WO2009017320A2 - Mold film composition for forming pattern and mold film manufactured by using the same - Google Patents
Mold film composition for forming pattern and mold film manufactured by using the same Download PDFInfo
- Publication number
- WO2009017320A2 WO2009017320A2 PCT/KR2008/004284 KR2008004284W WO2009017320A2 WO 2009017320 A2 WO2009017320 A2 WO 2009017320A2 KR 2008004284 W KR2008004284 W KR 2008004284W WO 2009017320 A2 WO2009017320 A2 WO 2009017320A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mold film
- acrylate
- oligomer
- film composition
- metha
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 39
- 239000000178 monomer Substances 0.000 claims abstract description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- -1 acryl Chemical group 0.000 claims abstract description 16
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 13
- 239000010703 silicon Substances 0.000 claims abstract description 13
- 229920000728 polyester Polymers 0.000 claims abstract description 9
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims abstract description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 50
- 239000000654 additive Substances 0.000 claims description 12
- 230000000996 additive effect Effects 0.000 claims description 12
- 230000001588 bifunctional effect Effects 0.000 claims description 11
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 3
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- 150000008062 acetophenones Chemical class 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 125000005605 benzo group Chemical group 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- 125000002091 cationic group Chemical group 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical class [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 claims description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 2
- 150000002170 ethers Chemical class 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- 150000003254 radicals Chemical class 0.000 claims description 2
- 239000012954 diazonium Substances 0.000 claims 1
- 150000001989 diazonium salts Chemical class 0.000 claims 1
- 239000010408 film Substances 0.000 description 45
- 239000000758 substrate Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 239000012467 final product Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 229940117913 acrylamide Drugs 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000001406 capillary force lithography Methods 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000000845 micromoulding in capillary Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229940059574 pentaerithrityl Drugs 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 238000006552 photochemical reaction Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- RFVHVYKVRGKLNK-UHFFFAOYSA-N bis(4-methoxyphenyl)methanone Chemical compound C1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1 RFVHVYKVRGKLNK-UHFFFAOYSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FSPSELPMWGWDRY-UHFFFAOYSA-N m-Methylacetophenone Chemical compound CC(=O)C1=CC=CC(C)=C1 FSPSELPMWGWDRY-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 238000001682 microtransfer moulding Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 238000001127 nanoimprint lithography Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
Definitions
- the present invention relates to a mold film composition for forming a pattern on a substrate when semiconductor devices, electronic devices, photoelectronic devices, magnetic devices, display devices, microelectromechanical systems, optical lens sheets such as prism sheets and lenticular lens sheets, or the like are manufactured, and a mold film manufactured by using the same.
- Background Art
- micropatterns on a substrate are performed when semiconductor devices, electronic devices, photoelectronic devices, magnetic devices, display devices, microelectromechanical systems, optical lens sheets such as prism sheets and lenticular lens sheets, or the like are manufactured.
- Photolithography is a procedure of using light to form micropatterns on a substrate.
- Examples of the non-traditional lithography are nanoimprint lithography, micro contact printing (CP), micro-molding in capillaries (MIMIC), micro-transfer molding (TM), soft molding, and capillary force lithography (CFL).
- a method of forming a pattern using a metal mold is known in addition to the method of forming a pattern described above.
- a metal mold is used, a thin film metal mold is not easily treated, preparation of the thin film metal mold takes a long time, and manufacturing costs therefore is also high even though transcription can be accurately performed.
- Disclosure of Invention Technical Problem [7] A mold film for forming a pattern may be used to form a micropattern. Thermal resistance is an important property for a composition for preparing the mold film.
- the present invention provides a mold film for forming a pattern which does not deform the pattern formed using the mold film and provides high quality to a final product manufactured using the mold film when the mold film is repeatedly exposed to ultraviolet rays for a long period of time during a process of manufacturing the final product using the mold film.
