WO2008090690A1 - 潜在性硬化剤 - Google Patents

潜在性硬化剤 Download PDF

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Publication number
WO2008090690A1
WO2008090690A1 PCT/JP2007/074228 JP2007074228W WO2008090690A1 WO 2008090690 A1 WO2008090690 A1 WO 2008090690A1 JP 2007074228 W JP2007074228 W JP 2007074228W WO 2008090690 A1 WO2008090690 A1 WO 2008090690A1
Authority
WO
WIPO (PCT)
Prior art keywords
aluminum
curing agent
latent curing
thermocurable
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/074228
Other languages
English (en)
French (fr)
Inventor
Katsuhiko Komuro
Tadasu Kawashima
Masahiko Ito
Daisuke Masuko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to JP2008554984A priority Critical patent/JP5130501B2/ja
Priority to TW096150211A priority patent/TW200833730A/zh
Publication of WO2008090690A1 publication Critical patent/WO2008090690A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/24Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0091Complexes with metal-heteroatom-bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyethers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

比較的低温で短時間の条件で熱硬化型化合物をカチオン重合硬化させることが可能なアルミニウムキレート系潜在性硬化剤を含有しながらも、十分な潜在性と貯蔵安定性を確保でき、しかもシャープなDSCの発熱ピークを示す熱硬化型組成物を提供する。アルミニウムキレート剤に、シルセスキオキサン型オキセタン誘導体を、非水溶性又は難水溶性セルロースエーテルの存在下で反応させて潜在化させたアルミニウムキレート系潜在性硬化剤と、トリアルコキシシリル基含有カップリング剤と、熱硬化型化合物とを含有する熱硬化型組成物における当該トリアルコキシシリル基含有カップリング剤として、各アルコキシ基の炭素数が2以上であるものを使用する。
PCT/JP2007/074228 2007-01-24 2007-12-17 潜在性硬化剤 Ceased WO2008090690A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008554984A JP5130501B2 (ja) 2007-01-24 2007-12-17 潜在性硬化剤
TW096150211A TW200833730A (en) 2007-01-24 2007-12-26 Latent curing agent

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007014089 2007-01-24
JP2007-014089 2007-01-24

Publications (1)

Publication Number Publication Date
WO2008090690A1 true WO2008090690A1 (ja) 2008-07-31

Family

ID=39644268

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074228 Ceased WO2008090690A1 (ja) 2007-01-24 2007-12-17 潜在性硬化剤

Country Status (3)

Country Link
JP (1) JP5130501B2 (ja)
TW (1) TW200833730A (ja)
WO (1) WO2008090690A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114075323A (zh) * 2020-08-18 2022-02-22 旭化成株式会社 母料型热固性树脂组合物及热固性树脂组合物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006132133A1 (ja) * 2005-06-06 2006-12-14 Sony Chemical & Information Device Corporation 潜在性硬化剤

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5267757B2 (ja) * 2006-02-07 2013-08-21 デクセリアルズ株式会社 潜在性硬化剤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006132133A1 (ja) * 2005-06-06 2006-12-14 Sony Chemical & Information Device Corporation 潜在性硬化剤

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114075323A (zh) * 2020-08-18 2022-02-22 旭化成株式会社 母料型热固性树脂组合物及热固性树脂组合物

Also Published As

Publication number Publication date
TW200833730A (en) 2008-08-16
JP5130501B2 (ja) 2013-01-30
JPWO2008090690A1 (ja) 2010-05-13

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