WO2008117385A1 - 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 - Google Patents

電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 Download PDF

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Publication number
WO2008117385A1
WO2008117385A1 PCT/JP2007/056080 JP2007056080W WO2008117385A1 WO 2008117385 A1 WO2008117385 A1 WO 2008117385A1 JP 2007056080 W JP2007056080 W JP 2007056080W WO 2008117385 A1 WO2008117385 A1 WO 2008117385A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
base
circuit chip
conductor pattern
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/056080
Other languages
English (en)
French (fr)
Inventor
Hiroshi Kobayashi
Kenji Kobae
Shuichi Takeuchi
Hidehiko Kira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2007/056080 priority Critical patent/WO2008117385A1/ja
Publication of WO2008117385A1 publication Critical patent/WO2008117385A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　本発明は、回路チップへの曲げ応力が低減され、かつ、導体パターンの断線も回避された電子装置等を提供することを目的とし、ベース１１と、ベース上に配線された導体パターン１２と、導体パターン１２に電気的に接続された回路チップ１３と、ベース１１上に回路チップ１３を囲んで配置された、環状の外形を有する、ベース１１側の形状は導体パターン１２との接触を避けて跨いだ形状となっている補強体１６と、補強体１６の内側を埋めて回路チップ１３上部を覆い、回路チップ１３をベース１１上で封止した封止体１５ａとを備えた。
PCT/JP2007/056080 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 Ceased WO2008117385A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056080 WO2008117385A1 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056080 WO2008117385A1 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法

Publications (1)

Publication Number Publication Date
WO2008117385A1 true WO2008117385A1 (ja) 2008-10-02

Family

ID=39788129

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056080 Ceased WO2008117385A1 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法

Country Status (1)

Country Link
WO (1) WO2008117385A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013206122A (ja) * 2012-03-28 2013-10-07 Toppan Printing Co Ltd Ｉｃモジュールとこれを搭載したｉｃカード
JPWO2013145532A1 (ja) * 2012-03-28 2015-12-10 パナソニックＩｐマネジメント株式会社 樹脂パッケージ
WO2018033720A1 (en) * 2016-08-19 2018-02-22 Jook Ltd A tag for an item of apparel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001034727A (ja) * 1999-07-22 2001-02-09 Toppan Printing Co Ltd 非接触ｉｃカード及びその製造方法
JP2003058853A (ja) * 2001-08-17 2003-02-28 Toppan Forms Co Ltd 非接触型ｉｃカード及びその製造方法
JP2003288568A (ja) * 2002-03-27 2003-10-10 Toppan Forms Co Ltd 非接触型ｉｃラベル

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001034727A (ja) * 1999-07-22 2001-02-09 Toppan Printing Co Ltd 非接触ｉｃカード及びその製造方法
JP2003058853A (ja) * 2001-08-17 2003-02-28 Toppan Forms Co Ltd 非接触型ｉｃカード及びその製造方法
JP2003288568A (ja) * 2002-03-27 2003-10-10 Toppan Forms Co Ltd 非接触型ｉｃラベル

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013206122A (ja) * 2012-03-28 2013-10-07 Toppan Printing Co Ltd Ｉｃモジュールとこれを搭載したｉｃカード
JPWO2013145532A1 (ja) * 2012-03-28 2015-12-10 パナソニックＩｐマネジメント株式会社 樹脂パッケージ
WO2018033720A1 (en) * 2016-08-19 2018-02-22 Jook Ltd A tag for an item of apparel

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