WO2008110613A1 - Dispositif et procédé pour guider un rayon lumineux - Google Patents

Dispositif et procédé pour guider un rayon lumineux Download PDF

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Publication number
WO2008110613A1
WO2008110613A1 PCT/EP2008/053042 EP2008053042W WO2008110613A1 WO 2008110613 A1 WO2008110613 A1 WO 2008110613A1 EP 2008053042 W EP2008053042 W EP 2008053042W WO 2008110613 A1 WO2008110613 A1 WO 2008110613A1
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WO
WIPO (PCT)
Prior art keywords
optical
light beam
optical group
plane
guiding
Prior art date
Application number
PCT/EP2008/053042
Other languages
German (de)
English (en)
Inventor
David Ashkenasi
Norbert Müller
Original Assignee
Laser- Und Medizin-Technologie Gmbh Berlin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102007012695A external-priority patent/DE102007012695A1/de
Priority claimed from DE102007014933A external-priority patent/DE102007014933A1/de
Application filed by Laser- Und Medizin-Technologie Gmbh Berlin filed Critical Laser- Und Medizin-Technologie Gmbh Berlin
Priority to DE112008000681T priority Critical patent/DE112008000681A5/de
Publication of WO2008110613A1 publication Critical patent/WO2008110613A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/108—Scanning systems having one or more prisms as scanning elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0875—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more refracting elements

Definitions

  • the invention presented here describes a method and a device for realizing a fast linear or circular or elliptical-shaped guidance of a light beam, in particular a laser beam by deflecting the beam from the original propagation direction or optical axis.
  • a deflection is desired to perform a targeted micromachining of any materials by using focused laser radiation by a laser beam is focused on a workpiece and a combination of movements, of which at least one movement has a high speed, is performed.
  • Such a variant in the laser micromachining for the introduction of linear sections, for the structuring of surfaces or for separating is referred to in this invention as a laser beam planer.
  • DE 40 26 130 A1 for this purpose is a device for deflecting a light beam with a combined mirror system, which allows to guide the light beam without distortion to the destination.
  • This is mainly the labeling by laser beam.
  • Mirror systems which are arranged behind the focusing optics, do not permit a short focal-range focusing system, since in mirror systems - or even individual mirrors - the deflection of the beam is usually used for reflection, and this can only be realized with a certain optical path length.
  • distortion errors pincushion and barrel distortion
  • Another disadvantage is the difficulty with mirror systems to realize small distances, as due to the property of the mirror (angle of incidence equal angle of reflection) extremely small angles of attack are required. These small ways can not be achieved by currently available drives (galvo systems) at high frequencies.
  • Another drive option is piezoelectric drives, which cope well with these short distances; However, these have the disadvantage that the piezoceramic incorporated in continuous operation on one and the same place in the treads and this very quickly leads to failures.
  • Another disadvantage of mirror systems is that the direction of movement must be reduced to zero before it can be accelerated in the opposite direction.
  • DE 100 54 853 A1 discloses a method for introducing microbores in mainly metallic materials in which by means of rotating wedge plates, a beam is placed in tumbling motion about the optical axis. High rotational speeds are excluded in this method by the uneven mass distribution.
  • the laser described represents a system which is equipped with pulse widths in the nanosecond range and moderate repetition rates and in combination with the slow movement of the tumbling jet is unsuitable for processing brittle materials.
  • the deflected beam does not run parallel to the optical axis, which means that protection against machining residues can not be achieved without influencing the beam path and the beam quality. This is an essential point in laser micro machining, which influences the quality of the processing result.
  • From DE 101 05 346 A1 discloses a device for helical cutting holes in workpieces is known in which by means of wedge plates, a beam is deflected from the optical axis, which he rotates when turning the wedge plate combination about the optical axis.
  • ⁇ / 4 or ⁇ % plates are also rotated in order to carry the polarization direction with respect to the processing.
  • This system also serves to produce small holes in predominantly metallic materials with high efficiency.
