WO2009017741A1 - Soupape à commande thermique - Google Patents

Soupape à commande thermique Download PDF

Info

Publication number
WO2009017741A1
WO2009017741A1 PCT/US2008/009183 US2008009183W WO2009017741A1 WO 2009017741 A1 WO2009017741 A1 WO 2009017741A1 US 2008009183 W US2008009183 W US 2008009183W WO 2009017741 A1 WO2009017741 A1 WO 2009017741A1
Authority
WO
WIPO (PCT)
Prior art keywords
valve
thermally actuated
predetermined temperature
biasing member
actuated valve
Prior art date
Application number
PCT/US2008/009183
Other languages
English (en)
Inventor
Changqi Liu
Original Assignee
Therm-O-Disc Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Therm-O-Disc Incorporated filed Critical Therm-O-Disc Incorporated
Publication of WO2009017741A1 publication Critical patent/WO2009017741A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/002—Actuating devices; Operating means; Releasing devices actuated by temperature variation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/02—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature
    • G05D23/08—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature with bimetallic element
    • G05D23/10—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature with bimetallic element with snap-action elements

Definitions

  • the present disclosure relates generally to thermal valves and more particularly to thermal valves having a bimetal disc for controlling passage of fluid through a fluid orifice.
  • Thermal valves have been used for controlling temperature of apparatuses to which the thermal valves are mounted.
  • One type of thermal valve is a temperature control pressure release valve (TCPR valve).
  • a TCPR valve uses a bimetal disc for controlling passage of fluid through a fluid orifice around which the thermal valve is mounted. The bimetal disc moves between two positions, i.e., an open position and a closed position. The bimetal disc blocks the fluid orifice in the normally closed position and flexes away from the fluid orifice in the open position. When the apparatus is in the normal operating temperature range, the bimetal disc blocks the fluid orifice.
  • the bimetal disc When the environment temperature rises to a threshold temperature, the bimetal disc flexes to open the fluid orifice to allow a high-temperature working fluid received adjacent to the thermal valve to vent through the fluid orifice to reduce the temperature of the apparatus. As the temperature of the apparatus drops to within the normal operating temperature range, the bimetal disc flexes back to its normally closed position and blocks the fluid orifice.
  • the known thermal valve has a disadvantage of limiting the flow rate of working fluid passing through the fluid orifice.
  • a space is formed between the bimetal disc and a wall that defines the fluid orifice. Due to the small travel distance of the bimetal disc, the space is small and the working fluid that is allowed to enter this space and vent through the fluid orifice is limited per unit time. Therefore, the ability of the thermal valve to reduce the temperature of the apparatus is limited.
  • a thermally actuated valve includes a valve body comprising a fluid port, a valve member comprising a bimetal disc, and a first biasing member.
  • the bimetal disc is movable at a first predetermined temperature between a seated position and an unseated position.
  • the valve member is adapted to close the fluid port in the seated position and open the fluid port in the unseated position.
  • the first biasing member is located intermediate the valve member and the valve body and is made from a shape memory alloy material. At the first predetermined temperature, the first biasing member biases the valve member toward one of the seated position and the unseated position.
  • a thermally actuated valve includes a valve body having an orifice, a bimetal disc movable between a first position and a second position, and a first spring element located between the bimetal disc and the orifice and made from a shape memory alloy.
  • the bimetal disc closes the orifice when in the first position and opens the orifice when in the second position.
  • the bimetal disc is movable from the first position to the second position at a predetermined temperature threshold.
  • the first spring element changes from a first length to a second length that is larger than the first length at the predetermined temperature threshold.
  • Figure 1 is a partial cross-sectional front view of a compressor showing one exemplary application of a thermal valve in accordance with the present disclosure
  • Figure 2 is a partial cross-sectional exploded perspective view of an exemplary thermal valve of a first embodiment
  • Figure 3 is a partial cross-sectional perspective view of an exemplary thermal valve of a first embodiment in a normally closed position;
  • Figure 4 is a partial cross-sectional perspective view of an exemplary thermal valve of a first embodiment in an open position;
