WO2009013278A1 - Dispositif de réglage de température d'un élément optique - Google Patents

Dispositif de réglage de température d'un élément optique Download PDF

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Publication number
WO2009013278A1
WO2009013278A1 PCT/EP2008/059549 EP2008059549W WO2009013278A1 WO 2009013278 A1 WO2009013278 A1 WO 2009013278A1 EP 2008059549 W EP2008059549 W EP 2008059549W WO 2009013278 A1 WO2009013278 A1 WO 2009013278A1
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WO
WIPO (PCT)
Prior art keywords
chamber
medium
optical element
temperature
cooling
Prior art date
Application number
PCT/EP2008/059549
Other languages
German (de)
English (en)
Inventor
Stefan Hembacher
Markus Hauf
Original Assignee
Carl Zeiss Smt Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Smt Ag filed Critical Carl Zeiss Smt Ag
Publication of WO2009013278A1 publication Critical patent/WO2009013278A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

Definitions

  • the present invention relates to a device for adjusting the temperature of an optical element, in particular of optical elements in objectives for microlithography, and to a lens with a corresponding device, preferably an illumination objective for microlithography.
  • the optical elements used there such as mirror elements and the like
  • high thermal loads are affected by the incident light.
  • the optical element By a possible heating of the optical element, its optical properties can be changed, so that the imaging properties of the lens are impaired overall.
  • uneven exposure of the optical element to light due to non-homogeneous light irradiation as well as inhomogeneous heat dissipation may result in addition to inhomogeneous temperature distributions on the optical element, so that the imaging properties of a lens with such an optical element can also be impaired thereby.
  • the cooling element has cooling channels through which a cooling medium is passed in order to cool the optical element, preferably a mirror element.
  • a cooling medium preferably a mirror element.
  • An elastic element a so-called sponge element, is provided to dampen the vibrations.
  • Such a cooling device is due to their design only very limited useable and also has the disadvantage that an uneven temperature distribution in the optical element can be generated by the dissipation of heat in a single direction, namely the direction of the cooling element.
  • a device for temperature compensation for thermally loaded bodies such as, for example, mirror carriers for a projection objective in semiconductor lithography
  • the corresponding device comprises a heat distribution body disposed on one side of the thermally stressed body, wherein a gap is provided between the thermally stressed body and the heat distribution body, which is filled with a fluid for mechanical decoupling and for thermal coupling. According to a development of this fluid performs a circulating flow movement, so that takes place on the surface of the thermally stressed body temperature compensation.
  • a method and an apparatus for operating a micromechanical element is also known, wherein the micromechanical element may comprise pivotable micromirrors on a chip.
  • the micromechanical element is cooled by a cooling device comprising, for example, a Peltier element, in order to avoid changes in the mirror elements due to the heat input.
  • a cooling device comprising, for example, a Peltier element
  • the chip with the mirror elements and the Peltier element used for cooling can be enclosed in an airtight housing which is evacuated or is filled with a dry gas. Again, there is the problem that can occur due to the one-sided cooling with the Peltier element temperature inhomogeneities.
  • WO 03/093 167 a device for protecting a chip is also known, which in turn can aur loa variety of micromirrors.
  • the chip is placed in a chamber with a window, the chamber being cleaned by means of a flushing gas of aggressive components, such as oxygen.
  • a flushing gas of aggressive components such as oxygen.
  • purge gas argon or a nitrogen-hydrogen mixture is used for this purpose.
  • the device should be constructed so that the optical properties of the optical element are not impaired and the device is easy to manufacture and operate.
  • the present invention is based on the finding that an avoidance or reduction of heating of an optical element by incident light thereby achieved is that the largest possible heat flow to dissipate the heat is provided or a low thermal resistance is set.