  • the parameters necessary for the production of micrographs such as rotational speed, plane-parallel offset and wavelength independence are not given.
  • US Pat. No. 4,461,947 describes a method in which, by means of a lens arranged eccentrically on the optical axis, the rotation of which causes the beam to be set in a rotating movement with respect to the optical axis. Again, according to the described embodiments, the problem of unequal mass distribution that does not allow high speeds.
  • DE 10 2005 047 328 B3 discloses a method in which a dove prism is used as an image rotator in a hollow shaft motor. It is advantageously described that the setting of a parallel beam offset is independent of the rotation of the dove prism and thus the adjustment mechanism for the beam offset can be mechanically relatively easily performed.
  • a disadvantage is also in this device, the non-rotationally symmetric mass distribution of the Dove prism, whereby an imbalance arises at high speeds.
  • the prism requires a relatively large hollow space. Ie the rotary drive, which limits the speed of the available motors.
  • the object of the invention is to provide an improved apparatus for guiding a laser beam, which in particular allows to move the focus of a light beam at high web speed.
  • a device for guiding a light beam having a rotating or oscillating driven light guide element having at least one optical group, which in turn has at least in an operating state two plane-parallel surfaces which are aligned transversely to the light beam at an adjustable tilt angle.
  • optical group is used here in a conventional manner so that the optical group may contain a single isolated optical element, or several directly adjacent optical elements, which, however, need not be cemented together in the present case. Rather, the term optical group should also refer to a combination of two optical elements which are displaceable relative to one another along mutually opposite, congruent surfaces, wherein a negligible air gap can also exist between the two surfaces lying opposite one another.
  • the optical group is formed by a single optical element with two plane-parallel surfaces, which is also referred to below as a plane-parallel plate.
  • the plane-parallel plate according to the first preferred embodiment variant is connected to a drive which is designed so that it puts the plane-parallel plate in operation in an oscillating pivoting movement about an at least approximately perpendicular to the optical axis pivot axis.
  • the light guide element is thus driven to oscillate about an at least approximately perpendicular to the optical axis extending pivot axis.
  • the pivot axis intersects the optical axis at right angles.
  • the light guide element is driven in rotation about a rotation axis extending parallel to the optical axis of the light beam.
  • the optical group is connected to an adjusting device, which makes it possible to adjust the tilt angle of the optical group.
  • the adjusting device is designed so that it allows the setting of the tilt angle both at rest as well as rotating optical group.
  • a third preferred embodiment is characterized in that the optical group is formed by two optical elements and has two planar surfaces as end faces.
  • the optical elements of the optical group have mutually facing, complementary spherically curved surfaces, of which one curved surface forms a concave surface of the first optical element and the second curved surface forms a convex surface of the second optical element and the concave surface and the convex surface have the same radius of curvature.
  • the two optical elements of the optical group are to be displaced relative to one another along the mutually facing spherical surfaces in such a way that the planar surfaces, as surfaces facing away from the respective spherical surface of a respective optical element, are either plane-parallel or at an angle to one another.
  • a further aspect of the invention consists in a method for guiding a light beam, in which a light beam is guided through an optical group having plane-parallel faces at least in an operating state, wherein the optical group is continuously moved such that the direction of a surface normal is one of the planar Periodically changes the end faces of the optical group with respect to the optical axis.
  • the optical group is preferably moved continuously in such a way that the angle between a surface normal of one of the planar end faces of the optical group and the optical axis changes in an oscillating manner.
  • a laser beam pulsed at a repetition rate is used as the light beam and the optical group is oscillated back and forth at an oscillation frequency which is tuned to the repetition rate. In this way, in particular, a desired pulse-to-pulse overlap can be set, as described in more detail below.
  • the optical group can be tilted relative to the optical axis and rotated, so that the surface normal of one of the planar end faces of the optical group rotates about the optical axis and thus changes its direction with respect to the optical axis.
  • the light beam is a laser beam pulsed at a repetition rate and the optical group rotates at a rotational speed which is tuned to the repetition rate in order, for example, to achieve a desired pulse-to-pulse overlap.