  • Figure 5 is a partial cross-sectional exploded perspective view of an exemplary thermal valve of a second embodiment.
  • Figure 6 is a partial cross-sectional perspective view of an exemplary thermal valve of a second embodiment.
  • FIG. 1 depicts a compressor 10 which exemplifies one application of a thermal valve 12.
  • the thermal valve 12 is mounted to a partition wall 14 which divides the compressor 10 into a low pressure zone 16 (also called a suction pressure zone) and a high pressure zone 18 (also called a discharge pressure zone).
  • the partition wall 14 has a fluid passageway 19 communicating between the low pressure zone 16 and the high pressure zone 18.
  • the thermal valve 12 is mounted around the fluid passageway 19 for controlling passage of fluid through the fluid passageway 19.
  • the compressor 10 has a compression unit 21 for compressing a working fluid. After the working fluid is compressed, the compressed fluid is delivered from the compressor unit 21 to the high pressure zone 18 and then discharged to, for example, an external refrigeration system through a discharge fitting 23.
  • the compressed working fluid discharged to the high pressure zone 18 generally has a high temperature and causes the temperature of the high pressure zone 18 to rise.
  • the thermal valve 12 includes a valve body 20, a cover 22 mounted on the valve body 20.
  • the valve body 20 and the cover 22 jointly define a valve space 24.
  • the thermal valve 12 further includes a bimetal disc 26, a first spring element 28 and a second spring element 30 received in the valve space 24.
  • the valve body 20 includes an engagement portion 32 and a support portion 34.
  • the engagement portion 32 is shown to have a threaded outer surface 36 and a central passageway 38 and is to be threaded into a valve seat formed around the fluid passageway 19 of the partition wall 14.
  • the valve body 20 may be installed in the partition wall 14 by any of a variety of well-know methods, such as welding for example.
  • the central passageway 38 is in communication with the fluid passageway 19 of the partition wall 14.
  • the support portion 34 has an orifice 40 communicating with the central passageway 38 and positioning features for positioning and supporting the bimetal disc 26, the first spring element 28 and the second spring element 30 in the valve space 24.
  • the positioning features may include a plurality of grooves and/or annular surfaces.
  • the bimetal disc 26 has a central concaved portion in the form of a central disc dimple 42 and a plurality of vent apertures 44.
  • the first spring element 28 and the second spring element 30 are preferably in the form of a coil spring and disposed on opposite sides of the bimetal disc 26.
  • the first spring element 28 is provided between the support portion 34 of the valve body 20 and the bimetal disc 26 and is preferably made of a shape memory alloy.
  • the second spring element 30 is provided between the bimetal disc 26 and the cover 22 and is preferably made of spring steel, although it may be made from a shape memory alloy, as described further herein, depending on the application for the valve 12.
  • the cover 22 has an opening 46 for allowing the high-temperature working fluid to enter the thermal valve 12.
  • the bimetal disc 26 when the thermal valve 12 is in its normally closed position, the bimetal disc 26 is in a concave upward position and the central disc dimple 42 extends into and blocks the orifice 40.
  • the bimetal disc 26 is plastically formed and thermally treated so that the bimetal disc 26 remains in the closed position in a range of normal operating temperatures.
  • the bimetal disc 26 when the temperature of the high pressure zone 18 rises to a threshold temperature, the bimetal disc 26 snaps from the concave upward position to a concave downward position and the central disc dimple 42 is moved away from the orifice 40 to open the orifice 40.
  • the first spring element 28 is thermally treated to have different lengths at different temperatures, depending on specific applications.
  • the first spring element 28 may be made of shape memory alloy and may be properly heat-treated so that the first spring element 28 undergoes an austenite transformation from a martensite phase at a transformation temperature, which is set to be equal to the threshold temperature when the bimetal disc 26 changes its position.
  • the first spring element 28 is properly treated to have a contracted, deformed length L1 at the normal operating temperature T1 and an expanded, recovered length L2 at a threshold temperature T2, wherein L2 is greater than L1.
  • the first spring element 28 can have a specific spring rate by properly choosing the diameter of the coil wire of the shape memory alloy.
