WO2008099988A1 - Method of cutting large tft-lcd panel and liquid crystal display device using the same - Google Patents

Method of cutting large tft-lcd panel and liquid crystal display device using the same Download PDF

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Publication number
WO2008099988A1
WO2008099988A1 PCT/KR2007/001949 KR2007001949W WO2008099988A1 WO 2008099988 A1 WO2008099988 A1 WO 2008099988A1 KR 2007001949 W KR2007001949 W KR 2007001949W WO 2008099988 A1 WO2008099988 A1 WO 2008099988A1
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WO
WIPO (PCT)
Prior art keywords
tft
substrate
lcd panel
cutting
large size
Prior art date
Application number
PCT/KR2007/001949
Other languages
French (fr)
Inventor
Woon Yong Park
Dong Hyun Kim
Original Assignee
Tovis Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tovis Co., Ltd filed Critical Tovis Co., Ltd
Publication of WO2008099988A1 publication Critical patent/WO2008099988A1/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors

Definitions

  • the present invention relates to a cutting method of a large size TFT-LCD panel and a liquid crystal display unit to enhance a simplicity of process facility and a speediness through solving a problem of an increase of facilities due to manufacturing TFT-LCD panels of respective sizes and reducing a subsequently increased cost by enabling a mass production of a various size of TFT-LCD panels in one manufacturing line through using a TFT-LCD panel cut in a desired size that is manufactured in large size.
  • LCD liquid crystal display
  • one pixel (composed of R. G. B. three sub-pixels) in the thin film transistor (TFT) - LCD is approximately as fine as 0.3 mm wide.
  • the TFT included in the pixel is smaller than the pixel. Moreover, in order to meet a resolution of 1600x1200, 1,920,000 pixels are required and 5,760,000 TFTs are necessary if the sub-pixels are considered. Therefore, an overall process is very precise and demands a level of semiconductor process.
  • TFT process a color filter (CF) process
  • cell process makes one panel with two glasses undergone the TFT process and the CF process.
  • module process completes the manufacturing process by mounting the one TFT-LCD panel undergone the cell process in a real monitor or TV.
  • the TFT process is the most basic core process for forming the most basic electrodes that provides an electrode for each cell.
  • the process includes five process steps in order of forming a gate electrode, an insulating film, a semiconductor film, a data electrode, a protective film, and a pixel electrode that requires one or more pattern processes for each process step.
  • this pattern process that may be called a core process in the processes of manufacturing the TFT-LCD panel is necessary in the TFT process but also a similar pattern process is necessary in the CF process.
  • the CF process is composed of black matrix (BM) process (requires pattern processes of vapor deposition, cleaning, PR process, exposure, development, etching, and stripping), each pixel process and Indium Tin Oxide (ITO) process (Indium Tin Oxide is an excellent transparent electrode material of good light transmittance, electrical conductivity, chemical and thermal stability.) .
  • BM black matrix
  • ITO Indium Tin Oxide
  • the TFT-LCD panel formed as hereinabove, the TFT-LCD panel is completed by providing a polarized plate on a surface of the TFT substrate and the CF substrate.
  • the TFT-LCD panel of size demanded by a user may be produced in a large amount but the other TFT-LCD panel of less demand may be produced in only a limited amount since various sizes of the TFT-LCD panels completed as hereinabove require a difference in production line and in each process of the production line dependent on the sizes of the TFT-LCD panels. Disclosure of Invention Technical Problem
  • the present invention is provided to overcome an inconvenience and a limit in mass production by a production dependent on the respective sizes.
  • the cutting method of a large size TFT-LCD panel of the present invention has an object of enhancing a simplicity of process facility and speediness through solving a problem of an increase of facilities due to manufacturing TFT-LCD panels of different sizes and reducing a subsequently increased cost by enabling a mass production of a various size of TFT-LCD panels in one manufacturing line through using a TFT-LCD panel cut in a desired size that is manufactured in large size.
  • the cutting method of a large size TFT-LCD panel formed as hereinabove can devise a simplicity in process and a profitability through solving a spatial enlargement and other costs increase due to an increase of facilities by equipping a facility's process dependent on a size according to a production of TFT-LCD panels in various sizes, having an advantage of possibly producing a various size of the TFT-LCD panel asked by a user purpose or a user taste in a simple and convenient way, and solving an abandonment and reduction of the facilities due to a change in consumption dependent on the TFT-LCD panel size.
  • FIG. 1 is a flowchart of a cutting method of a large size TFT-LCD panel of the present invention.
  • FIG. 2 is a flowchart of a cutting method of a large size TFT-LCD panel according to other exemplary embodiment of the present invention.
  • FIG. 3 illustrates a course of stripping a polarized plate in the cutting method of a large size TFT-LCD panel of the present invention.
  • FIG. 4 illustrates a state of a scribe line set into a mid-depth of a color filter substrate and a thin film transistor substrate by diamond wheel in the cutting method of a large size TFT-LCD panel of the present invention.
  • FIG. 5 illustrates a cut state after undergoing a tempering step in the cutting method of a large size TFT-LCD panel of the present invention.
