1282564 九、發明說明： 【發明所屬之技術領域】 、 纟發明關於-種表面黏著元件及其製造方法，特別曰一 種端電極内部具有一金屬材質 疋 其製造方法。 *衝層之表面黏者元件及 【先前技術】 蒼考圖1 ’顯示第一種習用積層陶瓷電容器之剖視示音 • ®。該積層陶究電容器1包括，本體Η及二端電： 12。該陶瓷本體U係由複數層陶瓷薄帶lu堆疊後燒結而 成，其中該等陶究薄帶⑴上印刷有複數個内電極ιΐ2。該 陶究本體η具有二端部113。該等端電極12係分別形成^ »亥陶瓷本體之端部113上。每一端電極係為三層结 構，其包括一電極層121、一保護層122及一導電層123。、口 -亥電極層121係直接位於該陶究本體u之端部m上，其 材質為銀’且其形成方式係利用沾銀機於該等端部113沾 _ ⑽後，再於-供乾爐内烘乾及—還原爐内燒附而成。該 保護層122係位於該電極層121上，用以保護該電極層i2i 之銀《亥保羞層122之材質為鎖，其係利用電鑛製程而形 A ’且其電鍍後之硬度係大於該電極層121之銀。該導電 層123係位於該保護層122上，用以電氣連接一外部元件。 該導電層123之材質為錫，其_用電鐘製程而形成。 該積層陶瓷電容器1之缺點為，當該積層陶瓷電容器丨安 瓜於一電路板後，如果該電路板受力而彎曲時，會連帶使 該積層陶曼電容器丨受力彎曲，然而該積層陶竟電容器丨所 102946.doc 1282564 能承受之外力是有限的，因此容易產生損壞。1282564 IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a surface-adhesive element and a method of manufacturing the same, and particularly to a method of manufacturing a metal material in a terminal electrode. *Surface adhesive component of the layered layer and [Prior Art] The image of the first conventional laminated ceramic capacitor is shown in Fig. 1 '. The laminated ceramic capacitor 1 comprises a body Η and two terminals: 12. The ceramic body U is formed by stacking a plurality of layers of ceramic strips lu, wherein the plurality of inner electrodes ι 2 are printed on the ceramic strips (1). The ceramic body η has two end portions 113. The terminal electrodes 12 are respectively formed on the end portions 113 of the ceramic body. Each of the electrodes is a three-layer structure comprising an electrode layer 121, a protective layer 122 and a conductive layer 123. The mouth-helium electrode layer 121 is directly located on the end portion m of the ceramic body u, and the material thereof is silver 'and is formed by using a dipstick machine at the end portions 113 after the _ (10), and then Drying in a dry furnace and burning in a reduction furnace. The protective layer 122 is located on the electrode layer 121 for protecting the silver of the electrode layer i2i. The material of the shy layer 122 is a lock, which is formed by an electric ore process and has a hardness greater than that after plating. The silver of the electrode layer 121. The conductive layer 123 is located on the protective layer 122 for electrically connecting an external component. The material of the conductive layer 123 is tin, which is formed by an electric clock process. The laminated ceramic capacitor 1 has the disadvantage that when the laminated ceramic capacitor is mounted on a circuit board, if the circuit board is bent by force, the laminated ceramic capacitor can be bent under force, but the laminated ceramic capacitor is bent. Capacitor 102102946.doc 1282564 can withstand external forces is limited, so it is prone to damage.
