WO2008104103A1 - Procédé de fabrication d'une pluralité de del smd et structure de del - Google Patents

Procédé de fabrication d'une pluralité de del smd et structure de del Download PDF

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Publication number
WO2008104103A1
WO2008104103A1 PCT/CN2007/000643 CN2007000643W WO2008104103A1 WO 2008104103 A1 WO2008104103 A1 WO 2008104103A1 CN 2007000643 W CN2007000643 W CN 2007000643W WO 2008104103 A1 WO2008104103 A1 WO 2008104103A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting
heat dissipation
metal strip
adhesive
Prior art date
Application number
PCT/CN2007/000643
Other languages
English (en)
Chinese (zh)
Inventor
Tsungwen Chan
Chinhsiang Ku
Original Assignee
Tsungwen Chan
Chinhsiang Ku
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsungwen Chan, Chinhsiang Ku filed Critical Tsungwen Chan
Priority to PCT/CN2007/000643 priority Critical patent/WO2008104103A1/fr
Publication of WO2008104103A1 publication Critical patent/WO2008104103A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Definitions

  • the invention relates to a method for manufacturing a plurality of surface-adhesive light-emitting diodes and a structure thereof, in particular to a surface-adhesive light-emitting diode, which can effectively provide a heat dissipation mechanism of the light-emitting diode, reduce energy loss, and has a simple and environmentally friendly manufacturing process. LED production technology.
  • LEDs Light Emi tt ing Diodes
  • LEDs Light Emi tt ing Diodes
  • It is the component with the largest field value in all kinds of photoelectric components.
  • the light-emitting diode is a light-emitting element made of a semiconductor material, and has two electrode terminals, a voltage is applied between the terminals, a very small current is supplied, and the remaining energy is in the form of light via the combination of electrons and holes. Excitation release, this is the basic principle of light-emitting diodes. Unlike ordinary incandescent bulbs, LEDs are cold-emitting, have low power consumption, long component life, no need for warm-up time, fast response, etc., plus their small size, vibration resistance, mass production, easy to match The application requirements are made into very small or arrayed components. Therefore, LEDs have been widely used in indicators and display devices for information, communication and consumer electronics, and have become an indispensable element in daily life.
  • the die can be packaged into different light-emitting diodes.
  • the packaged product types include bullet type, cluster type, digital display, dot matrix type and surface adhesion type (SMD).
  • SMD surface adhesion type
  • the surface-adhesive LED is smaller than other conventional LEDs, so it is mainly used in the screen backlight of mobile phones and the buttons of mobile phones, which is in great demand in the current market.
  • the heat dissipation structure of the conventional surface-adhesive light-emitting diode is as shown in FIG. 4 of US Pat. No. 7,138,660.
  • the light-emitting diode of the light-emitting diode is placed on the positive terminal, and the light-emitting die is respectively wired to positive and negative.
  • the completed LED does not require additional optical components or reflectors, and the path of the light after soldering can be parallel to each board.
  • the surface-bonded LED emits heat through a positive metal.
  • the heat dissipation mechanism has the following disadvantages and needs to be improved:
  • the heat dissipation mechanism of existing LEDs is not enough to cope with the heat generated by them. When the temperature rises, it will not only cause the brightness to drop, but also exceed 85 degrees Celsius to accelerate the deterioration of the components.
  • Phosphors used in LED packaging when the temperature is too high, they will absorb water after shutdown. These water molecules will blacken the phosphor, which will reduce the luminous efficiency and affect the product efficiency.
  • a first object of the present invention is to provide a method for fabricating a plurality of surface-adhesive light-emitting diodes and a structure thereof, which achieve sufficient heat dissipation by an added heat dissipation structure, and the added structure can be combined with an existing process There is no need to increase the cost significantly, but it can effectively increase the service life and luminous efficiency of the product.
  • a second object of the present invention is to provide a method for fabricating a plurality of surface-adhesive light-emitting diodes and a structure thereof, and the heat-dissipating structure can also be combined with a heat-dissipating mechanism of the printed circuit board to more effectively conduct heat generated by the light-emitting diodes.
  • a third object of the present invention is to provide a method for fabricating a plurality of surface-adhesive light-emitting diodes and a structure thereof, which have no soldering operation in a series/parallel manufacturing process of a plurality of light-emitting dies, and are in compliance with the European electronic motor equipment.
  • Hazardous Substances Directive RoHs
  • a fourth object of the present invention is to provide a method for fabricating a plurality of surface-adhesive light-emitting diodes and a structure thereof. After the plurality of light-emitting diodes are serially/parallel-connected, a single point light source can be assembled into a whole light-emitting surface. Form a wider use.
  • the manufacturing method of the foregoing structure firstly cuts the heat dissipating structure and the excess area other than the two electrodes on the metal strip, so that the metal strip has a basic shape; and then the plastic injection molding is used.
  • a plurality of surface-adhesive light-emitting diodes of each group can also be arranged in series/parallel, in such a manner that the connection region is also directly cut on the same metal strip, and two adjacent surfaces are turned on by the connection region.
  • Adhesive LEDs to provide more product options.
  • the multi-surface adhesion type light-emitting diode of the invention and the structure thereof can effectively increase the service life and the luminous efficiency of the product without greatly increasing the cost, and the welding process is eliminated when performing the serial/parallel operation of the plurality of illuminating dies , meets environmental protection needs, and can greatly increase production efficiency.
  • FIG. 1 is a flow chart of a method for manufacturing a plurality of surface-adhesive light-emitting diodes according to Embodiment 1 of the present invention