  • This can be achieved according to the invention by providing a gas surrounding the optical element instead of the usually surrounding air, which gas has a suitable, in particular higher, thermal conductivity than air. If a different atmosphere is usually present in the objective or general imaging device or optical arrangement in which the optical element is to be used, a gas or generally medium having a higher thermal conductivity than this atmosphere can be used for heat dissipation. This ensures that the thermally loaded element is largely surrounded by a medium, which allows a good heat dissipation.
  • the medium, in particular gas, which completely surrounds the optical element in addition to the uniform environment and heat dissipation in the optical element itself provides in itself for the best possible heat balance.
  • a chamber which can receive the optical element and which includes a volume in which the medium can be taken up with higher thermal conductivity, in particular gas-tightly received.
  • the corresponding chamber has at least one transparent cover, through which light can reach the optical element.
  • reflective optical elements such as mirrors or mirror arrays and in particular multi-mirror arrays MMAs can be provided with a large number of small, adjustable mirrors which are arranged in one field.
  • the device with the transparent cover chamber comprises at least one MMA as the corresponding optical element which is accommodated in the chamber.
  • the application of heat dissipation by means of a surrounding medium and the arrangement of the medium and the optical element to be treated in a chamber is particularly advantageous for MMAs, since the small structures make uniform and effective heat dissipation very difficult.
  • MMAs are to be understood in the context of the chamber to mean that in relation to the chamber the mirrors are small or much smaller and have only a fraction of the extent of the chamber. The fraction is correspondingly given by the number of MMA mirrors, which may range from a few to a few tens or hundreds to several thousands.
  • the device with the transparent cover chamber comprises a single reflective element, in particular a mirror, as an optical element , which preferably by the
  • Chamber is separated from other optical elements.
  • the medium can be arranged motionless, that is static, in the chamber. This has the advantage that vibrations or vibrations of the optical element are avoided by a possible medium movement.
  • the corresponding inlets and outlets for the medium in the chamber can be vorteilhafltgue be formed so that in the chamber results in a laminar flow, preferably tangentially or parallel to the main surfaces of the optical Element or the optically active surface of the optical element or the chamber walls.
  • a corresponding laminar flow avoids that the optical element (s) are impaired by the flow in their imaging properties and, in particular, that vibrations are excited. If both the optical effect of a non-laminar flow and the resulting vibrations can be neglected, non-laminar flow, in particular turbulent flow, can also be used.
  • the chamber of the device is designed so that a laminar flow of the medium tangentially or parallel to the main surface of the optical Elements, eg to the mirror surface of a reflective element or the mirror surfaces of a multi-mirror assembly MMA in parallel alignment of the mirror, or results in a chamber wall.
  • a laminar flow of the medium tangentially or parallel to the main surface of the optical Elements eg to the mirror surface of a reflective element or the mirror surfaces of a multi-mirror assembly MMA in parallel alignment of the mirror, or results in a chamber wall.
  • This can be achieved for example by the above-mentioned arrangement of the inlets and outlets.
  • convection can occur, which brings the arrangement and shaping in the chamber to a laminar flow, in particular in the region between the transparent cover and the optical element.
  • the chamber volume can be fixed or variable. Through a variable chamber volume, the heat conduction conditions can be changed and adapted to the respective application.
  • the chamber may be designed so that the volume enclosed by the chamber can be adjusted variably, ie adjusted. This allows the amount of medium, its pressure, the length of the heat conduction paths, etc. changed and thus the varnishleitbedin- conditions are set.
  • a device can thus be provided with which the heat conduction conditions or the temperature setting conditions can be changed.
  • a device may not only comprise means for changing the volume of the chamber, but various means, such as e.g. also heating devices, cooling devices, etc., which may preferably be arranged on a chamber wall.
  • various means such as e.g. also heating devices, cooling devices, etc., which may preferably be arranged on a chamber wall.
  • chamber walls may be flexible or adjustable, wherein by a corresponding adjustment of chamber walls and the distance of the chamber walls to the optical element or the optically active surfaces of the optical element can be changed. This also influences the heat conduction and heat dissipation, so that optimal conditions can be set by appropriate changes for the respective application.