  • FIG. 6 illustrates a state completed after processing sealing a cut portion in the cutting method of a large size TFT-LCD panel of the present invention.
  • FIG. 7 is a cross sectional view illustrating a state of a light blocking tape attached on a surface above the cut portion of the color filter substrate and the thin film transistor substrate.
  • FIG. 8 is a cross sectional view different from FIG. 7 illustrating a state of a light blocking tape attached on outer surfaces of the polarized plate bonded above the color filter substrate and the polarized plate bonded below the thin film transistor substrate at the respective cut portions.
  • FIG. 9 is a cross sectional view illustrating other exemplary embodiment.
  • FIG. 10 is a brief exploded perspective view of a liquid crystal display unit.
  • FIG. 11 is a brief cross sectional view of FIG. 10.
  • a polarized plate stripping step that removes a portion of a predetermined width to be cut from the each polarized plate provided on a surface and an opposite surface of the large size TFT-LCD panel, a cutting location setting step that sets a portion not damaging a gate line and a data line of the TFT substrate through investigating a portion stripped in the polarized plate stripping step by microscope, a scribe line setting step that sets a first scribe line cutting the CF substrate into its mid-depth along the portion set in the cutting location setting step using a diamond wheel, a turning over step that turns over the large size TFT-LCD panel to a side opposite from a side where a portion of the first scribe line is set after chucking one end of the large size TFT
  • a cutting location setting step that sets a portion to be cut
  • a scribe line setting step that sets a first scribe line cutting the CF substrate into its mid-depth along the portion set in the cutting location setting step using a diamond wheel
  • a turning over step that turns over the large size TFT-LCD panel to a side opposite from a side where a portion of the first scribe line is set after chucking one end of the large size TFT-LCD panel
  • a scribe line setting step that sets a second scribe line cutting the TFT substrate into its mid-depth along the portion set in the cutting line setting step which precisely corresponds with the set first scribe line, using a diamond wheel after turning over the large size TFT-LCD panel
  • a tempering step that tempers for 30 minutes to form a
  • the present invention comprises a scribe line setting step that sets scribe lines simultaneously cutting the CF substrate and the TFT substrate into their mid-depths along the portions set in the cutting location setting step using a diamond wheel.
  • the cutting method of a large size TFT-LCD panel further comprises a blocking off a light illuminated from a backlight through attaching a light blocking tape along a cut portion selected between the CF substrate and the TFT substrate or the both substrates or between the polarized plates located above the CF substrate and below the TFT substrate or the both polarized plates.
  • the present invention comprising the cutting performed by using any one among a diamond needle, laser, and a diamond wheel in the first and second scribe line setting step or in the simultaneous scribe line setting step may accomplish the hereinabove object.
  • the present step is a first step of the present invention.
  • LCD panel 100 is formed in structure sequentially coupled of, a polarized plate 10, a color filter (CF) substrate 11, a liquid crystal layer 12, a thin film transistor (TFT) substrate 13 and a polarized plate 14.
  • CF color filter
  • TFT thin film transistor
  • a polarized plate stripping step is initially performed that removes a portion of a predetermined width to be cut from the each polarized plate 10 provided on a surface above the CF substrate 11 and an opposite surface below the TFT substrate 13.
  • the TFT substrate 13 is exposed if the polarized plates 10 and 14 around the cutting portion are removed by its lengthwise direction. Since gate lines transferring a scanning signal and data line transferring a screen image signal are configured by innumerably crossing with each other and difficult to perceive by naked eyes, a cutting location setting step sets a portion not damaging the gate line and the data line of the TFT substrate through investigating a portion stripped on the polarized plate stripping step by microscope.
  • 1st scribe line setting step refers to a step of cutting the CF substrate 11 into its mid- depth along the portion set in the cutting location setting step using a diamond wheel. This step is very difficult and requires a skill of high precision determined by an experience of a technician.
  • the cutting may be performed by using a diamond needle, laser besides the diamond wheel.
  • the present step turns over the large size TFT-LCD panel 100 after chucking one end of the large size TFT-LCD panel 100.
  • the present step sets a 2nd scribe line setting step cutting the TFT substrate 13 into its mid-depth in the portion of the stripped polarized plate 14 bonded with the TFT substrate 13 below along the portion set in the cutting location setting step which precisely corresponds with the set first scribe line, using a diamond wheel after turning over the large size TFT-LCD panel 100.
  • This step is also difficult and requires a skill of high precision to correspond with the set first scribe line.
  • the cutting may be performed by using a diamond needle, laser besides the diamond wheel.
  • a natural crack is made if tempered for 30 minutes to form a natural crack in the scribe lines formed on the CF substrate 11 and the TFT substrate 13 of the large size TFT-LCD panel 100. Then, the air flows into a liquid crystal layer 12. If there is the air flow into the liquid crystal layer 12, the liquid crystal layer 12 is temporarily restricted from flowing out by the flowed in air.
