WO2009022921A1 - Étiquette rfid, et procédé de fabrication d'une étiquette rfid - Google Patents

Étiquette rfid, et procédé de fabrication d'une étiquette rfid Download PDF

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Publication number
WO2009022921A1
WO2009022921A1 PCT/NZ2008/000208 NZ2008000208W WO2009022921A1 WO 2009022921 A1 WO2009022921 A1 WO 2009022921A1 NZ 2008000208 W NZ2008000208 W NZ 2008000208W WO 2009022921 A1 WO2009022921 A1 WO 2009022921A1
Authority
WO
WIPO (PCT)
Prior art keywords
rfid tag
sheet
forming
tag
conductive
Prior art date
Application number
PCT/NZ2008/000208
Other languages
English (en)
Inventor
Mathias Martin Ernest Ehlen
Original Assignee
Times-7 Holdings Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Times-7 Holdings Limited filed Critical Times-7 Holdings Limited
Publication of WO2009022921A1 publication Critical patent/WO2009022921A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole

Definitions

  • This invention relates to an RFID tag (a radio frequency identification tag) and a method of forming an RFID tag.
  • an RFID chip is embedded within an opening in a composite sheet.
  • a conductive sheet on a dielectric sheet is divided into two parts and an RFID chip drives the two parts.
  • Passive UHF RFID tags are generally constructed by either etching a printed circuit board, or by printing conductive ink onto a substrate. Solid state dielectrics and additional conductive sheets are often added to a tag to make- it robust, or to provide the desired operating characteristics such as the ability to operate near metal objects. Such techniques often require complex manufacturing processes and/or use expensive materials making the tags expensive.
  • a method of forming an RFID tag comprising the steps of: a. providing a composite sheet comprising a dielectric sheet sandwiched between first and second conductive sheets; b. forming an opening through the first conductive sheet and dielectric sheet through to the second conductive sheet; c. inserting an RFID chip into the opening in the dielectric sheet; and d. coupling the chip to the first and second conductive sheets.
  • an- RFID tag comprising: a. ⁇ a composite sheet comprising a dielectric sheet sandwiched between first and second conductive sheets; and b. an RFID chip located within a cavity in the dielectric sheet and coupled to the first and second conductive sheets.
  • an RFID tag comprising the steps of: a. providing a composite sheet comprising a dielectric sheet secured to a first conductive sheet; b. dividing the first conductive sheet into first and second portions; and c. coupling an RFID chip to the first and second portions.
  • an RFID tag comprising: a. a composite sheet comprising a dielectric sheet secured to a first conductive sheet, wherein the first conductive sheet is divided into first and second portions; and b. an RFID chip coupled to the first and second portions.
  • Figure 1 shows a perspective view of a composite sheet for forming an antenna according to one embodiment
  • Figure 2 shows the composite sheet of figure 1 with an opening formed therein
  • Figure 3 shows an exploded view of the components of an RFlD antenna according to one embodiment
  • Figure 4 shows an assembled RFlD tag
  • Figure 5 shows an RFID tag and a protective cover
  • Figure 6 shows an RFiD tag with a protective cover
  • Figure 7 shows a perspective view of composite sheet for forming an RFID tag according to another embodiment
  • Figure 8 shows a groove formed in the composite sheet shown in figure 7;
  • Figure 9 shows an RFID chip applied to the composite sheet of figure 8.
  • LO Figure 10 shows an RFlD tag formed according to a further embodiment
  • Figure 11 shows an RFID tag formed according to a further embodiment
  • Figure 12 shows an RFID tag formed according to a further embodiment
  • Figure 13 shows an RFID tag formed according to a further embodiment
  • Figure 14 shows an RFID tag formed according to a further embodiment
  • an RFID tag utilizes an antenna that may be formed from a composite sheet such as a construction grade building panel.
  • a method of 15 forming such an RFID tag will now be described with reference to figures 1 to 6.
  • Figure 1 shows a composite sheet 1 consisting of a dielectric layer 2 sandwiched between conductive sheets 3 and 4.
  • the conductive sheets 3 and 4 may be copper, aluminium, stainless steel or any other suitable conductive material.
  • the dielectric sheet 2 may be formed of any suitable dielectric material, polyethylene or polypropylene are preferred as these materials are inexpensive and are commonly employed in low cost construction grade building materials which can be used in this embodiment.
  • the dielectric sheet is preferably more than 3 mm thick and preferably more than 4 mm thick. A dielectric sheet of about 6 mm thickness has been found provide satisfactory results. Lesser thicknesses will operate with a lesser bandwidth.