- a mold film composition for forming a pattern comprising: 30 to 70 parts by weight of each of or at least two reactive oligomers selected from the group consisting of a polyester based reactive oligomer, a silicon based reactive oligomer, an acryl based reactive oligomer, and an epoxy acrylate based oligomer; 30 to 70 parts by weight of a monofunctional or multifunctional monomer having at least one unsaturated group; and 1 to 10 parts by weight of a photoinitiator, based on 100 parts by weight of the composition.
- a mold film for forming a pattern manufactured by using the mold film composition is provided.
- a mold film composition having excellent thermal resistance and used to form a pattern and a mold film manufactured by using the mold film composition are provided.
- the mold film composition for forming a pattern according to the present invention has excellent thermal resistance. Thus, if a pattern is formed on a substrate using the mold film composition, the pattern is not deformed even though it is repeatedly exposed to ultraviolet rays for a long period of time, thereby improving uniformity of the pattern formed on the substrate.
- a mold film composition for forming a pattern includes: 30 to 70 parts by weight of each of or at least two reactive oligomers selected from the group consisting of a polyester based reactive oligomer, a silicon based reactive oligomer, an acryl based reactive oligomer, and an epoxy acrylate based oligomer; 30 to 70 parts by weight of a monofunctional or multi- functional monomer having at least one unsaturated group; and 1 to 10 parts by weight of a photoinitiator, based on 100 parts by weight of the composition.
- the reactive oligomer is an element providing basic physical properties of a mold film for forming a pattern according to the present invention and improves thermal resistance of an intaglio pattern formed in the mold film.
- the amount of each of or at least two reactive oligomers selected from the group consisting of the polyester based reactive oligomer, the silicon based reactive oligomer, the acryl based reactive oligomer, and the epoxy acrylate based oligomer may be in the range of 30 to 70 parts by weight based on 100 parts by weight of the composition. If the amount of the reactive oligomer is within the range described above, processibility may be increased due to sufficient thermal resistance and adjusted viscosity.
- the polyester based reactive oligomer may be a bifunctional or more than bifunctional oligomer having a molecular weight ranging from 200 to 5000.
- the silicon based reactive oligomer may be a bifunctional or more than bifunctional oligomer having a molecular weight ranging from 200 to 5000.
- the acryl based reactive oligomer may be a bifunctional or more than bifunctional acrylic acrylate based oligomer having a molecular weight ranging from 200 to 5000.
- the reactive oligomer may be aromatic oligomer (for example, Aromatic Polyester
- the reactive oligomer may have a hydroxyl value ranging from 50 to 500 mg KOH/g and a viscosity ranging from 300 to 20000 cps.
- the monofunctional or multifunctional monomer having at least one unsaturated group photochemical reacts with a reactive functional group of the reactive oligomer to enhance coating characteristics of an intaglio pattern formed in the mold film for forming a pattern according to the present invention.
- the monofunctional or multi- functional monomer having at least one unsaturated group lowers viscosity of the reactive oligomer.
- the reactive oligomer typically has a high viscosity equal to or greater than
- the viscosity of the reactive oligomer needs to be lowered less than, for example, 2000 cps, in order to form an intaglio pattern of the mold film for forming a pattern according to the present invention.
- the monofunctional or multifunctional monomer having at least one unsaturated group is added to the reactive oligomer to lower the viscosity of the reactive oligomer.
- the amount of the monofunctional or multifunctional monomer having at least one unsaturated group may be in the range of 30 to 70 parts by weight based on 100 parts by weight of the composition.
- processibility may be increased due to adjusted viscosity and thermal properties of a coating may be improved.
- the monofunctional or multifunctional monomer may be a monofunctional
- (metha)acrylate or multifunctional (metha)acrylate monomer for example, multifunctional (di or tri)(metha)acrylate monomer.