  • the solution according to the invention and its variants have the advantage that a linear or circular deflection of the light beam for small to very small amplitudes can be realized with high web speeds without lingering in the end positions and with short focal length processing optics.
  • Another advantage is that the straight or circular deflected beam is aligned in all positions parallel to the optical axis, and thus orthogonal to the workpiece. Particularly in the processing of brittle materials, such as glass or ceramic, this type of beam guidance results in a high quality of processing, which is reflected in the good edge quality (minimization of scalloping and cracking).
  • the solution according to the invention is not limited by restrictions with regard to the pulse duration or wavelength. Suitable arrangements in beam path or materials are known for all pulse durations from continuous wave (cw) to femtosecond pulses, which can be used as a plane-parallel offset plate (3) in the manner described. The beam deflection of different wavelengths can also be used with the described principle by suitable selection of materials from UV applications to infrared laser radiation.
  • Another significant advantage is that the application can be controlled by the targeted control of the oscillation or rotation speed and thus the definition of a pulse-to-pulse overlap of the laser radiation on the workpiece to be machined, without entering the parameter field of the laser, eg the repetition rate, which in turn not only provides gentle processing, but also maximizes processing efficiency.
  • the amplitude can be adapted for a wide range of applications.
  • the beam can also strike the optics slightly eccentrically, without this having any effect on the beam offset.
  • the focal length can be determined by selecting a suitable focusing optics or their spatial position relative to the plane-parallel plate. It is even possible to use the same focusing optics which were also used before the use of the solution according to the invention.
  • One advantage of the embodiment variant with a rotationally driven, tilted plane-parallel plate is the possibility of adjusting the beam offset during processing or else in a stationary position.
  • This allows, coupled by a motorized X-Y drive to the device (such as on a CNC trajectory), a complex, program-based applications of the laser beam milling machine.
  • free-form removal tracks with adjustable width can be generated with the device according to the invention.
  • the beam can be moved in one axis, which allows very narrow micro-trenches or a slot-shaped breakthrough or the separation of thin components.
  • the angle adjustment takes place with two lenses with the same surface curvature, more precisely a combination of a concave lens and a convex lens.
  • lens pairs with different radius pairs can be selected here.
  • the order of the lens combination concave-convex or convex-concave can be reversed to achieve an angle reversal. This makes it possible, depending on the choice of the lens radii and order of the concave and convex lenses relative to the direction of laser beam to set a predetermined angle.
  • the tilt angle is limited only because of the beam distortion, but this can be compensated by the choice of materials. It is not necessary to specify micro or macro processing. dig, since this depends only on the selected lens diameters and the focal length of the focusing lens.
  • An essential component of this third embodiment are thus two with their curved surfaces superimposed plano-concave and plano-convex lenses.
  • the adjustment of the angle is the
  • Angle adjustment of the focused processing beam is carried out analogously, as provided according to the second preferred embodiment for the plane-parallel plate.
  • the adjustment of the beam offset is also analogous to the second preferred embodiment.
  • the diameter of the machining focus must be reduced with increasing z-feed (movement of the focus to the material surface).
  • Such an embodiment for the introduction of holes also in greater depth of material, for the precise structuring of surfaces or for cutting in any contours is referred to in this invention as Laserstrahlfräse with selectable angle.
  • Winkelein- position acts completely independent of the adjustment of the parallel beam offset and can thus serve to produce cavities with "punctiform" opening.
  • a set angle of attack of the laser radiation above 0 ° which counteracts a notch of the processing in greater depth and thus minimizes the effect of rejuvenation during processing in greater depth or even completely excludes, thus ensuring the production of significantly higher aspect ratios.
  • This method also prevents different diameters from being formed in the inlet and outlet bores of the workpiece as a result of absorption of the laser radiation at the workpiece edge. This is expediently carried out in that the jet flank, which is at the outer edge of the bore, is aligned coaxially with the axis of the bore.
  • the minimum achievable diameter of the cylindrical bore is determined by the beam diameter at the level of the bore entrance.