  • an opening 5 may be formed in conductive sheet 3 and dielectric sheet 2 of composite sheet 1 by any suitable method such as drilling, milling, routing etc.
  • a conductive coupling element 7 may be placed within an opening 5 with a chip 6 placed on top of it.
  • Conductive coupling 7 provides capacitive coupling with conductive sheet 3.
  • a resilient foam insert 9 may be applied on top of RFID chip 6 to retain it in place.
  • Sheets 3 and 4 may be capacitively coupled together by coupling strip 8 along an edge of composite sheet remote from opening 5.
  • Coupling strip 8 may include a dielectric layer between a conductive coupling sheet and conductive sheets 3 and 4.
  • the capacitance of the coupling may be adjusted so that the capacitance of the coupling strip 8 and the inductance of the antenna form of a resonant circuit at a design operating frequency of the RFID tag.
  • RFID chip 6 is preferably held to conductive sheet 3 at a position a quarter of a wavelength away from the edge of conductive sheet 3 proximate coupling strip 8.
  • a protective housing a 10 may be provided about the RFID tag to provide additional protection, if required.
  • the foam insert 9 may be replaced with a dielectric substance such as glue, silicon paste, or epoxy resin.
  • Composite sheet 21 of the same form as composite sheet 1 of the previous embodiment is used.
  • Composite sheet 21 consists of a dielectric sheet 22 sandwiched between conductive sheets 23 and 24.
  • a groove 25 is formed in conductive sheet 23 to form portions 23a and 23b.
  • potion 23a forms a monopole antenna and portion 23b forms of a stub.
  • an RFID chip 26 is positioned to the groove 25 so that it is.capacitively coupled to portions 23a and 23b.
  • potions 23a and 23b may be of the same size so that a dielectric antenna is formed.
  • the RFID chip may be affixed using an RFID strap which contains the RFID chip and small quantities of conductive material in a sticky label format, or similar.
  • Figure 10 shows a further embodiment, similar to figure 9 (and using the same reference numerals), in which RFID chip 26 has been forced into dielectric material 22 so as to be embedded within dielectric material 22 and conductively coupled to portions 23a and 23b.
  • This arrangement has the advantage that RFID chip 26 is at or below the surface of composite sheet 21 and is protected thereby.
  • Figure 1 1 shows another embodiment in which a nonrectangular geometry is employed. It will be appreciated by one skilled in the field at a variety of geometries may be employed depending upon the requirements of a particular application.
  • a large antenna portion 23c and a small triangular stub 23d are formed by groove 27 dividing conductive sheet 23.
  • RFID chip 26 is capacitively coupled to portions 23c and 23d.
  • Figure 12 shows an embodiment, similar to the embodiment of figures 1 to 6 in which apertures 1 1 are formed through composite sheet 1 to facilitate mounting of the RFID tag.
  • capacitive coupling 12 extends along only a portion of an edge of composite sheet 1.
  • Figure 13 shows an embodiment in which portions of conductive sheet 14 have been removed from regions 13 to provide improved operation of over a broad bandwidth.
  • Figure 14 shows a further embodiment in which a plurality of rivets 15 are provided along an edge to electrically couple conductive sheets 16 and 17 along one edge.
  • the composite sheet may be efficiently and accurately formed from larger sheets of construction grade building panel by stamping or pneumatically pressing it in the desired shape and size.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une étiquette d'identification radiofréquence (RFID) en fournissant un premier panneau comprenant des première et seconde feuilles conductrices fixées sur une feuille de matériau diélectrique et formant un ou plusieurs éléments de rayonnement dans les feuilles conductrices en couplant une puce RFID aux deux feuilles conductrices. Le premier panneau peut être un panneau de bâtiment de catégorie construction ou un panneau approprié similaire. Le procédé permet de fabriquer des étiquettes RFID en utilisant des matériaux peu coûteux à l'aide de processus de fabrication peu coûteux. L'invention concerne également un procédé de fabrication d'une étiquette d'identification radiofréquence (RFID) en fournissant un premier panneau comprenant une première feuille conductrice fixée sur une feuille de matériau diélectrique, et en formant un ou plusieurs éléments de rayonnement dans la feuille conductrice en formant des rainures dans la feuille conductrice. Le premier panneau peut être un panneau de bâtiment de catégorie construction ou un panneau approprié similaire. Le procédé permet de fabriquer des antennes de panneau en utilisant des matériaux peu coûteux à l'aide de processus de fabrication peu coûteux.
PCT/NZ2008/000208 2007-08-16 2008-08-13 Étiquette rfid, et procédé de fabrication d'une étiquette rfid WO2009022921A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NZ56071907 2007-08-16
NZ560719 2007-08-16