  • the CF substrate 11 and the TFT substrate 13 are naturally cracked along the first scribe line and the second scribe line and the present step externally applies a certain amount of force in order to cut the large size TFT-LCD panel 100 along the scribe lines.
  • the present step is the last step that applies a sealant 30 on a cut portion in the large size TFT-LCD panel 100 and the present invention is completed by applying the sealant 30.
  • the large size TFT-LCD panel 100 is possible to be cut into a plural or multiple numbers without a many numbers of equipment and to meet a desired size of a demander or an operator.
  • process steps of the present invention may proceed without the polarized stripping step .
  • a cutting location setting step that sets a portion to be cut
  • a scribe line setting step that sets a first scribe line cutting the CF substrate 11 into its mid-depth along the portion set in the cutting location setting step using a diamond wheel
  • a turning over step that turns over the large size TFT-LCD panel 100 to a side opposite from a side where a portion of the first scribe line is set after chucking one end of the large size TFT-LCD panel 100
  • a scribe line setting step that sets a second scribe line cutting the TFT substrate 13 into its mid-depth along the portion set in the cutting location setting step corresponds with the set first scribe line, using a diamond wheel after turning over the large size TFT-LCD panel 100, a temper
  • the first and the second scribe lines setting steps which sequentially proceed in the respective first and second exemplary embodiments may be singly unified to realize the present invention.
  • a scribe line setting step sets scribe lines simultaneously cutting the CF substrate 11 and the TFT substrate 13 into their mid-depths along the portion set in the cutting location setting step using a diamond wheel.
  • TFT substrate 13 by applying the same scribe line depth and the like enables not only an abridgement of the operation process but also a precise setting job.
  • the present exemplary embodiment may or may not include the polarized plate stripping step like the first or second exemplary embodiment, and the subsequent steps may proceed in the same sequence as tempering step for the natural crack, cutting step cutting the CF substrate 11 and the TFT substrate 13 and sealing process step .
  • the image may be displayed with an image quality relatively unclear at a portion corresponding to the cutting portion.
  • a light blocking tape 20 may be provided to accomplish the object of the present invention by covering a certain region including the cutting portion against the light illuminated from the back light unit and realizing a clear screen quality at the display region corresponding to the cutting portion.
  • the light blocking tape 20 may be attached in a range covering any cut portions of the CF substrate 11 and the TFT substrate 13 or the both substrates 11 and 13 as shown in FIG. 7.
  • an additional process that is attaching the light blocking tape 20 at a periphery of the polarized plate 10 bonded above with the CF substrate 11 or at a periphery of the polarized plate 14 bonded below with the TFT substrate 14 which are removed with the set cutting portion, may maximize a clearness of the screen quality when the light from the back light unit is illuminated on the cut portion of the TFT-LCD panel 100 completed by cutting into a desirable size.
  • a width of the light blocking tape 20 between 2-60 mm is most preferable.
  • a transparent tape is used to cover an outer peripheral edge of the CF substrate 11 and the TFT substrate 13 after sealing the outer peripheral edge with an ultraviolet sealant 31 while the CF substrate 11 and the TFT substrate 13 are in bonded state.
  • the peripheries of the CF substrate 11 and the TFT substrate 13 may be covered by tape-processing or may be fixed by clipping and the like.
  • the present invention may be realized by variously selecting these examples according to a work condition and a product.
  • FIG. 10 and FIG. 11 illustrate an application of the TFT-LCD panel according to the cutting method provided by the present invention.
  • FIG. 10 is a brief exploded perspective view of a liquid crystal display unit.
  • FIG. 11 is a brief cross sectional view of FIG. 10.
  • the cut processed TFT-LCD panel 100 equipped with the backlight unit (not shown in drawing) below undergoes a series of course coupling a top sash 2 corresponding to an upper frame with an accommodating frame 3 accommodating the TFT-LCD panel 100 and the backlight unit to be used for the liquid crystal display unit.

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  • Nonlinear Science (AREA)
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  • Crystallography & Structural Chemistry (AREA)
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Abstract

The present invention relates to a cutting method of a large size TFT-LCD panel and a liquid crystal display unit to enhance a simplicity of process facility and a speediness through solving a problem of an increase of facilities due to fabrication of TFT-LCD panels of respective sizes and reducing a subsequently increased cost by enabling a mass production of a various size of TFT-LCD panels in one manufacturing line through using a TFT-LCD panel cut in a desired size that is manufactured in large size, thereby devising a simplicity in process and a profitability through solving a spatial enlargement and other costs increase due to an increase of facilities, having an advantage of possibly producing a various size of the TFT-LCD panel asked by a user purpose or a user taste in a simple and convenient way, and solving an abandonment and reduction of the facilities due to a change in consumption dependent on the TFT-LCD panel size.

Description

Description
METHOD OF CUTTING LARGE TFT-LCD PANEL AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME
Technical Field
[1] The present invention relates to a cutting method of a large size TFT-LCD panel and a liquid crystal display unit to enhance a simplicity of process facility and a speediness through solving a problem of an increase of facilities due to manufacturing TFT-LCD panels of respective sizes and reducing a subsequently increased cost by enabling a mass production of a various size of TFT-LCD panels in one manufacturing line through using a TFT-LCD panel cut in a desired size that is manufactured in large size. Background Art
[2] Generally, it is well known that various flat panel display units replacing a cathode ray tube (CRT) which has been used so far are developed and being distributed as many interests are concentrated on a display unit of larger size and better quality as a medium for screen image information.
