WO2008120474A1 - Rfid粘着ラベル連続体の製造方法と検査方法 - Google Patents

Rfid粘着ラベル連続体の製造方法と検査方法 Download PDF

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Publication number
WO2008120474A1
WO2008120474A1 PCT/JP2008/000846 JP2008000846W WO2008120474A1 WO 2008120474 A1 WO2008120474 A1 WO 2008120474A1 JP 2008000846 W JP2008000846 W JP 2008000846W WO 2008120474 A1 WO2008120474 A1 WO 2008120474A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive label
rfid adhesive
continuum
production method
inspection method
Prior art date
Application number
PCT/JP2008/000846
Other languages
English (en)
French (fr)
Inventor
Sunao Ito
Original Assignee
Tac Kasei Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tac Kasei Co., Ltd. filed Critical Tac Kasei Co., Ltd.
Publication of WO2008120474A1 publication Critical patent/WO2008120474A1/ja

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B31MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31DMAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
    • B31D1/00Multiple-step processes for making flat articles ; Making flat articles
    • B31D1/02Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
    • B31D1/027Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags involving, marking, printing or coding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B31MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31DMAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
    • B31D1/00Multiple-step processes for making flat articles ; Making flat articles
    • B31D1/02Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
    • B31D1/028Applying RFID chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Making Paper Articles (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)

Abstract

 RFID粘着ラベルへの印刷にあたり支障が生じることがないRFID粘着ラベル連続体の製造方法、または検査方法を提供するものである。  帯状の剥離紙上に複数のRFID粘着ラベルが仮着されたRFID粘着ラベル連続体の製造方法または検査方法であって、以下の工程を含む。 (1) 光学的測定手段により、帯状の剥離紙上でのRFID粘着ラベルにおける表面基材の相対位置を測定し、予め定められた表面基材理想相対位置との第1誤差値を算出する第1位置誤差算出工程 (2) 予め定められた第1誤差許容値と、第1位置誤差算出工程で算出された第1誤差値を比較し、前記剥離紙上での前記表面基材の相対位置の良不良を判別する工程
PCT/JP2008/000846 2007-04-03 2008-04-02 Rfid粘着ラベル連続体の製造方法と検査方法 WO2008120474A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP2007/000357 2007-04-03
PCT/JP2007/000357 WO2008126150A1 (ja) 2007-04-03 2007-04-03 Rfid粘着ラベル連続体の製造方法

Publications (1)

Publication Number Publication Date
WO2008120474A1 true WO2008120474A1 (ja) 2008-10-09

Family

ID=39808060

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2007/000357 WO2008126150A1 (ja) 2007-04-03 2007-04-03 Rfid粘着ラベル連続体の製造方法
PCT/JP2008/000846 WO2008120474A1 (ja) 2007-04-03 2008-04-02 Rfid粘着ラベル連続体の製造方法と検査方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/000357 WO2008126150A1 (ja) 2007-04-03 2007-04-03 Rfid粘着ラベル連続体の製造方法

Country Status (1)

Country Link
WO (2) WO2008126150A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010152525A (ja) * 2008-12-24 2010-07-08 Toppan Forms Co Ltd 不良ラベル貼替え装置
CN103091331A (zh) * 2013-01-11 2013-05-08 华中科技大学 一种rfid天线毛刺和污点缺陷的视觉检测系统及方法
CN104865181A (zh) * 2015-05-28 2015-08-26 山东泰宝防伪技术产品有限公司 电子标签inlay导电胶耐候性筛选方法
FR3071083A1 (fr) * 2017-09-11 2019-03-15 Phone Me Bobine d’etiquettes nfc et procede de fabrication d’une telle bobine
GB2576640A (en) * 2015-07-07 2020-02-26 Avery Dennison Retail Information Services Lcc Label Assembly
IT202200006479A1 (it) * 2022-04-01 2023-10-01 Graphimecc Group S R L Procedimento per l'individuazione e la correzione di difetti o non conformità presenti su etichette autoadesive o motivi realizzati su banda continua
US11842655B2 (en) 2017-11-10 2023-12-12 Avery Dennison Retail Information Services Llc Label assembly