  • the heat transport path can be shortened when z. B. in the vicinity of the chamber wall, a heat sink is present. This results in a low thermal resistance and thus good heat dissipation despite mechanical decoupling.
  • a media reservoir in a variable chamber volume, it may be advantageous to provide a media reservoir, so that when an enlargement of the chamber corresponding medium refilled or can be taken in a reduction of the chamber volume excess medium.
  • in gaseous media can be ensured in this way that the pressure conditions in the chamber can be kept constant.
  • the optical element may be completely surrounded by the chamber, or the chamber wall may be partially formed by the optical element or components thereof.
  • the board or the substrate on which the mirror array is disposed may be part of the chamber wall. It is advantageous, however, that a large part of the optical element, which is thermally stressed, is surrounded by the medium in the chamber.
  • Cooling and / or heating devices can be provided on or in the chamber, in particular spatially distributed, by means of which the heat removal can be intensified and / or the temperature compensation can be corrected if necessary.
  • Suitable cooling and / or heating means are all conceivable means, in particular ducts through which cooling media pass, Peltier elements, electrical heating elements and the like.
  • the corresponding cooling and / or heating devices must again be transparent in this case, even with the wavelength of light used, whereby external cooling channels for passing cooling media, such as gases and liquids, can be created, for example, by a double-layer, transparent cover.
  • Transparent heating elements can be formed by conductive transparent layers, such as indium tin oxide (ITO) layers or strips.
  • a laminar flow of the cooling medium is advantageous since this can prevent a deterioration of the optical imaging properties due to streaking or the like.
  • heaters have surprisingly been found to be advantageous in connection with the heat dissipation chamber according to the invention, since by means of the heaters equalization of the temperature of the optical element can be achieved. Since a good heat dissipation is ensured by the surrounding medium at the same time, the additional contribution of heat energy, which could be supposedly disadvantageous, is not critical. Accordingly, according to another aspect of the present invention, for which, independently and in combination with other aspects of the present invention, fmdung protection is sought, a chamber with transparent cover and heat dissipation medium and at least one heating proposed.
  • One or more temperature sensors may be provided on or in the chamber or on the optical element in order to detect the temperatures and in particular the temperature distribution.
  • the detected temperatures can in turn be used via a control and / or regulating unit for setting the temperature or control / regulation of the cooling and / or heating elements.
  • Figure 1 is a sectional view of a first embodiment of an inventive
  • Figure 2 is a sectional view of a second embodiment of the device according to the invention.
  • Figure 3 is a sectional view of a third embodiment of the device according to the invention.
  • Figure 4 is a sectional view of a fourth embodiment of an inventive
  • FIG. 5 shows a sectional view of a fifth embodiment of a device according to the invention
  • the chamber 1 shows a schematic sectional view of a chamber 1, which encloses a volume 7, in which an optical element 4 is arranged.
  • the chamber 1 has a transparent cover 2, which is formed for example from calcium fluoride (CaF 2 ).
  • the transparent cover 2 can be adapted to the light used in order to provide the greatest possible transparency for the wavelength used.
  • the optical element 4 which is shown only schematically in Figure 1, may be a single mirror element or an array of a plurality of mirrors, in particular in the form of a so-called.
  • Multi-mirror array A multi-mirror array has a multiplicity of mirrors arranged in rows and columns, which are arranged movably, in particular pivotably, on a circuit board or a substrate.
  • the board or the substrate comprises corresponding actuators and control electronics, which allows the adjustment or adjustment of the mirror.
  • the substrate or the circuit board may be part of the chamber wall, so that only the adjustable mirror elements are accommodated in the chamber volume 7. Alternatively, however, the entire multi-mirror array with a corresponding control board can be accommodated in the chamber volume 7. Accordingly, a bottom plate 3 is then provided as a chamber wall.