[3] It is also well known that a liquid crystal display unit, one of these flat panel display units, has developed in a level equal or better than CRT in screen color tone quality aspect.
[4] A manufacturing process of general liquid crystal display (LCD) panel included in the LCD unit is as follows.
[5] Most of all as an outline, one pixel (composed of R. G. B. three sub-pixels) in the thin film transistor (TFT) - LCD is approximately as fine as 0.3 mm wide.
[6] Of course, the TFT included in the pixel is smaller than the pixel. Moreover, in order to meet a resolution of 1600x1200, 1,920,000 pixels are required and 5,760,000 TFTs are necessary if the sub-pixels are considered. Therefore, an overall process is very precise and demands a level of semiconductor process.
[7] Meanwhile, a manufacturing process of TFT-LCD panel is mainly divided into a
TFT process, a color filter (CF) process, a cell process and a module process. The cell process makes one panel with two glasses undergone the TFT process and the CF process. Then, the module process completes the manufacturing process by mounting the one TFT-LCD panel undergone the cell process in a real monitor or TV.
[8] First, the TFT process is the most basic core process for forming the most basic electrodes that provides an electrode for each cell. The process includes five process steps in order of forming a gate electrode, an insulating film, a semiconductor film, a data electrode, a protective film, and a pixel electrode that requires one or more pattern processes for each process step. Not only this pattern process that may be called a core process in the processes of manufacturing the TFT-LCD panel is necessary in the TFT process but also a similar pattern process is necessary in the CF process.
[9] Next, the CF process is composed of black matrix (BM) process (requires pattern processes of vapor deposition, cleaning, PR process, exposure, development, etching, and stripping), each pixel process and Indium Tin Oxide (ITO) process (Indium Tin Oxide is an excellent transparent electrode material of good light transmittance, electrical conductivity, chemical and thermal stability.) .
[10] After forming a liquid crystal layer between a TFT substrate and a CF substrate in the
TFT-LCD panel formed as hereinabove, the TFT-LCD panel is completed by providing a polarized plate on a surface of the TFT substrate and the CF substrate.
[11] The TFT-LCD panel of size demanded by a user may be produced in a large amount but the other TFT-LCD panel of less demand may be produced in only a limited amount since various sizes of the TFT-LCD panels completed as hereinabove require a difference in production line and in each process of the production line dependent on the sizes of the TFT-LCD panels. Disclosure of Invention Technical Problem
[12] Accordingly, if produced in a small amount as hereinabove, there are many problems in productivity and profitability which result in waste and abandonment of the facilities. The present invention is provided to overcome an inconvenience and a limit in mass production by a production dependent on the respective sizes.
Technical Solution
[13] The cutting method of a large size TFT-LCD panel of the present invention, provided to solve the hereinabove problems, has an object of enhancing a simplicity of process facility and speediness through solving a problem of an increase of facilities due to manufacturing TFT-LCD panels of different sizes and reducing a subsequently increased cost by enabling a mass production of a various size of TFT-LCD panels in one manufacturing line through using a TFT-LCD panel cut in a desired size that is manufactured in large size.
Advantageous Effects
[14] The cutting method of a large size TFT-LCD panel formed as hereinabove can devise a simplicity in process and a profitability through solving a spatial enlargement and other costs increase due to an increase of facilities by equipping a facility's process dependent on a size according to a production of TFT-LCD panels in various sizes, having an advantage of possibly producing a various size of the TFT-LCD panel asked by a user purpose or a user taste in a simple and convenient way, and solving an abandonment and reduction of the facilities due to a change in consumption dependent on the TFT-LCD panel size.
Brief Description of the Drawings
[15] FIG. 1 is a flowchart of a cutting method of a large size TFT-LCD panel of the present invention.
[16] FIG. 2 is a flowchart of a cutting method of a large size TFT-LCD panel according to other exemplary embodiment of the present invention.
[17] FIG. 3 illustrates a course of stripping a polarized plate in the cutting method of a large size TFT-LCD panel of the present invention.
[18] FIG. 4 illustrates a state of a scribe line set into a mid-depth of a color filter substrate and a thin film transistor substrate by diamond wheel in the cutting method of a large size TFT-LCD panel of the present invention.
[19] FIG. 5 illustrates a cut state after undergoing a tempering step in the cutting method of a large size TFT-LCD panel of the present invention.
[20] FIG. 6 illustrates a state completed after processing sealing a cut portion in the cutting method of a large size TFT-LCD panel of the present invention.
[21] FIG. 7 is a cross sectional view illustrating a state of a light blocking tape attached on a surface above the cut portion of the color filter substrate and the thin film transistor substrate.