  • the second spring element 30 biases the bimetal disc 26 against the surface 48 of the support portion 34 with the first spring element 28 in a contracted, deformed configuration. Because the first spring element 28 in the contracted, deformed configuration is received in the groove 43 with an upper end slightly contacting or not in contact with the bimetal disc 26, the first spring element 28 applies only a small force or no force at all against the bimetal disc 26.
  • the second spring element 30 can effectively bias the bimetal disc 26 against the surface 48 of the support portion 34 to ensure good sealing between the bimetal disc 26 and the surface 48.
  • the bimetal disc 26 flexes in a snap acting manner to move the central disc dimple 42 away from the orifice 40.
  • the first spring element 28 expands from the contracted, deformed length L1 to the expanded, recovered length L2 and contacts the bimetal disc 26.
  • the increased length (L2>L1 ) of the first spring element 28 biases the bimetal disc 26 against the second spring element 30 and moves the bimetal disc 26 further away from the orifice 40.
  • the space between the bimetal disc 26 and a surface 48 that defines the orifice 40 is increased.
  • the temperature of the high pressure zone 18 starts to drop.
  • the bimetal disc 26 flexes back to its original position.
  • the first spring element 28 returns to the deformed length L1 from L2 and retracts into the groove 43, no longer exerting a biasing force against the bimetal disc 26.
  • the bimetal disc 26 can flex back to contact the surface 48 through its own action to close the orifice 40.
  • the second spring element 30 further presses the bimetal disc 26 against the surface 48 of the support portion 34 to improve sealing between the bimetal disc 26 and the surface 48.
  • both the first spring element and the second spring element can be made from shape memory alloy.
  • the first spring element and the second spring element act in an opposite manner at the threshold temperature.
  • the shape memory alloy second spring 30 can contract to reduce the biasing force which must be overcome by the first spring element 28 in order to effectively move the bimetal disc 26 away from the orifice.
  • the same effect can be achieved by properly balancing the spring force of the two spring elements.
  • the side of the bimetal disc 28 adjacent to the first spring element is the disc low expansion side (LES) 1 whereas the side of the bimetal disc 28 adjacent to the second spring element 30 is the disc high expansion side (HES).
  • the first spring element 28 may be designed to provide a spring force on the LES larger than the combining force applying to the HES at the threshold temperature.
  • the combining force is the sum of the force caused by the pressure difference between the HES side and the LES side and the spring force of the second spring element.
  • thermal valve 50 has a structure similar to that of the thermal valve 12 except the valve cover 52.
  • the valve cover 52 in this embodiment has a plurality of vent apertures 54 around the central opening 56, thereby allowing more working fluid to enter the thermal valve 50 and flow through the fluid passageway 19 when the thermal valve 50 is in the open position.
  • the space between the bimetal disc 26 and the surface 48 that defines the orifice 40 is increased when the bimetal disc 26 is in the open position. Therefore, the flow rate of the working fluid flowing through the fluid orifice 40 is increased and the high-temperature compressed working fluid can be more quickly vented into the low pressure zone 16 to more quickly reduce the temperature of the high pressure zone 18. Due to the increased flow rate, the fluid orifice and, hence, the valve, may be made smaller than a conventional valve to achieve similar pressure reduction within a desired time period.
  • a thermally actuated valve has the advantage of controlling the pressure under operating conditions which exhibit temperature differences only over a small range.
  • the amount of "snap action" travel of the bimetal disc resulting from a temperature change depends on the material composition of the bimetal disc and the temperature change that it experiences.
  • the "snap action" travel distance of the bimetal disc is generally decreased when the temperature change is small.
  • the fluid orifice may not be completely open if the snap travel of the bimetal disc is decreased.
  • the first spring element that is made of shape memory alloy can further push the bimetal disc away from the orifice after the bimetal disc changes its position due to a temperature change.
  • the first spring element increases the "snap action" travel distance of the bimetal disc to completely open the orifice.
  • the thermally actuated valve of the present disclosure may be operable under operating conditions which exhibit a temperature change as small as about 50 0 F.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Temperature-Responsive Valves (AREA)

