WO2008114545A1 - Processing equipment and processing method - Google Patents

Processing equipment and processing method Download PDF

Info

Publication number
WO2008114545A1
WO2008114545A1 PCT/JP2008/052112 JP2008052112W WO2008114545A1 WO 2008114545 A1 WO2008114545 A1 WO 2008114545A1 JP 2008052112 W JP2008052112 W JP 2008052112W WO 2008114545 A1 WO2008114545 A1 WO 2008114545A1
Authority
WO
WIPO (PCT)
Prior art keywords
tanks
pump
processing
predetermined
system pipelines
Prior art date
Application number
PCT/JP2008/052112
Other languages
French (fr)
Japanese (ja)
Inventor
Yasuyuki Kitagawa
Shuzo Yamaji
Takaaki Hibi
Original Assignee
Towa Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corporation filed Critical Towa Corporation
Publication of WO2008114545A1 publication Critical patent/WO2008114545A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/02—Abrasive blasting machines or devices; Plants characterised by the arrangement of the component assemblies with respect to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C5/00—Devices or accessories for generating abrasive blasts
    • B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
    • B24C7/0007—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Pipeline Systems (AREA)

Abstract

Processing equipment comprises a plurality of tanks (T1-T4) each storing processing water (5), and a pump (4) for pressurizing the processing water (5) stored, respectively, in the plurality of tanks (T1-T4). The pump (4) and the plurality of tanks (T1-T4) are interconnected through a plurality of pump system pipelines (P1-P4), respectively. The plurality of pump system pipelines (P1-P4) are provided, respectively, with a plurality of selector valves (V1-V4). The plurality of tanks (T1-T4) are connected, respectively, with a plurality of nozzle system pipelines (J1-J4). The plurality of nozzle system pipelines (J1-J4) are connected, respectively, with a plurality of nozzles (N1-N4). The plurality of selector valves (V1-V4) change to such a state as the pressure of the pump (4) is applied to the pressurization water (2) in predetermined pump system pipelines (P1, P2) connected with predetermined tanks (T1, T2) so that high pressure water (6) is jetted from predetermined nozzles (N1, N2) connected with the predetermined tanks (T1, T2).
PCT/JP2008/052112 2007-03-22 2008-02-08 Processing equipment and processing method WO2008114545A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-074933 2007-03-22
JP2007074933A JP2008229795A (en) 2007-03-22 2007-03-22 Machining device and machining method

Publications (1)

Publication Number Publication Date
WO2008114545A1 true WO2008114545A1 (en) 2008-09-25

Family

ID=39765660

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052112 WO2008114545A1 (en) 2007-03-22 2008-02-08 Processing equipment and processing method

Country Status (3)

Country Link
JP (1) JP2008229795A (en)
TW (1) TW200916263A (en)
WO (1) WO2008114545A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105150118A (en) * 2015-10-08 2015-12-16 江苏宏联环保科技有限公司 Sand blasting machine nozzle capable of adjusting sand blasting amount

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009166198A (en) * 2008-01-18 2009-07-30 Disco Abrasive Syst Ltd Water jet machining device
CN103596728A (en) * 2011-09-26 2014-02-19 新东工业株式会社 Blasting device and blasting method
JP5412567B1 (en) * 2012-10-19 2014-02-12 東芝機械株式会社 Wet blast spray gun
JP5412568B1 (en) * 2012-10-19 2014-02-12 東芝機械株式会社 Wet blast spray gun
KR101545063B1 (en) * 2013-12-20 2015-08-17 동부대우전자 주식회사 The microwave oven and control method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60181669U (en) * 1984-01-27 1985-12-02 株式会社　不二精機製造所 Slurry solid-liquid mixing ratio measuring device in wet blasting equipment
JPS61290052A (en) * 1985-06-18 1986-12-20 Fuji Photo Film Co Ltd Manufacturing machine of lithography processing support material
JP2005338028A (en) * 2004-05-31 2005-12-08 Macoho Co Ltd Apparatus for measuring slurry concentration
JP2006007411A (en) * 2004-06-11 2006-01-12 Jetsis Internatl Pte Ltd Polishing fluid feeder without interruption
JP2006130574A (en) * 2004-11-02 2006-05-25 Disco Abrasive Syst Ltd High-pressure liquid injection type cutting device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60181669U (en) * 1984-01-27 1985-12-02 株式会社　不二精機製造所 Slurry solid-liquid mixing ratio measuring device in wet blasting equipment
JPS61290052A (en) * 1985-06-18 1986-12-20 Fuji Photo Film Co Ltd Manufacturing machine of lithography processing support material
JP2005338028A (en) * 2004-05-31 2005-12-08 Macoho Co Ltd Apparatus for measuring slurry concentration
JP2006007411A (en) * 2004-06-11 2006-01-12 Jetsis Internatl Pte Ltd Polishing fluid feeder without interruption
JP2006130574A (en) * 2004-11-02 2006-05-25 Disco Abrasive Syst Ltd High-pressure liquid injection type cutting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105150118A (en) * 2015-10-08 2015-12-16 江苏宏联环保科技有限公司 Sand blasting machine nozzle capable of adjusting sand blasting amount

Also Published As

Publication number Publication date
TW200916263A (en) 2009-04-16
JP2008229795A (en) 2008-10-02

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