WO2008135345A1 - Tête de soudage de réparation pour composant monté en surface et procédé pour faire fonctionner cette tête de soudage - Google Patents

Tête de soudage de réparation pour composant monté en surface et procédé pour faire fonctionner cette tête de soudage Download PDF

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Publication number
WO2008135345A1
WO2008135345A1 PCT/EP2008/054524 EP2008054524W WO2008135345A1 WO 2008135345 A1 WO2008135345 A1 WO 2008135345A1 EP 2008054524 W EP2008054524 W EP 2008054524W WO 2008135345 A1 WO2008135345 A1 WO 2008135345A1
Authority
WO
WIPO (PCT)
Prior art keywords
receiving surface
component
soldering head
heat transfer
repair soldering
Prior art date
Application number
PCT/EP2008/054524
Other languages
German (de)
English (en)
Inventor
Ulrich Wittreich
Bernd Müller
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2008135345A1 publication Critical patent/WO2008135345A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81052—Detaching bump connectors, e.g. after testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H01L2224/81204—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding with a graded temperature profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Definitions

  • the invention relates to a repair soldering head for a surface-mounted component.
  • the repair soldering has a receiving surface that can be placed on the component to entlötende on ⁇ .
  • the repair soldering head is provided with a heat source, with which the receiving surface can be heated.
  • a repair soldering head of the type mentioned above is described for example in US 4,066,204.
  • the repair soldering head described there has as a receiving surface for a component to be desoldered a perforated metal plate, which can be placed on the surface of the component to be desoldered.
  • a heat element which serves as a heat source
  • a quantity of heat is introduced into the device to be desoldered, resulting in a softening of the solder contacts between the device to be desoldered and the substrate.
  • the repair soldering head has a vacuum connection, which opens into a cavity formed by the receiving plate. After applying a negative pressure, the repair soldering head can be lifted off the substrate, the vacuum-fixed component remaining on the repair soldering head because of the softened solder joints.
  • the object of the invention is to provide a repair solder, which can be relatively flexible adapt to different applications.
  • This object is achieved in that the receiving surface is formed by a separation membrane, which forms a cavity together with a housing structure of the repair solder on the receiving surface facing away from the receiving surface of the separation membrane, the cavity two independent feeds and a return for a fluidic heat transfer medium as a heat source having.
  • a fluidic heat transfer medium in the sense of the invention is meant a heat ⁇ transmission medium, which is either gaseous or liquid. It is important therefore that's Heat Transf ⁇ transfer medium flowing. As a result, it is advantageously ensured that the heat can be introduced in a well-dosed manner to the component to be desoldered.
  • the heat introduced into the component to be desoldered can furthermore advantageously be set precisely by mixing two partial lengths of the heat transfer medium in a specific ratio. This allows advantageously be observing a thermal overload of the Einbauplat ⁇ duties and when the intended recycling also the desoldered component.
  • a separation membrane As a receptacle for the device to be desoldered a separation membrane is used. This allows the heat transfer medium to circulate cleanly in the cavity formed by the separation membrane, without this would dirty the slot.
  • the separation membrane has a certain Elah ⁇ ticity, which makes it possible to set up recording with a mög ⁇ lichst large transfer area for heat transfer to the Stanfordlötende component. This requires a certain contact pressure.
  • the separation membrane can be made of an elastomer such as silicone or of a metal foil.
  • the metal foil in particular alloys can be used, the have a melting range, which overlaps with the process-related operating temperatures of the repair soldering head.
  • the elastic behavior of the alloy in the melting range can be used to improve the elastic properties of the separating membrane. Examples of the latter alloys are SnPb, SnBi, SnSb, SnAg or SnIn.
  • repair soldering head can advantageously also be used for a subsequent soldering in of a new component, wherein the metered circulation of the heat transfer medium prevents thermal overstressing of the component to be soldered.
  • the separation membrane is interchangeable fastened to the housing structure. This means that separation membranes of different geometry can be kept, which are each tailored to a particular component to be desoldered or a group of components with similar geometry. This makes it easier to retrofit the repair soldering head with changing requirements for the components to be desoldered.
  • the separating membrane is held in a clamping surfaces formver Sli- according to a particularly advantageous Ausgestal ⁇ processing of the invention.
  • the form-adjustable clamping allows adaptation to separation membranes with different geometries as soon as they are replaced.
  • a form-adjustable clamping can also be used to the currently used separation membrane deform in the context of their elasticity and so make an adjustment of the same membrane to different components to be desoldered.
  • the easier adaptability of the repair soldering head to different component geometries advantageously provides a further increase in flexibility in use.
  • variable-shape clamping voltage consists of a large number of movable fixing pins which hold the edge of the separating membrane.
