WO2009001448A1 - Thermosetting resin composition and process for producing the same - Google Patents

Thermosetting resin composition and process for producing the same Download PDF

Info

Publication number
WO2009001448A1
WO2009001448A1 PCT/JP2007/062884 JP2007062884W WO2009001448A1 WO 2009001448 A1 WO2009001448 A1 WO 2009001448A1 JP 2007062884 W JP2007062884 W JP 2007062884W WO 2009001448 A1 WO2009001448 A1 WO 2009001448A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
thermosetting resin
mounting
solder particles
producing
Prior art date
Application number
PCT/JP2007/062884
Other languages
French (fr)
Japanese (ja)
Inventor
Hirohisa Hino
Taro Fukui
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Priority to PCT/JP2007/062884 priority Critical patent/WO2009001448A1/en
Publication of WO2009001448A1 publication Critical patent/WO2009001448A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A resin composition that in the mounting of an electronic circuit including parts incapable of resisting high temperature, with the utilization of low-temperature fusible solder particles, realizes collective reflow at low temperature and realizes mounting of parts excelling in strength/toughness. The resin composition is characterized by containing solder particles of 180°C or below melting point, a thermosetting resin binder and, as a flux component, any of compounds of the following structural formula (1) or (2). In the formulae, each of R1 to R6 is hydrogen or an alkyl; and X is an organic group with a loneelectron pairor double bond π electrons allowing a metal coordination.
PCT/JP2007/062884 2007-06-27 2007-06-27 Thermosetting resin composition and process for producing the same WO2009001448A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/062884 WO2009001448A1 (en) 2007-06-27 2007-06-27 Thermosetting resin composition and process for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/062884 WO2009001448A1 (en) 2007-06-27 2007-06-27 Thermosetting resin composition and process for producing the same

Publications (1)

Publication Number Publication Date
WO2009001448A1 true WO2009001448A1 (en) 2008-12-31

Family

ID=40185282

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/062884 WO2009001448A1 (en) 2007-06-27 2007-06-27 Thermosetting resin composition and process for producing the same

Country Status (1)