  • Another advantage of the third embodiment is that when changing the angle of attack of the focused processing beam by tilting the concave lens and the convex lens relative to the optical axis, the optical beam path is not further changed or disturbed to the desired angular displacement, with the result that the optimum focusing for the processing is only minimally disturbed.
  • an adjustment of the angle during processing without great influence on the other settings (laser parameters, machining distance, gas flow, etc.) optimized cutting and removal performance is possible.
  • micro trenches or a slit-shaped breakthrough or the separation of thin components under an adjustable edge angle can be made possible during laser ablation, for example as preparation for (laser) welding of overlapping components or inclined edges in impact welding or for laser-assisted separation in corners and angles and for the removal (hole, slot, countersink, chamfer) in angular components or for the taper of a leg of angled components. Laser welding on inclined surfaces is also possible.
  • the described invention also permits independent movement of plane-parallel plate and the optical group comprising the lens combination concave lens and convex lens. This allows angular movement along a circular path with a small diameter, which can be controlled depending on the speed of the moving components. For example, e.g. in conjunction with a linear axis, a complex shaped track with changing geometries (removal width, angle of the wall surfaces, course, etc.) in the micrometer range possible by changing angles of attack.
  • Figure 1 shows the physical action principle of the invention with its necessary components and their directions of movement.
  • FIG. 3 is a perspective view of a machined workpiece with a removal track and an indication of the oscillating laser beam
  • FIG. 4 is a sectional view of a possible implementation variant with adjusting ring for tilting the plane-parallel plate.
  • FIG. 5 shows a perspective view of a machined workpiece with a removal track and an indication of the tumbling laser beam
  • Fig. 6 shows the physical action principle of the invention in combination with a plane-parallel plate as an application example. The necessary components and their directions of movement are shown;
  • Fig. 7 shows the physical working principle of the invention with the inclusion of the function of the plane-parallel plate in the lens combination.
  • FIG. 8 is a perspective view of a machined workpiece with a removal track and a counterbore and an indication of the tumbling focused laser beam; and 9 to 12 calculated by a simulation beam trajectories for different implementation examples of the laser beam cutter with selectable angle of attack.
  • FIG. 1 The schematically outlined in Fig. 1 apparatus for micromachining of materials has an arrangement based on the physical principle of refraction of light on a plane-parallel plate 6.
  • the plane-parallel plate 6, which need not have a circular shape, can, as explained below to FIGS. 2 and 3, be set in a rapid pivoting movement. In addition, the distance from the focusing optics 4 can be changed.
  • plane-parallel plate 6 as explained below to Figs. 4 and 5, are set in rotation and tilted.
  • the angle of incidence ⁇ continuously changes, which leads to a parallel movement. offset S and thus leads to the linear movement orthogonal to the optical axis.
  • the focus be adapted to the respective working level and the corresponding processing.
  • the plane-parallel plate 6 standing under the angle of incidence ⁇ that is, tilted with respect to the light beam and arranged behind the focusing lens 4
  • the beam moves due to the parallel offset S centric around the optical axis.
  • the angle of incidence a is changed, which results in the parallel offset S of the radiation.
  • the diameter of the beam moving centrically around the optical axis is changed.
  • plan offset S Another possibility for influencing the plan offset S is achieved via the thickness d and the refractive index n of the plane-parallel plate 6.
  • a preselection of the plan offset S can be determined. Due to the arrangement and the drive of the moving parts, it is possible to realize a wide variety of movement speeds and Strahlaus- deflections, wherein the moving beam follows approximately a sine function. The moving beam is always orthogonal to the working plane during the offset movement, which positively influences the quality of the processing.
  • a first embodiment of the invention which allows to offset a plane-parallel plate 6 in an oscillating movement, in which the plane-parallel plate 6 is tilted continuously oscillating.
  • the focusing optics 4 is in a socket that can be adapted to different variants with the aid of a corresponding tube (not shown).
  • the plane-parallel plate 6 is guided in a second version, which in turn is mounted in a bearing block 12 so that it can be tilted perpendicular to the plane of the drawing.