  • the deformable clamping consists of a plurality of movable fixing pins which hold the edge of the separating membrane. Suitable fixing elements are provided on these fixing pins, which engage in the edge of the separating membrane and fix it in a specific position. If the shape of the separation membrane are changed, the fixing pins can be adjusted, thereby adjusting the shape of the separation membrane to a different type of components suffletenden ⁇ SUC gene can. The flexible use of the repair soldering is thereby advantageously improved.
  • the separation membrane is rectangular, with two opposite edges with kon ⁇ stantem distance from each other and the other two edges of which are held with a variable distance from one another in the clamp.
  • This advantageously creates a separating membrane which can be adapted to the widely used right-angled components.
  • the format of ent ⁇ soldered components is easy to adjust advantageous over the two edges with a variable distance.
  • the heat transfer can be advantageous always on the largest possible Area share of the component to be eroded widened who ⁇ .
  • the separating membrane has a vacuum connection which communicates with the receiving surface.
  • a negative pressure between the separating membrane and the component can be advantageously constructed via the vacuum connection, which leads to adhesion of the component to the receiving surface. This ensures that the repair soldering head can also be used as a handling tool for the component to be soldered or to be soldered. This facilitates use of the repair soldering head, with which the soldering or desoldering of components can be done in one operation.
  • the invention relates to a method for desoldering a surface-mounted component.
  • a repair solder is placed with a receiving surface on the component to be desoldered, heated the receiving surface by a heat source until softened solder contacts between the device and the surface and then lifted the device from the surface of the substrate component.
  • soldering components are soldered by the fact that a re ⁇ paraturlötkopf is fixed with a receiving surface on the contemplatlötende component, the component with the repair soldering to the surface of the intended mounting location (thus to the substrate member) is placed and the receiving surface by a heat source is heated until solder deposits between the device and the Soften the surface and form solder contacts.
  • the heat source is a fluid heat transfer medium
  • the receiving surface is formed by a separation membrane, which forms a cavity together with a housing structure of the repair soldering on the receiving surface facing away from the side of the separation membrane.
  • a fluidic heat transfer medium ie a gas or preferably a liquid
  • a time profile is taken into account for setting the required temperature profile.
  • the required temperature profile ultimately aims at setting the temperature required for desoldering, at which the solder contacts soften. In this way, it can advantageously be ensured that a thermal overstress due to too rapid heating of the component to be soldered or brazed off can be avoided.
  • the time profile can for example provide a linear heating of the component.
  • the creation of the profile can be determined depending on the component to be heated from experience.
  • component or the surface of the substrate on which the component is off or Weglö ⁇ tet is to be be equipped with a temperature control. In this case, for example, a temperature sensor can be used, with the aid of which a control or regulation of the temperature behavior of the heating component can be generated.
  • the separating membrane has a vacuum port communicating with the on ⁇ takeover, wherein the component is fixed by applying a vacuum to the vacuum port on the receiving surface and lifted from the surface ⁇ after the softening of the solder contacts ,
  • the component can advantageously be fixed particularly easily on the receiving surface.
  • a relatively gentle handling of the component is also possible because it can be dispensed with mechanical handling equipment.
  • the vacuum connection also makes advantageous the elasticity O
  • an advantageous development of the invention results from the fact that, after fixing the component on the receiving surface and before softening the solder contacts, the distance of the repair soldering head from the surface is increased by building up tensile stresses in the separation membrane.
  • bias voltages are generated in the separation ⁇ membrane, which lead to a relaxation of the separation membrane by increasing the distance of the component to be desoldered from the surface at a softening of the solder contacts.
  • This can advantageously be avoided that this is first pressed onto the surface to ⁇ by a contact pressure of the diligentlötkopfes to entlötende component, with the softening solder material would distribute. Due to the immediate lifting of the component, unnecessary contamination of the surface with soldering material is largely avoided, so that the installation location after the
  • FIG. 1 shows an embodiment of the repair soldering head according to the invention in a schematic cross section
  • FIG. 2 shows a plan view into the cavity of the repair soldering head according to FIG. 1,
  • FIGS. 3 and 4 schematically show a cross section and an embodiment of the repair soldering head according to the invention
  • Figure 5 shows a temperature profile for the operation of the repair soldering head according to the invention.
  • FIGS. 6 to 8 show selected steps of desoldering as an exemplary embodiment of the method according to the invention.
  • a repair soldering head 11 according to FIG. 1 consists of a housing structure 12 which, for example, can be connected to the gripper arm of a placement machine in a manner not shown.
  • the housing structure has movable guide pins 13, which serve to fix a separation membrane 14 at its edge 15.
  • an elastic sleeve 16 is further provided.
