WO2008133243A1 - Ｂｓｔ系誘電層、そのｂｓｔ系誘電層を備えるキャパシタ層形成材、電極回路付キャパシタ層構成部材及び内蔵キャパシタ回路を備えるプリント配線板 - Google Patents

Ｂｓｔ系誘電層、そのｂｓｔ系誘電層を備えるキャパシタ層形成材、電極回路付キャパシタ層構成部材及び内蔵キャパシタ回路を備えるプリント配線板 Download PDF

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Publication number
WO2008133243A1
WO2008133243A1 PCT/JP2008/057739 JP2008057739W WO2008133243A1 WO 2008133243 A1 WO2008133243 A1 WO 2008133243A1 JP 2008057739 W JP2008057739 W JP 2008057739W WO 2008133243 A1 WO2008133243 A1 WO 2008133243A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
capacitor
dielectric layer
bst dielectric
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057739
Other languages
English (en)
French (fr)
Inventor
Akihiro Kanno
Akiko Sugioka
Naohiko Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2008521667A priority Critical patent/JPWO2008133243A1/ja
Publication of WO2008133243A1 publication Critical patent/WO2008133243A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

　発熱による温度変化があっても、容量密度の変化が小さな誘電層等を提供することを目的とする。この目的を達成するため、キャパシタ回路の製造に用いるＢＳＴ系誘電層において、当該ＢＳＴ系誘電層はバリウムとストロンチウムとの組成バランスが、ＢａＸＳｒ１－ＸＴｉＯ３　（０．８≦Ｘ＜１）の関係を満たし、その厚さが０．３μｍ～０．７μｍであることを特徴としたＢＳＴ系誘電層を採用する。また、当該ＢＳＴ系誘電層の片面側に下部電極形成層、他面側に上部電極形成層を備えるプリント配線板のキャパシタ層形成材等を提供する。
PCT/JP2008/057739 2007-04-23 2008-04-22 Ｂｓｔ系誘電層、そのｂｓｔ系誘電層を備えるキャパシタ層形成材、電極回路付キャパシタ層構成部材及び内蔵キャパシタ回路を備えるプリント配線板 Ceased WO2008133243A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008521667A JPWO2008133243A1 (ja) 2007-04-23 2008-04-22 Ｂｓｔ系誘電層、そのｂｓｔ系誘電層を備えるキャパシタ層形成材、電極回路付キャパシタ層構成部材及び内蔵キャパシタ回路を備えるプリント配線板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007113196 2007-04-23
JP2007-113196 2007-04-23

Publications (1)

Publication Number Publication Date
WO2008133243A1 true WO2008133243A1 (ja) 2008-11-06

Family

ID=39925693

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057739 Ceased WO2008133243A1 (ja) 2007-04-23 2008-04-22 Ｂｓｔ系誘電層、そのｂｓｔ系誘電層を備えるキャパシタ層形成材、電極回路付キャパシタ層構成部材及び内蔵キャパシタ回路を備えるプリント配線板

Country Status (3)

Country Link
JP (1) JPWO2008133243A1 (ja)
TW (1) TW200917914A (ja)
WO (1) WO2008133243A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013005473A1 (ja) * 2011-07-01 2013-01-10 三洋電機株式会社 積層構造体及びその製造方法
EP4481776A1 (de) * 2023-06-22 2024-12-25 E-Convert GmbH Verfahren zur herstellung eines umgebungsenergie-wandlers, insbesondere eines umgebungsenergieelektrischen elements

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107404806B (zh) * 2016-05-18 2020-12-01 德昌电机(深圳)有限公司 印刷电路板及电机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130678A (ja) * 1984-07-19 1986-02-12 Sony Corp Ｔｉ金属層とＢａ１−ｘＳｒｘＴｉＯ３被膜よりなる複合体及びその製造方法
JP2007035975A (ja) * 2005-07-27 2007-02-08 Mitsui Mining & Smelting Co Ltd 支持基板付キャパシタ層形成材及びキャパシタ層形成材並びにこれらの製造方法
JP2007036237A (ja) * 2005-07-22 2007-02-08 Samsung Electro-Mechanics Co Ltd 複合金属酸化物誘電体膜の製造方法及び複合金属酸化物誘電体膜
JP2007042989A (ja) * 2005-08-05 2007-02-15 Ibiden Co Ltd 薄膜エンベディッドキャパシタンス、その製造方法、及びプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130678A (ja) * 1984-07-19 1986-02-12 Sony Corp Ｔｉ金属層とＢａ１−ｘＳｒｘＴｉＯ３被膜よりなる複合体及びその製造方法
JP2007036237A (ja) * 2005-07-22 2007-02-08 Samsung Electro-Mechanics Co Ltd 複合金属酸化物誘電体膜の製造方法及び複合金属酸化物誘電体膜
JP2007035975A (ja) * 2005-07-27 2007-02-08 Mitsui Mining & Smelting Co Ltd 支持基板付キャパシタ層形成材及びキャパシタ層形成材並びにこれらの製造方法
JP2007042989A (ja) * 2005-08-05 2007-02-15 Ibiden Co Ltd 薄膜エンベディッドキャパシタンス、その製造方法、及びプリント配線板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013005473A1 (ja) * 2011-07-01 2013-01-10 三洋電機株式会社 積層構造体及びその製造方法
EP4481776A1 (de) * 2023-06-22 2024-12-25 E-Convert GmbH Verfahren zur herstellung eines umgebungsenergie-wandlers, insbesondere eines umgebungsenergieelektrischen elements
WO2024261345A1 (de) * 2023-06-22 2024-12-26 E-convert Gmbh Verfahren zur herstellung eines umgebungsenergie-wandlers, insbesondere eines umgebungsenergieelektrischen elements in gleichstrom

Also Published As

Publication number Publication date
JPWO2008133243A1 (ja) 2010-07-29
TW200917914A (en) 2009-04-16

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