chamber cover according to claim 1, wherein the number of the gas inlets is one. [4] The chamber cover according to claim 1, wherein a thickness and weight of the plate are respectively 10-100 mm and 5-20 kg. [5] The chamber cover according to claim 1, wherein a tensile strength and and yield strength of the plate are respectively 13-17 kgf/cm² and 8-12 kgf/cm². [6] The chamber cover according to claim 1, comprising an O-ring disposed on an undersurface of the plate. [7] The chamber cover according to claim 6, wherein only the gas inlet and the O- ring are formed on or under the plate. [8] The chamber cover according to claim 1, wherein the gas inlet is a vacuum converter refining fitting.