WO2008117405A1 - Dispositif et procédé de connexion ainsi que dispositif et procédé de test - Google Patents

Dispositif et procédé de connexion ainsi que dispositif et procédé de test Download PDF

Info

Publication number
WO2008117405A1
WO2008117405A1 PCT/JP2007/056269 JP2007056269W WO2008117405A1 WO 2008117405 A1 WO2008117405 A1 WO 2008117405A1 JP 2007056269 W JP2007056269 W JP 2007056269W WO 2008117405 A1 WO2008117405 A1 WO 2008117405A1
Authority
WO
WIPO (PCT)
Prior art keywords
gap
connection device
contacts
thickness
state
Prior art date
Application number
PCT/JP2007/056269
Other languages
English (en)
Japanese (ja)
Inventor
Toshihiro Ishizuka
Takeo Ogawa
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/056269 priority Critical patent/WO2008117405A1/fr
Publication of WO2008117405A1 publication Critical patent/WO2008117405A1/fr

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • H01R12/718Contact members provided on the PCB without an insulating housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/82Coupling devices connected with low or zero insertion force
    • H01R12/85Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/89Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by moving connector housing parts linearly, e.g. slider
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/20Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Le dispositif de connexion (110) selon l'invention a des contacts (126) dotés d'ouvertures (126a) dans lesquelles sont insérées des bornes de connecteur semblables à des fiches (2) d'une carte de connexion (1), et a également des pièces de pression (130) destinées à déformer les contacts (126) de sorte qu'un interstice (Wb) à la partie la plus proche d'une ouverture (126a) d'un contact (126) soit changé entre un état dans lequel l'interstice (Wb) est plus grand que l'épaisseur (Wa) d'une borne de connecteur (2) mesurée dans la direction correspondant à la direction de l'interstice (Wb) et un état dans lequel l'interstice (Wb) est plus petit que l'épaisseur (Wa).
PCT/JP2007/056269 2007-03-26 2007-03-26 Dispositif et procédé de connexion ainsi que dispositif et procédé de test WO2008117405A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056269 WO2008117405A1 (fr) 2007-03-26 2007-03-26 Dispositif et procédé de connexion ainsi que dispositif et procédé de test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056269 WO2008117405A1 (fr) 2007-03-26 2007-03-26 Dispositif et procédé de connexion ainsi que dispositif et procédé de test

Publications (1)

Publication Number Publication Date
WO2008117405A1 true WO2008117405A1 (fr) 2008-10-02

Family

ID=39788148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056269 WO2008117405A1 (fr) 2007-03-26 2007-03-26 Dispositif et procédé de connexion ainsi que dispositif et procédé de test

Country Status (1)

Country Link
WO (1) WO2008117405A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004382A (ja) * 2011-06-17 2013-01-07 Yokowo Co Ltd コネクタ及び中継コネクタ装置
WO2014054674A1 (fr) * 2012-10-03 2014-04-10 矢崎総業株式会社 Connecteur
JP2018190712A (ja) * 2017-04-27 2018-11-29 デルフィ・インターナショナル・オペレーションズ・ルクセンブルク・エス・アー・エール・エル 安全システムのためのコネクタアセンブリ
WO2019170353A1 (fr) * 2018-03-09 2019-09-12 Phoenix Contact E-Mobility Gmbh Dispositif servant à vérifier une résistance de contact d'une liaison électromécanique et dispositif de recharge pour un véhicule électrique
EP3813203A1 (fr) * 2019-10-25 2021-04-28 Schleuniger AG Dispositif d'essai de câble
FR3129035A1 (fr) * 2021-11-10 2023-05-12 A.Raymond Et Cie Dispositif de connexion

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0564774U (ja) * 1992-02-05 1993-08-27 シャープ株式会社 電気測定器の電気接続部
JPH07229940A (ja) * 1994-02-18 1995-08-29 Fuji Electric Co Ltd 電気抵抗測定治具
JPH08273761A (ja) * 1995-03-31 1996-10-18 Nec Corp コネクタ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0564774U (ja) * 1992-02-05 1993-08-27 シャープ株式会社 電気測定器の電気接続部
JPH07229940A (ja) * 1994-02-18 1995-08-29 Fuji Electric Co Ltd 電気抵抗測定治具
JPH08273761A (ja) * 1995-03-31 1996-10-18 Nec Corp コネクタ

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004382A (ja) * 2011-06-17 2013-01-07 Yokowo Co Ltd コネクタ及び中継コネクタ装置
WO2014054674A1 (fr) * 2012-10-03 2014-04-10 矢崎総業株式会社 Connecteur
CN104685726A (zh) * 2012-10-03 2015-06-03 矢崎总业株式会社 连接器
JP2018190712A (ja) * 2017-04-27 2018-11-29 デルフィ・インターナショナル・オペレーションズ・ルクセンブルク・エス・アー・エール・エル 安全システムのためのコネクタアセンブリ
JP7027242B2 (ja) 2017-04-27 2022-03-01 アプティブ・テクノロジーズ・リミテッド 安全システムのためのコネクタアセンブリ
WO2019170353A1 (fr) * 2018-03-09 2019-09-12 Phoenix Contact E-Mobility Gmbh Dispositif servant à vérifier une résistance de contact d'une liaison électromécanique et dispositif de recharge pour un véhicule électrique
EP3813203A1 (fr) * 2019-10-25 2021-04-28 Schleuniger AG Dispositif d'essai de câble
FR3129035A1 (fr) * 2021-11-10 2023-05-12 A.Raymond Et Cie Dispositif de connexion
WO2023083544A1 (fr) * 2021-11-10 2023-05-19 A. Raymond Et Cie Dispositif de connexion

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