WO2009005134A1 - ダイヤモンド半導体デバイス - Google Patents

ダイヤモンド半導体デバイス Download PDF

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Publication number
WO2009005134A1
WO2009005134A1 PCT/JP2008/062111 JP2008062111W WO2009005134A1 WO 2009005134 A1 WO2009005134 A1 WO 2009005134A1 JP 2008062111 W JP2008062111 W JP 2008062111W WO 2009005134 A1 WO2009005134 A1 WO 2009005134A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor device
substrate
electrodes
diamond
diamond semiconductor
Prior art date
Application number
PCT/JP2008/062111
Other languages
English (en)
French (fr)
Inventor
Tokuyuki Teraji
Satoshi Koizumi
Yasuo Koide
Original Assignee
National Institute For Materials Science
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute For Materials Science filed Critical National Institute For Materials Science
Priority to US12/667,112 priority Critical patent/US8338834B2/en
Priority to EP08790855.4A priority patent/EP2169709B1/en
Priority to JP2009521672A priority patent/JP5360766B6/ja
Publication of WO2009005134A1 publication Critical patent/WO2009005134A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1602—Diamond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0405—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising semiconducting carbon, e.g. diamond, diamond-like carbon
    • H01L21/0425—Making electrodes
    • H01L21/0435—Schottky electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66015—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene
    • H01L29/66022—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/6603—Diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/872—Schottky diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/47—Schottky barrier electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

　本ダイヤモンド半導体デバイスは、ダイヤモンド基板に、対をなす電極が固定されてなるダイヤモンド半導体デバイスであって、前記ダイヤモンド基板の表面の内、電極との界面の内少なくとも一方が水素終端を有し、少なくとも対をなす両電極間の基板表面は、基板内部よりも大きい電気抵抗値となるようにしてあることを特徴とする。これにより、水素終端の有する機能を最大限に発揮しながら、デバイス動作の安定性、特に高温等の厳しい環境下でのデバイス動作の安定性を図ることができるダイヤモンド半導体デバイスが実現される。
PCT/JP2008/062111 2007-07-04 2008-07-03 ダイヤモンド半導体デバイス WO2009005134A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/667,112 US8338834B2 (en) 2007-07-04 2008-07-03 Diamond semiconductor device
EP08790855.4A EP2169709B1 (en) 2007-07-04 2008-07-03 Diamond semiconductor device
JP2009521672A JP5360766B6 (ja) 2007-07-04 2008-07-03 ダイヤモンド半導体デバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007175702 2007-07-04
JP2007-175702 2007-07-04

Publications (1)

Publication Number Publication Date
WO2009005134A1 true WO2009005134A1 (ja) 2009-01-08

Family

ID=40226175

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062111 WO2009005134A1 (ja) 2007-07-04 2008-07-03 ダイヤモンド半導体デバイス

Country Status (3)

Country Link
US (1) US8338834B2 (ja)
EP (1) EP2169709B1 (ja)
WO (1) WO2009005134A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016522988A (ja) * 2013-04-22 2016-08-04 セントレ・ナショナル・デ・ラ・レシェルシェ・サイエンティフィーク ダイヤモンド基板にショットキーダイオードを製造する方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5504565B2 (ja) * 2008-02-07 2014-05-28 独立行政法人物質・材料研究機構 ダイヤモンド紫外線センサー素子とその製造方法、並びに紫外線センサー装置
US20130026492A1 (en) * 2011-07-30 2013-01-31 Akhan Technologies Inc. Diamond Semiconductor System and Method
FR2984595B1 (fr) * 2011-12-20 2014-02-14 Centre Nat Rech Scient Procede de fabrication d'un empilement mos sur un substrat en diamant
CN103280395B (zh) * 2013-05-17 2015-07-08 中国电子科技集团公司第十三研究所 一种热退火法在金刚石表面制作氢端基导电沟道的方法
EP3198651A4 (en) * 2014-09-24 2018-05-02 Intel Corporation Scaled tfet transistor formed using nanowire with surface termination
CN113130695A (zh) * 2019-12-31 2021-07-16 西安电子科技大学 基于氢氧终端全垂直结构的金刚石核探测器及制备方法
CN113130697B (zh) * 2019-12-31 2024-01-23 西安电子科技大学 一种赝竖式氢氧终端金刚石核探测器及其制备方法
WO2023288108A1 (en) * 2021-07-16 2023-01-19 The University Of Chicago Biocompatible surface for quantum sensing and methods thereof
CN114068681B (zh) * 2021-11-17 2024-04-05 哈尔滨工业大学 基于金刚石肖特基二极管的高温工作的逻辑器件及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139109A (ja) * 1994-09-16 1996-05-31 Tokyo Gas Co Ltd 素子分離された水素終端ダイヤモンド半導体素子および該半導体素子の製造方法
JPH09312300A (ja) * 1995-11-17 1997-12-02 Tokyo Gas Co Ltd 水素終端ダイヤモンドデプレッション型ｍｅｓｆｅｔおよび該デプレッション型ｍｅｓｆｅｔの製造方法
EP0827208A2 (en) 1996-09-02 1998-03-04 Tokyo Gas Co., Ltd. Hydrogen-terminated diamond misfet and its manufacturing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3394096B2 (ja) 1994-09-16 2003-04-07 東京瓦斯株式会社 水素終端ホモエピタキシャルダイヤモンドを用いたｆｅｔおよびその製造方法
SE515494C2 (sv) * 1999-12-28 2001-08-13 Abb Ab Högspänningshalvledaranordning och förfarande för tillverkning av ett passiveringsskikt på en högspänningshalvledaranordning
JP3910512B2 (ja) 2002-09-20 2007-04-25 独立行政法人科学技術振興機構 ｐチャネル電界効果トランジスタの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139109A (ja) * 1994-09-16 1996-05-31 Tokyo Gas Co Ltd 素子分離された水素終端ダイヤモンド半導体素子および該半導体素子の製造方法
JPH09312300A (ja) * 1995-11-17 1997-12-02 Tokyo Gas Co Ltd 水素終端ダイヤモンドデプレッション型ｍｅｓｆｅｔおよび該デプレッション型ｍｅｓｆｅｔの製造方法
EP0827208A2 (en) 1996-09-02 1998-03-04 Tokyo Gas Co., Ltd. Hydrogen-terminated diamond misfet and its manufacturing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2169709A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016522988A (ja) * 2013-04-22 2016-08-04 セントレ・ナショナル・デ・ラ・レシェルシェ・サイエンティフィーク ダイヤモンド基板にショットキーダイオードを製造する方法

Also Published As

Publication number Publication date
EP2169709A4 (en) 2011-06-22
EP2169709A1 (en) 2010-03-31
JP5360766B2 (ja) 2013-12-04
JPWO2009005134A1 (ja) 2010-08-26
US20100289031A1 (en) 2010-11-18
EP2169709B1 (en) 2017-12-20
US8338834B2 (en) 2012-12-25

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