WO2008132979A1 - 撮像装置の製造方法及び撮像装置 - Google Patents

撮像装置の製造方法及び撮像装置 Download PDF

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Publication number
WO2008132979A1
WO2008132979A1 PCT/JP2008/056886 JP2008056886W WO2008132979A1 WO 2008132979 A1 WO2008132979 A1 WO 2008132979A1 JP 2008056886 W JP2008056886 W JP 2008056886W WO 2008132979 A1 WO2008132979 A1 WO 2008132979A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging device
eliminated
troubles
diaphragm
assembly
Prior art date
Application number
PCT/JP2008/056886
Other languages
English (en)
French (fr)
Inventor
Keiichi Kawazu
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to JP2009511749A priority Critical patent/JP5035707B2/ja
Priority to US12/595,920 priority patent/US8339502B2/en
Priority to EP08739989A priority patent/EP2136553A4/en
Publication of WO2008132979A1 publication Critical patent/WO2008132979A1/ja

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/005—Diaphragms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/026—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/06—Simple or compound lenses with non-spherical faces with cylindrical or toric faces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)

Abstract

　本発明は、製造容易性を確保しつつ安価に撮像装置を製造できる製造方法及び撮像装置を提供する。この撮像装置は、レンズを形成する透明な樹脂材に金属板素材ＭＰをインサート成形することで、開口１４ａを絞りとして用いることが出来、別部材としての絞りを組み込む必要がなく、組み付け時の手間が省ける。更に、脚部１４ｂをアース端子Ｔ１ｇに当接させながら、レンズアレイＬＡを撮像素子アレイＩＡに組み付けることで、撮像素子のシールドの接地を行うことができ、ハンダによる結線等が不要となって、組み付け時の手間が省ける。
PCT/JP2008/056886 2007-04-17 2008-04-07 撮像装置の製造方法及び撮像装置 WO2008132979A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009511749A JP5035707B2 (ja) 2007-04-17 2008-04-07 撮像装置の製造方法及び撮像装置
US12/595,920 US8339502B2 (en) 2007-04-17 2008-04-07 Imaging device manufacturing method and imaging device
EP08739989A EP2136553A4 (en) 2007-04-17 2008-04-07 METHOD FOR MANUFACTURING IMAGING DEVICE AND IMAGING DEVICE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-108068 2007-04-17
JP2007108068 2007-04-17

Publications (1)

Publication Number Publication Date
WO2008132979A1 true WO2008132979A1 (ja) 2008-11-06

Family

ID=39925438

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056886 WO2008132979A1 (ja) 2007-04-17 2008-04-07 撮像装置の製造方法及び撮像装置

Country Status (4)

Country Link
US (1) US8339502B2 (ja)
EP (1) EP2136553A4 (ja)
JP (1) JP5035707B2 (ja)
WO (1) WO2008132979A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009076789A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Optical module, wafer scale package, and method for manufacturing those
JP2011100903A (ja) * 2009-11-06 2011-05-19 Sharp Corp 電子素子モジュールおよびその製造方法、電子素子ウエハモジュールおよびその製造方法、並びに電子情報機器
JP2012018993A (ja) * 2010-07-06 2012-01-26 Toshiba Corp カメラモジュールおよびその製造方法
EP2352170A3 (en) * 2009-11-30 2013-06-12 STMicroelectronics (Research & Development) Limited Electromagnetic shielding for camera modules

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5487842B2 (ja) * 2009-06-23 2014-05-14 ソニー株式会社 固体撮像装置
US8576574B2 (en) 2010-04-21 2013-11-05 Stmicroelectronics Pte Ltd. Electromagnetic interference shielding on semiconductor devices
JP5221615B2 (ja) * 2010-09-21 2013-06-26 株式会社東芝 撮像装置およびその製造方法
US8642119B2 (en) * 2010-09-22 2014-02-04 Stmicroelectronics Pte Ltd. Method and system for shielding semiconductor devices from light
JP2012212019A (ja) * 2011-03-31 2012-11-01 Konica Minolta Advanced Layers Inc 光学要素アレイの製造方法、光学要素アレイ、レンズユニット、及びカメラモジュール
KR101452078B1 (ko) * 2012-12-28 2014-10-16 삼성전기주식회사 쉴드캔 및 쉴드캔 제조용 지그
JP2015099262A (ja) * 2013-11-19 2015-05-28 ソニー株式会社 固体撮像装置およびカメラモジュール、並びに電子機器
EP3975539A4 (en) * 2019-06-28 2022-10-12 Guangdong Oppo Mobile Telecommunications Corp., Ltd. APERTURE SHUTTER COVER USED FOR CAMERA MODULE, CAMERA ASSEMBLY AND ELECTRONIC EQUIPMENT

