WO2008123519A1 - Laser processing apparatus and laser processing method - Google Patents

Laser processing apparatus and laser processing method Download PDF

Info

Publication number
WO2008123519A1
WO2008123519A1 PCT/JP2008/056463 JP2008056463W WO2008123519A1 WO 2008123519 A1 WO2008123519 A1 WO 2008123519A1 JP 2008056463 W JP2008056463 W JP 2008056463W WO 2008123519 A1 WO2008123519 A1 WO 2008123519A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
laser
laser processing
outputs
processing apparatus
Prior art date
Application number
PCT/JP2008/056463
Other languages
French (fr)
Japanese (ja)
Inventor
Naruhiko Mukai
Wataru Kono
Makoto Ochiai
Katsuhiko Sato
Nobuichi Suezono
Original Assignee
Kabushiki Kaisha Toshiba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toshiba filed Critical Kabushiki Kaisha Toshiba
Priority to US12/594,240 priority Critical patent/US20100116801A1/en
Priority to EP08739576A priority patent/EP2135703A1/en
Publication of WO2008123519A1 publication Critical patent/WO2008123519A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

A laser processing apparatus is provided with a laser oscillator which outputs a continuous wave or pulse wave thermal processing laser beam or a pulse wave surface processing laser beam; a light inputting optical system for inputting a laser beam outputted from the laser oscillator into an optical fiber; a collecting lens for collecting laser beams outputted from an optical fiber; and a processing apparatus which has the collecting lens mounted thereon, moves close to an object to be processed, and applies laser beams to the surface of the object to be processed. The laser oscillator outputs the thermal processing laser beams for thermal processing, and outputs surface processing laser beams for pre-processing or post-processing of the thermal processing.
PCT/JP2008/056463 2007-04-02 2008-04-01 Laser processing apparatus and laser processing method WO2008123519A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/594,240 US20100116801A1 (en) 2007-04-02 2008-04-01 Laser processing apparatus and laser processing method
EP08739576A EP2135703A1 (en) 2007-04-02 2008-04-01 Laser processing apparatus and laser processing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007096356A JP2008254006A (en) 2007-04-02 2007-04-02 Laser beam machining apparatus and method
JP2007-096356 2007-04-02

Publications (1)

Publication Number Publication Date
WO2008123519A1 true WO2008123519A1 (en) 2008-10-16

Family

ID=39830996

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056463 WO2008123519A1 (en) 2007-04-02 2008-04-01 Laser processing apparatus and laser processing method

Country Status (4)

Country Link
US (1) US20100116801A1 (en)
EP (1) EP2135703A1 (en)
JP (1) JP2008254006A (en)
WO (1) WO2008123519A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5667344B2 (en) * 2009-01-22 2015-02-12 オー・エム・シー株式会社 Laser emission unit
US20130061827A1 (en) * 2011-09-09 2013-03-14 GM Global Technology Operations LLC Cylinder head system and method of forming same
WO2013170160A1 (en) 2012-05-10 2013-11-14 Preco, Inc. Odor reduction in laser processed material with curl reduction
US9458728B2 (en) * 2013-09-04 2016-10-04 Siemens Energy, Inc. Method for forming three-dimensional anchoring structures on a surface by propagating energy through a multi-core fiber
US9343307B2 (en) 2013-12-24 2016-05-17 Ultratech, Inc. Laser spike annealing using fiber lasers
US10239155B1 (en) * 2014-04-30 2019-03-26 The Boeing Company Multiple laser beam processing
JP6549878B2 (en) * 2015-04-03 2019-07-24 株式会社東芝 Laser light irradiation apparatus and laser peening method
US10226838B2 (en) 2015-04-03 2019-03-12 Kabushiki Kaisha Toshiba Laser light irradiation apparatus and laser peening treatment method
JP5997804B1 (en) * 2015-06-03 2016-09-28 株式会社Ihi Surface treatment equipment
PL3523083T3 (en) * 2016-11-18 2024-02-05 Ipg Photonics Corporation System and method for laser processing of materials.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11277277A (en) * 1994-01-25 1999-10-12 Sumitomo Heavy Ind Ltd Laser beam machine
JP2003053533A (en) 2001-08-09 2003-02-26 Toshiba Corp Method of repairing structure and repair welding equipment
JP2005034849A (en) * 2003-07-15 2005-02-10 Seiko Epson Corp Laser beam machining method, and liquid droplet discharge head
JP2005262220A (en) * 2004-03-16 2005-09-29 Ricoh Co Ltd On-the-spot measuring unit for laser beam machining, on-the spot measuring method, and laser beam machining apparatus
JP2006130534A (en) * 2004-11-05 2006-05-25 Honda Motor Co Ltd Laser beam brazing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6769307B1 (en) * 1997-11-21 2004-08-03 Perceptron, Inc. Method and system for processing measurement signals to obtain a value for a physical parameter
US6211482B1 (en) * 1997-10-24 2001-04-03 Electric Power Research Institute, Inc. Apparatus and method for precision excavation and welding of thick-walled components

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11277277A (en) * 1994-01-25 1999-10-12 Sumitomo Heavy Ind Ltd Laser beam machine
JP2003053533A (en) 2001-08-09 2003-02-26 Toshiba Corp Method of repairing structure and repair welding equipment
JP2005034849A (en) * 2003-07-15 2005-02-10 Seiko Epson Corp Laser beam machining method, and liquid droplet discharge head
JP2005262220A (en) * 2004-03-16 2005-09-29 Ricoh Co Ltd On-the-spot measuring unit for laser beam machining, on-the spot measuring method, and laser beam machining apparatus
JP2006130534A (en) * 2004-11-05 2006-05-25 Honda Motor Co Ltd Laser beam brazing method

Also Published As

Publication number Publication date
EP2135703A1 (en) 2009-12-23
US20100116801A1 (en) 2010-05-13
JP2008254006A (en) 2008-10-23

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