  • the separating membrane 14 has a receiving surface 17 directed downwards in FIG. 1, on which a component not shown in more detail, which preferably offers a flat surface for this purpose, can be deposited.
  • the component can be fixed to the receiving surface 17 by a vacuum connection 18, which is connected to a vacuum pump 19 for this purpose.
  • a part of the separation membrane 14 forms a suction cup 20.
  • the separation membrane 14 forms, together with a collar 16 and the housing structure, a cavity 21 into which a heat transfer medium, for example oil 22, can be filled. Since the cavity is closed off from the environment, As a result, contamination of the component to be handled and the installation location (substrate, not shown) is avoided.
  • a heat transfer medium for example oil 22
  • the oil 22 can be pumped into the cavity 21 through independent feeds 23a, 23b.
  • two pumps 24a, 24b are available, which pump the oil from two reservoirs 25a, 25b.
  • the temperature of the oil stored in the reservoirs 25a, 25b is different (for example
  • the oil 22 is pumped back via a return 26 by means of a pump 27 into the reservoirs 25a, 25b.
  • the temperature prevailing in the reservoirs is set again via heat exchangers 28a, 28b. Accordingly, this either a cooling or heating of the returning oil is necessary.
  • FIG. 2 shows how the diameter of the separation membrane 14 can be widened by means of the guide pins 13.
  • the pins are mounted radially movable for this purpose in a manner not shown, so that a radia ⁇ les moving apart of their end points leads to a widening of the edge 15 of the separation membrane 14. It can also be seen that the one arranged in the center of the separation membrane 14
  • Vacuum port 18 of the elastic deformation of the membrane 14 is unaffected.
  • HTV silicone rubber can be used as the material for the separating membrane 14 since components made of this material in the stabilized form have a Temperature resistance of up to 300 0 C may have.
  • a separating membrane of silicone rubber therefore meets the requirements of the application.
  • a chemical resistance to Wär ⁇ meübertragungsmedium is still necessary.
  • a sufficient elasticity must be present.
  • a sufficient thermal conductivity is required so that the temperature of the heat transfer medium can be transferred to the device.
  • Figures 3 and 4 show another design of the separation membrane. This is shown in Figure 3 in a schematic section and in Figure 4 as a top view.
  • the Trennmem- bran 14 has a trough-shaped construction with rectangular
  • the level with the oil 22 is indicated. It is located for the sake of a reliable seal below the edge of the side wall 29.
  • the remaining structure of the repair soldering ⁇ fes 11 is not shown in more detail, but can be constructed according to Figure 1.
  • the figure 4 can be seen as the Verstellmechanis ⁇ mechanism for the separation membrane 14 is formed in this embodiment.
  • the wall elements 30, which are parallel to ⁇ each other and are arranged at a constant distance in repair solder 11 two other wall elements 31 is provided, on which the side wall 29 is fixed. These wall elements 31 can be displaced between the wall elements 30, as a result of which the separation membrane 14 experiences an elongation and the repair soldering head 11 can be adapted to a component of a different format.
  • the separation membrane (14) according to this embodiment can be formed for example by a highly flexible copper foil ⁇ the.
  • the use of copper has the significant advantage that heat transfer can occur quickly due to the good thermal conductivity of copper.
  • the copper foil on a sufficient elasticity, so that it can adapt well to better heat transfer to the surface of the device.
  • FIG. 5 shows how, for example, a temperature profile can be created for the purpose of desoldering a component. If the component is to be supplied, for example, to a new use after the soldering, then the specifications of the manufacturer must be observed with regard to the heating. These consist of a maximum permissible temperature Tmax and a permissible heating rate delta T / ⁇ t. In order to ensure the fastest possible heating of the component despite these specifications, a temperature profile is selected for the heat transfer medium, which is influenced by the specifications of the manufacturer. The temperature of the heat transfer medium is always higher by the amount .DELTA.T than the currently measured temperature of the component, so that a constant heating ⁇ T / ⁇ t is ensured.
  • the temperature of the heat transfer medium is lowered by admixing cold heat transfer medium to the temperature of the component T max , so that this temperature in the component is held. As soon as the solder joints soften, the component can be removed from the installation site. Subsequently, a further compliance with the temperature T max is no longer necessary.
  • Figures 6 to 8 show selected steps of a soldering of a component 32. This is fixed with solder contacts 33 on a printed circuit board 34.
  • the repair soldering head 11 which is constructed in accordance with FIG. 1, is placed on the component 32.
  • the vacuum connection 18 is evacuated, so that a negative pressure is created in the bell 20, which fixes the separation membrane 14 on the component 32.
  • the separation membrane has a height h up to the point of fixation in the repair soldering head 11.
  • the repair soldering head 11 is raised by the amount x. It can be seen that due to the elasticity of the separating membrane 14 and due to the firm abutment of the separating membrane 14 on the component 32, the separating diaphragm is elongated in the direction of the height h by the amount x. As a result, tensile stresses are induced in the separation membrane, due to which the component 32 is subjected to a tensile force Z of the circuit board 34 away. It is also shown that the suction cup 20 receives a slightly larger volume by the elongation of the separation membrane by the amount x.