[22] FIG. 8 is a cross sectional view different from FIG. 7 illustrating a state of a light blocking tape attached on outer surfaces of the polarized plate bonded above the color filter substrate and the polarized plate bonded below the thin film transistor substrate at the respective cut portions.
[23] FIG. 9 is a cross sectional view illustrating other exemplary embodiment.
[24] FIG. 10 is a brief exploded perspective view of a liquid crystal display unit.
[25] FIG. 11 is a brief cross sectional view of FIG. 10.
Best Mode for Carrying Out the Invention
[26] Specific solutions to accomplish the object are:
[27] In a completed large size TFT-LCD panel formed in a sequentially coupled configuration of a polarized plate, a color filter (CF) substrate, a liquid crystal layer, a thin film transistor (TFT) substrate and a polarized plate below the TFT substrate, a polarized plate stripping step that removes a portion of a predetermined width to be cut from the each polarized plate provided on a surface and an opposite surface of the large size TFT-LCD panel, a cutting location setting step that sets a portion not damaging a gate line and a data line of the TFT substrate through investigating a portion stripped in the polarized plate stripping step by microscope, a scribe line setting step that sets a first scribe line cutting the CF substrate into its mid-depth along the portion set in the cutting location setting step using a diamond wheel, a turning over step that turns over the large size TFT-LCD panel to a side opposite from a side where a portion of the first scribe line is set after chucking one end of the large size TFT-LCD panel, a scribe line setting step that sets a second scribe line cutting the TFT substrate into its mid-depth in the stripped polarized plate portion along the portion set in the cutting location setting step which precisely corresponds with the set first scribe line using a diamond wheel after turning over the large size TFT-LCD panel, a tempering step that tempers for 30 minutes to form a natural crack in the scribe lines formed on the CF substrate and the TFT substrate of the large size TFT-LCD panel, a cutting step that cuts the CF substrate and the TFT substrate naturally cracked after the 30 minutes tempering step, and a sealing process step that sealing a cut portion formed in the cutting step, and
[28] In a completed large size TFT-LCD panel formed in a sequentially coupled configuration of a polarized plate, a color filter (CF) substrate, a liquid crystal layer, a thin film transistor (TFT) substrate and a polarized plate, a cutting location setting step that sets a portion to be cut, a scribe line setting step that sets a first scribe line cutting the CF substrate into its mid-depth along the portion set in the cutting location setting step using a diamond wheel, a turning over step that turns over the large size TFT-LCD panel to a side opposite from a side where a portion of the first scribe line is set after chucking one end of the large size TFT-LCD panel, a scribe line setting step that sets a second scribe line cutting the TFT substrate into its mid-depth along the portion set in the cutting line setting step which precisely corresponds with the set first scribe line, using a diamond wheel after turning over the large size TFT-LCD panel, a tempering step that tempers for 30 minutes to form a natural crack in the scribe lines formed on the CF substrate and the TFT substrate of the large size TFT-LCD panel, a cutting step that cuts the CF substrate and the TFT substrate naturally cracked after the 30 minutes tempering step, and a sealing process step that sealing a cut portion formed in the cutting step may accomplish the present invention object.
[29] Further, the present invention comprises a scribe line setting step that sets scribe lines simultaneously cutting the CF substrate and the TFT substrate into their mid-depths along the portions set in the cutting location setting step using a diamond wheel.
[30] The cutting method of a large size TFT-LCD panel further comprises a blocking off a light illuminated from a backlight through attaching a light blocking tape along a cut portion selected between the CF substrate and the TFT substrate or the both substrates or between the polarized plates located above the CF substrate and below the TFT substrate or the both polarized plates.
[31] Further, the present invention comprising the cutting performed by using any one among a diamond needle, laser, and a diamond wheel in the first and second scribe line setting step or in the simultaneous scribe line setting step may accomplish the hereinabove object. Mode for the Invention
[32] Hereinafter, a cutting method of a large size TFT-LCD panel is described in detail referring to the drawings. [33] (1st Exemplary Embodiment)
[34] [Polarized Plate Stripping Step]
[35] The present step is a first step of the present invention. A completed large size TFT-
LCD panel 100 is formed in structure sequentially coupled of, a polarized plate 10, a color filter (CF) substrate 11, a liquid crystal layer 12, a thin film transistor (TFT) substrate 13 and a polarized plate 14.
[36] In order to cut the large size TFT-LCD panel 100 completed as hereinabove, a polarized plate stripping step is initially performed that removes a portion of a predetermined width to be cut from the each polarized plate 10 provided on a surface above the CF substrate 11 and an opposite surface below the TFT substrate 13.
[37] [Cutting Location Setting Step]
[38] The TFT substrate 13 is exposed if the polarized plates 10 and 14 around the cutting portion are removed by its lengthwise direction. Since gate lines transferring a scanning signal and data line transferring a screen image signal are configured by innumerably crossing with each other and difficult to perceive by naked eyes, a cutting location setting step sets a portion not damaging the gate line and the data line of the TFT substrate through investigating a portion stripped on the polarized plate stripping step by microscope.