蒼考圖2，顯示第二種習用積層陶瓷電容器之剖視示意 圖。為了改善上述該第一種習用積層陶瓷電容器1之缺 點，中華民國專利公告第532548號提出一種新的積層陶究 電容器2，該積層陶瓷電容器2包括一陶瓷本體21及二端電 極22。該陶瓷本體21係由複數層陶瓷薄帶211堆疊後燒結 而成，其中該等陶瓷薄帶211上印刷有複數個内電極212。 忒陶瓷本體21具有二端部213。該等端電極22係分別形成 於忒陶瓷本體21之端部213上。每一端電極22係為一四層 結構，其包括一電極層221、一機械緩衝層222、一保護層 223及一導電層224。其中該電極層221係與圖丨之該電極層 121相同，該保護層223係與圖i之該保護層122相同，該^ 電層224係與圖1之該導電層123相同。 人圖1之該第一種習用積層陶瓷電容 一 ------- «V & ,砀乐 二種習用積層魏電容器2多了該機械緩衝層222,其係位 於该電極層221上並具高延展性。該機械緩衝層222之材質 為金屬導體（金或銀）與有機黏著劑之複合材料，其形成方 式係利用沾附㈣該電極層221上沾附該複合材料後，再 於一遠紅外線烘乾爐内烘乾與硬化而成。 ，第二種習㈣層陶t電容器2雖然多了該機械緩衝層 U以緩衝該積層„電容器2所受之外力， —種金屬導體與有機黏著 -係 A心稷口材枓，因此其導 耐熱性不佳。此外，在萝 # + 4 a ^耘中，该機械緩衝層222形成於 该電極層221後必須再貼附— 膠^(圖中未示）以 102946.doc 1282564 緩衝層222，因此會有殘膠（giue residue)的問題，致使該 積層陶瓷電容器2的銲性變差，進而降低該積層陶竞電容 器2整體之可靠度。 因此，本案發明人乃開發一種新穎之表面黏著元件及其 製造方法，以解決上述問題。 η 【發明内容】 本發明之主要目的在於提供一種具緩衝層之表面黏著元 件，其中該緩衝層係為以鑛覆（eQating)方 覆層(例如銅、銀或其他金屬)，由於其結構較緻密且= 小，因此具有緩衝效果，可提高該表面黏著^件之抗彎強 度(b-ing strength) ’且同時具有良好之導電性及耐敎 本發明之另一目的在於提供一種具緩衝層之表面黏著元 =’^-本體及„㈣電極。該本體具有複數個端 4。该專端電極係分別形成於該本體之端部，每一端電極 ^括：一電極層、—金屬鑛覆層（⑽及- V電層。該電極層係位於該本體之端部上。 係位於該電極層上，且㈣屬鏟覆^ ^ 極層，該金屬鍍覆層之硬产 、’、口 電 於兮八麗” a 亥電極層。該導電層係位 m屬鍍復層上，用以電氣連接—外部元件。 本發明之3 —目的在於提供―種具 + 件之製造方法，包括以下步驟： 《之表面黏者元 ⑷ (b) 提供一本體，該本體具有複數個端部； 分別附著一電極層於該本體之端部； 102946.doc 1282564 ()纟共乾及燒附該電極層； (d) 鍍覆一金屬鍍覆層於該電極層上，鍍覆後之該金屬 錢覆層之硬度小於該電極層；及 (e) 形成一導電層於該金屬鍍覆層上，該導電層係用以 電氣連接一外部元件。 【實施方式】 一=考圖3，顯示本發明表面黏著元件較佳實施例之剖視 —〜圖。本發明之「表面黏著元件」包括但不限於為一電 容器。該表面黏著元件3包括—本體31及複數個端電極 較佳地，該本體31係由複數層陶究薄帶311堆疊後燒 結而成’其中該等陶究薄帶311上印刷有複數個内電極 312。該本體31具有複數個端部313。該等端電極32係分別 形成於該本體31之端部313 ’每一端電極32包括—電極層 321、一金屬鍍覆層（metal coating layer)322、一 保護層 323及一導電層324。 '曰在本發明中，該電極層321係為—第_金屬及_玻璃之 混合物’纟中該第一金屬係為該電極層32ι之基材。該金 屬鍍覆層322之材質係為一第二金屬。該第一金屬之材質 可以相同或不同於該第二金屬。 ^本發明中，該第—金屬之材質包括但不限於銀或銅，Figure 2 shows a cross-sectional schematic view of a second conventional multilayer ceramic capacitor. In order to improve the above-mentioned first conventional laminated ceramic capacitor 1, the Republic of China Patent Publication No. 532548 proposes a new laminated ceramic capacitor 2 comprising a ceramic body 21 and two terminal electrodes 22. The ceramic body 21 is formed by stacking and laminating a plurality of layers of ceramic strips 211, wherein a plurality of internal electrodes 212 are printed on the ceramic strips 211. The ceramic body 21 has two end portions 213. The terminal electrodes 22 are formed on the end portions 213 of the ceramic body 21, respectively. Each end electrode 22 is a four-layer structure including an electrode layer 221, a mechanical buffer layer 222, a protective layer 223, and a conductive layer 224. The electrode layer 221 is the same as the electrode layer 121 of FIG. 1, and the protective layer 223 is the same as the protective layer 122 of FIG. 1, which is the same as the conductive layer 123 of FIG. The first conventional laminated ceramic capacitor of FIG. 1 ------- "V &, two types of conventional laminated multilayer Wei capacitors 2 have the mechanical buffer layer 222, which is located on the electrode layer 221 And highly malleable. The mechanical buffer layer 222 is made of a composite material of a metal conductor (gold or silver) and an organic adhesive, and is formed by adhering (4) the electrode layer 221 is adhered to the composite material, and then dried in a far infrared ray. It is dried and hardened in the furnace. The second (four) layer of ceramic t-capacitor 2, although the mechanical buffer layer U is added to buffer the laminated layer „capacitor 2 is subjected to external forces, a kind of metal conductor and organic adhesion-system A core 稷 稷 枓, therefore its guide The