  • the crank disk 8 is here designed so that it provides for a balancing mass distribution, and so a swing - especially at high speeds - prevented.
  • the device is integrated into a housing which is provided with a protective glass at the jet exit side (not shown).
  • a protective glass at the jet exit side (not shown).
  • the housing In order to support workpiece machining, the housing also offers the possibility of providing a gas connection in order to create a corresponding (protective gas) atmosphere at the processing station.
  • FIG. 3 shows a workpiece 18 in which a free-formed trench 20, also referred to below as a removal track, has been removed, as can be produced with the device according to FIG. 2.
  • the oscillating beam 16 describes a linear movement orthogonal to the working plane and thus carries material from the workpiece, similar to a planer.
  • the efficiency of the removal is determined very strongly by the pulse-to-pulse overlap and thus by the oscillation speed of the plane-parallel plate 6.
  • f r is the number of laser pulses per second (repetition rate) determined
  • _ the effective laser beam diameter on the work piece
  • S is the parallel displacement according to Equation [1]. Beam deflection and thus the amplitude is equal to 2 * S.
  • FIG. 4 shows a sectional view of a second embodiment variant of the invention, in which a fixed tilt angle can be set and the plane-parallel plate 6 can be set in rotation at the set tilt angle.
  • the focusing optics is in a version that can be adapted to different variants with the aid of a corresponding tube.
  • the plane-parallel plate 6 is guided in a second version, which in turn is mounted in a sleeve 22.
  • the running sleeve 22 in turn is rotated by an externally acting force, in this embodiment, a toothed belt in rotation.
  • Speed limiting acts only the storage of the sleeve 22, which is executed in the embodiment in the form of ball bearings.
  • all other types of bearings are conceivable that allow a much higher speed, for example with magnetic, sliding or air bearing.
  • a tilt angle of the plane-parallel plate 6 can be set both in the stationary state and during the fast rotation, ie the plane-parallel plate 6 can both in the stationary state as well as being tilted during the fast rotation so as to adjust an offset of the beam.
  • the adjusting ring 24 also offers the possibility of providing a gas connection in order to create a corresponding (protective gas) atmosphere at the processing point.
  • the protective glass 26 protects the internal components from contamination and damage by the residues of processing, without affecting the deflected beam.
  • FIG. 5 shows a workpiece 18 'in which a free-formed trench 20' is removed, as can be produced with the device according to FIG. 4.
  • the tumbling beam 28 describes a circular movement about the optical axis and thus carries - like a milling head - material from the workpiece.
  • the efficiency of the removal is determined very strongly by the pulse-to-pulse overlap and thus by the rotational speed of the plane-parallel plate 6.
  • Particularly in the case of laser radiation with a high repetition rate or pulse repetition frequency (eg 100,000 pulses per second) extremely gentle speeds (up to 100,000 rpm) are required for the gentlest possible machining.
  • the required speeds in rpm U rJ for a given optimum pulse-to-pulse overlap O can be determined according to the following relationship:
  • f r is the number of laser pulses per second (repetition rate) determined
  • d L is the effective laser beam diameter on the work piece
  • S is the parallel displacement according to Equation [1].
  • the circumference of the beam deflection is equal to 2 * ⁇ * p.
  • the bundled laser beam has an effective diameter on the material c /
  • _ 100 ⁇ m, ie a mean distance of 50 ⁇ m should lie between the laser pulses.
  • the bundled laser beam has an effective diameter c /
  • _ 20 ⁇ m on the material.
  • the schematically illustrated in Fig. 6 third embodiment of a device for micromachining of materials has an arrangement based on the physical principle of refraction of light on optical surfaces of the components focusing lens 4, plane-parallel plate 6, concave lens 30 and convex lens 32.
  • the concave lens 30 and the convex lens 32 form an optical group.
  • the plane-parallel plate 6 and the concave 30 and convex lens 32 can be rotated together.
