WO2008154952A1 - Composant électronique et procédé de fabrication d'un composant électronique - Google Patents

Composant électronique et procédé de fabrication d'un composant électronique Download PDF

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Publication number
WO2008154952A1
WO2008154952A1 PCT/EP2007/056021 EP2007056021W WO2008154952A1 WO 2008154952 A1 WO2008154952 A1 WO 2008154952A1 EP 2007056021 W EP2007056021 W EP 2007056021W WO 2008154952 A1 WO2008154952 A1 WO 2008154952A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
recess
electronic component
housing
board
Prior art date
Application number
PCT/EP2007/056021
Other languages
German (de)
English (en)
Inventor
Franz Bernitz
Peter Niedermeier
Original Assignee
Osram Gesellschaft mit beschränkter Haftung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gesellschaft mit beschränkter Haftung filed Critical Osram Gesellschaft mit beschränkter Haftung
Priority to PCT/EP2007/056021 priority Critical patent/WO2008154952A1/fr
Publication of WO2008154952A1 publication Critical patent/WO2008154952A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to an electronic component with egg ⁇ ner electrically conductive heat sink and with a housing for receiving at least one LED or the like electronic assembly. Furthermore, concerns the He ⁇ invention, a method for manufacturing such electronic component.
  • the power loss of the electronic component is largely released during the operation of the electronic component as heat loss.
  • LEDs are provided with heat sinks to dissipate the heat loss.
  • the heat sink coupled to the LED is designed to be electrically conductive.
  • the object of the present invention is therefore to provide an electronic component of the type mentioned, in which an efficient dissipation of the heat loss and at the same time a more reliable operation of the LED is made possible.
  • the present invention is based on the finding that, given a given areal extent of the heat sink, its thickness is of great importance for efficiently dissipating the heat loss.
  • the heat sink arranged on a housing for receiving the LED is inclined and / or laterally offset with respect to the board contact element, the heat sink may be in contact with electrically conductive structures, inter alia due to the thickness of the heat sink Board come. Therefore, the electrically conductive formation of the heat sink brings Restriktio ⁇ nen in the layout of the board with, since in assembling the electrically coupled to the LED heat sink on the board the probability of such a contact is to be kept low.
  • the housing has a recess for arranging the heat sink, which has a thickness, wherein the recess has a depth which the thickness of the heat sink is adapted such that the heat sink is sunk after its placement in the recess at least partially in the recess of the housing.
  • the electrically conductive heat sink with the prescribed thickness ⁇ be an efficient deriving the comparison is pleasurable heat possible.
  • the probability of Kon ⁇ clock of the heat sink is reduced with electrically conductive struc ⁇ ren a circuit board. This allows a more reliable operation of the LED electrically coupled to the heat sink.
  • the depth of the recess is greater than or equal to the thickness of the heat sink.
  • a PI tin ink contact element is provided, by means of which the Heat sink can be coupled to the board, wherein the depth of the recess is dimensioned such that after coupling the heat sink to the board by means of Platinen prestigeelements the board contact element is at least partially recessed in the recess of the housing.
  • the platinum contact element game as positional accuracy introduce at ⁇ in the form of a thermally conductive adhesive or a thermally conductive paste.
  • a contact of the heat sink with electrically conductive structures of the board is in this case also reduced if the heat ⁇ sink with respect to the board contact element inclined and / or laterally offset coupled to the board.
  • the board contact ⁇ element is electrically non-conductive.
  • the board contact element thus constitutes an insulation path for the electrically conductive heat sink.
  • the electrically non-conductive board contact ⁇ element is at least up to an outer edge of the heat sink ke formed surface.
  • the heat sink is fully ⁇ constantly galvanically isolated coupled to the board.
  • housing at least one channel is provided, which from ⁇ is at least sectionally formed radially away from the recess leading off.
  • the electronic component is designed to be surface-mountable, since particularly flat designs of the electronic component can thus be achieved in particular in conjunction with the arrangement of the heat sink sunk in the recess of the housing.
  • the board has an electrically conductive zone at least in the region of the board contact element. Is the elekt ⁇ driven conductive zone of the board in the region of Plati- nenchantelements for example, copper, can here particularly efficient ⁇ coupled with the deduced from the heat sink heat loss of the LED in the printed circuit board ⁇ the.
  • Figure 1 is a schematic side view of a mounted on a circuit board electronic component according to the prior art.
  • FIG. 2 is a schematic sectional view of an electronic component mounted on a circuit board according to the invention.
  • FIG. 3 shows a schematic view of an underside of the electronic component according to FIG. 2; FIG. and
  • FIG. 4 shows a schematic sectional view of the electronic component according to FIG. 2 along a line IV-IV;
  • Fig. 1 is a schematic side view of an assembled on a board electronic component 10 shows 12 ge ⁇ Mäss the prior art.
  • the electronic component 12 is electrically connected to the circuit board 10 by means of two connection elements 14.
  • an LED not shown in the present case is arranged which is 18 gekop ⁇ pelt with egg ner disposed on the housing 16 a heat sink.
  • the heat sink 18 is designed to derive the heat loss ⁇ loss of the LED electrically conductive.
  • the heat sink 18 is coupled to the circuit board 10 by means of an electrically non-conductive board contact element 20.