heat resistance is not good. In addition, in the root # + 4 a ^ , the mechanical buffer layer 222 is formed on the electrode layer 221 and must be attached again - glue (not shown) to 102946.doc 1282564 buffer layer 222 Therefore, there is a problem of giue residue, which deteriorates the weldability of the laminated ceramic capacitor 2, thereby reducing the overall reliability of the laminated ceramic capacitor 2. Therefore, the inventor of the present invention developed a novel surface adhesion. The present invention is directed to a surface mount component having a buffer layer, wherein the buffer layer is an eQating square cladding layer (for example, copper). , silver or other metals), because of its dense structure and = small, it has a buffering effect, which can improve the b-ing strength of the surface adhesive member, and at the same time has good electrical conductivity and resistance to sputum. hair Another object of the invention is to provide a surface adhesive element with a buffer layer = '^-body and „(four) electrodes. The body has a plurality of ends 4. The end electrodes are respectively formed at the ends of the body, and each end electrode comprises: an electrode layer, a metal ore layer ((10) and - V electric layer. The electrode layer is located at an end of the body. Located on the electrode layer, and (4) is a shovel layer, the metal plating layer is hard-produced, ', and the electric port is on the 兮Bali' a hai electrode layer. The conductive layer is on the plated layer. For the purpose of electrical connection - external components. The third aspect of the present invention is to provide a method for manufacturing a tool + component, comprising the following steps: "Surface adhesive element (4) (b) provides a body having a plurality of ends Attaching an electrode layer to the end of the body; 102946.doc 1282564 () 纟 co-drying and burning the electrode layer; (d) plating a metal plating layer on the electrode layer, after plating The metal money coating has a hardness less than the electrode layer; and (e) forming a conductive layer on the metal plating layer, the conductive layer is used for electrically connecting an external component. [Embodiment] A cross-sectional view of a preferred embodiment of a surface mount component of the present invention is shown. The adhesive component includes, but is not limited to, a capacitor. The surface adhesive component 3 includes a body 31 and a plurality of terminal electrodes. Preferably, the body 31 is formed by stacking a plurality of layers of ceramic strips 311 and sintering them. A plurality of inner electrodes 312 are printed on the ceramic strip 311. The body 31 has a plurality of end portions 313. The end electrodes 32 are respectively formed at the end portions 313 of the body 31. Each of the end electrodes 32 includes an electrode layer 321 a metal coating layer 322, a protective layer 323, and a conductive layer 324. In the present invention, the electrode layer 321 is a mixture of -metal and glass. A metal is a substrate of the electrode layer 32. The material of the metal plating layer 322 is a second metal. The material of the first metal may be the same or different from the second metal. - the material of the metal includes but is not limited to silver or copper,
