WO2008099635A1 - 光学素子、電子モジュール及び電子モジュールの製造方法 - Google Patents
光学素子、電子モジュール及び電子モジュールの製造方法 Download PDFInfo
- Publication number
- WO2008099635A1 WO2008099635A1 PCT/JP2008/050594 JP2008050594W WO2008099635A1 WO 2008099635 A1 WO2008099635 A1 WO 2008099635A1 JP 2008050594 W JP2008050594 W JP 2008050594W WO 2008099635 A1 WO2008099635 A1 WO 2008099635A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic module
- optical element
- production
- curable resin
- transmittance
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/525,996 US20100321901A1 (en) | 2007-02-09 | 2008-01-18 | Optical element, electronic module and method of producing electronic module |
JP2008558021A JPWO2008099635A1 (ja) | 2007-02-09 | 2008-01-18 | 光学素子、電子モジュール及び電子モジュールの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007030434 | 2007-02-09 | ||
JP2007-030434 | 2007-02-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008099635A1 true WO2008099635A1 (ja) | 2008-08-21 |
Family
ID=39689881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/050594 WO2008099635A1 (ja) | 2007-02-09 | 2008-01-18 | 光学素子、電子モジュール及び電子モジュールの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100321901A1 (ja) |
JP (1) | JPWO2008099635A1 (ja) |
CN (1) | CN101605855A (ja) |
WO (1) | WO2008099635A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04370113A (ja) * | 1991-06-18 | 1992-12-22 | Sanko Kagaku Kk | エポキシ樹脂組成物 |
JP2001234032A (ja) * | 2000-02-24 | 2001-08-28 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物 |
JP2002012743A (ja) * | 2000-06-28 | 2002-01-15 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物及びその硬化物にて封止された光半導体装置 |
JP2004002823A (ja) * | 2002-04-26 | 2004-01-08 | Kanegafuchi Chem Ind Co Ltd | 光学材料用組成物、光学用材料、その製造方法およびそれを用いた発光ダイオード |
JP2005105148A (ja) * | 2003-09-30 | 2005-04-21 | Nagase Chemtex Corp | エポキシ樹脂組成物および該組成物から得られる硬化物 |
JP2006083299A (ja) * | 2004-09-16 | 2006-03-30 | Nippon Shokubai Co Ltd | 光電子部品用組成物 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1293655C (en) * | 1985-04-30 | 1991-12-31 | Takashi Taniguchi | Anti-reflection optical article and process for preparation thereof |
US5032657A (en) * | 1990-05-21 | 1991-07-16 | The United States Of America As Represented By The United States Department Of Energy | Polymerizable 2(2-hydroxynaphthyl)2H-benzotriazole compounds |
US5372871A (en) * | 1992-03-10 | 1994-12-13 | Mitsui Toatsu Chemicals, Incorporated | Circuit board for optical element |
JP2004149782A (ja) * | 2002-10-09 | 2004-05-27 | Mitsubishi Chemicals Corp | 熱可塑性樹脂組成物及びそれを用いてなる成形体 |
US6800946B2 (en) * | 2002-12-23 | 2004-10-05 | Motorola, Inc | Selective underfill for flip chips and flip-chip assemblies |
CN1645172A (zh) * | 2004-01-22 | 2005-07-27 | 松下电器产业株式会社 | 光传送路基板、光传送路内置基板、及它们的制造方法 |
US20060285231A1 (en) * | 2005-05-24 | 2006-12-21 | Matsushita Electric Industrial Co., Ltd. | Optical component and optical pickup device |
-
2008
- 2008-01-18 CN CNA2008800042187A patent/CN101605855A/zh active Pending
- 2008-01-18 JP JP2008558021A patent/JPWO2008099635A1/ja active Pending
- 2008-01-18 WO PCT/JP2008/050594 patent/WO2008099635A1/ja active Application Filing
- 2008-01-18 US US12/525,996 patent/US20100321901A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04370113A (ja) * | 1991-06-18 | 1992-12-22 | Sanko Kagaku Kk | エポキシ樹脂組成物 |
JP2001234032A (ja) * | 2000-02-24 | 2001-08-28 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物 |
JP2002012743A (ja) * | 2000-06-28 | 2002-01-15 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物及びその硬化物にて封止された光半導体装置 |
JP2004002823A (ja) * | 2002-04-26 | 2004-01-08 | Kanegafuchi Chem Ind Co Ltd | 光学材料用組成物、光学用材料、その製造方法およびそれを用いた発光ダイオード |
JP2005105148A (ja) * | 2003-09-30 | 2005-04-21 | Nagase Chemtex Corp | エポキシ樹脂組成物および該組成物から得られる硬化物 |
JP2006083299A (ja) * | 2004-09-16 | 2006-03-30 | Nippon Shokubai Co Ltd | 光電子部品用組成物 |
Also Published As
Publication number | Publication date |
---|---|
CN101605855A (zh) | 2009-12-16 |
JPWO2008099635A1 (ja) | 2010-05-27 |
US20100321901A1 (en) | 2010-12-23 |
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