[39] [1st Scribe Line Setting Step]
[40] 1st scribe line setting step refers to a step of cutting the CF substrate 11 into its mid- depth along the portion set in the cutting location setting step using a diamond wheel. This step is very difficult and requires a skill of high precision determined by an experience of a technician.
[41] Preferably, the cutting may be performed by using a diamond needle, laser besides the diamond wheel.
[42] [TFT-LCD Turning Over Step]
[43] To process a side opposite from a side where a portion of the first scribe line is set, the present step turns over the large size TFT-LCD panel 100 after chucking one end of the large size TFT-LCD panel 100.
[44] [2nd Scribe Line Setting Step]
[45] The present step sets a 2nd scribe line setting step cutting the TFT substrate 13 into its mid-depth in the portion of the stripped polarized plate 14 bonded with the TFT substrate 13 below along the portion set in the cutting location setting step which precisely corresponds with the set first scribe line, using a diamond wheel after turning over the large size TFT-LCD panel 100. This step is also difficult and requires a skill of high precision to correspond with the set first scribe line.
[46] Preferably, the cutting may be performed by using a diamond needle, laser besides the diamond wheel.
[47] [Tempering Step]
[48] A natural crack is made if tempered for 30 minutes to form a natural crack in the scribe lines formed on the CF substrate 11 and the TFT substrate 13 of the large size TFT-LCD panel 100. Then, the air flows into a liquid crystal layer 12. If there is the air flow into the liquid crystal layer 12, the liquid crystal layer 12 is temporarily restricted from flowing out by the flowed in air.
[49] [Cutting Step]
[50] After the 30 minutes tempering step, the CF substrate 11 and the TFT substrate 13 are naturally cracked along the first scribe line and the second scribe line and the present step externally applies a certain amount of force in order to cut the large size TFT-LCD panel 100 along the scribe lines.
[51] [Sealing Process Step]
[52] The present step is the last step that applies a sealant 30 on a cut portion in the large size TFT-LCD panel 100 and the present invention is completed by applying the sealant 30.
[53] Through undergoing the process hereinabove, the large size TFT-LCD panel 100 is possible to be cut into a plural or multiple numbers without a many numbers of equipment and to meet a desired size of a demander or an operator.
[54] (2nd Exemplary Embodiment)
[55] Meanwhile, different from the first exemplary embodiment, process steps of the present invention may proceed without the polarized stripping step .
[56] That is, in a large size TFT-LCD panel 100 completed of forming sequentially coupled, a polarized plate 10, a color filter (CF) substrate 11, a liquid crystal layer 12, a thin film transistor (TFT) substrate 13 and a polarized plate 14 below the TFT substrate 13, a cutting location setting step that sets a portion to be cut, a scribe line setting step that sets a first scribe line cutting the CF substrate 11 into its mid-depth along the portion set in the cutting location setting step using a diamond wheel, a turning over step that turns over the large size TFT-LCD panel 100 to a side opposite from a side where a portion of the first scribe line is set after chucking one end of the large size TFT-LCD panel 100, a scribe line setting step that sets a second scribe line cutting the TFT substrate 13 into its mid-depth along the portion set in the cutting location setting step corresponds with the set first scribe line, using a diamond wheel after turning over the large size TFT-LCD panel 100, a tempering step that tempers for 30 minutes to form a natural crack in the scribe lines formed on the CF substrate 11 and the TFT substrate 13 of the large size TFT-LCD panel 100, a cutting step that cuts the CF substrate 11 and the TFT 13 substrate naturally cracked after the 30 minutes tempering step, and a sealing process step that sealing a cut portion formed in the cutting step may configure the present invention.
[57] (3rd Exemplary Embodiment)
[58] Meanwhile, different from the above exemplary embodiments, the first and the second scribe lines setting steps which sequentially proceed in the respective first and second exemplary embodiments may be singly unified to realize the present invention.
[59] For example, after undergoing the sequentially processed cutting location setting steps of the first or the second exemplary embodiments through the polarized plate stripping step that removes a corresponding portion of a predetermined width to be cut from the polarized plates 10 and 14 provided on a surface of the CF substrate 11 and an opposite surface of the TFT substrate 13 like the first exemplary embodiment or without the polarized plate stripping step like the second exemplary embodiment, a scribe line setting step sets scribe lines simultaneously cutting the CF substrate 11 and the TFT substrate 13 into their mid-depths along the portion set in the cutting location setting step using a diamond wheel.
[60] Simultaneous application of the scribe line setting job on the CF substrate 11 and the
TFT substrate 13 by applying the same scribe line depth and the like enables not only an abridgement of the operation process but also a precise setting job.
[61] The present exemplary embodiment may or may not include the polarized plate stripping step like the first or second exemplary embodiment, and the subsequent steps may proceed in the same sequence as tempering step for the natural crack, cutting step cutting the CF substrate 11 and the TFT substrate 13 and sealing process step .
[62] Meanwhile, when a light from the backlight unit through the TFT-LCD panel 100 processed by the respective exemplary embodiments is illuminated to display a corresponding image, the image may be displayed with an image quality relatively unclear at a portion corresponding to the cutting portion.