Abstract

L'invention concerne une tête de soudage de réparation (11) destinée à un composant monté en surface. Grâce à cette tête de soudage de réparation, le composant peut être réchauffé, puis retiré après ramollissement des contacts de soudure. Selon l'invention, la surface de réception (17) pour le composant est formée par une membrane de séparation (14) qui forme une cavité pouvant être remplie d'un fluide caloporteur (22). Cette cavité présente en outre deux conduites d'arrivée indépendantes pour le fluide caloporteur (22) de sorte que par mélange du fluide caloporteur en provenance de deux réservoirs (25b, 25a) la température recherchée pour la membrane de séparation puisse être réglée en vue de transférer de la chaleur au composant à souder ou dessouder. Une conduite de retour (26) permet d'obtenir une circulation du fluide caloporteur (22). L'invention concerne en outre des procédés de soudage ou de dessoudage de composants au moyen de la tête de soudage de réparation selon l'invention.
PCT/EP2008/054524 2007-05-03 2008-04-15 Tête de soudage de réparation pour composant monté en surface et procédé pour faire fonctionner cette tête de soudage WO2008135345A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710021269 DE102007021269B4 (de) 2007-05-03 2007-05-03 Reparaturlötkopf für oberflächenmontiertes Bauelement und Verfahren zu dessen Betrieb
DE102007021269.2 2007-05-03

Publications (1)

Publication Number Publication Date
WO2008135345A1 true WO2008135345A1 (fr) 2008-11-13

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DE (1) DE102007021269B4 (fr)
WO (1) WO2008135345A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116313946A (zh) * 2023-05-24 2023-06-23 长鑫存储技术有限公司 温度调节系统及调节方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021214626A1 (de) 2021-12-17 2023-06-22 Robert Bosch Gesellschaft mit beschränkter Haftung Werkzeug und Verfahren zum Entlöten eines auf einem Schaltungsträger oberflächenmontierten Bauelements

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066204A (en) * 1975-07-02 1978-01-03 Siemens Aktiengesellschaft Process and device for unsoldering semiconductor modules in the flip-chip technique
US4444559A (en) * 1982-06-28 1984-04-24 International Business Machines Corporation Process and apparatus for unsoldering solder bonded semiconductor devices
US5139193A (en) * 1990-06-04 1992-08-18 Toddco General, Inc. Fluxless resoldering system and fluxless soldering process
WO2004030077A1 (fr) * 2002-09-26 2004-04-08 Toray Engineering Co., Ltd. Procede de connexion et dispositif de connexion

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004003521B3 (de) * 2004-01-21 2005-02-17 Siemens Ag Reparaturlötkopf mit einem Zuführkanal für ein Wärmeübertragungsmedium und dessen Verwendung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066204A (en) * 1975-07-02 1978-01-03 Siemens Aktiengesellschaft Process and device for unsoldering semiconductor modules in the flip-chip technique
US4444559A (en) * 1982-06-28 1984-04-24 International Business Machines Corporation Process and apparatus for unsoldering solder bonded semiconductor devices
US5139193A (en) * 1990-06-04 1992-08-18 Toddco General, Inc. Fluxless resoldering system and fluxless soldering process
WO2004030077A1 (fr) * 2002-09-26 2004-04-08 Toray Engineering Co., Ltd. Procede de connexion et dispositif de connexion

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116313946A (zh) * 2023-05-24 2023-06-23 长鑫存储技术有限公司 温度调节系统及调节方法
CN116313946B (zh) * 2023-05-24 2023-10-17 长鑫存储技术有限公司 温度调节系统及调节方法

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DE102007021269A1 (de) 2008-11-06

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