WO2009008156A1 - Wiring method, and wiring apparatus - Google Patents
Wiring method, and wiring apparatus Download PDFInfo
- Publication number
- WO2009008156A1 WO2009008156A1 PCT/JP2008/001811 JP2008001811W WO2009008156A1 WO 2009008156 A1 WO2009008156 A1 WO 2009008156A1 JP 2008001811 W JP2008001811 W JP 2008001811W WO 2009008156 A1 WO2009008156 A1 WO 2009008156A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring
- substrate
- applied layer
- conductive fine
- laser beam
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Provided are a wiring method and a wiring apparatus, which can form an irradiation spot of a homogeneous laser beam at an arbitrary portion of an applied layer formed on a substrate, even if the substrate is not homogeneous in its surface shape and/or heat transfer characteristics, and which can perform the control of a heat energy. The wiring method comprises the step of applying a dispersed solution containing conductive fine particles to a substrate (1) inhomogeneous in its surface shape and/or characteristics, thereby to form an applied layer (3), the step of feeding a laser beam (6) continuously to the wiring region of the applied layer (3) on the basis of the substrate attribute information indicating the shape and/or characteristics at each position of the surface of the substrate (1), thereby to form a conductive fine wiring (4), and the step of eliminating the material of the region in the applied layer (3) other than the conductive fine wiring (4).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007179551A JP2009016724A (en) | 2007-07-09 | 2007-07-09 | Wiring forming method and wiring forming device |
JP2007-179551 | 2007-07-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009008156A1 true WO2009008156A1 (en) | 2009-01-15 |
Family
ID=40228348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/001811 WO2009008156A1 (en) | 2007-07-09 | 2008-07-07 | Wiring method, and wiring apparatus |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2009016724A (en) |
WO (1) | WO2009008156A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011165617A (en) * | 2010-02-15 | 2011-08-25 | Panasonic Corp | Plasma display panel and method of producing the same |
WO2017066338A1 (en) * | 2015-10-12 | 2017-04-20 | Te Connectivity Corporation | Process of producting electronic component and an electronic component |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6032637B2 (en) * | 2012-07-05 | 2016-11-30 | パナソニックIpマネジメント株式会社 | Component mounting board manufacturing system and manufacturing method |
JP6351938B2 (en) * | 2013-08-16 | 2018-07-04 | 国立大学法人大阪大学 | Manufacturing method of bonded structure, bonded structure and apparatus |
WO2016072011A1 (en) * | 2014-11-07 | 2016-05-12 | 富士機械製造株式会社 | Wiring formation method |
EP3217773B1 (en) | 2014-11-07 | 2021-09-22 | FUJI Corporation | Wiring formation method, and circuit board |
US9985344B2 (en) * | 2014-12-23 | 2018-05-29 | Te Connectivity Corporation | Electronic article and process of producing an electronic article |
JP2018129409A (en) * | 2017-02-09 | 2018-08-16 | 国立研究開発法人産業技術総合研究所 | Method for forming pattern wiring circuit on the basis of metal powder low temperature melting by irradiation with substrate back surface laser light and formed structure of the same |
JP6818154B2 (en) * | 2017-08-24 | 2021-01-20 | 株式会社Fuji | Wiring forming method and wiring forming device |
JP7061308B2 (en) * | 2018-01-22 | 2022-04-28 | 国立大学法人静岡大学 | Manufacturing method of metal microstructure |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006012057A1 (en) * | 2004-06-30 | 2006-02-02 | Eastman Kodak Company | Forming electrical conductors on a substrate |
JP2006059942A (en) * | 2004-08-19 | 2006-03-02 | Mamoru Onda | Wiring board, manufacturing method thereof electronic equipment and electronic device using the same |
-
2007
- 2007-07-09 JP JP2007179551A patent/JP2009016724A/en active Pending
-
2008
- 2008-07-07 WO PCT/JP2008/001811 patent/WO2009008156A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006012057A1 (en) * | 2004-06-30 | 2006-02-02 | Eastman Kodak Company | Forming electrical conductors on a substrate |
JP2006059942A (en) * | 2004-08-19 | 2006-03-02 | Mamoru Onda | Wiring board, manufacturing method thereof electronic equipment and electronic device using the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011165617A (en) * | 2010-02-15 | 2011-08-25 | Panasonic Corp | Plasma display panel and method of producing the same |
WO2017066338A1 (en) * | 2015-10-12 | 2017-04-20 | Te Connectivity Corporation | Process of producting electronic component and an electronic component |
Also Published As
Publication number | Publication date |
---|---|
JP2009016724A (en) | 2009-01-22 |
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