  • the optical element 4 in particular in the form of a multi-mirror array, can be connected to an external control and / or regulating unit via corresponding control and / or signal lines, which are passed through passages (not shown) of the chamber wall be (not shown).
  • a reinforced, uniform as possible temperature dissipation through the gas chamber 7 causes by the inventive device, which in the illustrated embodiment is formed by helium.
  • a heat flow from the optical element 4 can be adjusted via the gas space 7 into the chamber walls and to correspondingly connected cooling devices. Since the gas largely surrounds the optical element, moreover, homogenization of the temperature distribution via the optical element 4 is also achieved.
  • the chamber 1 is equipped with cooled side panels 5 and 6, which allow heat dissipation.
  • the side parts 5 and 6 of the chamber 1 can be traversed by cooling channels, through which a corresponding cooling medium, such as a cooling gas or a cooling liquid, is passed.
  • the corresponding cooling medium can be cooled in an additional external cooling device (not shown).
  • heating means can also be provided so that the optical element can be kept at a constant temperature or a temperature homogenization can be set.
  • Figure 2 shows in a similar representation to that of Figure 1 a modified embodiment of the device according to the invention, in which similar or identical components are provided with the same reference numerals. In this respect, one is unnecessary repeated description and reference is made in this regard to the description of the embodiment of Figure 1.
  • the embodiment of Figure 2 differs from that of Figure 1 to the effect that different side parts 9 and 10 are provided.
  • a gas reservoir 11 is provided in the apparatus of Figure 2, which is connected via a line 13 with the gas volume enclosed by the chamber 1 7.
  • the line 13 can be closed by a valve 12.
  • the valve 12 can be opened, so that from the gas reservoir 11 gas can flow into the gas volume 7 or can be sucked out of this to keep the pressure constant.
  • the embodiment of FIG. 3 has a gas inlet 17 and gas outlet 18 , which allow an interval-like and / or continuous flushing of the gas volume 7.
  • the advantage of the static, closed gas volume 7 is that vibrations of the optical element 4 are avoided by gas movements
  • the advantage of the embodiment of Figure 3 is that the chamber 1 no such must meet high requirements in terms of gas-tightness, since by the constant supply and removal of gas small losses of gas due to leaks are negligible.
  • gas inlet and outlet 17, 18 it is advantageous to be arranged in the chamber 1, that turbulence can be avoided , In particular, it is advantageous if the laminar gas flow is parallel to the optically active surface of the optical element 4 or parallel to the walls of the chamber 1. Accordingly, it is advantageous to provide either the gas inlet 17 or the gas outlet 18 on the same side part 16, so that the gas flow can run along the chamber walls and the optical element 4 is arranged in the middle of the annular gas flow. Alternatively, gas inlet 17 and gas outlet 18 can also be provided on the opposite side parts 16 and 15, so that a linear gas flow results from the gas inlet 17 to the opposite gas outlet 18.
  • the embodiment of Figure 3 differs from those of Figures 1 and 2 in that the substrate 14 on which the optical element 4 is arranged forming a part of the chamber wall.
  • an additional cooling device 19 in the form of a Peltier element or an external water cooling is provided in the region of the bottom plate of the chamber 1 and the substrate 14, so that in particular, as indicated by the arrow of the optical element 4, a heat flow over the Substrate 14 results in the cooling device 19.
  • 4 shows a fourth embodiment of the device according to the invention, again similar or identical components are provided with the same reference numerals.
  • the embodiment of FIG. 4 represents a combination of the embodiments of FIGS. 2 and 3.
  • the gas volume 7 can be adapted by means of variably formed side parts 15 'and 16'.
  • the side parts 15 'and 16' corresponding flexible elements 30 and 31, z. B. in the form of a bellows or the like.