  • FIG. 2 is a schematic view showing a structure of a metal strip for cutting an excess portion in the first step of Embodiment 1 of the present invention
  • FIG. 4 is a schematic view showing a structure of a solid crystal and a wire bonding in a third step in Embodiment 1 of the present invention.
  • FIG. 5 is a schematic structural view of a metal strip after cutting in a fourth step in the first embodiment of the present invention
  • FIG. 6 is a schematic view showing the encapsulation of the fifth step in the first embodiment of the present invention
  • Figure 7 is a flow chart showing a manufacturing method of Embodiment 2 of the present invention.
  • FIG. 8 is a schematic structural view of a metal strip after cutting in a fourth step in the first embodiment of the present invention
  • FIG. 9 is a schematic view showing the encapsulation of the fifth step in the second embodiment of the present invention
  • 10 is a schematic diagram of an actual circuit according to Embodiment 2 of the present invention.
  • FIG. 11 is a schematic diagram of an equivalent circuit of Embodiment 2 of the present invention.
  • FIG. 1 to FIG. 6 are schematic diagrams showing a structure and a related structure of a plurality of surface mount type light emitting diodes 10 according to the present invention; the plurality of surface mount type light emitting diodes 10 are composed of more than one light emitting unit 100 in parallel.
  • the embodiment is illustrated in three parts.
  • Each of the light-emitting units 100 includes a light-emitting die 1 disposed on a heat-dissipating structure 2.
  • the heat-dissipating structure 2 is provided with two electrodes 31 and 32, and emits light.
  • the die 1 extends from the two wires 41, 42 respectively connected to the two electrodes 31, 32.
  • the heat dissipation structure 2 and the two electrodes 31, 32 are formed on the same metal strip 6; between two adjacent light-emitting units, The opposite electrodes 31 are connected in parallel by the wires 43, and the other electrode 32 is connected to the metal strip 6 in parallel; and between the heat dissipation structure 2 and the electrodes 31 and 32 covered by each of the plurality of surface-adhesive LEDs 10 , a support structure 5 is provided for fixing, and then packaged by a general light-emitting diode arrangement to form a plurality of surface-adhesive light-emitting diodes that can be used.
  • the plurality of surface-adhesive light-emitting diodes 10 are the two electrodes when in use. 31, 32 contact with a printed circuit board for surface adhesion, and then electrically conductive to cause the light-emitting die 1 to start to emit light, the heat generated by the light-emitting die 1 is extended by the heat-dissipating structure 2 to other positions, if necessary,
  • the printed circuit board has external heat dissipation measures to conduct excess heat to the outside of the printed circuit board. Since the heat dissipation structure 2 itself is not in contact with any of the electrodes, it is in a non-polar state and does not interfere with the use of other circuits during use.
  • the heat dissipation structure 2 can be bent into various shapes as needed to facilitate contact with other heat dissipation devices, or change the heat dissipation space configuration to provide the most efficient heat dissipation result; or the heat dissipation structure 2 can change its area according to needs, The increased heat dissipation area can produce better heat dissipation results.
  • the detailed method for manufacturing the plurality of surface-adhesive LEDs 10 is as follows: First step P10, as shown in FIG. 2, first, the heat-dissipating structure 2 is removed from the metal strip 6 by a die. The excess area 61 other than the two electrodes 31, 32 forms the basic shape of the electrodes 31, 32 and the heat dissipation structure 2 on the metal strip 6;
  • the support structure 5 is emitted in a range covered by the plurality of surface-adhesive light-emitting diodes 10 by using a plastic injection molding method, so that the support structure 5 can fix the plurality of heat dissipation structures 2 and the electrodes 31, 32;
  • Step 3 F12, as shown in FIG. 4, performing solid crystal bonding and wire bonding on the metal strip 6 with the cut shape, first placing the light emitting die 1 on the heat dissipation structure 2, and then connecting the two wires 41, 42 is connected to the two electrodes 31, 32 by the light-emitting crystal grains 1, and the electrodes 31 are connected in parallel by a wire 43 between the two adjacent light-emitting units 100;
  • the other cutting regions 62 of the heat dissipation structure 2 and the two electrodes 31, 32 on the metal strip 6 are cut off, so that the light-emitting units 100 are
  • the heat dissipation structure 2 forms an independent individual with the electrodes 31, 32, but still can be designed due to the design of the support structure 5. Keep positioning;
  • the LED structure is packaged, the structure of the plurality of surface-adhesive LEDs 10 is completed, and then the metal strip 6 is cut off at the cutting line 63 according to the required size. That is, the present invention has been completed.
  • FIG. 7 to FIG. 11 is a schematic diagram of a method for fabricating a plurality of surface-adhesive LEDs 10 and related structures. This embodiment further generates a series/parallel LED structure, and steps 1 to 3 are performed. Embodiment 1 is the same, and the technical features of the two are as follows:
  • step F15 another cutting mode is used to cut off the connection portion 62 of the heat dissipation structure 2 and the two electrodes 31, 32 on the metal strip 6, and two adjacent ones are Between the surface-adhesive LEDs 10, the metal strip 6 retains a connection region 64, which is connected to the electrodes 31 and 32 of the light-emitting unit 100 of the two adjacent surface-adhesive LEDs 10, respectively.
  • a series/parallel structure as shown in FIG. 10 and FIG. 11 , and the heat dissipation structure 2 and the electrodes 31 , 32 of each of the light emitting units can be kept positioned by the support structure 5 ;
  • the LED structure is packaged to form a plurality of surface-adhesive LEDs 10, and a plurality of light-emitting units 100 are connected in parallel in each of the plurality of surface-adhesive LEDs 10, and Two adjacent surface-mounting LEDs 10 are connected in series.
  • the present invention eliminates the welding process when performing the serial/parallel operation of the plurality of light-emitting dies 1, and meets environmental protection requirements, and can greatly increase the production efficiency.

