WO2008090690A1 - 潜在性硬化剤 - Google Patents
潜在性硬化剤 Download PDFInfo
- Publication number
- WO2008090690A1 WO2008090690A1 PCT/JP2007/074228 JP2007074228W WO2008090690A1 WO 2008090690 A1 WO2008090690 A1 WO 2008090690A1 JP 2007074228 W JP2007074228 W JP 2007074228W WO 2008090690 A1 WO2008090690 A1 WO 2008090690A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- aluminum
- curing agent
- latent curing
- thermocurable
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyethers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
比較的低温で短時間の条件で熱硬化型化合物をカチオン重合硬化させることが可能なアルミニウムキレート系潜在性硬化剤を含有しながらも、十分な潜在性と貯蔵安定性を確保でき、しかもシャープなDSCの発熱ピークを示す熱硬化型組成物を提供する。アルミニウムキレート剤に、シルセスキオキサン型オキセタン誘導体を、非水溶性又は難水溶性セルロースエーテルの存在下で反応させて潜在化させたアルミニウムキレート系潜在性硬化剤と、トリアルコキシシリル基含有カップリング剤と、熱硬化型化合物とを含有する熱硬化型組成物における当該トリアルコキシシリル基含有カップリング剤として、各アルコキシ基の炭素数が2以上であるものを使用する。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008554984A JP5130501B2 (ja) | 2007-01-24 | 2007-12-17 | 潜在性硬化剤 |
| TW096150211A TW200833730A (en) | 2007-01-24 | 2007-12-26 | Latent curing agent |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007014089 | 2007-01-24 | ||
| JP2007-014089 | 2007-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008090690A1 true WO2008090690A1 (ja) | 2008-07-31 |
Family
ID=39644268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/074228 Ceased WO2008090690A1 (ja) | 2007-01-24 | 2007-12-17 | 潜在性硬化剤 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5130501B2 (ja) |
| TW (1) | TW200833730A (ja) |
| WO (1) | WO2008090690A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114075323A (zh) * | 2020-08-18 | 2022-02-22 | 旭化成株式会社 | 母料型热固性树脂组合物及热固性树脂组合物 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006132133A1 (ja) * | 2005-06-06 | 2006-12-14 | Sony Chemical & Information Device Corporation | 潜在性硬化剤 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5267757B2 (ja) * | 2006-02-07 | 2013-08-21 | デクセリアルズ株式会社 | 潜在性硬化剤 |
-
2007
- 2007-12-17 WO PCT/JP2007/074228 patent/WO2008090690A1/ja not_active Ceased
- 2007-12-17 JP JP2008554984A patent/JP5130501B2/ja active Active
- 2007-12-26 TW TW096150211A patent/TW200833730A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006132133A1 (ja) * | 2005-06-06 | 2006-12-14 | Sony Chemical & Information Device Corporation | 潜在性硬化剤 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114075323A (zh) * | 2020-08-18 | 2022-02-22 | 旭化成株式会社 | 母料型热固性树脂组合物及热固性树脂组合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200833730A (en) | 2008-08-16 |
| JP5130501B2 (ja) | 2013-01-30 |
| JPWO2008090690A1 (ja) | 2010-05-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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| DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
| WWE | Wipo information: entry into national phase |
Ref document number: 2008554984 Country of ref document: JP |
|
| NENP | Non-entry into the national phase |
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| 122 | Ep: pct application non-entry in european phase |
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| DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) |