  • the plane-parallel plate can be tilted by the angle ⁇ and bow the concave 30 and the convex lens 32 in equal parts by the angle ß and ⁇ in the opposite direction.
  • the distance of the focusing optics 4 can be changed to adjust the focal length.
  • arrows in Fig. 6 indicate the articulation of the components, i. the forces that cause an adjustment, or rotation.
  • a parallel displacement S occurs when the light beam 2 passes through an inclined plane-parallel plate 6.
  • the beam 2 Upon further passage, the beam 2 impinges on a lens combination consisting of a concave lens 30 with refractive index ni and a convex lens 32 with refractive index n 2 with a common axis of rotation.
  • the beam moves on the basis of the parallel offset S at an angle ⁇ on a conical surface Path around the optical axis.
  • the focus diameter can be adapted to the respective working plane and the corresponding processing.
  • Angle reversal can also be achieved with an unchanged angle of inclination by a simple exchange of the order within the lens combination of concave 30 and convex lens 32.
  • ß and ⁇ for adjusting the parallel offset S and the angle of attack ⁇ can also by the choice of the thickness of the plane-parallel plate d, as well as influencing the refractive index n, H 1 , n 2 of said optical components focusing lens 4, concave 30 and convex lens 32 influence on the parameters S and ⁇ are taken.
  • a preselection of the parameters S and ⁇ can be determined, wherein tilt and inclination of the fine adjustment are used.
  • a beam cone of approx. 6 ° is created. If you now want to introduce a cylindrical bore in a workpiece, the beam cone must be changed at an angle so that on the outside of the beam rotated in diameter perpendicular to the bore axis.
  • the concave lens 30 and the convex lens 32 are inclined with their common pivot point symmetrically opposite to each other out of the axis. The inclination is here about 3 °.
  • Fig. 7 shows a structure analogous to FIG. 6, in which the plane-parallel plate 6 is summarized in the components Konkav- 30 and convex lens 32, therefore referred to as a plane-parallel plate with concave lens 40 and plane-parallel plate with convex lens 42.
  • a plane-parallel plate with concave lens 40 and plane-parallel plate with convex lens 42 This means that the Lens combination against each other and also can be tilted together around their main plane.
  • Such solutions can also be used with a fixed angle ⁇ (or exchangeable exchangeable sets).
  • FIG. 8 shows a workpiece 18 "in which a freely shaped removal track 20" has been introduced, as can be produced with the devices according to FIGS. 6 or 7.
  • the tumbling beam 34 describes a concentric movement about the optical axis and thus carries - similar to a milling head with a conical milling tool material from the workpiece.
  • the efficiency of the removal is very strongly determined by the pulse-to-pulse overlap and thus by the rotational speed of the optical components plane-parallel plate 6, the concave lens 30 and the convex lens 32.
  • FIGS. 9 to 12 show results of numerical calculations for the beam path of the focused laser beam for different conversion examples of the device of FIG. 6 with regard to the selection and arrangement of the optical components for the described invention.
  • a selection was made of the optical components focusing lens 4, plane-parallel plate 6, concave lens 30 and convex lens 32 in a numerical simulation for beam propagation with different parameters such as the distance between the surfaces, refractive index, radii of curvature and tilt angle , calculated.
  • the following table shows the application-relevant results for a focused laser beam with a focusing lens 4 of the focal length of 30 mm and a beam diameter of the incident laser beam 2 in front of the focusing lens 4 of 2mm.
  • a laser beam with an optimal mode profile TEM O o was chosen.
  • the parameters for Fig. 9 produce a cone.
  • Fig. 10 results in a truncated cone with a straight side surface, ie a cylindrical bore.