- the monofunctional (metha)acrylate or multifunctional (metha)acrylate monomer may be 2-hydroxyethyl(metha)acrylate, 2-hydroxypropyl(metha)acrylate, tetrahydro- furfuryl(metha)acrylate, butoxy ethyl(metha)acrylate, ethyldiethylene glycol(metha)acrylate, 2-ethylhexyl(metha)acrylate, cyclohexyl(metha)acrylate, phe- noxyethyl(metha)acrylate, dicyclopentadiene(metha)acrylate, polyethylene glycol(metha)acrylate, polypropylene glycol(metha)acrylate, methyltriethylene diglycol(metha)acrylate, isobornyl(metha)acrylate, N- vinyl pyrrolidone, N-vinyl caprolactam, diacetone acrylamide, isobutoxy methyl(metha)acrylamide, N,N-
- the monofunctional (metha)acrylate or multifunctional (metha)acrylate monomer may be 2-hydroxyethyl(metha)acrylate, 2-hydroxypropyl(metha)acrylate, polypropylene glycol (metha)acrylate, isobornyl(metha)acrylate, triethylene glycol di(metha)acrylate, tripropylene glycol di(metha)acrylate, trimethylol propane tri(metha)acrylate, or the like. They may be used alone or in combination of at least two. However, the mono- functional or multifunctional monomer is not limited thereto.
- the photoinitiator initiates photochemical reactions between the reactive oligomer and the monofunctional or multifunctional monomer by light.
- the light may be one of ultraviolet rays and electronic rays.
- the amount of the photoinitiator may be in the range of 1 to 10 parts by weight based on 100 parts by weight of the composition. In this regard, if the amount of the photoinitiator is within the range described above, reaction rate may be controlled, and thus flexibility of the intaglio pattern formed in the mold film for forming a pattern manufactured according to the present invention may be increased, and crumbling of the intaglio pattern and reduction in adhesion to the substrate may be prevented.
- the photoinitiator may be at least one free radical initiator selected from the group consisting of benzyl ketals, benzoin ethers, acetophenone derivatives, ketoxime ethers, benzophenone, and benzo or thioxantone based compounds, at least one cationic initiator selected from the group consisting of onium salts, ferrocenium salts, and diazoniun salts, or a mixture thereof.
- the light is ultraviolet rays, the following photoinitiator may be used.
- the photoinitiator may be 1 -hydroxy cyclohexylphenyl kethone
- Irgacure 184, 369, 651, 819, 907, 1700, and 1800 (Ciba Specialty Chemicals Corp.), Darocure 1173 and 1116 (Merck Corp.), Ubecyl-936 (UCB Chemicals, Inc.), or the like may be used alone or in combination of at least two.
- the mold film composition for forming a pattern according to the present invention may further include 0.01 to 3 parts by weight of an additive based on 100 parts by weight of the composition. If the amount of the additive is within the range described above, the mold film has excellent detachability from a final product and excellent adhesion, and whitening does not occur even though it is exposed to a high temperature and a high hunidity.
- the additive may be at least one of a fluorine based additive and a silicon based additive.
- the fluorine based additive and the silicon based additive may be: a reactive monomer or reactive oligomer having a silicon group such as a silicon group- containing vinyl compound, a silicon group-containing (metha)acrylate compound, a (metha)acryloxy group-containing organosiloxane, or silicon polyacrylate; a reactive monomer or reactive oligomer having a fluorine group such as a fluoroalkyl group- containing vinyl compound, a fluoroalkyl group-containing (metha)acrylate compound, or fluorine polyacrylate; a resin having a silicon group or a fluorine group such as polydimethylsiloxane and a fluorine polymer; and a surfactant or oil having a silicon group or a fluorine group such as dimethyl silicon oil, but are not limited thereto.
- An antistatic agent having flowability, slidability
- a mold film for forming a pattern according to another embodiment of the present invention may be manufactured by using the mold film composition for forming a pattern.
- An intaglio pattern has a uniform line width or is randomly formed in the mold film manufactured by using the mold film composition for forming a pattern according to the present invention. If semiconductor devices, electronic devices, photoelectronic devices, magnetic devices, display devices, microelectromechanical systems, optical lens sheets such as prism sheets and lenticular lens sheets, or the like are manufactured using the mold film for forming a pattern, a micropattern having excellent uniformity may be formed on the substrate.
- a pattern is formed using the mold film for forming a pattern according to the present invention on a sheet installed in a display device, a micropattern may be uniformly formed on the sheet, and thus decrease in brightness due to deformation of the pattern formed on the sheet can be prevented when the sheet is installed in the display device.
