WO2008136292A1 - ロボットアーム - Google Patents

ロボットアーム Download PDF

Info

Publication number
WO2008136292A1
WO2008136292A1 PCT/JP2008/057672 JP2008057672W WO2008136292A1 WO 2008136292 A1 WO2008136292 A1 WO 2008136292A1 JP 2008057672 W JP2008057672 W JP 2008057672W WO 2008136292 A1 WO2008136292 A1 WO 2008136292A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
prescribed
links
robot arm
changed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057672
Other languages
English (en)
French (fr)
Inventor
Mitsuru Shimamoto
Takahiro Maekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nabtesco Corp
Original Assignee
Nabtesco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nabtesco Corp filed Critical Nabtesco Corp
Priority to US12/450,802 priority Critical patent/US8677853B2/en
Priority to JP2009512927A priority patent/JP5033180B2/ja
Publication of WO2008136292A1 publication Critical patent/WO2008136292A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Program-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Program-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • B25J9/107—Program-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Program-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Program-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)

Abstract

　基部とハンドの間に閉リンク機構を有するロボットアームにおいて、そのロボットアームを使用して高温のワークを移動させるときに、ハンドの位置ずれを抑制する。 閉リンク機構を構成するリンク群のうちの第１所定リンク（２０、４）の温度が第１温度Ｔ１となり、第２所定リンク（１８、１０、２、１８）の温度が第２温度Ｔ２となるロボットアーム（１００）において、第１所定リンク（２０、４）と第２所定リンク（１８、１０、２、１８）は異なる材質で形成されている。使用前の温度Ｔ０から第１温度Ｔ１に変化するときの第１所定リンク（２０、４）の長さの熱膨張による伸び率が、使用前の温度Ｔ０から第２温度Ｔ２に変化するときの第２所定リンク（１８、１０、２、１８）の長さの熱膨張による伸び率にほぼ等しい。
PCT/JP2008/057672 2007-04-27 2008-04-21 ロボットアーム Ceased WO2008136292A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/450,802 US8677853B2 (en) 2007-04-27 2008-04-21 Robot arm with temperature compensation
JP2009512927A JP5033180B2 (ja) 2007-04-27 2008-04-21 ロボットアーム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007119695 2007-04-27
JP2007-119695 2007-04-27

Publications (1)

Publication Number Publication Date
WO2008136292A1 true WO2008136292A1 (ja) 2008-11-13

Family

ID=39943404

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057672 Ceased WO2008136292A1 (ja) 2007-04-27 2008-04-21 ロボットアーム

Country Status (3)

Country Link
US (1) US8677853B2 (ja)
JP (1) JP5033180B2 (ja)
WO (1) WO2008136292A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9142442B2 (en) 2012-10-11 2015-09-22 Tes Co., Ltd. Apparatus for transferring substrates

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9117859B2 (en) * 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
CN119257747B (zh) * 2024-07-25 2025-09-23 天津大学 一种模块化骨科手术机器人及其使用方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464232A (en) * 1987-09-03 1989-03-10 Toshiba Corp Conveyor
JPH01305533A (ja) * 1988-06-03 1989-12-08 Toshiba Corp 搬送装置
JPH11216691A (ja) * 1998-02-03 1999-08-10 Hitachi Ltd フロッグレッグ形ロボット並びに処理装置および処理方法
JP2002307341A (ja) * 2001-02-06 2002-10-23 Ulvac Japan Ltd 搬送装置
JP2004134747A (ja) * 2002-07-22 2004-04-30 Applied Materials Inc 高温基板移送用ロボット
JP2006123135A (ja) * 2004-11-01 2006-05-18 Daihen Corp 直線移動機構およびこれを用いた搬送ロボット

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761940A (en) * 1994-11-09 1998-06-09 Amada Company, Ltd. Methods and apparatuses for backgaging and sensor-based control of bending operations
JP3926501B2 (ja) 1998-11-13 2007-06-06 ナブテスコ株式会社 ロボットアーム及びその駆動装置
KR100867293B1 (ko) 2000-10-24 2008-11-06 가부시키가이샤 알박 반송장치 및 이를 이용한 진공처리장치
US20030014155A1 (en) 2001-07-12 2003-01-16 Applied Material, Inc. High temperature substrate transfer robot
US20030012631A1 (en) 2001-07-12 2003-01-16 Pencis Christopher H. High temperature substrate transfer robot
US6556887B2 (en) 2001-07-12 2003-04-29 Applied Materials, Inc. Method for determining a position of a robot
JP3853645B2 (ja) * 2001-12-03 2006-12-06 ナブテスコ株式会社 ロボットアーム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464232A (en) * 1987-09-03 1989-03-10 Toshiba Corp Conveyor
JPH01305533A (ja) * 1988-06-03 1989-12-08 Toshiba Corp 搬送装置
JPH11216691A (ja) * 1998-02-03 1999-08-10 Hitachi Ltd フロッグレッグ形ロボット並びに処理装置および処理方法
JP2002307341A (ja) * 2001-02-06 2002-10-23 Ulvac Japan Ltd 搬送装置
JP2004134747A (ja) * 2002-07-22 2004-04-30 Applied Materials Inc 高温基板移送用ロボット
JP2006123135A (ja) * 2004-11-01 2006-05-18 Daihen Corp 直線移動機構およびこれを用いた搬送ロボット

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9142442B2 (en) 2012-10-11 2015-09-22 Tes Co., Ltd. Apparatus for transferring substrates
US9209064B2 (en) 2012-10-11 2015-12-08 Tes Co., Ltd. Apparatus for transferring substrates
US9209063B2 (en) 2012-10-11 2015-12-08 Tes Co., Ltd. Apparatus for transferring substrates

Also Published As

Publication number Publication date
US20100116077A1 (en) 2010-05-13
JPWO2008136292A1 (ja) 2010-07-29
US8677853B2 (en) 2014-03-25
JP5033180B2 (ja) 2012-09-26

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