Abstract

L'invention concerne une soupape à commande thermique qui comprend un corps de soupape ayant un orifice, un disque bilame, un premier élément de ressort situé sur un côté du disque bilame et un second élément de ressort situé sur le côté opposé du disque bilame. Le disque bilame est déplaçable entre une première position et une seconde position. Le disque bilame ferme l'orifice lorsqu'il est dans la première position et ouvre l'orifice lorsqu'il est dans la seconde position. Le premier élément de ressort et/ou le second élément de ressort est fait à partir d'un alliage à mémoire de forme.
PCT/US2008/009183 2007-07-30 2008-07-30 Soupape à commande thermique WO2009017741A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US95264807P 2007-07-30 2007-07-30
US60/952,648 2007-07-30

Publications (1)

Publication Number Publication Date
WO2009017741A1 true WO2009017741A1 (fr) 2009-02-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/009183 WO2009017741A1 (fr) 2007-07-30 2008-07-30 Soupape à commande thermique

Country Status (1)

Country Link
WO (1) WO2009017741A1 (fr)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150118076A1 (en) * 2013-10-31 2015-04-30 Emerson Climate Technologies, Inc. Compressor with improved valve assembly
CN106321429A (zh) * 2015-07-01 2017-01-11 艾默生环境优化技术有限公司 具有热保护系统的压缩机
US20170241419A1 (en) * 2016-02-24 2017-08-24 Lg Electronics Inc. Hermetic compressor
US9989057B2 (en) 2014-06-03 2018-06-05 Emerson Climate Technologies, Inc. Variable volume ratio scroll compressor
US10066622B2 (en) 2015-10-29 2018-09-04 Emerson Climate Technologies, Inc. Compressor having capacity modulation system
US10094380B2 (en) 2012-11-15 2018-10-09 Emerson Climate Technologies, Inc. Compressor
CN109140004A (zh) * 2017-06-28 2019-01-04 通用汽车环球科技运作有限责任公司 被动致动式可复位阀
US10323638B2 (en) 2015-03-19 2019-06-18 Emerson Climate Technologies, Inc. Variable volume ratio compressor
US10378540B2 (en) 2015-07-01 2019-08-13 Emerson Climate Technologies, Inc. Compressor with thermally-responsive modulation system
US10495086B2 (en) 2012-11-15 2019-12-03 Emerson Climate Technologies, Inc. Compressor valve system and assembly
US10598180B2 (en) 2015-07-01 2020-03-24 Emerson Climate Technologies, Inc. Compressor with thermally-responsive injector
US10753352B2 (en) 2017-02-07 2020-08-25 Emerson Climate Technologies, Inc. Compressor discharge valve assembly
US10801495B2 (en) 2016-09-08 2020-10-13 Emerson Climate Technologies, Inc. Oil flow through the bearings of a scroll compressor
US10890186B2 (en) 2016-09-08 2021-01-12 Emerson Climate Technologies, Inc. Compressor
US10954940B2 (en) 2009-04-07 2021-03-23 Emerson Climate Technologies, Inc. Compressor having capacity modulation assembly
US10962008B2 (en) 2017-12-15 2021-03-30 Emerson Climate Technologies, Inc. Variable volume ratio compressor
US10995753B2 (en) 2018-05-17 2021-05-04 Emerson Climate Technologies, Inc. Compressor having capacity modulation assembly
US11022119B2 (en) 2017-10-03 2021-06-01 Emerson Climate Technologies, Inc. Variable volume ratio compressor
US11655813B2 (en) 2021-07-29 2023-05-23 Emerson Climate Technologies, Inc. Compressor modulation system with multi-way valve
US11846287B1 (en) 2022-08-11 2023-12-19 Copeland Lp Scroll compressor with center hub
US11965507B1 (en) 2022-12-15 2024-04-23 Copeland Lp Compressor and valve assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5616679U (fr) * 1979-07-12 1981-02-13
JPS57172U (fr) * 1980-02-01 1982-01-05
JPH04272490A (ja) * 1990-10-01 1992-09-29 Copeland Corp スクロール式圧縮機

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5616679U (fr) * 1979-07-12 1981-02-13
JPS57172U (fr) * 1980-02-01 1982-01-05
JPH04272490A (ja) * 1990-10-01 1992-09-29 Copeland Corp スクロール式圧縮機