Publications (1)

Publication Number Publication Date
WO2009022921A1 true WO2009022921A1 (fr) 2009-02-19

Family

ID=40350878

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NZ2008/000208 WO2009022921A1 (fr) 2007-08-16 2008-08-13 Étiquette rfid, et procédé de fabrication d'une étiquette rfid

Country Status (1)

Country Link
WO (1) WO2009022921A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016119564A1 (fr) * 2015-01-26 2016-08-04 Jingmeng Sun Étiquette rf comprenant une structure de circuit de résonance

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000042569A1 (fr) * 1999-01-13 2000-07-20 Brady Worldwide, Inc. Étiquette rfid stratifiee et son procede de fabrication
US20060000915A1 (en) * 2004-07-01 2006-01-05 Intermec Lp Corp. RFID tag and method of manufacture
US20060032926A1 (en) * 2004-08-13 2006-02-16 Fujitsu Limited Radio frequency identification (RFID) tag and manufacturing method thereof
US20060091225A1 (en) * 2003-11-04 2006-05-04 Forster Ian J RFID tag using a surface insensitive antenna structure
WO2006062175A1 (fr) * 2004-12-07 2006-06-15 Semiconductor Energy Laboratory Co., Ltd. Dispositif semi-conducteur et procédé de fabrication dudit dispositif
US20060255945A1 (en) * 2005-05-13 2006-11-16 3M Innovative Properties Company Radio frequency identification tags for use on metal or other conductive objects

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000042569A1 (fr) * 1999-01-13 2000-07-20 Brady Worldwide, Inc. Étiquette rfid stratifiee et son procede de fabrication
US20060091225A1 (en) * 2003-11-04 2006-05-04 Forster Ian J RFID tag using a surface insensitive antenna structure
US20060000915A1 (en) * 2004-07-01 2006-01-05 Intermec Lp Corp. RFID tag and method of manufacture
US20060032926A1 (en) * 2004-08-13 2006-02-16 Fujitsu Limited Radio frequency identification (RFID) tag and manufacturing method thereof
WO2006062175A1 (fr) * 2004-12-07 2006-06-15 Semiconductor Energy Laboratory Co., Ltd. Dispositif semi-conducteur et procédé de fabrication dudit dispositif
US20060255945A1 (en) * 2005-05-13 2006-11-16 3M Innovative Properties Company Radio frequency identification tags for use on metal or other conductive objects

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016119564A1 (fr) * 2015-01-26 2016-08-04 Jingmeng Sun Étiquette rf comprenant une structure de circuit de résonance
US9460379B2 (en) 2015-01-26 2016-10-04 Neoid Limited (Shenzhen) RF tag with resonant circuit structure

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