WO2008099635A1 - 光学素子、電子モジュール及び電子モジュールの製造方法 - Google Patents

光学素子、電子モジュール及び電子モジュールの製造方法 Download PDF

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Publication number
WO2008099635A1
WO2008099635A1 PCT/JP2008/050594 JP2008050594W WO2008099635A1 WO 2008099635 A1 WO2008099635 A1 WO 2008099635A1 JP 2008050594 W JP2008050594 W JP 2008050594W WO 2008099635 A1 WO2008099635 A1 WO 2008099635A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic module
optical element
production
curable resin
transmittance
Prior art date
Application number
PCT/JP2008/050594
Other languages
English (en)
French (fr)
Inventor
Shuji Murakami
Mika Wachi
Takashi Washizu
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to US12/525,996 priority Critical patent/US20100321901A1/en
Priority to JP2008558021A priority patent/JPWO2008099635A1/ja
Publication of WO2008099635A1 publication Critical patent/WO2008099635A1/ja

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/02Simple or compound lenses with non-spherical faces
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

 本発明は、リフロー処理による光学素子の透過率の変化を抑制した光学素子、電子モジュール及び電子モジュールの製造方法を提供する。この光学素子は、硬化性樹脂と硬化剤からなる硬化性樹脂材料と少なくとも1種の添加剤とを有する光学材料からなる光学素子において、前記光学材料の波長400nmにおける透過率が、前記添加剤を添加していない硬化性樹脂材料の波長400nmにおける透過率よりも1~10%低いことを特徴とする。
PCT/JP2008/050594 2007-02-09 2008-01-18 光学素子、電子モジュール及び電子モジュールの製造方法 WO2008099635A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/525,996 US20100321901A1 (en) 2007-02-09 2008-01-18 Optical element, electronic module and method of producing electronic module
JP2008558021A JPWO2008099635A1 (ja) 2007-02-09 2008-01-18 光学素子、電子モジュール及び電子モジュールの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007030434 2007-02-09
JP2007-030434 2007-02-09

Publications (1)

Publication Number Publication Date
WO2008099635A1 true WO2008099635A1 (ja) 2008-08-21

Family

ID=39689881

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050594 WO2008099635A1 (ja) 2007-02-09 2008-01-18 光学素子、電子モジュール及び電子モジュールの製造方法

Country Status (4)

Country Link
US (1) US20100321901A1 (ja)
JP (1) JPWO2008099635A1 (ja)
CN (1) CN101605855A (ja)
WO (1) WO2008099635A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04370113A (ja) * 1991-06-18 1992-12-22 Sanko Kagaku Kk エポキシ樹脂組成物
JP2001234032A (ja) * 2000-02-24 2001-08-28 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2002012743A (ja) * 2000-06-28 2002-01-15 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及びその硬化物にて封止された光半導体装置
JP2004002823A (ja) * 2002-04-26 2004-01-08 Kanegafuchi Chem Ind Co Ltd 光学材料用組成物、光学用材料、その製造方法およびそれを用いた発光ダイオード
JP2005105148A (ja) * 2003-09-30 2005-04-21 Nagase Chemtex Corp エポキシ樹脂組成物および該組成物から得られる硬化物
JP2006083299A (ja) * 2004-09-16 2006-03-30 Nippon Shokubai Co Ltd 光電子部品用組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1293655C (en) * 1985-04-30 1991-12-31 Takashi Taniguchi Anti-reflection optical article and process for preparation thereof
US5032657A (en) * 1990-05-21 1991-07-16 The United States Of America As Represented By The United States Department Of Energy Polymerizable 2(2-hydroxynaphthyl)2H-benzotriazole compounds
US5372871A (en) * 1992-03-10 1994-12-13 Mitsui Toatsu Chemicals, Incorporated Circuit board for optical element
JP2004149782A (ja) * 2002-10-09 2004-05-27 Mitsubishi Chemicals Corp 熱可塑性樹脂組成物及びそれを用いてなる成形体
US6800946B2 (en) * 2002-12-23 2004-10-05 Motorola, Inc Selective underfill for flip chips and flip-chip assemblies
CN1645172A (zh) * 2004-01-22 2005-07-27 松下电器产业株式会社 光传送路基板、光传送路内置基板、及它们的制造方法
US20060285231A1 (en) * 2005-05-24 2006-12-21 Matsushita Electric Industrial Co., Ltd. Optical component and optical pickup device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04370113A (ja) * 1991-06-18 1992-12-22 Sanko Kagaku Kk エポキシ樹脂組成物
JP2001234032A (ja) * 2000-02-24 2001-08-28 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2002012743A (ja) * 2000-06-28 2002-01-15 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及びその硬化物にて封止された光半導体装置
JP2004002823A (ja) * 2002-04-26 2004-01-08 Kanegafuchi Chem Ind Co Ltd 光学材料用組成物、光学用材料、その製造方法およびそれを用いた発光ダイオード
JP2005105148A (ja) * 2003-09-30 2005-04-21 Nagase Chemtex Corp エポキシ樹脂組成物および該組成物から得られる硬化物
JP2006083299A (ja) * 2004-09-16 2006-03-30 Nippon Shokubai Co Ltd 光電子部品用組成物

Also Published As

Publication number Publication date
CN101605855A (zh) 2009-12-16
JPWO2008099635A1 (ja) 2010-05-27
US20100321901A1 (en) 2010-12-23

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