該第二金屬之材質係選自由銅、銀、&、鋅、鎂H 及金所組成之群。 σ 31之端部313上。該金屬 ’且該金屬鍍覆層322係 該電極層32 1係直接位於該本體 鑛覆層322係位於該電極層321上 102946.doc 1282564 利用錢覆製程所形成，該鍍覆方式包括但不限於電鍍 (plating)、濺鍍法（sputtering)、電化學沈積 (electrochemical deposition)、熱蒸鍍法（thermal evaporation)及電子束沈積法（electr〇n beam dep〇siti〇n)。 由於該金屬鍍覆層322係利用鍍覆製程所形成，因此其硬 度係小於該電極層321，可於該表面黏著元件3受一外力時 供作緩衝之用，亦即該金屬鍍覆層322係為一緩衝層。此 外，由於該金屬鍍覆層322係為金屬材質，其具有良好之 導電性及耐熱性。 要注意的是，在本發明中，該保護層323可有可無。當 忒金屬鍍覆層322之材質為銀時，則需要該保護層323係位 於忒金屬鍍覆層322上，用以保護該金屬鍍覆層322之銀； 。而田忒金屬鍍覆層322之材質不為銀時，則不一定需要 該保漢層323。该導電層324係位於該保護層323上，用以 電氣連接'一外部元件。 該表面黏著元件3依據該等端電極32之材質之不同而有 下述幾種實施例。 第一實施例係為貴重金屬電極（N〇Me Meul ΕΐαίΓ〇&， NME)製程。在本第一實施例中，該電極層之材質為銀 及玻璃之混合物，其中銀為該電極層321之基材（第一金 屬）"、开^成方式係利用銀貧沾附機於該等端部3 13沾附銀 “銀及玻璃)後’再於一烘乾爐内烘乾及一還原爐内燒附 而成。該金屬鍍覆層322之材質（第二金屬）絲，其係以 鍍覆（C〇ating)方式形成。由於該金屬鍍覆層322係以鍍覆 102946.doc 1282564 方式所形成，其結構較緻密且硬度小於該電極層321，因 此具有緩衝效果且同時具有良好之導電性及耐熱性。 該保護層323之材質為鎳，其係利用電鍍製程而形成， 該電鐘後之鎳之硬度大於該第二金屬之銀。該導電層324 之材質為錫或錫鉛合金，其係利用電鍍製程而形成。 要注意的是，在本實施例中，該表面黏著元件3在外觀 上係為四層結構’其包括該電極層3 21、該金屬鑛覆層 3之2、該保護層323及該導電層324。 第二實施例亦為貴重金屬電極製程。在本第二實施例 中，该電極層321之材質為銀及玻璃之混合物，其中銀為 该電極層32 1之基材（第一金屬），其形成方式係利用銀膏沾 附機於泫等端部3 13沾附銀膏（銀及玻璃）後，再於一烘乾爐 内烘乾及一還原爐内燒附而成。該金屬鍍覆層322之材質 (第二金屬）為銅，其係以鍍覆方式形成。由於該金屬鍍覆 層322係以鍍覆方式所形成，其結構較緻密且硬度小於該 電極層321，因此具有緩衝效果且同時具有良好之導電性 及耐熱性。 該保護層323之材質為鎳，其係利用電鍍製程而形成， 該電鍍後之鎳之硬度大於該金屬鍍覆層322之銅。該導電 層324之材質為錫或錫鉛合金，其係利用電鍍製程而形 成。 要注意的是，在本實施例中，由於該金屬鍍覆層322之 材質為銅，因此該保護層323可有可無。如果沒有該保護 層323的活，該導電層324則直接依附於該金屬鍍覆層 102946.doc -11 - 1282564 322，如此，形成三層結構，其包括該電極層321、該金屬 鍍覆層322及該導電層324 ;如果有該保護層323的話，係 开y成四層、、”構，其包括該電極層321、該金屬鐘覆層322 ' 該保護層323及該導電層324。 第二貫施例係為卑金屬電極（Base Metal Electrode， BME)製程。在本第三實施例中，該電極層321之材質為銅 及玻璃之混合物，其中銅為該電極層321之基材（第一金 屬），其形成方式係利用銅膏沾附機於該等端部3丨3沾附銅 膏（銅及玻璃）後，再於一烘乾爐内烘乾及一還原爐内燒附 而成。該金屬鍍覆層322之材質（第二金屬）為銀，其係以鍍 覆方式形成。由於該金屬鍍覆層322係以鍍覆方式所形 成，其結構較緻密且硬度小於該電極層321，因此具有緩 衝效果且同時具有良好之導電性及耐熱性。 該保護層323之材質為鎳，其係利用電鍍製程而形成， 該電鍍後之鎳之硬度大於該金屬鍍覆層322之銀。該導電 層3 24之材質為錫或錫鉛合金，其係利用電鍍製程而形 成。 在本實施例中，由於該金屬鍍覆層322之材質為銀，因 此需要該保護層323，而形成四層結構，其包括該電極層 321、該金屬鍍覆層322、該保護層323及該導電層Μ*。 第四實施例亦為卑金屬電極製程。在本第四實施例中， 該電極層321之材質為銅及玻璃之混合物，其中鋼為該電 極層321之基材（第一金屬），其形成方式係利用鋼膏沾附機 於該等端部313沾附銅膏（銅及玻璃）後，再於一烘乾爐内烘 102946.doc -12- 1282564 乾及-還原爐内燒附而成。該金屬鍍覆層322之 金屬）亦為銅，其係以鐘覆方式形成。由於該金屬鑛制 322係以鐘覆方式所形成，其結構較緻密且硬度^㈣ 極層321，因此具有緩衝效果且同卑 ” 』時具有良好之導電性及 财熱性。 該保護層323之材質為鎳’其係利用電鍍製程而形成， 該電鍍後之錄之硬度大於該金屬鑛覆層切之銅。該導電 層324之材質為錫或錫錯合金’其係利用電鑛製程而形 成0 要注意的是，在本實施例中，由於該金屬鍍覆層322之 材質係為銅，因此該保護層323可有可無。如果沒有該保 漠層323的居’。亥^電層324則直接依附於該金屬鐘覆層 322 ’如此’形成二層結構，其包括該電極層切、該金屬 鍵復層322及4 ^電層324 ;如果有該保護層323的話，係 I成四層結構’其包括該電極層321、該金屬鑛覆層似、 该保護層323及該導電層324。 本發明另外關於一種表面黏著元件之製造方法，包括以 下步驟。 首先提ί、本體，該本體具有複數個端部。較佳地， -亥本體係由複數層陶竟薄帶堆叠後燒結而成，纟中該等陶 瓷薄帶上印刷有複數個内電極。 接著，分別附著一電極層於該本體之端部。該電極層之 材貝係為一第-金屬及-玻璃之混合物，t亥第-金屬包括 但不限於銀及銅。其附著方式較佳為沾附。 102946.doc 1282564 圖2顯示第二種習用積層陶瓷電容器之剖視示意圖： 圖3顯示本發明表面黏著元件之剖視示意圖； 圖4顯示實例1與習用電容器之彎曲測試結果比較圖；及 圖5顯示具有由不同電鍍時間所形成之金屬鍍覆層之電 容器及習用電容器之彎曲測試結果比較圖。 