WO2009022405A1 - Photosensitive polyimide precursor composition and electronic part made with the same - Google Patents

Photosensitive polyimide precursor composition and electronic part made with the same Download PDF

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Publication number
WO2009022405A1
WO2009022405A1 PCT/JP2007/065806 JP2007065806W WO2009022405A1 WO 2009022405 A1 WO2009022405 A1 WO 2009022405A1 JP 2007065806 W JP2007065806 W JP 2007065806W WO 2009022405 A1 WO2009022405 A1 WO 2009022405A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide precursor
photosensitive polyimide
precursor composition
same
electronic part
Prior art date
Application number
PCT/JP2007/065806
Other languages
French (fr)
Japanese (ja)
Inventor
Hisashi Tanda
Tomohiro Nodu
Yoshino Tanaka
Takashi Yokoyama
Original Assignee
I.S.T. Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by I.S.T. Corporation filed Critical I.S.T. Corporation
Priority to PCT/JP2007/065806 priority Critical patent/WO2009022405A1/en
Publication of WO2009022405A1 publication Critical patent/WO2009022405A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Abstract

A photosensitive polyimide resin composition which has properties inherent in polyimide resins, such as heat resistance, electrical properties, mechanical properties, and incombustibility, is excellent in adhesion, flexibility, etc., can form a cover lay film reduced in molding warpage, and can be developed with a weakly alkaline solution of an inorganic alkali. The photosensitive polyimide precursor composition comprises at least one polyimide precursor, a photosensitizer, and a polar organic solvent. The polyimide precursor is obtained by the polymerization of at least one aromatic tetracarboxylic dianhydride with at least one aromatic diamine selected among aromatic diamines respectively represented by the following chemical formulae (I) and (II).
PCT/JP2007/065806 2007-08-13 2007-08-13 Photosensitive polyimide precursor composition and electronic part made with the same WO2009022405A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/065806 WO2009022405A1 (en) 2007-08-13 2007-08-13 Photosensitive polyimide precursor composition and electronic part made with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/065806 WO2009022405A1 (en) 2007-08-13 2007-08-13 Photosensitive polyimide precursor composition and electronic part made with the same

Publications (1)

Publication Number Publication Date
WO2009022405A1 true WO2009022405A1 (en) 2009-02-19

Family

ID=40350469

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/065806 WO2009022405A1 (en) 2007-08-13 2007-08-13 Photosensitive polyimide precursor composition and electronic part made with the same

Country Status (1)

Country Link
WO (1) WO2009022405A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113292727A (en) * 2021-05-07 2021-08-24 东华大学 Ultraviolet radiation resistant polyimide and preparation method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04284455A (en) * 1991-03-14 1992-10-09 Toshiba Corp Photosensitive resin composition
JPH055996A (en) * 1991-01-17 1993-01-14 Toshiba Corp Method of forming pattern
JPH10307394A (en) * 1997-05-09 1998-11-17 Hitachi Ltd Positive photosensitive resin composition and pattern forming method by using the same and method of manufacture of electronic device
JPH1165119A (en) * 1997-08-22 1999-03-05 Ube Ind Ltd Positive photosensitive polyamidoacid composition and pattern forming method
JPH11282157A (en) * 1997-10-31 1999-10-15 Nippon Zeon Co Ltd Polymide type photosensitive composition
JP2003035950A (en) * 2001-05-15 2003-02-07 Hitachi Cable Ltd Photosensitive polyimide resin composition
JP2005091479A (en) * 2003-09-12 2005-04-07 Fuji Photo Film Co Ltd Photosensitive composition
JP2005309215A (en) * 2004-04-23 2005-11-04 Hitachi Chemical Dupont Microsystems Ltd Photosensitive polymer composition, method for manufacturing relief pattern by using the same, and electronic component
JP3882817B2 (en) * 2001-09-26 2007-02-21 日産化学工業株式会社 Positive photosensitive polyimide resin composition

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH055996A (en) * 1991-01-17 1993-01-14 Toshiba Corp Method of forming pattern
JPH04284455A (en) * 1991-03-14 1992-10-09 Toshiba Corp Photosensitive resin composition
JPH10307394A (en) * 1997-05-09 1998-11-17 Hitachi Ltd Positive photosensitive resin composition and pattern forming method by using the same and method of manufacture of electronic device
JPH1165119A (en) * 1997-08-22 1999-03-05 Ube Ind Ltd Positive photosensitive polyamidoacid composition and pattern forming method
JPH11282157A (en) * 1997-10-31 1999-10-15 Nippon Zeon Co Ltd Polymide type photosensitive composition
JP2003035950A (en) * 2001-05-15 2003-02-07 Hitachi Cable Ltd Photosensitive polyimide resin composition
JP3882817B2 (en) * 2001-09-26 2007-02-21 日産化学工業株式会社 Positive photosensitive polyimide resin composition
JP2005091479A (en) * 2003-09-12 2005-04-07 Fuji Photo Film Co Ltd Photosensitive composition
JP2005309215A (en) * 2004-04-23 2005-11-04 Hitachi Chemical Dupont Microsystems Ltd Photosensitive polymer composition, method for manufacturing relief pattern by using the same, and electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113292727A (en) * 2021-05-07 2021-08-24 东华大学 Ultraviolet radiation resistant polyimide and preparation method thereof

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