WO2008107977A1 - 端面処理装置 - Google Patents

端面処理装置 Download PDF

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Publication number
WO2008107977A1
WO2008107977A1 PCT/JP2007/054344 JP2007054344W WO2008107977A1 WO 2008107977 A1 WO2008107977 A1 WO 2008107977A1 JP 2007054344 W JP2007054344 W JP 2007054344W WO 2008107977 A1 WO2008107977 A1 WO 2008107977A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin plate
face
infrared light
treating
burrs
Prior art date
Application number
PCT/JP2007/054344
Other languages
English (en)
French (fr)
Inventor
Katsumi Tsuda
Masayuki Choumei
Yasuhiro Yoshida
Masahiro Ooki
Yoshihito Nozaki
Atsushi Saiki
Original Assignee
Ulvac-Riko, Inc.
Mitsubishi Rayon Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac-Riko, Inc., Mitsubishi Rayon Co., Ltd. filed Critical Ulvac-Riko, Inc.
Priority to JP2009502393A priority Critical patent/JPWO2008107977A1/ja
Priority to PCT/JP2007/054344 priority patent/WO2008107977A1/ja
Publication of WO2008107977A1 publication Critical patent/WO2008107977A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/02—Deburring or deflashing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

樹脂板端面処理装置を、樹脂板のバリ以外の部分には影響を与えることなく、短時間で端面のバリのみを除去することができるように構成する。略矩形の樹脂板を処理位置で支持するための樹脂板支持装置１と、支持された前記樹脂板の処理端面を溶融処理するための赤外線照射装置２とからなる端面処理装置１であって、前記赤外線照射装置は、赤外線を発生させる線状の赤外線源と、赤外線を前記樹脂板の端面の所定部分に集光するための断面が楕円形状の集光手段とを備え、前記赤外線源が可動であるように構成されている。
PCT/JP2007/054344 2007-03-06 2007-03-06 端面処理装置 WO2008107977A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009502393A JPWO2008107977A1 (ja) 2007-03-06 2007-03-06 端面処理装置
PCT/JP2007/054344 WO2008107977A1 (ja) 2007-03-06 2007-03-06 端面処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/054344 WO2008107977A1 (ja) 2007-03-06 2007-03-06 端面処理装置

Publications (1)

Publication Number Publication Date
WO2008107977A1 true WO2008107977A1 (ja) 2008-09-12

Family

ID=39737882

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/054344 WO2008107977A1 (ja) 2007-03-06 2007-03-06 端面処理装置

Country Status (2)

Country Link
JP (1) JPWO2008107977A1 (ja)
WO (1) WO2008107977A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006110989A (ja) * 2004-08-17 2006-04-27 Mitsubishi Rayon Co Ltd 樹脂板用端面処理装置
JP2006120565A (ja) * 2004-10-25 2006-05-11 Hybec Corp 線集光型ヒータの焦点合わせ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006110989A (ja) * 2004-08-17 2006-04-27 Mitsubishi Rayon Co Ltd 樹脂板用端面処理装置
JP2006120565A (ja) * 2004-10-25 2006-05-11 Hybec Corp 線集光型ヒータの焦点合わせ装置

Also Published As

Publication number Publication date
JPWO2008107977A1 (ja) 2010-06-10

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