WO2008117800A1 - Reflective optical sensor - Google Patents

Reflective optical sensor Download PDF

Info

Publication number
WO2008117800A1
WO2008117800A1 PCT/JP2008/055589 JP2008055589W WO2008117800A1 WO 2008117800 A1 WO2008117800 A1 WO 2008117800A1 JP 2008055589 W JP2008055589 W JP 2008055589W WO 2008117800 A1 WO2008117800 A1 WO 2008117800A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
transmitting substrate
optical sensor
emitting element
storing space
Prior art date
Application number
PCT/JP2008/055589
Other languages
French (fr)
Japanese (ja)
Inventor
Rintaro Nishina
Original Assignee
Rintaro Nishina
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rintaro Nishina filed Critical Rintaro Nishina
Priority to JP2009506345A priority Critical patent/JPWO2008117800A1/en
Publication of WO2008117800A1 publication Critical patent/WO2008117800A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A reflective optical sensor (10) includes a cover case (20), which has a window section on the upper surface side for passing light and a storing space (21) at a lower section, and a shield cover (24) for covering an opening of the storing space (21) at the lower section of the cover case (20). In the storing space (21), a circuit board (50), a light receiving element (60), a light blocking plate (62), an electronic circuit (70), a light transmitting substrate (80), a light emitting element (82) and the like are stored and arranged. On the light transmitting substrate (80), the light emitting element (82) is attached at the center portion by using a bump terminal, and the light transmitting substrate is attached to the circuit board (50) at the peripheral section. The light transmitting substrate (80) is arranged on an upper surface side of the light receiving element (60) so that the light emitting element (82) is substantially at the center of the light receiving element (60).
PCT/JP2008/055589 2007-03-26 2008-03-25 Reflective optical sensor WO2008117800A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009506345A JPWO2008117800A1 (en) 2007-03-26 2008-03-25 Reflective light sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007079891 2007-03-26
JP2007-079891 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008117800A1 true WO2008117800A1 (en) 2008-10-02

Family

ID=39788534

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055589 WO2008117800A1 (en) 2007-03-26 2008-03-25 Reflective optical sensor

Country Status (2)

Country Link
JP (1) JPWO2008117800A1 (en)
WO (1) WO2008117800A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012070828A (en) * 2010-09-28 2012-04-12 Seiko Epson Corp Biological information detector and biological information measuring device
WO2014054083A1 (en) * 2012-10-05 2014-04-10 パイオニア株式会社 Semiconductor device, semiconductor device, proximity sensor equipped with same, and semiconductor device manufacturing method
JP2016191949A (en) * 2008-10-31 2016-11-10 ジョンソン・アンド・ジョンソン・ビジョン・ケア・インコーポレイテッドＪｏｈｎｓｏｎ ＆ Ｊｏｈｎｓｏｎ Ｖｉｓｉｏｎ Ｃａｒｅ， Ｉｎｃ． Method for forming ophthalmological lenses equipped with embedded microcontroller
WO2022023056A1 (en) * 2020-07-27 2022-02-03 Signify Holding B.V. Assembly for a semiconductor photonic component

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201381A (en) * 1982-05-19 1983-11-24 Sanyo Electric Co Ltd Photo coupler
JPS60126873A (en) * 1983-12-13 1985-07-06 Toshiba Corp Optical coupling semiconductor device
JPS62252178A (en) * 1986-04-24 1987-11-02 Sharp Corp Reflection type optical sensor
JPH01223414A (en) * 1988-03-02 1989-09-06 Ricoh Co Ltd Led packaging body for electronic device
JPH01171052U (en) * 1988-05-20 1989-12-04
JPH0661524A (en) * 1992-08-04 1994-03-04 Sony Corp Light transmitter
JPH09116187A (en) * 1995-10-16 1997-05-02 Stanley Electric Co Ltd Completely coaxial composite optical element
JPH09148620A (en) * 1995-09-20 1997-06-06 Sharp Corp Light reflecting type detector and manufacture thereof
JPH1082626A (en) * 1996-09-05 1998-03-31 Sharp Corp Fight-coupling apparatus for detection of inclination
JPH10307237A (en) * 1997-05-08 1998-11-17 New Japan Radio Co Ltd Integrated type semiconductor device for optical communication
JPH11150292A (en) * 1997-11-19 1999-06-02 Sanyo Electric Co Ltd Light-receiving and emitting element
JP2004014913A (en) * 2002-06-10 2004-01-15 Seiko Epson Corp Semiconductor integrated circuit, signal transmission device, electro-optical device and electronic apparatus
JP2005010435A (en) * 2003-06-18 2005-01-13 Seiko Epson Corp Optical communication module and its manufacturing method, optical communication device, electronic equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326382A (en) * 2000-05-15 2001-11-22 Citizen Electronics Co Ltd Reflective photosensor and manufacturing method thereof
JP2004333179A (en) * 2003-04-30 2004-11-25 Inax Corp Reflective photosensor

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201381A (en) * 1982-05-19 1983-11-24 Sanyo Electric Co Ltd Photo coupler
JPS60126873A (en) * 1983-12-13 1985-07-06 Toshiba Corp Optical coupling semiconductor device
JPS62252178A (en) * 1986-04-24 1987-11-02 Sharp Corp Reflection type optical sensor
JPH01223414A (en) * 1988-03-02 1989-09-06 Ricoh Co Ltd Led packaging body for electronic device
JPH01171052U (en) * 1988-05-20 1989-12-04
JPH0661524A (en) * 1992-08-04 1994-03-04 Sony Corp Light transmitter
JPH09148620A (en) * 1995-09-20 1997-06-06 Sharp Corp Light reflecting type detector and manufacture thereof
JPH09116187A (en) * 1995-10-16 1997-05-02 Stanley Electric Co Ltd Completely coaxial composite optical element
JPH1082626A (en) * 1996-09-05 1998-03-31 Sharp Corp Fight-coupling apparatus for detection of inclination
JPH10307237A (en) * 1997-05-08 1998-11-17 New Japan Radio Co Ltd Integrated type semiconductor device for optical communication
JPH11150292A (en) * 1997-11-19 1999-06-02 Sanyo Electric Co Ltd Light-receiving and emitting element
JP2004014913A (en) * 2002-06-10 2004-01-15 Seiko Epson Corp Semiconductor integrated circuit, signal transmission device, electro-optical device and electronic apparatus
JP2005010435A (en) * 2003-06-18 2005-01-13 Seiko Epson Corp Optical communication module and its manufacturing method, optical communication device, electronic equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016191949A (en) * 2008-10-31 2016-11-10 ジョンソン・アンド・ジョンソン・ビジョン・ケア・インコーポレイテッドＪｏｈｎｓｏｎ ＆ Ｊｏｈｎｓｏｎ Ｖｉｓｉｏｎ Ｃａｒｅ， Ｉｎｃ． Method for forming ophthalmological lenses equipped with embedded microcontroller
JP2012070828A (en) * 2010-09-28 2012-04-12 Seiko Epson Corp Biological information detector and biological information measuring device
WO2014054083A1 (en) * 2012-10-05 2014-04-10 パイオニア株式会社 Semiconductor device, semiconductor device, proximity sensor equipped with same, and semiconductor device manufacturing method
WO2022023056A1 (en) * 2020-07-27 2022-02-03 Signify Holding B.V. Assembly for a semiconductor photonic component

Also Published As

Publication number Publication date
JPWO2008117800A1 (en) 2010-07-15

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