  • the circuit board 10 has an electrically leitfähi ⁇ ge zone 22nd During operation of the LED, the LED is cooled, by their loss of heat is coupled in particular in the zone 22 of the board 10.
  • Fig. 2 shows a schematic sectional view of an assembled on the circuit board 10 by surface mount technology, the electronic component according to the invention 12.
  • the electrically conductive heat sink 18 is arranged in an off ⁇ recess 26 of the housing 16.
  • a depth 28 of the recess 26 in this case is greater than a thickness 30 of the heat sink 18, so that it is completely recessed in the Ausneh ⁇ tion 26 of the housing 16.
  • the heat sink 18 is designed to conduct the heat loss of the arranged in the housing 16 LED electrically conductive and connected, for example, with an anode of the LED.
  • the power loss of the LED which is released during its operation as heat loss is so particularly effi ⁇ cient coupled into the existing example of copper, elec ⁇ ⁇ electrically conductive zone 22 of the board 10.
  • the associated cooling of the LED is particularly important when using a high-power LED in order to not be shortened by high temperatures.
  • the board contact element 20 which in the present case is designed as an electrically non-conductive heat-conducting adhesive, is partially sunk in the recess 26 of the housing 16.
  • the embodiment of the recess 26 shown in Fig. 2 thus allows a particularly accurate insertion of the thermal adhesive.
  • Even with respect to the board contact element 20 inclined or laterally offset mounting of the electronic component 12 is a galvani ⁇ cal insulation of the heat sink 18 of the cooling, presently made of copper zone 22 of the board 10 ge ⁇ give.
  • the board contact element 20 may alternatively be formed as a heat ⁇ conductive paste.
  • a use of heat ⁇ conductive adhesive or thermal compound is particularly preferable if the LED pre-mounted plastic lenses, so that the electrically coupled to the LED heat sink 18 can not be soldered by means of a reflow soldering to the board 10.
  • the heat-conducting adhesive is, as shown in Fig. 2, up to an outer edge 32 of the heat sink 18 formed flat.
  • An isolati ⁇ onsumble between the heat sink 18 and the surface 24 of the board 10 is always guaranteed. This allowed ⁇ light one optimized for thermal management of the LED out ⁇ blank layout or design of the board 10th
  • a schematic view is ber Formation in a mon ⁇ oriented state of the electronic component 12 of the O- 24 of the board 10 opposite bottom of the electronic component shown in FIG. 2.
  • the substantially round heat sink 18 is arranged sunk.
  • Au ⁇ ßerdem are arranged in the housing 16 includes two channels 34 which are radially from the recess 26 away leader keptbil ⁇ det.
  • FIG. 4 shows a schematic sectional illustration through the housing 16 and the channel 34 of the electronic component 12 arranged on the underside of the housing 16 along a line IV-IV indicated in FIG. 2.
  • the channel 34 may also have a different cross-sectional shape than shown in Fig. 4.
  • more or less than two channels 34 or similar hollow shapes may be provided in the housing 16, which are at least sectionally fashioned leading away from the recess. These can also be executed blind in the housing 16 ending. It can be arranged in the housing 16 and more than one LED or the like electronic components such as transistors or rectifier diodes.
  • the LED has an operating mode at a power consumption associated with a given operating state. loss of energy, which is mainly released as heat loss. Therefore, the LED can be described by an operating loss power, in particular by the maximum power loss corresponding to the maximum power consumption.
  • the operating power loss at maximum power consumption is determined.
  • the thickness 30 of the heat sink 18 is tuned to the maximum operating power dissipation of the LED.
  • the depth 28 of the recess 26 of the housing 16 is greater than the thickness 30 of the heat sink 18 dimensioned so that the heat sink 18 is completely sunk in the recess 26 of the housing 16 when arranged in the recess 26.
  • the heat sink 18 is then foamed, for example in egg ⁇ nem molding method by insert molding or posterior surrounded together with the electrically coupled to the LED heat sink 18 to the housing sixteenth In this case, the LED can already have a pre-assembled plastic lens.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne un composant électronique qui présente un drain thermique (18) électriquement conducteur et un boîtier (16) qui loge au moins une LED, le boîtier (16) présentant une découpe (26) permettant d'y placer le drain thermique (18) qui présente une épaisseur (30), la découpe (18) ayant une profondeur (28) qui est adaptée à l'épaisseur (30) du drain thermique (18) de telle sorte qu'après avoir été placé dans la découpe (26), le drain thermique (18) est enfoncé au moins en partie dans la découpe (26) du boîtier (16). L'invention concerne en outre un procédé de fabrication d'un composant électronique (12) qui présente un drain thermique (18) électriquement conducteur et un boîtier (16) qui loge au moins une LED qui peut être activée par la puissance de perte en fonctionnement, le procédé comprenant les étapes suivantes : a) détermination de la puissance de perte en fonctionnement, b) détermination d'une épaisseur (30) du drain thermique (18) électriquement conducteur accordée à la puissance de perte en fonctionnement; c) détermination de la profondeur (28) d'une découpe (26) ménagée dans le boîtier (16) de telle sorte que lorsqu'il est placé dans la découpe (26), le drain thermique (18) s'enfonce au moins en partie dans la découpe (26) ménagée dans le boîtier (16) et d) placement d'au moins le drain thermique (18) dans le boîtier (16).
PCT/EP2007/056021 2007-06-18 2007-06-18 Composant électronique et procédé de fabrication d'un composant électronique WO2008154952A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2007/056021 WO2008154952A1 (fr) 2007-06-18 2007-06-18 Composant électronique et procédé de fabrication d'un composant électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2007/056021 WO2008154952A1 (fr) 2007-06-18 2007-06-18 Composant électronique et procédé de fabrication d'un composant électronique

