WO2009020052A1 - Coating method - Google Patents

Coating method Download PDF

Info

Publication number
WO2009020052A1
WO2009020052A1 PCT/JP2008/063798 JP2008063798W WO2009020052A1 WO 2009020052 A1 WO2009020052 A1 WO 2009020052A1 JP 2008063798 W JP2008063798 W JP 2008063798W WO 2009020052 A1 WO2009020052 A1 WO 2009020052A1
Authority
WO
WIPO (PCT)
Prior art keywords
main body
adhesion layer
wafer
tool main
sidewall
Prior art date
Application number
PCT/JP2008/063798
Other languages
French (fr)
Japanese (ja)
Inventor
Takeshi Segawa
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corporation filed Critical Lintec Corporation
Publication of WO2009020052A1 publication Critical patent/WO2009020052A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

A wafer is protected against damage at the time of forming a predetermined film, by dripping coating agent on the surface of the wafer which is ground extremely thinly through a back grind step and then by smoothing the surface. A wafer W is carried under such a state as a fixing tool (1) is fixed tightly to one side of the wafer and then it is held by a coating device. The fixing tool consists of a planar tool main body (2), and an adhesion layer (3) provided on one side of the tool main body in order to tightly holding a semiconductor wafer removably. The tool main body is provided, on one side thereof, with a plurality of protrusions (4)for supporting the adhesion layer and, at the outer periphery on one side thereof, with a sidewall (5) having a height equal to that of the supporting protrusion. The adhesion layer is bonded to the end face of the sidewall and a section space (6) surrounded by the sidewall is defined between the adhesion layer and the tool main body, a vent (7) communicating with the section space is formed in the tool main body, and the adhesion layer is deformed by sucking air in the section space through the vent.
PCT/JP2008/063798 2007-08-09 2008-07-31 Coating method WO2009020052A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-208265 2007-08-09
JP2007208265A JP2009043997A (en) 2007-08-09 2007-08-09 Coating method

Publications (1)

Publication Number Publication Date
WO2009020052A1 true WO2009020052A1 (en) 2009-02-12

Family

ID=40341286

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063798 WO2009020052A1 (en) 2007-08-09 2008-07-31 Coating method

Country Status (3)

Country Link
JP (1) JP2009043997A (en)
TW (1) TW200923586A (en)
WO (1) WO2009020052A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010239026A (en) * 2009-03-31 2010-10-21 Tokyo Electron Ltd Substrate holding member and liquid treatment apparatus
KR101534357B1 (en) 2009-03-31 2015-07-06 도쿄엘렉트론가부시키가이샤 Substrate support device and substrate support method
JP5757649B2 (en) * 2011-02-14 2015-07-29 信越ポリマー株式会社 Holding jig
CN104465459A (en) * 2014-11-12 2015-03-25 南通富士通微电子股份有限公司 Process for brushing wafer with glue

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006318984A (en) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd Stationary carrier and manufacturing method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006318984A (en) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd Stationary carrier and manufacturing method thereof

Also Published As

Publication number Publication date
TW200923586A (en) 2009-06-01
JP2009043997A (en) 2009-02-26

Similar Documents

Publication Publication Date Title
WO2007103703A3 (en) Polishing head for polishing semiconductor wafers
US11637074B2 (en) Method of processing wafer
TW200715396A (en) Manufacturing method for a semiconductor device
US8124455B2 (en) Wafer strength reinforcement system for ultra thin wafer thinning
SG116648A1 (en) Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same.
TW200636905A (en) Suction device, polishing device, semiconductor device and manufacturing method of semiconductor device
KR102445608B1 (en) Wafer processing method
WO2009132003A3 (en) Methods and apparatus for low cost and high performance polishing tape for substrate bevel and edge polishing in semiconductor manufacturing
EP1895581A3 (en) Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet
WO2009020051A1 (en) Securing tool and work processing method
KR102450305B1 (en) Wafer processing method
WO2009006284A3 (en) Semiconductor die having a redistribution layer
WO2006038030A3 (en) Equipment for wafer bonding
WO2009059128A3 (en) Crystalline-thin-film photovoltaic structures and methods for forming the same
WO2009020052A1 (en) Coating method
WO2009032536A3 (en) Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby
WO2009020050A1 (en) Work carrying method and device with work transfer mechanism
EP2762272A3 (en) Wafer polishing apparatus and method
WO2011159536A3 (en) A splicing technique for fixed abrasives used in chemical mechanical planarization
KR20140095008A (en) Roller
JP2012209480A (en) Processing method of electrode-embedded wafer
US8895363B2 (en) Die preparation for wafer-level chip scale package (WLCSP)
TW200735271A (en) Semiconductor device fabrication method
CN108471704B (en) Support for flexible workpieces
WO2006088737A3 (en) Semiconductor cleaning

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08792013

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08792013

Country of ref document: EP

Kind code of ref document: A1