Abstract

L'invention concerne un procédé de fabrication d'une pluralité de DEL montées en surface (SMD) et la structure associée. Cette structure (10) comprend une pluralité d'unités électroluminescentes (100). Chaque unité électroluminescente (5) comprend une puce électroluminescente (1), un dispositif dissipateur thermique (2) et deux électrodes (31, 32), ces unités électroluminescentes (100) étant connectées par une structure de support (5). Ce procédé de fabrication consiste à découper une forme de base sur une bande de métal (6), à former la structure de support (5) au moyen d'un processus de moulage, puis à fixer les puces électroluminescentes (1) sur la bande de métal (6) possédant la forme de base et à connecter les deux électrodes (31, 32), à connecter les unités électroluminescentes en série ou en parallèle, et à découper les régions excédentaires et à effectuer la mise en boîtier.
PCT/CN2007/000643 2007-03-01 2007-03-01 Procédé de fabrication d'une pluralité de del smd et structure de del WO2008104103A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2007/000643 WO2008104103A1 (fr) 2007-03-01 2007-03-01 Procédé de fabrication d'une pluralité de del smd et structure de del

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2007/000643 WO2008104103A1 (fr) 2007-03-01 2007-03-01 Procédé de fabrication d'une pluralité de del smd et structure de del

Publications (1)

Publication Number Publication Date
WO2008104103A1 true WO2008104103A1 (fr) 2008-09-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9219211B1 (en) * 2014-07-14 2015-12-22 Genesis Photonics Inc. Method for manufacturing light emitting unit
US9997676B2 (en) 2014-05-14 2018-06-12 Genesis Photonics Inc. Light emitting device and manufacturing method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
CN1396667A (zh) * 2001-07-16 2003-02-12 诠兴开发科技股份有限公司 发光二极管的封装
CN1466230A (zh) * 2002-07-04 2004-01-07 菱生精密工业股份有限公司 发光二极管的封装成型方法及成品结构
US6943433B2 (en) * 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
CN1758436A (zh) * 2004-10-09 2006-04-12 光磊科技股份有限公司 高功率发光二极管阵列模块
CN1825645A (zh) * 2005-02-17 2006-08-30 三星电机株式会社 Led外壳及其制造方法
CN1885577A (zh) * 2005-06-25 2006-12-27 财团法人工业技术研究院 表面粘着装置型的发光二极管封装组件与制造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1396667A (zh) * 2001-07-16 2003-02-12 诠兴开发科技股份有限公司 发光二极管的封装
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US6943433B2 (en) * 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
CN1466230A (zh) * 2002-07-04 2004-01-07 菱生精密工业股份有限公司 发光二极管的封装成型方法及成品结构
CN1758436A (zh) * 2004-10-09 2006-04-12 光磊科技股份有限公司 高功率发光二极管阵列模块
CN1825645A (zh) * 2005-02-17 2006-08-30 三星电机株式会社 Led外壳及其制造方法
CN1885577A (zh) * 2005-06-25 2006-12-27 财团法人工业技术研究院 表面粘着装置型的发光二极管封装组件与制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9997676B2 (en) 2014-05-14 2018-06-12 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
US9219211B1 (en) * 2014-07-14 2015-12-22 Genesis Photonics Inc. Method for manufacturing light emitting unit

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