Publications (1)

Publication Number Publication Date
WO2008154952A1 true WO2008154952A1 (fr) 2008-12-24

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Country Status (1)

Country Link
WO (1) WO2008154952A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013164113A1 (fr) * 2012-04-30 2013-11-07 Tridonic Jennersdorf Gmbh Ensemble del

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020141197A1 (en) * 2001-03-29 2002-10-03 Petroski James T. Heat dissipation system for high power LED lighting system
US20030062526A1 (en) * 2001-10-02 2003-04-03 Xerox Corporation Substrates having increased thermal conductivity for semiconductor structures
US20050077623A1 (en) * 1999-03-15 2005-04-14 Roberts John K. Semiconductor radiation emitter package
EP1622432A2 (fr) * 2004-07-30 2006-02-01 Patent -Treuhand-Gesellschaft für elektrische Glühlampen mbH Pannau à circuit imprimé et procédé de fabrication d'un tel panneau à circuit imprimé
US20060273338A1 (en) * 2005-06-03 2006-12-07 Samsung Electro-Mechanics Co., Ltd. High power LED package and fabrication method thereof
US20070018190A1 (en) * 2005-07-20 2007-01-25 Samsung Electro-Mechanics Co., Ltd. LED package and fabricating method thereof
EP1753036A2 (fr) * 2005-08-08 2007-02-14 Samsung Electronics Co., Ltd. Boîtier de diode électroluminescente et sa méthode de fabrication
DE102006038099A1 (de) * 2005-09-28 2007-03-29 Industrial Technology Research Institute, Chutung Licht emittierende Vorrichtung
US20070081313A1 (en) * 2005-07-29 2007-04-12 Kozo Tanaka Surface mounting semiconductor device
WO2007058438A1 (fr) * 2005-11-18 2007-05-24 Amosense Co., Ltd. Boitier de composants electroniques

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050077623A1 (en) * 1999-03-15 2005-04-14 Roberts John K. Semiconductor radiation emitter package
US20020141197A1 (en) * 2001-03-29 2002-10-03 Petroski James T. Heat dissipation system for high power LED lighting system
US20030062526A1 (en) * 2001-10-02 2003-04-03 Xerox Corporation Substrates having increased thermal conductivity for semiconductor structures
EP1622432A2 (fr) * 2004-07-30 2006-02-01 Patent -Treuhand-Gesellschaft für elektrische Glühlampen mbH Pannau à circuit imprimé et procédé de fabrication d'un tel panneau à circuit imprimé
US20060273338A1 (en) * 2005-06-03 2006-12-07 Samsung Electro-Mechanics Co., Ltd. High power LED package and fabrication method thereof
US20070018190A1 (en) * 2005-07-20 2007-01-25 Samsung Electro-Mechanics Co., Ltd. LED package and fabricating method thereof
US20070081313A1 (en) * 2005-07-29 2007-04-12 Kozo Tanaka Surface mounting semiconductor device
EP1753036A2 (fr) * 2005-08-08 2007-02-14 Samsung Electronics Co., Ltd. Boîtier de diode électroluminescente et sa méthode de fabrication
DE102006038099A1 (de) * 2005-09-28 2007-03-29 Industrial Technology Research Institute, Chutung Licht emittierende Vorrichtung
WO2007058438A1 (fr) * 2005-11-18 2007-05-24 Amosense Co., Ltd. Boitier de composants electroniques

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013164113A1 (fr) * 2012-04-30 2013-11-07 Tridonic Jennersdorf Gmbh Ensemble del

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