  • angles are selected to produce an undercut, which are thus also used in the literature for inclined beams.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention porte sur un dispositif pour guider un rayon lumineux avec un élément de guidage de lumière entraîné de façon rotative ou oscillante avec au moins un groupe optique qui présente au moins dans un état de fonctionnement deux surfaces à faces planes et parallèles, qui sont orientées transversalement au rayon lumineux, inclinées autour d'un angle de basculement réglable. Egalement, l'invention porte sur un procédé pour guider un rayon lumineux, suivant lequel un rayon lumineux est guidé à travers un groupe optique avec au moins dans un état de fonctionnement des faces frontales planes et parallèles, le groupe optique étant déplacé en continu de telle sorte que la direction d'une perpendiculaire au plan de l'une des surfaces frontales planes du groupe optique se modifie périodiquement par rapport à l'axe optique.
PCT/EP2008/053042 2007-03-13 2008-03-13 Dispositif et procédé pour guider un rayon lumineux WO2008110613A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112008000681T DE112008000681A5 (de) 2007-03-13 2008-03-13 Vorrichtung und Verfahren zum Führen eines Lichtstrahls

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102007012695A DE102007012695A1 (de) 2007-03-13 2007-03-13 Verfahren und Vorrichtung zur schnellen Ablenkung eines Lichtstrahles auf eine einstellbare Kreisbahn
DE102007012695.8 2007-03-13
DE102007014933A DE102007014933A1 (de) 2007-03-22 2007-03-22 Verfahren und Vorrichtung zur schnellen Ablenkung eines Lichtstrahles auf eine einstellbare Längsbahn
DE102007014933.8 2007-03-22

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010049460A1 (de) 2010-09-13 2012-03-15 Laser- Und Medizin-Technologie Gmbh, Berlin Trepanieroptik
DE102011082627A1 (de) 2010-09-13 2012-03-15 Laser- Und Medizin-Technologie Gmbh, Berlin Trepanieroptik
DE102012004312A1 (de) 2012-02-27 2013-08-29 Laser- Und Medizin-Technologie Gmbh, Berlin Verfahren und Vorrichtung zur schnellen konzentrischen Ablenkung mehrerer Lichtstrahlen mit einstellbarem Winkel um die Systemachse
EP2633940A1 (fr) * 2012-02-29 2013-09-04 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif de traitement laser
DE102015205643A1 (de) 2015-03-27 2016-09-29 3D-Micromac Ag Vorrichtung zum Wendelbohren
EP2314412B1 (fr) 2009-10-22 2018-12-19 Ewag AG Dispositif de traitement au laser et procédé de fabrication d'une surface sur une ébauche
WO2019002301A1 (fr) * 2017-06-27 2019-01-03 Laser Engineering Applications Methode de structurisation d'un substrat, ensemble comprenant un substrat et un dispositif de structuration dudit substrat, et substrat avec une telle structuration
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EP2314412B1 (fr) 2009-10-22 2018-12-19 Ewag AG Dispositif de traitement au laser et procédé de fabrication d'une surface sur une ébauche
DE102011082627A1 (de) 2010-09-13 2012-03-15 Laser- Und Medizin-Technologie Gmbh, Berlin Trepanieroptik
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KR20200030033A (ko) * 2017-06-27 2020-03-19 레이저 엔지니어링 애플리케이션즈 기판을 구조화하는 방법, 상기 기판을 구조화하기 위한 기판 및 장치를 포함하는 조립체 및 그러한 구조를 가진 기판
US11267072B2 (en) 2017-06-27 2022-03-08 Laser Engineering Applications Method for structuring a substrate, assembly comprising a substrate and a device for structuring said substrate, and substrate with such a structure
WO2019002301A1 (fr) * 2017-06-27 2019-01-03 Laser Engineering Applications Methode de structurisation d'un substrat, ensemble comprenant un substrat et un dispositif de structuration dudit substrat, et substrat avec une telle structuration
CN110891730B (zh) * 2017-06-27 2022-09-06 激光工程应用公司 用于构建基材的方法、包括基材和用于构建所述基材的设备的组件、以及具有这种结构的基材
KR102509189B1 (ko) 2017-06-27 2023-03-13 레이저 엔지니어링 애플리케이션즈 기판을 구조화하는 방법, 상기 기판을 구조화하기 위한 기판 및 장치를 포함하는 조립체 및 그러한 구조를 가진 기판

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