- a mold film composition according to an embodiment of the present invention as described below was coated on a 188 /M-thick polyester film to a thickness of about 35 /M to form a lenticular mold film for forming a pattern.
- a high-pressure mercury lamp 500 mJ/sq.m was used as ultraviolet rays.
- the mold film composition for forming a pattern according to the present invention can be applied to technical fields of semiconductor devices, electronic devices, photo- electronic devices, magnetic devices, display devices, microelectromechanical systems, or the like.
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
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- Manufacture Of Macromolecular Shaped Articles (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Provided are a mold film composition for forming a pattern including: 30 to 70 parts by weight of each of or at least two reactive oligomers selected from the group consisting of a polyester based reactive oligomer, a silicon based reactive oligomer, an acryl based reactive oligomer, and an epoxy acrylate based oligomer; 30 to 70 parts by weight of a monofunctional or multifunctional monomer having at least one unsaturated group; and 1 to 10 parts by weight of a pho- toinitiator, based on 100 parts by weight of the composition, and a mold film manufactured by using the mold film composition.
Description
Description
MOLD FILM COMPOSITION FOR FORMING PATTERN AND MOLD FILM MANUFACTURED BY USING THE SAME
Technical Field
[1] The present invention relates to a mold film composition for forming a pattern on a substrate when semiconductor devices, electronic devices, photoelectronic devices, magnetic devices, display devices, microelectromechanical systems, optical lens sheets such as prism sheets and lenticular lens sheets, or the like are manufactured, and a mold film manufactured by using the same. Background Art
[2] Generally, processes of forming micropatterns on a substrate are performed when semiconductor devices, electronic devices, photoelectronic devices, magnetic devices, display devices, microelectromechanical systems, optical lens sheets such as prism sheets and lenticular lens sheets, or the like are manufactured. Photolithography is a procedure of using light to form micropatterns on a substrate.
[3] However, operations involved in conventional photolithographic processes are substrate cleaning, substrate surface treatment, photosensitive polymer coating, soft- baking, light exposure, development, washing, and hard-baking. Thus, conventional photolithography processes are complicated, take a long time, and require expensive equipment. Therefore, manufacturing costs may be increased and productivity may be decreased.
[4] In order to overcome problems of photolithography, non-traditional lithography has been suggested.
[5] Examples of the non-traditional lithography are nanoimprint lithography, micro contact printing ( CP), micro-molding in capillaries (MIMIC), micro-transfer molding ( TM), soft molding, and capillary force lithography (CFL).
[6] A method of forming a pattern using a metal mold is known in addition to the method of forming a pattern described above. However, if a metal mold is used, a thin film metal mold is not easily treated, preparation of the thin film metal mold takes a long time, and manufacturing costs therefore is also high even though transcription can be accurately performed. Disclosure of Invention Technical Problem
[7] A mold film for forming a pattern may be used to form a micropattern. Thermal resistance is an important property for a composition for preparing the mold film.
[8] Thus, the present invention provides a mold film for forming a pattern which does not deform the pattern formed using the mold film and provides high quality to a final product manufactured using the mold film when the mold film is repeatedly exposed to ultraviolet rays for a long period of time during a process of manufacturing the final product using the mold film. Technical Solution
[9] According to an aspect of the present invention, there is provided a mold film composition for forming a pattern comprising: 30 to 70 parts by weight of each of or at least two reactive oligomers selected from the group consisting of a polyester based reactive oligomer, a silicon based reactive oligomer, an acryl based reactive oligomer, and an epoxy acrylate based oligomer; 30 to 70 parts by weight of a monofunctional or multifunctional monomer having at least one unsaturated group; and 1 to 10 parts by weight of a photoinitiator, based on 100 parts by weight of the composition.
[10] According to another aspect of the present invention, there is provided a mold film for forming a pattern manufactured by using the mold film composition.
Advantageous Effects
[11] According to the present invention, a mold film composition having excellent thermal resistance and used to form a pattern and a mold film manufactured by using the mold film composition are provided.
