WO2009017320A3 - Mold film composition for forming pattern and mold film manufactured by using the same - Google Patents

Mold film composition for forming pattern and mold film manufactured by using the same Download PDF

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Publication number
WO2009017320A3
WO2009017320A3 PCT/KR2008/004284 KR2008004284W WO2009017320A3 WO 2009017320 A3 WO2009017320 A3 WO 2009017320A3 KR 2008004284 W KR2008004284 W KR 2008004284W WO 2009017320 A3 WO2009017320 A3 WO 2009017320A3
Authority
WO
WIPO (PCT)
Prior art keywords
mold film
weight
parts
same
composition
Prior art date
Application number
PCT/KR2008/004284
Other languages
French (fr)
Other versions
WO2009017320A2 (en
Inventor
Seung Kyu Choi
Cheol Heung Ahn
Suk Jun Kim
Je Min Yeoun
Young Shin Choi
Chan Kyu Park
Ka Young Son
Hyun Ee Yang
Original Assignee
Shinwha Intertek Corp
Seung Kyu Choi
Cheol Heung Ahn
Suk Jun Kim
Je Min Yeoun
Young Shin Choi
Chan Kyu Park
Ka Young Son
Hyun Ee Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinwha Intertek Corp, Seung Kyu Choi, Cheol Heung Ahn, Suk Jun Kim, Je Min Yeoun, Young Shin Choi, Chan Kyu Park, Ka Young Son, Hyun Ee Yang filed Critical Shinwha Intertek Corp
Priority to CN200880022012A priority Critical patent/CN101711375A/en
Publication of WO2009017320A2 publication Critical patent/WO2009017320A2/en
Publication of WO2009017320A3 publication Critical patent/WO2009017320A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Provided are a mold film composition for forming a pattern including: 30 to 70 parts by weight of each of or at least two reactive oligomers selected from the group consisting of a polyester based reactive oligomer, a silicon based reactive oligomer, an acryl based reactive oligomer, and an epoxy acrylate based oligomer; 30 to 70 parts by weight of a monofunctional or multifunctional monomer having at least one unsaturated group; and 1 to 10 parts by weight of a pho- toinitiator, based on 100 parts by weight of the composition, and a mold film manufactured by using the mold film composition.
PCT/KR2008/004284 2007-07-31 2008-07-22 Mold film composition for forming pattern and mold film manufactured by using the same WO2009017320A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880022012A CN101711375A (en) 2007-07-31 2008-07-22 Mold film composition for forming pattern and mold film manufactured by using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070076984A KR100902550B1 (en) 2007-07-31 2007-07-31 Mold film composition for forming pattern and mold film composition manufactured by using the same
KR10-2007-0076984 2007-07-31

Publications (2)

Publication Number Publication Date
WO2009017320A2 WO2009017320A2 (en) 2009-02-05
WO2009017320A3 true WO2009017320A3 (en) 2009-03-19

Family

ID=40305034

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/004284 WO2009017320A2 (en) 2007-07-31 2008-07-22 Mold film composition for forming pattern and mold film manufactured by using the same

Country Status (4)

Country Link
KR (1) KR100902550B1 (en)
CN (1) CN101711375A (en)
TW (1) TWI382278B (en)
WO (1) WO2009017320A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102119596B1 (en) * 2013-10-18 2020-06-08 엘지이노텍 주식회사 Composition of resin and condunctive pattern forming mold with the same
KR102452035B1 (en) 2017-04-14 2022-10-11 삼성디스플레이 주식회사 Composition for soft mold and soft mold manufactured by using the composition
KR102297307B1 (en) * 2020-08-18 2021-09-02 황진상 Preparation method of embossing release film for semiconductor package mold, and embossing release film thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0980225A (en) * 1995-01-20 1997-03-28 Zeiru Synthetics Inc Pigment-dispersion photoresist composition for liquid crystal display color filter
KR20000021804A (en) * 1998-09-30 2000-04-25 장용균 Compositions hardened by ultraviolet compositions and surface protected film thereof
KR20020020599A (en) * 2000-09-09 2002-03-15 황성호 Composition of Radiation Curable Silicone Materials
JP2003345006A (en) * 2002-05-29 2003-12-03 Nippon Synthetic Chem Ind Co Ltd:The Photosensitive resin composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0980225A (en) * 1995-01-20 1997-03-28 Zeiru Synthetics Inc Pigment-dispersion photoresist composition for liquid crystal display color filter
KR20000021804A (en) * 1998-09-30 2000-04-25 장용균 Compositions hardened by ultraviolet compositions and surface protected film thereof
KR20020020599A (en) * 2000-09-09 2002-03-15 황성호 Composition of Radiation Curable Silicone Materials
JP2003345006A (en) * 2002-05-29 2003-12-03 Nippon Synthetic Chem Ind Co Ltd:The Photosensitive resin composition

Also Published As

Publication number Publication date
WO2009017320A2 (en) 2009-02-05
CN101711375A (en) 2010-05-19
TW200925781A (en) 2009-06-16
KR20090012823A (en) 2009-02-04
KR100902550B1 (en) 2009-06-15
TWI382278B (en) 2013-01-11

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