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5038471B2 (ja) * 2010-07-30 2012-10-03 リンテック株式会社 ラベル製造装置及びラベル製造方法
JP5629655B2 (ja) * 2011-07-12 2014-11-26 東芝テック株式会社 Rfidタグ発行装置及びrfidタグの位置ずれ検出方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03197802A (ja) * 1989-12-26 1991-08-29 Mitsubishi Rayon Co Ltd ラベルズレ検査装置
JP2003279312A (ja) * 2002-03-25 2003-10-02 Kita Denshi Corp シール用抜きズレ検査方法及び装置
JP2004527734A (ja) * 2001-02-12 2004-09-09 スリーエム イノベイティブ プロパティズ カンパニー ウェブの検査方法および装置
JP2005044270A (ja) * 2003-07-25 2005-02-17 Toppan Forms Co Ltd Icラベル製造装置
JP2005283484A (ja) * 2004-03-30 2005-10-13 Mitsubishi Electric Engineering Co Ltd 貼付ラベル片の検査装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652242B2 (ja) * 1988-08-29 1994-07-06 剛一 中本 等間隔で移動する同一物品の検品及び計数方法
JP4071618B2 (ja) * 2002-12-26 2008-04-02 リンテック株式会社 ラベルリジェクト装置
JP4652790B2 (ja) * 2004-12-07 2011-03-16 株式会社サトー Rfidラベル検品装置及び検品方法
JP4677268B2 (ja) * 2005-04-08 2011-04-27 トッパン・フォームズ株式会社 Rf−idメディアの検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03197802A (ja) * 1989-12-26 1991-08-29 Mitsubishi Rayon Co Ltd ラベルズレ検査装置
JP2004527734A (ja) * 2001-02-12 2004-09-09 スリーエム イノベイティブ プロパティズ カンパニー ウェブの検査方法および装置
JP2003279312A (ja) * 2002-03-25 2003-10-02 Kita Denshi Corp シール用抜きズレ検査方法及び装置
JP2005044270A (ja) * 2003-07-25 2005-02-17 Toppan Forms Co Ltd Icラベル製造装置
JP2005283484A (ja) * 2004-03-30 2005-10-13 Mitsubishi Electric Engineering Co Ltd 貼付ラベル片の検査装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010152525A (ja) * 2008-12-24 2010-07-08 Toppan Forms Co Ltd 不良ラベル貼替え装置
CN103091331A (zh) * 2013-01-11 2013-05-08 华中科技大学 一种rfid天线毛刺和污点缺陷的视觉检测系统及方法
CN103091331B (zh) * 2013-01-11 2014-12-31 华中科技大学 一种rfid天线毛刺和污点缺陷的视觉检测系统及方法
CN104865181A (zh) * 2015-05-28 2015-08-26 山东泰宝防伪技术产品有限公司 电子标签inlay导电胶耐候性筛选方法
GB2576640A (en) * 2015-07-07 2020-02-26 Avery Dennison Retail Information Services Lcc Label Assembly
GB2576640B (en) * 2015-07-07 2020-05-13 Avery Dennison Retail Information Services Lcc Label Assembly
FR3071083A1 (fr) * 2017-09-11 2019-03-15 Phone Me Bobine d’etiquettes nfc et procede de fabrication d’une telle bobine
US11842655B2 (en) 2017-11-10 2023-12-12 Avery Dennison Retail Information Services Llc Label assembly
IT202200006479A1 (it) * 2022-04-01 2023-10-01 Graphimecc Group S R L Procedimento per l'individuazione e la correzione di difetti o non conformità presenti su etichette autoadesive o motivi realizzati su banda continua
WO2023187702A1 (en) * 2022-04-01 2023-10-05 Graphimecc Group S.R.L. Process for identifying and correcting defects or non-conformities on self-adhesive labels or patterns made on a continuous band

Also Published As

Publication number Publication date
WO2008126150A1 (ja) 2008-10-23

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