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200965A (ja) 2002-12-18 2004-07-15 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
JP2004260356A (ja) * 2003-02-24 2004-09-16 Hitachi Maxell Ltd カメラモジュール
WO2005041561A1 (en) * 2003-10-27 2005-05-06 Koninklijke Philips Electronics N.V. Camera module and manufacturing method for such a camera module
JP2005176185A (ja) * 2003-12-15 2005-06-30 Nec Access Technica Ltd カメラモジュール実装構造
WO2006109638A1 (ja) * 2005-04-08 2006-10-19 Konica Minolta Opto, Inc. 固体撮像素子及びその製造方法
JP2007001365A (ja) 2005-06-22 2007-01-11 Toyota Motor Corp 車両の操舵制御装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
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US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP2002290842A (ja) 2001-03-23 2002-10-04 Sanyo Electric Co Ltd 固体撮像素子の製造方法
TWI296154B (en) * 2004-01-27 2008-04-21 Casio Computer Co Ltd Optical sensor module
JP2006165624A (ja) * 2004-12-02 2006-06-22 Konica Minolta Opto Inc 撮像装置及び該撮像装置を有する携帯端末
JP2006208928A (ja) * 2005-01-31 2006-08-10 Seiko Precision Inc プラスチックレンズ及びレンズユニット並びにレンズユニットの組立方法
KR100817060B1 (ko) * 2006-09-22 2008-03-27 삼성전자주식회사 카메라 모듈 및 그 제조 방법
WO2010033211A1 (en) * 2008-09-18 2010-03-25 Tessera North America, Inc. Recessed optical surfaces

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200965A (ja) 2002-12-18 2004-07-15 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
JP2004260356A (ja) * 2003-02-24 2004-09-16 Hitachi Maxell Ltd カメラモジュール
WO2005041561A1 (en) * 2003-10-27 2005-05-06 Koninklijke Philips Electronics N.V. Camera module and manufacturing method for such a camera module
JP2005176185A (ja) * 2003-12-15 2005-06-30 Nec Access Technica Ltd カメラモジュール実装構造
WO2006109638A1 (ja) * 2005-04-08 2006-10-19 Konica Minolta Opto, Inc. 固体撮像素子及びその製造方法
JP2007001365A (ja) 2005-06-22 2007-01-11 Toyota Motor Corp 車両の操舵制御装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2136553A4

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009076789A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Optical module, wafer scale package, and method for manufacturing those
US8582022B2 (en) 2007-12-19 2013-11-12 Heptagon Micro Optics Pte. Ltd. Optical module, wafer scale package, and method for manufacturing those
JP2011100903A (ja) * 2009-11-06 2011-05-19 Sharp Corp 電子素子モジュールおよびその製造方法、電子素子ウエハモジュールおよびその製造方法、並びに電子情報機器
EP2352170A3 (en) * 2009-11-30 2013-06-12 STMicroelectronics (Research & Development) Limited Electromagnetic shielding for camera modules
US9099368B2 (en) 2009-11-30 2015-08-04 Stmicroelectronics (Research & Development) Limited Electromagnetic shielding for camera modules
JP2012018993A (ja) * 2010-07-06 2012-01-26 Toshiba Corp カメラモジュールおよびその製造方法

Also Published As

Publication number Publication date
EP2136553A1 (en) 2009-12-23
US20100165172A1 (en) 2010-07-01
JP5035707B2 (ja) 2012-09-26
JPWO2008132979A1 (ja) 2010-07-22
US8339502B2 (en) 2012-12-25
EP2136553A4 (en) 2010-09-22

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