[63] Considering this, a light blocking tape 20 may be provided to accomplish the object of the present invention by covering a certain region including the cutting portion against the light illuminated from the back light unit and realizing a clear screen quality at the display region corresponding to the cutting portion.
[64] Here, the light blocking tape 20 may be attached in a range covering any cut portions of the CF substrate 11 and the TFT substrate 13 or the both substrates 11 and 13 as shown in FIG. 7.
[65] Further, as shown in FIG. 8 different from the above covering range, an additional process, that is attaching the light blocking tape 20 at a periphery of the polarized plate 10 bonded above with the CF substrate 11 or at a periphery of the polarized plate 14 bonded below with the TFT substrate 14 which are removed with the set cutting portion, may maximize a clearness of the screen quality when the light from the back light unit is illuminated on the cut portion of the TFT-LCD panel 100 completed by cutting into a desirable size.
[66] Here, a width of the light blocking tape 20 between 2-60 mm is most preferable.
[67] Meanwhile, as shown in FIG. 9 of other exemplary embodiment, a transparent tape is used to cover an outer peripheral edge of the CF substrate 11 and the TFT substrate 13 after sealing the outer peripheral edge with an ultraviolet sealant 31 while the CF substrate 11 and the TFT substrate 13 are in bonded state.
[68] Further, though not shown in the drawings, the peripheries of the CF substrate 11 and the TFT substrate 13 may be covered by tape-processing or may be fixed by clipping and the like.
[69] The present invention may be realized by variously selecting these examples according to a work condition and a product.
[70] Further, FIG. 10 and FIG. 11 illustrate an application of the TFT-LCD panel according to the cutting method provided by the present invention. FIG. 10 is a brief exploded perspective view of a liquid crystal display unit. FIG. 11 is a brief cross sectional view of FIG. 10.
[71] As shown in FIG. 10 and FIG. 11, the cut processed TFT-LCD panel 100 equipped with the backlight unit (not shown in drawing) below undergoes a series of course coupling a top sash 2 corresponding to an upper frame with an accommodating frame 3 accommodating the TFT-LCD panel 100 and the backlight unit to be used for the liquid crystal display unit.
[72] Here, when the TFT-LCD panel 100 cut processed in a desired size according to the present invention is received in the top sash 2 and the accommodating frame 3, a realization of a clear screen may be difficult since a slight difference may be produced, not accurately fixing the TFT-LCD panel 100, and producing a flowing phenomena because of the internal difference.
[73] Not described reference number 101 means T-101.
[74] Accordingly, in order to prevent the flowing phenomena, that is the flowing phenomena of the received TFT-LCD panel 100, attaching a plurality of both-faces tape 4 at the outer peripheral edge on the top sash 2 surface and attaching a plurality of both-faces tape 4 at the outer peripheral edge on the accommodating frame 3 surface as well is preferable to completely prevent the flowing phenomena.
[75] Herein so far, though the present invention is described by illustrating preferable embodiments as examples, the present invention is not restricted to the exemplary embodiment hereinabove but may be variously modified and changed by persons skilled in the arts corresponding to the technical field of the present invention without deviating from the spirit of the present invention. Industrial Applicability
[76] Therefore, since a large size TFT-LCD panel may be miniaturized for an application to various video games, monitors or cell phone liquid crystal displays through cut processing the large size TFT-LCD panel without a separate manufacturing line for manufacturing process according to present invention, an industrial applicability expecting an effective reduction of manufacturing facility and its value may be recognized.
[77]

Claims

Claims
[1] A cutting method of a large size TFT-LCD panel, wherein the TFT-LCD panel is completed through sequentially coupling, a polarized plate, a color filter (CF) substrate, a liquid crystal layer, a thin film transistor (TFT) substrate and a polarized plate below the TFT substrate, comprising: a polarized plate stripping step that removes a portion of a predetermined width to be cut from the each polarized plate provided on a surface and an opposite surface of the large size TFT-LCD panel, a cutting location setting step that sets a portion not damaging a gate line and a data line of the TFT substrate through investigating a portion stripped in the polarized plate stripping step by microscope, a scribe line setting step that sets a first scribe line cutting the CF substrate into its mid-depth along the portion set in the cutting location setting step using a diamond wheel, a turning over step that turns over the large size TFT-LCD panel to a side opposite from a side where a portion of the first scribe line is set after chucking one end of the large size TFT-LCD panel, a scribe line setting step that sets a second scribe line cutting the TFT substrate into its mid-depth in the stripped polarized plate portion along the portion set in the cutting location setting step which precisely corresponds with the set first scribe line using a diamond wheel after turning over the large size TFT-LCD panel, a tempering step that tempers to form a natural crack in the scribe lines formed on the CF substrate and the TFT substrate of the large size TFT-LCD panel, a cutting step that cuts the CF substrate and the TFT substrate naturally cracked after the tempering step, and a sealing process step that applies a sealant formed on a cut portion in the cutting step.