【主要元件符號說明】The material of the second metal is selected from the group consisting of copper, silver, &, zinc, magnesium H, and gold. On the end 313 of σ 31. The metal coating layer 322 is formed by directly forming the electrode layer 32 1 on the electrode layer 321 on the electrode layer 321 102946.doc 1282564 is formed by a money coating process, including but not It is limited to plating, sputtering, electrochemical deposition, thermal evaporation, and electron beam deposition (electr〇n beam dep〇siti〇n). Since the metal plating layer 322 is formed by a plating process, the hardness is smaller than the electrode layer 321 and can be used for buffering when the surface adhesive component 3 is subjected to an external force, that is, the metal plating layer 322. It is a buffer layer. Further, since the metal plating layer 322 is made of a metal material, it has good electrical conductivity and heat resistance. It is to be noted that in the present invention, the protective layer 323 may or may not be included. When the material of the base metal plating layer 322 is silver, the protective layer 323 is required to be attached to the base metal plating layer 322 to protect the silver of the metal plating layer 322. When the material of the enamel metal plating layer 322 is not silver, the Baohan layer 323 is not necessarily required. The conductive layer 324 is located on the protective layer 323 for electrically connecting 'an external component. The surface adhesive member 3 has the following embodiments depending on the material of the terminal electrodes 32. The first embodiment is a noble metal electrode (N〇Me Meul ΕΐαίΓ〇&, NME) process. In the first embodiment, the material of the electrode layer is a mixture of silver and glass, wherein silver is the substrate (first metal) of the electrode layer 321 and the method of opening and closing is performed by using a silver-poor adhesion machine. The ends 3 13 are adhered to silver "silver and glass" and then dried in a drying oven and sintered in a reducing furnace. The material of the metal plating layer 322 (second metal) wire, It is formed by a plating method. Since the metal plating layer 322 is formed by plating 102946.doc 1282564, the structure is denser and the hardness is smaller than the electrode layer 321, so that it has a buffering effect and at the same time The material of the protective layer 323 is nickel, which is formed by an electroplating process, and the hardness of the nickel after the electric clock is greater than the silver of the second metal. The conductive layer 324 is made of tin. Or a tin-lead alloy, which is formed by an electroplating process. It is to be noted that in the present embodiment, the surface-adhesive member 3 is four-layered in appearance, which includes the electrode layer 321 and the metal ore cover. Layer 2, 2, the protective layer 323 and the conductive layer 324. Second The embodiment is also a precious metal electrode process. In the second embodiment, the electrode layer 321 is made of a mixture of silver and glass, wherein silver is the substrate (first metal) of the electrode layer 32 1 , and the manner of formation thereof. The silver paste (silver and glass) is adhered to the end portion 3 13 of the crucible