  • FIG. 5 shows a fifth embodiment of the device according to the invention in a similar representation as that of the embodiments of Figures 1 to 4. Again, it is true that similar or identical components are provided with identical reference numerals, wherein a repeated description is omitted ,
  • FIG. 5 differs from that of Figure 3 in that instead of a cooling device 19 on the back of the optical element 4, ie opposite the optically active surface, a cooling device in the region or adjacent the transparent cover 2 is provided ,
  • a further transparent cover 20 is mounted at a distance from the transparent cover 2, so that a cooling channel 21 or more cooling channels are formed therebetween.
  • a purge stream of a gaseous or liquid cooling medium can be passed, so that, in particular, a heat flow from the optically active surface of the optical element 4 through the transparent cover 2 results.
  • heating elements 23 are provided on the chamber, which can be used in particular for the homogenization of the temperature distribution.
  • the heating elements 23 may additionally or alternatively also be provided in the chamber 1.
  • transparent heating elements 23 are provided on the outside of the transparent cover 2 in the region of the cooling channel 21.
  • Such transparent heating elements may be formed, for example, by transparent, electrically conductive layers, such as, for example, indium tin oxide (ITO), so that electrical heating elements result.
  • the heating elements 23 as well as the cooling channels 21 are spatially distributed on the outside of the chamber 1 or provided in the chamber walls to distributed by targeted heating or cooling at individual locations on the chamber wall to achieve a temperature compensation.
  • a control and / or regulation with a control and / or regulating unit are also provided in or on the chamber 1, not shown in detail temperature sensors. For the temperature measurement in particular a non-contact temperature measurement via a pyrometer is conceivable.
  • the purge stream is also adjusted so that a time-stationary and in the optically relevant area largely homogeneous temperature and velocity profile is formed. This avoids that streaking in the cooling medium causes impairment of the optical image.
  • a device for adjusting the temperature of an optical element in a microlithography imaging device comprising a chamber (1) with at least one transparent cover (2), and wherein in the chamber (1) an arrangement of a plurality of smaller, adjustable Mirror (Multi Mirror Array MMA) and a medium for heat dissipation is provided.
  • a chamber (1) with at least one transparent cover (2) wherein in the chamber (1) an arrangement of a plurality of smaller, adjustable Mirror (Multi Mirror Array MMA) and a medium for heat dissipation is provided.
  • Multi Mirror Array MMA Multi Mirror Array MMA
  • Apparatus according to embodiment 1 or 2 wherein the medium is gas, wherein the gas in particular helium, nitrogen and / or air comprises.
  • the chamber is a closed or encapsulated chamber. 6. Device according to one of embodiments 1 to 3, wherein the chamber has at least one medium inlet (17) and at least one medium outlet (18), wherein the medium inlet and medium outlet in the chamber (1) are arranged such that a laminar medium flow sets, which is tangential or nearly parallel with respect to the MMA.
  • the transparent cover (2) comprises an optical glass, quartz, an optical crystal and / or CaF 2 .
  • a substrate (14), on which the MMA or the mirrors are arranged, is part of the chamber wall.
  • cooling means (19) comprise at least one chamber wall arranged channels for cooling media and / or Peltier elements.
  • cooling media are gases or liquids which are adjustable in their temperature.
  • heating means comprise transparent heating elements (23).
  • a device for adjusting the temperature of an optical element in an imaging apparatus for microlithography wherein a chamber (1) for receiving at least one optical element (4) with at least one transparent cover (2) is provided, wherein in the chamber (1) a medium is provided for heat dissipation and wherein at least one chamber wall has an adjustable means for changing the heat conduction within the chamber.
  • An apparatus for adjusting the temperature of an optical element in an imaging apparatus for microlithography wherein a chamber (1) is provided for receiving at least one optical element (4) with at least one transparent cover (2), wherein in the chamber (1) a medium for heat dissipation is provided and wherein the volume enclosed by the chamber (1) is variably adjustable.
  • An apparatus for adjusting the temperature of an optical element in a microlithography imaging apparatus wherein a chamber (1) is provided for receiving at least one optical element (4) with at least one transparent cover (2), wherein in the chamber (1) a medium for heat dissipation is provided and the chamber is formed so that a laminar flow of the medium results tangentially or parallel to the main surface of the optical element or a chamber wall.