[12] As described above, the mold film composition for forming a pattern according to the present invention has excellent thermal resistance. Thus, if a pattern is formed on a substrate using the mold film composition, the pattern is not deformed even though it is repeatedly exposed to ultraviolet rays for a long period of time, thereby improving uniformity of the pattern formed on the substrate. Mode for the Invention
[13] Hereinafter, the present invention will now be described more fully with exemplary embodiments.
[14] A mold film composition for forming a pattern according to an embodiment of the present invention includes: 30 to 70 parts by weight of each of or at least two reactive oligomers selected from the group consisting of a polyester based reactive oligomer, a silicon based reactive oligomer, an acryl based reactive oligomer, and an epoxy acrylate based oligomer; 30 to 70 parts by weight of a monofunctional or multi-
functional monomer having at least one unsaturated group; and 1 to 10 parts by weight of a photoinitiator, based on 100 parts by weight of the composition.
[15] When each of or at least two reactive oligomers selected from the group consisting of a polyester based reactive oligomer, a silicon based reactive oligomer, an acryl based reactive oligomer, and an epoxy acrylate based oligomer is used, photochemical reactions occur by a bifunctional to hexafunctional acrylate group.
[16] The reactive oligomer is an element providing basic physical properties of a mold film for forming a pattern according to the present invention and improves thermal resistance of an intaglio pattern formed in the mold film.
[17] The amount of each of or at least two reactive oligomers selected from the group consisting of the polyester based reactive oligomer, the silicon based reactive oligomer, the acryl based reactive oligomer, and the epoxy acrylate based oligomer may be in the range of 30 to 70 parts by weight based on 100 parts by weight of the composition. If the amount of the reactive oligomer is within the range described above, processibility may be increased due to sufficient thermal resistance and adjusted viscosity.
[18] The polyester based reactive oligomer may be a bifunctional or more than bifunctional oligomer having a molecular weight ranging from 200 to 5000. In addition, the silicon based reactive oligomer may be a bifunctional or more than bifunctional oligomer having a molecular weight ranging from 200 to 5000.
[19] In addition, the acryl based reactive oligomer may be a bifunctional or more than bifunctional acrylic acrylate based oligomer having a molecular weight ranging from 200 to 5000.
[20] The reactive oligomer may be aromatic oligomer (for example, Aromatic Polyester
Acrylate) or Aliphati oligomer. Furthermore, the reactive oligomer may have a hydroxyl value ranging from 50 to 500 mg KOH/g and a viscosity ranging from 300 to 20000 cps.
[21] In case that the hydroxyl value of the reactive oligomer is lower than 50 mg KOH/g, an adhesive power may be insufficient. In other hand, in case that the hydroxyl value of the reactive oligomer is higher than 500 mg KOH/g, a water absorption rate is high, thus weatherability may be insufficient.
[22] The monofunctional or multifunctional monomer having at least one unsaturated group photochemical reacts with a reactive functional group of the reactive oligomer to enhance coating characteristics of an intaglio pattern formed in the mold film for forming a pattern according to the present invention. The monofunctional or multi-
functional monomer having at least one unsaturated group lowers viscosity of the reactive oligomer.
[23] Since the reactive oligomer typically has a high viscosity equal to or greater than
5000 cps, the viscosity of the reactive oligomer needs to be lowered less than, for example, 2000 cps, in order to form an intaglio pattern of the mold film for forming a pattern according to the present invention. In this regard, the monofunctional or multifunctional monomer having at least one unsaturated group is added to the reactive oligomer to lower the viscosity of the reactive oligomer.
[24] The amount of the monofunctional or multifunctional monomer having at least one unsaturated group may be in the range of 30 to 70 parts by weight based on 100 parts by weight of the composition. Here, if the amount of the monofunctional or multifunctional monomer is within the range described above, processibility may be increased due to adjusted viscosity and thermal properties of a coating may be improved.
[25] The monofunctional or multifunctional monomer may be a monofunctional
(metha)acrylate or multifunctional (metha)acrylate monomer, for example, multifunctional (di or tri)(metha)acrylate monomer.