Country Link
WO (1) WO2009001448A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015047614A (en) * 2013-08-30 2015-03-16 株式会社タムラ製作所 Solder composition for fine pattern application
US9446484B2 (en) 2012-02-21 2016-09-20 Sekisui Chemical Co., Ltd. Conductive particles, method for producing conductive particles, conductive material and connection structure
WO2017086335A1 (en) * 2015-11-17 2017-05-26 積水化学工業株式会社 Solder joining material, connection structure, and method for producing connection structure
CN112888798A (en) * 2018-11-07 2021-06-01 松下知识产权经营株式会社 Cured resin composition and mounting structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002514973A (en) * 1995-05-24 2002-05-21 フライズ・メタルズ・インコーポレーテッド Epoxy VOC-free soldering flux
JP2002239785A (en) * 2000-12-04 2002-08-28 Fuji Electric Co Ltd Noncleaning flux corresponding to lead-free solder and solder composition containing the flux
JP2005519169A (en) * 2002-03-01 2005-06-30 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレーション B-stage compatible underfill encapsulating material and method of use
WO2006064849A1 (en) * 2004-12-15 2006-06-22 Tamurakaken Corporation Conductive adhesive, and utilizing the same, conductive section and electronic part module
WO2007018288A1 (en) * 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. Lead free solder paste and application thereof
JP2007119750A (en) * 2005-09-27 2007-05-17 Matsushita Electric Works Ltd Thermosetting resin composition and method for producing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002514973A (en) * 1995-05-24 2002-05-21 フライズ・メタルズ・インコーポレーテッド Epoxy VOC-free soldering flux
JP2002239785A (en) * 2000-12-04 2002-08-28 Fuji Electric Co Ltd Noncleaning flux corresponding to lead-free solder and solder composition containing the flux
JP2005519169A (en) * 2002-03-01 2005-06-30 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレーション B-stage compatible underfill encapsulating material and method of use
WO2006064849A1 (en) * 2004-12-15 2006-06-22 Tamurakaken Corporation Conductive adhesive, and utilizing the same, conductive section and electronic part module
WO2007018288A1 (en) * 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. Lead free solder paste and application thereof
JP2007119750A (en) * 2005-09-27 2007-05-17 Matsushita Electric Works Ltd Thermosetting resin composition and method for producing the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9446484B2 (en) 2012-02-21 2016-09-20 Sekisui Chemical Co., Ltd. Conductive particles, method for producing conductive particles, conductive material and connection structure
JP2015047614A (en) * 2013-08-30 2015-03-16 株式会社タムラ製作所 Solder composition for fine pattern application
WO2017086335A1 (en) * 2015-11-17 2017-05-26 積水化学工業株式会社 Solder joining material, connection structure, and method for producing connection structure
CN107614192A (en) * 2015-11-17 2018-01-19 积水化学工业株式会社 The manufacture method of scolding tin grafting material, connection structural bodies and connection structural bodies
JPWO2017086335A1 (en) * 2015-11-17 2018-08-30 積水化学工業株式会社 Solder joint material, connection structure, and manufacturing method of connection structure
TWI717416B (en) * 2015-11-17 2021-02-01 日商積水化學工業股份有限公司 Flux bonding material, connection structure and manufacturing method of connection structure
CN107614192B (en) * 2015-11-17 2021-12-03 积水化学工业株式会社 Solder bonding material, connection structure, and method for manufacturing connection structure
JP7011892B2 (en) 2015-11-17 2022-02-10 積水化学工業株式会社 Manufacturing method of solder joint material and connection structure
JP2022050636A (en) * 2015-11-17 2022-03-30 積水化学工業株式会社 Solder joining material, connection structure, and method for producing connection structure
CN112888798A (en) * 2018-11-07 2021-06-01 松下知识产权经营株式会社 Cured resin composition and mounting structure

Similar Documents

Publication Publication Date Title
TW200745260A (en) Thermosetting resin composition and uses thereof
SG179001A1 (en) Adhesive film, multilayer circuit board, electronic component and semiconductor device
TWI231940B (en) Conductive paste, multi-layered substrate using it, and method for producing it
MX357114B (en) Lead-free solder alloy and in-vehicle electronic circuit.
US20130237645A1 (en) Thermosetting resin composition, method of manufacturing the same and circuit board
MX2009004793A (en) Flux for lead-free solder and method of soldering.
IN2014DN08075A (en)
JP2016537206A (en) Lead-free and silver-free solder alloy
WO2009001448A1 (en) Thermosetting resin composition and process for producing the same
TW200503872A (en) Solder paste
TW200642785A (en) Metal nanoparticle compositions
WO2009044801A1 (en) Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device
TW200631982A (en) Epoxy resin composition, process for providing latency to the composition and a semiconductor device
CN102699563A (en) Low-silver lead-free soft solder
WO2011102659A3 (en) Conductive ink and electronic device using same
TW200712267A (en) Tin electroplating solution and tin electroplating method
KR20150048208A (en) Soldering method for low-temperature solder paste
MY158834A (en) Lead-free solder alloy,connecting member and a method for its manufacture,and electronic part
CN103801853A (en) Lead-free tin-based solder for solar photovoltaic module and preparation method thereof
준혁손 et al. Thermal aging characteristics of Sn-xSb solder for automotive power module
TW200634127A (en) An electrically conductive adhesive, electrical part and electrical part module were made of it
JP2011147982A5 (en)
CN101844280A (en) Tin-bismuth solder with low melting point and preparation method thereof
GB201316162D0 (en) PB Free solder paste
CN102198570B (en) Heating welding flux of copper-coated steel/steel grounding network

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07767686

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07767686

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP