WO2008125009A1 - Substrat de circuit à conduction thermique élevée - Google Patents

Substrat de circuit à conduction thermique élevée Download PDF

Info

Publication number
WO2008125009A1
WO2008125009A1 PCT/CN2008/000732 CN2008000732W WO2008125009A1 WO 2008125009 A1 WO2008125009 A1 WO 2008125009A1 CN 2008000732 W CN2008000732 W CN 2008000732W WO 2008125009 A1 WO2008125009 A1 WO 2008125009A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
conductive
circuit substrate
high thermal
thermal conductivity
Prior art date
Application number
PCT/CN2008/000732
Other languages
English (en)
Chinese (zh)
Inventor
Hsu-Tan Huang
Chung-Lin Chou
Original Assignee
Cosmos Vacuum Technology Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cosmos Vacuum Technology Corporation filed Critical Cosmos Vacuum Technology Corporation
Publication of WO2008125009A1 publication Critical patent/WO2008125009A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

L'invention concerne un substrat (10) de circuit à conduction thermique élevée, qui comprend un substrat métallique (20), une couche isolante (30) qui est formée sur la surface du substrat métallique (20), une première couche diélectrique (40) qui est formée sur la surface de la couche isolante (30), une couche conductrice (50) qui est formée sur la surface de la première couche diélectrique (40). La couche conductrice (50) est constituée d'une couche de milieu conductrice (52) et d'une couche conductrice principale (54).
PCT/CN2008/000732 2007-04-12 2008-04-10 Substrat de circuit à conduction thermique élevée WO2008125009A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNA2007100958824A CN101287335A (zh) 2007-04-12 2007-04-12 高导热电路基板
CN200710095882.4 2007-04-12

Publications (1)

Publication Number Publication Date
WO2008125009A1 true WO2008125009A1 (fr) 2008-10-23

Family

ID=39863245

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2008/000732 WO2008125009A1 (fr) 2007-04-12 2008-04-10 Substrat de circuit à conduction thermique élevée

Country Status (2)

Country Link
CN (1) CN101287335A (fr)
WO (1) WO2008125009A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102159024A (zh) * 2011-02-28 2011-08-17 任正义 铝基印制电路板及其制备方法
CN102223767A (zh) * 2011-06-01 2011-10-19 何忠亮 一种高导热电路板的生产工艺
CN108878617B (zh) * 2017-05-09 2020-04-24 中国科学院化学研究所 Led异形散热基板及其制备方法和应用
CN108878631B (zh) * 2017-05-09 2020-05-12 中国科学院化学研究所 图案化绝缘层的led基板及其制备方法和应用
CN108878627B (zh) * 2017-05-09 2020-05-01 中国科学院化学研究所 Led基板及其制备方法和应用
CN107660064B (zh) * 2017-09-29 2020-06-05 中国科学院化学研究所 导热绝缘板及其制备方法和电子元器件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61156754A (ja) * 1984-12-27 1986-07-16 Matsushita Electric Ind Co Ltd 高熱伝導性金属ベ−スプリント基板
JPH01290279A (ja) * 1988-05-18 1989-11-22 Hitachi Chem Co Ltd 配線板及びその製造方法
CN1670947A (zh) * 2004-03-16 2005-09-21 私立逢甲大学 整合性散热基板及其制作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61156754A (ja) * 1984-12-27 1986-07-16 Matsushita Electric Ind Co Ltd 高熱伝導性金属ベ−スプリント基板
JPH01290279A (ja) * 1988-05-18 1989-11-22 Hitachi Chem Co Ltd 配線板及びその製造方法
CN1670947A (zh) * 2004-03-16 2005-09-21 私立逢甲大学 整合性散热基板及其制作方法

Also Published As

Publication number Publication date
CN101287335A (zh) 2008-10-15

Similar Documents

Publication Publication Date Title
WO2008125009A1 (fr) Substrat de circuit à conduction thermique élevée
WO2008125010A1 (fr) Procédé de fabrication d'un substrat de circuit à conduction thermique élevée
CN102256441A (zh) 一种导热铝基核心的金属基板及其制备方法
CN103327732A (zh) 一种高导热基板及其制备方法
KR100643320B1 (ko) 메탈코어 인쇄회로기판 및 그 제조방법
US7430106B2 (en) Materials for forming capacitor layer and printed wiring board having embedded capacitor circuit obtained by using the same
CN102291928A (zh) 一种导热氮化铝绝缘金属基板及其制备方法
US8448842B1 (en) Advanced copper bonding (ACB) with ceramic substrate technology
JP2006135036A (ja) キャパシタ層形成材及びそのキャパシタ層形成材を用いて得られる内蔵キャパシタ層を備えたプリント配線板
JP2023033313A (ja) キャリア付銅箔
CN207678068U (zh) 一种超高导热型陶瓷基板
CN103035585B (zh) 一种金属铝基氮化铝封装基板及其制备方法
US7773364B2 (en) Method of manufacturing capacitor
TW201101946A (en) Aluminum substrate circuit board, method of making the same, and electroplating solution for the method
TWI282564B (en) Surface mount device having a cushioning layer therein and the method of making the same
TW202237388A (zh) 層積體
KR100913309B1 (ko) 금속회로기판
US20080251282A1 (en) Highly thermally conductive circuit substrate
JP4222001B2 (ja) 銅被覆プラスチック基板
TW200841794A (en) Method of preparing highly thermally conductive circuit substrate
CN109400178B (zh) 一种片式陶瓷天线及其制备方法
JP5369609B2 (ja) 耐熱性絶縁基板およびその製造方法
US20110232950A1 (en) Substrate and method for manufacturing the same
KR101993521B1 (ko) 세라믹-메탈 패키지 및 그 제조방법
JP2020517115A (ja) 熱伝導及び電気絶縁のための装置

Legal Events

Date Code Title Description
DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08733935

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08733935

Country of ref document: EP

Kind code of ref document: A1