[26] The monofunctional (metha)acrylate or multifunctional (metha)acrylate monomer may be 2-hydroxyethyl(metha)acrylate, 2-hydroxypropyl(metha)acrylate, tetrahydro- furfuryl(metha)acrylate, butoxy ethyl(metha)acrylate, ethyldiethylene glycol(metha)acrylate, 2-ethylhexyl(metha)acrylate, cyclohexyl(metha)acrylate, phe- noxyethyl(metha)acrylate, dicyclopentadiene(metha)acrylate, polyethylene glycol(metha)acrylate, polypropylene glycol(metha)acrylate, methyltriethylene diglycol(metha)acrylate, isobornyl(metha)acrylate, N- vinyl pyrrolidone, N-vinyl caprolactam, diacetone acrylamide, isobutoxy methyl(metha)acrylamide, N,N-dimethyl(metha)acryl amide, t-octyl(metha)acryl amide, dimethy- laminoethyl(metha)acrylate, acryloyl morpholine, dicyclopentenyl(metha)acrylate, trimethylol propane tri(metha)acrylate, pentaerythritol tri(metha)acrylate, pen- taerythritol tetra(metha)acrylate, ethylene glycol di(metha)acrylate, tetraethylene glycol di(metha)acrylate, polyethylene glycol di(metha)acrylate, 1,4-butanediol di(metha)acrylate, 1,6-hexanediol di(metha)acrylate, neopentyl glycol di(metha)acrylate, trimethylol propane trioxyethyl(metha)acrylate, tricyclodecane dimethanol di(metha)acrylate, dicyclodecane dimethanol di(metha)acrylate, tripropylene glycol di(metha)acrylate, dicyclopentane di(metha)acrylate, dicy- clopentadiene di(metha)acrylate, or the like. Preferably, the monofunctional
(metha)acrylate or multifunctional (metha)acrylate monomer may be 2-hydroxyethyl(metha)acrylate, 2-hydroxypropyl(metha)acrylate, polypropylene glycol (metha)acrylate, isobornyl(metha)acrylate, triethylene glycol di(metha)acrylate, tripropylene glycol di(metha)acrylate, trimethylol propane tri(metha)acrylate, or the like. They may be used alone or in combination of at least two. However, the mono- functional or multifunctional monomer is not limited thereto.
[27] The photoinitiator initiates photochemical reactions between the reactive oligomer and the monofunctional or multifunctional monomer by light. Here, the light may be one of ultraviolet rays and electronic rays.
[28] The amount of the photoinitiator may be in the range of 1 to 10 parts by weight based on 100 parts by weight of the composition. In this regard, if the amount of the photoinitiator is within the range described above, reaction rate may be controlled, and thus flexibility of the intaglio pattern formed in the mold film for forming a pattern manufactured according to the present invention may be increased, and crumbling of the intaglio pattern and reduction in adhesion to the substrate may be prevented.
[29] The photoinitiator may be at least one free radical initiator selected from the group consisting of benzyl ketals, benzoin ethers, acetophenone derivatives, ketoxime ethers, benzophenone, and benzo or thioxantone based compounds, at least one cationic initiator selected from the group consisting of onium salts, ferrocenium salts, and diazoniun salts, or a mixture thereof. In particular, if the light is ultraviolet rays, the following photoinitiator may be used.
[30] For example, the photoinitiator may be 1 -hydroxy cyclohexylphenyl kethone,
2,2-dimethoxy-2-phenyl-acetophenone, xanthone, benzaldehyde, anthraquinone, 3-methylacetophenone, 4-chlorobenzophenone, 4,4'-dimethoxy benzophenone, 4,4'-diaminobenzophenone, benzoin propyl ether, benzoin ethyl ether, l-(44sopropyl-phenol)-2-hydroxy-2-methyl propane- 1 -one, thioxanthone, or the like, but is not limited thereto. Commercially available Irgacure 184, 369, 651, 819, 907, 1700, and 1800 (Ciba Specialty Chemicals Corp.), Darocure 1173 and 1116 (Merck Corp.), Ubecyl-936 (UCB Chemicals, Inc.), or the like may be used alone or in combination of at least two.