  • a device for adjusting the temperature of an optical element in an imaging device for microlithography wherein a chamber (1) for receiving at least one optical element (4) with at least one transparent cover (2) and at least one heating device is provided, wherein in Chamber (1) a medium for heat dissipation is provided.
  • Device for adjusting the temperature of an optical element in a microlithographic imaging device comprising a chamber (1) with at least one transparent cover (2) and a reflective element, wherein in the chamber (1) a medium for heat dissipation is provided.
  • the medium has a relation to the ambient atmosphere higher thermal conductivity, in particular higher thermal conductivity than air.
  • the medium is gas, wherein the gas in particular comprises helium, nitrogen and / or air.
  • Medium inlet and medium outlet in the chamber (1) are arranged so that a laminar medium flow is established, which is tangential or nearly parallel with respect to the optical element (4).
  • Device according to one of the embodiments 19 to 32 wherein at least one or more at least partially transparent to light of certain wavelength chamber walls (2) in their distance from the optical element (4) or the optically active surfaces are adjustable.
  • 34. The device according to one of the embodiments 19 to 33, wherein a with the chamber (1) connectable medium reservoir (11) is provided.
  • 35. Device according to one of the embodiments 19 to 34, wherein the transparent cover (2) comprises an optical glass, quartz, an optical crystal and / or CaF 2 .
  • cooling means (19) comprise at least one chamber wall arranged channels for cooling media and / or pelleting elements.
  • cooling media are gases or liquids which are adjustable in their temperature.
  • Lens in particular illumination objective for microlithography with an objective space with an objective atmosphere and with at least one device according to one of the preceding embodiments.

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  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention concerne un dispositif de réglage de température d'un élément optique, en particulier d'éléments optiques destinés à des objectifs pour microlithographie, caractérisé en ce qu'il est prévu une chambre (1) destinée à loger au moins un élément optique, en particulier un dispositif à miroirs, composé d'une pluralité de petits miroirs, réglables, disposés dans un champ (réseau de micro-miroirs MMA) (4) ayant au moins un recouvrement transparent (2), et en ce qu'il est prévu dans la chambre (1) un milieu qui présente une conductibilité thermique supérieure à celle de l'air. L'invention concerne en outre un objectif, en particulier un objectif d'éclairage pour microlithographie, doté d'un dispositif correspondant.
PCT/EP2008/059549 2007-07-25 2008-07-21 Dispositif de réglage de température d'un élément optique WO2009013278A1 (fr)

Applications Claiming Priority (2)

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DE102007034652.4 2007-07-25
DE200710034652 DE102007034652A1 (de) 2007-07-25 2007-07-25 Vorrichtung zur Temperatureinstellung eines optischen Elements

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DE102012005546A1 (de) 2012-03-21 2013-09-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrospiegelanordnung und Verfahren zur Herstellung einer Mikrospiegelanordnung
DE102021126360A1 (de) 2021-10-12 2023-04-13 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur Bearbeitung eines Werkstücks durch Laserstrahlung in Form von Lissajous-Figuren sowie ein hierfür bestimmter Scanner und ein Spiegelelement

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WO2003086955A1 (fr) * 2002-04-12 2003-10-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Procede et dispositif pour le fonctionnement d'un element micromecanique
EP1548505A1 (fr) * 2003-12-22 2005-06-29 ASML Netherlands B.V. Appareil de projection lithographique et méthode de fabrication d'un dispositif
US20060119815A1 (en) * 2004-12-07 2006-06-08 Franken Dominicus Jacobus P A Lithographic apparatus and device manufacturing method
EP1865359A1 (fr) * 2006-06-07 2007-12-12 ASML Netherlands B.V. Réseau de miroirs refroidi pour lithographie

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