WO2009017314A3 - Head socket for contacting probe card and wafer test apparatus - Google Patents

Head socket for contacting probe card and wafer test apparatus Download PDF

Info

Publication number
WO2009017314A3
WO2009017314A3 PCT/KR2008/004194 KR2008004194W WO2009017314A3 WO 2009017314 A3 WO2009017314 A3 WO 2009017314A3 KR 2008004194 W KR2008004194 W KR 2008004194W WO 2009017314 A3 WO2009017314 A3 WO 2009017314A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
head socket
test apparatus
wafer test
contacting probe
Prior art date
Application number
PCT/KR2008/004194
Other languages
French (fr)
Other versions
WO2009017314A2 (en
Inventor
Chang-Hak Lee
Sung-Chul Kim
Original Assignee
Chang-Hak Lee
Sung-Chul Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chang-Hak Lee, Sung-Chul Kim filed Critical Chang-Hak Lee
Publication of WO2009017314A2 publication Critical patent/WO2009017314A2/en
Publication of WO2009017314A3 publication Critical patent/WO2009017314A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts

Abstract

Provided are a head socket for contacting a probe card and a wafer test apparatus, in which the probe card and the head socket are simply connected to each other and damage of a connector or the head socket that may occur when the probe card and the head socket are connected to each other, is prevented from occurring in advance.
PCT/KR2008/004194 2007-07-30 2008-07-17 Head socket for contacting probe card and wafer test apparatus WO2009017314A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070076453A KR20090012539A (en) 2007-07-30 2007-07-30 Head socket for contacting probe card and wafer test apparatus
KR10-2007-0076453 2007-07-30

Publications (2)

Publication Number Publication Date
WO2009017314A2 WO2009017314A2 (en) 2009-02-05
WO2009017314A3 true WO2009017314A3 (en) 2009-04-02

Family

ID=40305030

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/004194 WO2009017314A2 (en) 2007-07-30 2008-07-17 Head socket for contacting probe card and wafer test apparatus

Country Status (2)

Country Link
KR (1) KR20090012539A (en)
WO (1) WO2009017314A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101125669B1 (en) * 2009-09-07 2012-03-27 (주)케미텍 Connector For Test Device
CN112462103B (en) * 2019-09-09 2022-05-27 英业达科技有限公司 Test system for improving test stability
CN113433504B (en) * 2021-05-12 2022-05-17 国网宁夏电力有限公司营销服务中心(国网宁夏电力有限公司计量中心) Self-adaptive connection device for electric energy meter detection and electric energy meter detection system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000030816A (en) * 1998-07-09 2000-01-28 Amp Japan Ltd Zero insertion force connector
JP2002170642A (en) * 2000-11-30 2002-06-14 Tyco Electronics Amp Kk Low insertion force connector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000030816A (en) * 1998-07-09 2000-01-28 Amp Japan Ltd Zero insertion force connector
JP2002170642A (en) * 2000-11-30 2002-06-14 Tyco Electronics Amp Kk Low insertion force connector

Also Published As

Publication number Publication date
KR20090012539A (en) 2009-02-04
WO2009017314A2 (en) 2009-02-05

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