[2] A cutting method of a large size TFT-LCD panel, wherein the TFT-LCD panel is completed through sequentially coupling, a polarized plate, a color filter (CF) substrate, a liquid crystal layer, a thin film transistor (TFT) substrate and a polarized plate, comprising: a cutting location setting step that sets a portion to be cut, a scribe line setting step that sets a first scribe line cutting the CF substrate into its mid-depth along the portion set in the cutting location setting step using a dia mond wheel, a turning over step that turns over the large size TFT-LCD panel to a side opposite from a side where a portion of the first scribe line is set after chucking one end of the large size TFT-LCD panel, a scribe line setting step that sets a second scribe line cutting the TFT substrate into its mid-depth along the portion set in the cutting location setting step which precisely corresponds with the set first scribe line, using a diamond wheel after turning over the large size TFT-LCD panel, a tempering step that tempers to form a natural crack in the scribe lines formed on the CF substrate and the TFT substrate of the large size TFT-LCD panel, a cutting step that cuts the CF substrate and the TFT substrate naturally cracked after the tempering step, and a sealing process step that applies a sealant on a cut portion formed in the cutting step.
[3] A cutting method of a large size TFT-LCD panel, wherein the TFT-LCD panel is completed through sequentially coupling, a polarized plate, a color filter (CF) substrate, a liquid crystal layer, a thin film transistor (TFT) substrate and a polarized plate below the TFT substrate, comprising: a polarized plate stripping step that removes a portion of a predetermined width to be cut from the each polarized plate provided on a surface and an opposite surface of the large size TFT-LCD panel, a cutting location setting step that sets a portion not damaging a gate line and a data line of the TFT substrate through investigating a portion stripped in the polarized plate stripping step by microscope, a scribe line setting step that sets scribe lines simultaneously cutting the CF substrate and the TFT substrate into their mid-depths along the portion set in the cutting location setting step using a diamond wheel, a tempering step that tempers to form a natural crack in the scribe lines formed on the CF substrate and the TFT substrate of the large size TFT-LCD panel, a cutting step that cuts the CF substrate and the TFT substrate naturally cracked after the tempering step, and a sealing process step that applies a sealant on a cut portion formed in the cutting step.
[4] A cutting method of a large TFT-LCD panel, wherein the TFT-LCD panel is completed through sequentially coupling, a polarized plate, a color filter (CF) substrate, a liquid crystal layer, a thin film transistor (TFT) substrate and a polarized plate, comprising: a cutting location setting step that sets a portion to be cut, a scribe line setting step that sets scribe lines simultaneously cutting the CF substrate and the TFT substrate into their mid-depths along the portion set in the cutting location setting step using a diamond wheel, a turning over step that turns over the large size TFT-LCD panel to a side opposite from a side where a portion of the first scribe line is set after chucking one end of the large size TFT-LCD panel, a tempering step that tempers to form a natural crack in the scribe lines formed on the CF substrate and the TFT substrate of the large size TFT-LCD panel, a cutting step that cuts the CF substrate and the TFT substrate naturally cracked after the tempering step, and a sealing process step that applies a sealant on a cut portion formed in the cutting step.
[5] The cutting method of a large size TFT-LCD panel according to any one of claim
1 through claim 4 wherein the tempering step is continued for 30 minutes to form the natural crack.
[6] The cutting method of a large size TFT-LCD panel according to any one of claim
1 through claim 5 wherein the cutting in the each scribe line setting step is performed by using any one among a diamond needle, laser, and a diamond wheel.
[7] The cutting method of a large size TFT-LCD panel according to any one of claim
1 through claim 5 further comprising a blocking off a light illuminated from a backlight through attaching a light blocking tape along a cut portion selected between the CF substrate and the TFT substrate or the both substrates.
[8] The cutting method of a large size TFT-LCD panel according to any one of claim
1 through claim 5 further comprising a blocking off a light illuminated from a backlight through attaching a light blocking tape along a cut portion selected between the polarized plates located above the CF substrate and below the TFT substrate or the both polarized plates.
[9] The cutting method of a large size TFT-LCD panel according to any one of claim
1 through claim 5 wherein a width of the light blocking tape is between 2-60 mm.
[10] The cutting method of a large size TFT-LCD panel according to any one of claim
1 through claim 4 wherein the sealing process step, a transparent tape is used to cover an outer peripheral edge of the CF substrate and the TFT substrate after sealing the outer peripheral edge with an ultraviolet sealant while the CF substrate and the TFT substrate are in bonded state.
[11] A liquid crystal display unit that includes a top sash and an accommodating frame accommodating a thin film transistor (TFT) - liquid crystal display (LCD) panel, a backlight unit and the like, comprising: the TFT-LCD panel cut-processed according to any one of claim 1 through claim 10 attached at the outer peripheral edges on the top sash surface above and the accommodating frame surface below through attaching a plurality of both-faces tapes at the outer peripheral edges on the top sash surface and the accommodating frame surface.
PCT/KR2007/001949 2007-02-12 2007-04-20 Method of cutting large tft-lcd panel and liquid crystal display device using the same WO2008099988A1 (en)

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