[31] Meanwhile, the mold film composition for forming a pattern according to the present invention may further include 0.01 to 3 parts by weight of an additive based on 100 parts by weight of the composition. If the amount of the additive is within the range described above, the mold film has excellent detachability from a final product and excellent adhesion, and whitening does not occur even though it is exposed to a high
temperature and a high hunidity.
[32] The additive may be at least one of a fluorine based additive and a silicon based additive. The fluorine based additive and the silicon based additive may be: a reactive monomer or reactive oligomer having a silicon group such as a silicon group- containing vinyl compound, a silicon group-containing (metha)acrylate compound, a (metha)acryloxy group-containing organosiloxane, or silicon polyacrylate; a reactive monomer or reactive oligomer having a fluorine group such as a fluoroalkyl group- containing vinyl compound, a fluoroalkyl group-containing (metha)acrylate compound, or fluorine polyacrylate; a resin having a silicon group or a fluorine group such as polydimethylsiloxane and a fluorine polymer; and a surfactant or oil having a silicon group or a fluorine group such as dimethyl silicon oil, but are not limited thereto. An antistatic agent having flowability, slidability, and a leveling property may further be added to the composition as an additive. The antistatic agent may be negative(-) charge antistatic agent.
[33] A mold film for forming a pattern according to another embodiment of the present invention may be manufactured by using the mold film composition for forming a pattern.
[34] An intaglio pattern has a uniform line width or is randomly formed in the mold film manufactured by using the mold film composition for forming a pattern according to the present invention. If semiconductor devices, electronic devices, photoelectronic devices, magnetic devices, display devices, microelectromechanical systems, optical lens sheets such as prism sheets and lenticular lens sheets, or the like are manufactured using the mold film for forming a pattern, a micropattern having excellent uniformity may be formed on the substrate.
[35] In particular, a pattern is formed using the mold film for forming a pattern according to the present invention on a sheet installed in a display device, a micropattern may be uniformly formed on the sheet, and thus decrease in brightness due to deformation of the pattern formed on the sheet can be prevented when the sheet is installed in the display device.
[36] Hereinafter, the present invention will be described in greater detail with reference to the following example and comparative example. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.
[37]
[38] Example 1
[39] A mold film composition according to an embodiment of the present invention as
described below was coated on a 188 /M-thick polyester film to a thickness of about 35 /M to form a lenticular mold film for forming a pattern. A high-pressure mercury lamp (500 mJ/sq.m) was used as ultraviolet rays.
[40] [Table 1]
[41] [42] Comparative Example 1 [43] A lenticular mold film having a thickness of about 35 /M was manufactured in the same manner as in Example 1, except that a mold film composition as described below was coated on a 188 /M-thick polyester film.
[44] [Table 2]
[45] [46] Ultraviolet rays (about 500 mJ/sq.m) were repeatedly irradiated to the mold films manufactured according to Example 1 and Comparative Example 1 while the mold films were rotated in order to manufacture final products. If the mold film manufactured according to Comparative Example 1 was repeatedly used about 50 times, the pattern of the mold film is deformed, and thus brightness of the final product was decreased by over 1%. However, the mold film manufactured according to Example 1 which is an embodiment of the present invention had excellent thermal resistance, and thus brightness of the final product was not decreased since the mold film was not deformed even though the mold film was repeatedly used about over 300 times in the
same conditions as in Comparative Example 1.
[47] While the present invention has been particularly described with exemplary embodiments, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims. Industrial Applicability
[48] The mold film composition for forming a pattern according to the present invention can be applied to technical fields of semiconductor devices, electronic devices, photo- electronic devices, magnetic devices, display devices, microelectromechanical systems, or the like.
Claims
[1] A mold film composition for forming a pattern comprising:
30 to 70 parts by weight of each of or at least two reactive oligomers selected from the group consisting of a polyester based reactive oligomer, a silicon based reactive oligomer, an acryl based reactive oligomer, and an epoxy acrylate based oligomer;
30 to 70 parts by weight of a monofunctional or multifunctional monomer having at least one unsaturated group; and
1 to 10 parts by weight of a photoinitiator, based on 100 parts by weight of the composition.