by a silver paste applicator, and then dried in a drying oven and sintered in a reduction furnace. The metal plating layer 322 is formed. The material (second metal) is copper, which is formed by plating. Since the metal plating layer 322 is formed by plating, the structure is denser and the hardness is smaller than the electrode layer 321 , so that the buffering effect is obtained. At the same time, it has good electrical conductivity and heat resistance. The protective layer 323 is made of nickel, which is formed by an electroplating process, and the hardness of the electroplated nickel is greater than that of the metal plating layer 322. The material of the conductive layer 324 It is a tin or tin-lead alloy which is formed by an electroplating process. It should be noted that in the present embodiment, since the material of the metal plating layer 322 is copper, the protective layer 323 may or may not be present. The protective layer 323 is active, the conductive layer 324 Then directly attached to the metal plating layer 102946.doc -11 - 1282564 322, thus forming a three-layer structure including the electrode layer 321, the metal plating layer 322 and the conductive layer 324; if there is the protective layer 323 In this case, the y is formed into four layers, and the structure includes the electrode layer 321, the metal clock layer 322', the protective layer 323, and the conductive layer 324. The second embodiment is a Base Metal Electrode (BME) process. In the third embodiment, the electrode layer 321 is made of a mixture of copper and glass, wherein copper is the substrate (first metal) of the electrode layer 321 formed by using a copper paste applicator. The end portion 3丨3 is adhered to copper paste (copper and glass), and then dried in a drying oven and burned in a reduction furnace. The material (second metal) of the metal plating layer 322 is silver, which is formed by plating. Since the metal plating layer 322 is formed by plating, the structure is denser and the hardness is smaller than that of the electrode layer 321, so that it has a buffering effect and at the same time has good electrical conductivity and heat resistance. The protective layer 323 is made of nickel, which is formed by an electroplating process, and the hardness of the electroplated nickel is greater than the silver of the metal plating layer 322. The conductive layer 324 is made of tin or tin-lead alloy, which is formed by an electroplating process. In this embodiment, since the material of the metal plating layer 322 is silver, the protective layer 323 is required to form a four-layer structure including the electrode layer 321, the metal plating layer 322, the protective layer 323, and The conductive layer Μ*. The fourth embodiment is also a sturdy metal electrode process. In the fourth embodiment, the material of the electrode layer 321 is a mixture of copper and glass, wherein the steel is the substrate (first metal) of the electrode layer 321 formed by using a steel paste applicator. The end portion 313 is adhered with copper paste (copper and glass), and then