WO2008133243A1 - Bst dielectric layer, capacitor layer-forming material comprising the bst dielectric layer, capacitor layer-forming member with electrode circuit, and printed wiring board having built-in capacitor circuit - Google Patents

Bst dielectric layer, capacitor layer-forming material comprising the bst dielectric layer, capacitor layer-forming member with electrode circuit, and printed wiring board having built-in capacitor circuit Download PDF

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Publication number
WO2008133243A1
WO2008133243A1 PCT/JP2008/057739 JP2008057739W WO2008133243A1 WO 2008133243 A1 WO2008133243 A1 WO 2008133243A1 JP 2008057739 W JP2008057739 W JP 2008057739W WO 2008133243 A1 WO2008133243 A1 WO 2008133243A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
capacitor
dielectric layer
bst dielectric
circuit
Prior art date
Application number
PCT/JP2008/057739
Other languages
French (fr)
Japanese (ja)
Inventor
Akihiro Kanno
Akiko Sugioka
Naohiko Abe
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to JP2008521667A priority Critical patent/JPWO2008133243A1/en
Publication of WO2008133243A1 publication Critical patent/WO2008133243A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Disclosed is a dielectric layer or the like which is small in capacitance density change even when the temperature is changed due to heat generation. Specifically disclosed is a BST dielectric layer to be used for capacitor circuit production, which is characterized by having a composition balance between barium and strontium satisfying the following relation: BaXSr1-XTiO3 (0.8 ≤ X < 1). This BST dielectric layer is also characterized by having a thickness of 0.3-0.7 μm. Also specifically disclosed is a capacitor layer-forming material for printed wiring boards, which comprises a lower electrode-forming layer on one side of the BST dielectric layer and an upper electrode-forming layer on the other side of the BST dielectric layer.
PCT/JP2008/057739 2007-04-23 2008-04-22 Bst dielectric layer, capacitor layer-forming material comprising the bst dielectric layer, capacitor layer-forming member with electrode circuit, and printed wiring board having built-in capacitor circuit WO2008133243A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008521667A JPWO2008133243A1 (en) 2007-04-23 2008-04-22 BST-based dielectric layer, capacitor layer forming material including the BST-based dielectric layer, capacitor layer constituent member with electrode circuit, and printed wiring board including a built-in capacitor circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007113196 2007-04-23
JP2007-113196 2007-04-23

Publications (1)

Publication Number Publication Date
WO2008133243A1 true WO2008133243A1 (en) 2008-11-06

Family

ID=39925693

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057739 WO2008133243A1 (en) 2007-04-23 2008-04-22 Bst dielectric layer, capacitor layer-forming material comprising the bst dielectric layer, capacitor layer-forming member with electrode circuit, and printed wiring board having built-in capacitor circuit

Country Status (3)

Country Link
JP (1) JPWO2008133243A1 (en)
TW (1) TW200917914A (en)
WO (1) WO2008133243A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013005473A1 (en) * 2011-07-01 2013-01-10 三洋電機株式会社 Multilayer structure and method for manufacturing same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107404806B (en) * 2016-05-18 2020-12-01 德昌电机(深圳)有限公司 Printed circuit board and motor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130678A (en) * 1984-07-19 1986-02-12 Sony Corp Composite body consisting of ti metallic layer and ba1-xsrxtio3 film and its production
JP2007035975A (en) * 2005-07-27 2007-02-08 Mitsui Mining & Smelting Co Ltd Capacitor layer formation material with support substrate, and capacitor layer formation material as well as method for manufacturing these
JP2007036237A (en) * 2005-07-22 2007-02-08 Samsung Electro-Mechanics Co Ltd Method of manufacturing compound metal-oxide dielectric film, and compound metal-oxide dielectric film
JP2007042989A (en) * 2005-08-05 2007-02-15 Ibiden Co Ltd Thin film embedded capacitance and its manufacturing method, and printed wiring board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130678A (en) * 1984-07-19 1986-02-12 Sony Corp Composite body consisting of ti metallic layer and ba1-xsrxtio3 film and its production
JP2007036237A (en) * 2005-07-22 2007-02-08 Samsung Electro-Mechanics Co Ltd Method of manufacturing compound metal-oxide dielectric film, and compound metal-oxide dielectric film
JP2007035975A (en) * 2005-07-27 2007-02-08 Mitsui Mining & Smelting Co Ltd Capacitor layer formation material with support substrate, and capacitor layer formation material as well as method for manufacturing these
JP2007042989A (en) * 2005-08-05 2007-02-15 Ibiden Co Ltd Thin film embedded capacitance and its manufacturing method, and printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013005473A1 (en) * 2011-07-01 2013-01-10 三洋電機株式会社 Multilayer structure and method for manufacturing same

Also Published As

Publication number Publication date
TW200917914A (en) 2009-04-16
JPWO2008133243A1 (en) 2010-07-29

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