[2] The mold film composition of claim 1, wherein each of the polyester based reactive oligomer and the silicon based reactive oligomer is a bifunctional or more than bifunctional oligomer having a molecular weight ranging from 200 to 5000.
[3] The mold film composition of claim 1, wherein the reactive oligomer has a hydroxyl value ranging from 50 to 500 mg KOH/g and a viscosity ranging from 300 to 20000 cps.
[4] The mold film composition of claim 1, wherein the acryl based reactive oligomer is a bifunctional or more than bifunctional acrylic acrylate based oligomer having a molecular weight ranging from 200 to 5000.
[5] The mold film composition of claim 1, wherein the monofunctional or multifunctional monomer is a monofunctional (metha) acrylate or multifunctional (di or tri)(metha)acrylate monomer.
[6] The mold film composition of claim 1, wherein the photoinitiator is at least one free radical initiator selected from the group consisting of benzyl ketals, benzoin ethers, acetophenone derivatives, ketoxime ethers, benzophenone, and benzo or thioxantone based compounds, at least one cationic initiator selected from the group consisting of onium salts, ferrocenium salts, and diazonium salts, or a mixture thereof.
[7] The mold film composition of claim 1, further comprising 0.01 to 3 parts by weight of an additive.
[8] The mold film composition of claim 7, wherein the additive is at least one of a fluorine based additive and a silicon based additive.
[9] A mold film for forming a pattern manufactured by using a mold film com-
position according to any one of claims 1 to 8.
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| CN200880022012A CN101711375A (en) | 2007-07-31 | 2008-07-22 | Mold film composition for forming pattern and mold film manufactured by using the same |
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| KR1020070076984A KR100902550B1 (en) | 2007-07-31 | 2007-07-31 | Mold film composition for forming pattern and mold film composition manufactured by using the same |
| KR10-2007-0076984 | 2007-07-31 |
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| CN (1) | CN101711375A (en) |
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| KR102119596B1 (en) * | 2013-10-18 | 2020-06-08 | 엘지이노텍 주식회사 | Composition of resin and condunctive pattern forming mold with the same |
| KR102452035B1 (en) | 2017-04-14 | 2022-10-11 | 삼성디스플레이 주식회사 | Composition for soft mold and soft mold manufactured by using the composition |
| KR102297307B1 (en) * | 2020-08-18 | 2021-09-02 | 황진상 | Preparation method of embossing release film for semiconductor package mold, and embossing release film thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000021804A (en) * | 1998-09-30 | 2000-04-25 | 장용균 | Compositions hardened by ultraviolet compositions and surface protected film thereof |
| KR20020020599A (en) * | 2000-09-09 | 2002-03-15 | 황성호 | Composition of Radiation Curable Silicone Materials |
| JP2003345006A (en) * | 2002-05-29 | 2003-12-03 | Nippon Synthetic Chem Ind Co Ltd:The | Photosensitive resin composition |
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| KR0140908B1 (en) * | 1995-01-20 | 1998-06-15 | 박흥기 | Pigment dispersed photoresist composition for color filter of lcd |
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2007
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2008
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000021804A (en) * | 1998-09-30 | 2000-04-25 | 장용균 | Compositions hardened by ultraviolet compositions and surface protected film thereof |
| KR20020020599A (en) * | 2000-09-09 | 2002-03-15 | 황성호 | Composition of Radiation Curable Silicone Materials |
| JP2003345006A (en) * | 2002-05-29 | 2003-12-03 | Nippon Synthetic Chem Ind Co Ltd:The | Photosensitive resin composition |
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| CN101711375A (en) | 2010-05-19 |
| TW200925781A (en) | 2009-06-16 |
| KR20090012823A (en) | 2009-02-04 |
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| TWI382278B (en) | 2013-01-11 |
| WO2009017320A3 (en) | 2009-03-19 |
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