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11635078B2 (en) 2009-04-07 2023-04-25 Emerson Climate Technologies, Inc. Compressor having capacity modulation assembly
US10954940B2 (en) 2009-04-07 2021-03-23 Emerson Climate Technologies, Inc. Compressor having capacity modulation assembly
US11434910B2 (en) 2012-11-15 2022-09-06 Emerson Climate Technologies, Inc. Scroll compressor having hub plate
US10907633B2 (en) 2012-11-15 2021-02-02 Emerson Climate Technologies, Inc. Scroll compressor having hub plate
US10094380B2 (en) 2012-11-15 2018-10-09 Emerson Climate Technologies, Inc. Compressor
US10495086B2 (en) 2012-11-15 2019-12-03 Emerson Climate Technologies, Inc. Compressor valve system and assembly
CN104595196A (zh) * 2013-10-31 2015-05-06 艾默生环境优化技术有限公司 用于压缩机的热力阀组件以及压缩机
US20150118076A1 (en) * 2013-10-31 2015-04-30 Emerson Climate Technologies, Inc. Compressor with improved valve assembly
US9989057B2 (en) 2014-06-03 2018-06-05 Emerson Climate Technologies, Inc. Variable volume ratio scroll compressor
US10323639B2 (en) 2015-03-19 2019-06-18 Emerson Climate Technologies, Inc. Variable volume ratio compressor
US10323638B2 (en) 2015-03-19 2019-06-18 Emerson Climate Technologies, Inc. Variable volume ratio compressor
US10598180B2 (en) 2015-07-01 2020-03-24 Emerson Climate Technologies, Inc. Compressor with thermally-responsive injector
US10378542B2 (en) 2015-07-01 2019-08-13 Emerson Climate Technologies, Inc. Compressor with thermal protection system
CN106321429A (zh) * 2015-07-01 2017-01-11 艾默生环境优化技术有限公司 具有热保护系统的压缩机
US10378540B2 (en) 2015-07-01 2019-08-13 Emerson Climate Technologies, Inc. Compressor with thermally-responsive modulation system
US10066622B2 (en) 2015-10-29 2018-09-04 Emerson Climate Technologies, Inc. Compressor having capacity modulation system
US10087936B2 (en) 2015-10-29 2018-10-02 Emerson Climate Technologies, Inc. Compressor having capacity modulation system
US10458412B2 (en) * 2016-02-24 2019-10-29 Lg Electronics Inc. Hermetic compressor having a thermal activated valve
US20170241419A1 (en) * 2016-02-24 2017-08-24 Lg Electronics Inc. Hermetic compressor
CN107120270A (zh) * 2016-02-24 2017-09-01 Lg电子株式会社 密闭型压缩机
US10801495B2 (en) 2016-09-08 2020-10-13 Emerson Climate Technologies, Inc. Oil flow through the bearings of a scroll compressor
US10890186B2 (en) 2016-09-08 2021-01-12 Emerson Climate Technologies, Inc. Compressor
US10753352B2 (en) 2017-02-07 2020-08-25 Emerson Climate Technologies, Inc. Compressor discharge valve assembly
CN109140004A (zh) * 2017-06-28 2019-01-04 通用汽车环球科技运作有限责任公司 被动致动式可复位阀
US11022119B2 (en) 2017-10-03 2021-06-01 Emerson Climate Technologies, Inc. Variable volume ratio compressor
US10962008B2 (en) 2017-12-15 2021-03-30 Emerson Climate Technologies, Inc. Variable volume ratio compressor
US10995753B2 (en) 2018-05-17 2021-05-04 Emerson Climate Technologies, Inc. Compressor having capacity modulation assembly
US11754072B2 (en) 2018-05-17 2023-09-12 Copeland Lp Compressor having capacity modulation assembly
US11655813B2 (en) 2021-07-29 2023-05-23 Emerson Climate Technologies, Inc. Compressor modulation system with multi-way valve
US11879460B2 (en) 2021-07-29 2024-01-23 Copeland Lp Compressor modulation system with multi-way valve
US11846287B1 (en) 2022-08-11 2023-12-19 Copeland Lp Scroll compressor with center hub
US11965507B1 (en) 2022-12-15 2024-04-23 Copeland Lp Compressor and valve assembly

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