WO2008123253A1 - Method for manufacturing composite body - Google Patents

Method for manufacturing composite body Download PDF

Info

Publication number
WO2008123253A1
WO2008123253A1 PCT/JP2008/055586 JP2008055586W WO2008123253A1 WO 2008123253 A1 WO2008123253 A1 WO 2008123253A1 JP 2008055586 W JP2008055586 W JP 2008055586W WO 2008123253 A1 WO2008123253 A1 WO 2008123253A1
Authority
WO
WIPO (PCT)
Prior art keywords
base material
inorganic base
composite body
aqueous solution
resin layer
Prior art date
Application number
PCT/JP2008/055586
Other languages
French (fr)
Japanese (ja)
Inventor
Toshihiko Jimbo
Takamasa Miyamoto
Junji Kodemura
Original Assignee
Zeon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corporation filed Critical Zeon Corporation
Priority to JP2009509118A priority Critical patent/JPWO2008123253A1/en
Publication of WO2008123253A1 publication Critical patent/WO2008123253A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

Provided is a method for manufacturing a composite body, which has an inorganic base material and a resin layer bonded extremely strongly and uniformly to each other, has excellent electrical characteristics and is suitable for a circuit board having fine wiring. The method has a step wherein surface treatment is performed to the surface of the inorganic base material with an aqueous solution containing silane coupling agent. The aqueous solution has a concentration of 0.01wt% or more and a total light transmissivity of 50% or more with an optical path length of 50mm. The method also has a step of forming a resin layer on the surface-treated surface of the inorganic base material.
PCT/JP2008/055586 2007-03-26 2008-03-25 Method for manufacturing composite body WO2008123253A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509118A JPWO2008123253A1 (en) 2007-03-26 2008-03-25 Method for producing composite

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-080295 2007-03-26
JP2007080295 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008123253A1 true WO2008123253A1 (en) 2008-10-16

Family

ID=39830746

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055586 WO2008123253A1 (en) 2007-03-26 2008-03-25 Method for manufacturing composite body

Country Status (2)

Country Link
JP (1) JPWO2008123253A1 (en)
WO (1) WO2008123253A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009107845A1 (en) * 2008-02-28 2009-09-03 日本ゼオン株式会社 Metal/cured resin laminate
WO2011010738A1 (en) * 2009-07-24 2011-01-27 Taga Yasunori Joint structure producing method and joint structure
JP2011023381A (en) * 2009-07-13 2011-02-03 Nippon Zeon Co Ltd Laminated module
JP2013041942A (en) * 2011-08-12 2013-02-28 Fujifilm Corp Method for manufacturing laminate
JP2015207669A (en) * 2014-04-21 2015-11-19 住友ベークライト株式会社 Metal base board, metal base circuit board, and electronic device
JP2018018930A (en) * 2016-07-27 2018-02-01 株式会社トーキン Solid electrolytic capacitor and method for manufacturing the same
WO2019142570A1 (en) * 2018-01-17 2019-07-25 京セラ株式会社 Organic insulator, metal-clad laminate sheet, and wiring board
JP7015972B1 (en) * 2021-04-09 2022-02-03 旭化成株式会社 Glass cloth, prepreg, and printed wiring board
WO2022215288A1 (en) * 2021-04-09 2022-10-13 旭化成株式会社 Glass cloth, prepreg, and printed wiring board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002536468A (en) * 1999-02-05 2002-10-29 マテリア インコーポレイテッド Metathesis-active adhesive and method for enhancing polymer adhesion to surfaces
JP2003283098A (en) * 2002-03-26 2003-10-03 Matsushita Electric Works Ltd Laminated material for manufacturing printed wiring board, laminate, copper foil with resin, printed wiring board and multilayer printed wiring board
JP2004149901A (en) * 2002-11-01 2004-05-27 Asahi Schwebel Co Ltd Chemically treated copper foil, and production method therefor
JP2004149782A (en) * 2002-10-09 2004-05-27 Mitsubishi Chemicals Corp Thermoplastic resin composition and molded article using the same
JP2004244609A (en) * 2002-07-29 2004-09-02 Nippon Zeon Co Ltd Thermoplastic resin, method for producing crosslinked resin and method for producing crosslinked resin composite material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002536468A (en) * 1999-02-05 2002-10-29 マテリア インコーポレイテッド Metathesis-active adhesive and method for enhancing polymer adhesion to surfaces
JP2003283098A (en) * 2002-03-26 2003-10-03 Matsushita Electric Works Ltd Laminated material for manufacturing printed wiring board, laminate, copper foil with resin, printed wiring board and multilayer printed wiring board
JP2004244609A (en) * 2002-07-29 2004-09-02 Nippon Zeon Co Ltd Thermoplastic resin, method for producing crosslinked resin and method for producing crosslinked resin composite material
JP2004149782A (en) * 2002-10-09 2004-05-27 Mitsubishi Chemicals Corp Thermoplastic resin composition and molded article using the same
JP2004149901A (en) * 2002-11-01 2004-05-27 Asahi Schwebel Co Ltd Chemically treated copper foil, and production method therefor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009107845A1 (en) * 2008-02-28 2009-09-03 日本ゼオン株式会社 Metal/cured resin laminate
JP2011023381A (en) * 2009-07-13 2011-02-03 Nippon Zeon Co Ltd Laminated module
WO2011010738A1 (en) * 2009-07-24 2011-01-27 Taga Yasunori Joint structure producing method and joint structure
US9108393B2 (en) 2009-07-24 2015-08-18 Yasunori Taga Joined structure manufacturing method and joined structure
JP2013041942A (en) * 2011-08-12 2013-02-28 Fujifilm Corp Method for manufacturing laminate
JP2015207669A (en) * 2014-04-21 2015-11-19 住友ベークライト株式会社 Metal base board, metal base circuit board, and electronic device
JP2018018930A (en) * 2016-07-27 2018-02-01 株式会社トーキン Solid electrolytic capacitor and method for manufacturing the same
WO2019142570A1 (en) * 2018-01-17 2019-07-25 京セラ株式会社 Organic insulator, metal-clad laminate sheet, and wiring board
JP7015972B1 (en) * 2021-04-09 2022-02-03 旭化成株式会社 Glass cloth, prepreg, and printed wiring board
WO2022215288A1 (en) * 2021-04-09 2022-10-13 旭化成株式会社 Glass cloth, prepreg, and printed wiring board

Also Published As

Publication number Publication date
JPWO2008123253A1 (en) 2010-07-15

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