baked in a drying oven to dry the 102946.doc -12-1282564 dry and reduced furnace. The metal of the metal plating layer 322 is also copper, which is formed by a clock cover method. Since the metal ore 322 is formed by a clock cover method, the structure is relatively dense and has a hardness of (4) the pole layer 321 , so that it has a buffering effect and has a good electrical conductivity and heat resistance when it is inferior. The protective layer 323 The material is nickel, which is formed by an electroplating process, and the hardness recorded after the electroplating is larger than the copper cut by the metal ore coating. The conductive layer 324 is made of tin or tin alloy, which is formed by an electric ore process. It should be noted that in the present embodiment, since the material of the metal plating layer 322 is copper, the protective layer 323 may or may not be present. 324 is directly attached to the metal clock cover 322 'so' to form a two-layer structure, which includes the electrode layer cut, the metal bond layer 322 and the 4 ^ electrical layer 324; if the protective layer 323 is present, The four-layer structure includes the electrode layer 321, the metal ore layer, the protective layer 323, and the conductive layer 324. The present invention further relates to a method for manufacturing a surface-adhesive element, comprising the following steps: The body has a plurality of ends Preferably, the Hei system is formed by stacking a plurality of layers of ceramics and thin strips, and a plurality of internal electrodes are printed on the ceramic strips. Then, an electrode layer is attached to the end of the body. The material of the electrode layer is a mixture of a first metal and a glass, and the metal includes, but is not limited to, silver and copper. The adhesion is preferably adhered. 102946.doc 1282564 FIG. 3 is a cross-sectional view showing the surface-adhesive element of the present invention; FIG. 4 is a cross-sectional view showing the bending test result of the example 1 and the conventional capacitor; and FIG. 5 is shown to have a different plating time. A comparison chart of the bending test results of the capacitor of the metal plating layer and the conventional capacitor. [Description of main component symbols]
1 積層陶瓷電容器 2 積層陶瓷電容器 3 表面黏著元件 11 陶瓷本體 12 端電極 21 陶瓷本體 22 端電極 31 陶瓷本體 32 端電極 111 陶瓷薄帶 112 内電極 113 端部 121 電極層 122 保護層 123 導電層 211 陶瓷薄帶 212 内電極 213 端部 102946.doc -17. 1282564 電極層 機械緩衝層 保護層 導電層 陶瓷薄帶 内電極 端部 電極層 金屬鍍覆層 保護層 導電層 102946.doc -18-1 laminated ceramic capacitor 2 laminated ceramic capacitor 3 surface adhesive member 11 ceramic body 12 terminal electrode 21 ceramic body 22 terminal electrode 31 ceramic body 32 terminal electrode 111 ceramic thin strip 112 inner electrode 113 end portion 121 electrode layer 122 protective layer 123 conductive layer 211 Ceramic strip 212 inner electrode 213 end 102946.doc -17. 1282564 electrode layer mechanical buffer layer protective layer conductive layer ceramic strip inner electrode end electrode layer metal plating layer protective layer conductive layer 102946.doc -18-