WO2008079098A1 - Procédé et appareil servant à porter une pièce de fabrication à couper - Google Patents

Procédé et appareil servant à porter une pièce de fabrication à couper Download PDF

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Publication number
WO2008079098A1
WO2008079098A1 PCT/SG2007/000439 SG2007000439W WO2008079098A1 WO 2008079098 A1 WO2008079098 A1 WO 2008079098A1 SG 2007000439 W SG2007000439 W SG 2007000439W WO 2008079098 A1 WO2008079098 A1 WO 2008079098A1
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
workpiece
cutting
solidified
solidified fluid
Prior art date
Application number
PCT/SG2007/000439
Other languages
English (en)
Inventor
Michael William Gadd
Original Assignee
Jetsis International Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jetsis International Pte Ltd filed Critical Jetsis International Pte Ltd
Priority to JP2009542726A priority Critical patent/JP2010513044A/ja
Publication of WO2008079098A1 publication Critical patent/WO2008079098A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20—Cutting beds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
    • B26F3/008—Energy dissipating devices therefor, e.g. catchers; Supporting beds therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet

Definitions

  • the invention relates to a method of and apparatus for cutting a workpiece supported by a solidified fluid.
  • the invention also relates to a method of and apparatus for cutting a workpiece supported by a solidified fluid having a pre-determined depth.
  • the invention also relates to a method of and apparatus for cutting a semiconductor substrate supported by a solidified fluid.
  • the invention also relates to a semiconductor substrate at least partially embedded in a solidified fluid.
  • the invention has particular, but not exclusive, application in singulation of semiconductor substrates.
  • Some disclosed methods provide examples of a disposable support for a workpiece to be cut.
  • the cutting of predetermined shapes from a workpiece may be achieved by using a laser or fluid jet, or other cutting agents of the mechanical type, such as saws.
  • a laser or fluid jet or other cutting agents of the mechanical type, such as saws.
  • the cutting agent When using the cutting agent to cut workpieces such as sheet materials it is common to cut all the way through the sheet material with the cutting agent passing through the material from one side to the other.
  • the sheet material is normally secured by a fixture which supports the sheet material to allow for the cutting agent to pass from one side to the other without the cutting agent damaging the fixtures.
  • the sheet material In the second position the sheet material is provided with upward support to support the predetermined shape to be cut from the sheet material and wherein in the second position the or another support means includes a through cut commensurate to the line or lines to define the remaining perimeter of the predetermined shape.
  • this method does not lend itself particularly well to cutting irregular shapes from the sheet material.
  • the method By supporting a workpiece for cutting by a solidified fluid, (for example, ice, a wax - such as candle wax - or equivalent) the method provides a fixture which can easily be repaired if it is cut or damaged by the cutting agent.
  • a solidified fluid for example, ice, a wax - such as candle wax - or equivalent
  • One method of repairing the fixture comprises introducing a fluid in an area of a cut in the solidified fluid and solidifying the introduced fluid.
  • the cut in the solidified fluid is able to retain a holding function on the workpiece allowing another part of the workpiece and fixture to be cut.
  • Another method allows for the solidified fluid to be of a pre-determined depth chosen in order to dissipate the energy of the cutting agent.
  • the solidified fluid is never cut through completely and this method does not require the cut to be repaired during the cutting process.
  • Reparation can be carried out later by thawing/liquefying and resolidifying at least the part of the solidified fluid (or all of it) which was cut for re-use.
  • the fixture is truly disposable and re-usable. There is no need for reparation of the cut in the solidified fluid as the solidified fluid is not cut through completely while the workpiece is retained in position.
  • Figure 1 is a schematic representation illustrating steps of a first method for cutting a workpiece
  • Figure 2 is a schematic representation illustrating steps of a second method for cutting a workpiece
  • Figure 3 is a schematic representation illustrating steps of a third method for cutting a workpiece
  • Figure 4 is a schematic representation illustrating steps for alignment of a workpiece for its subsequent cutting according to any of the methods of Figures 1 to 3.
  • workpiece 10 in this example a semiconductor substrate
  • solidified fluid 12 solidified fluid 12.
  • workpiece 10 is encapsulated (that is fully embedded) in solidified fluid 12 although full encapsulation is not required; it is sufficient for the workpiece 10 to be partially embedded in the solidified fluid 12.
  • Solidified fluid 12 is contained by tray 14.
  • Tray 14 comprises an aperture 14a, the significance of which is described below.
  • Workpiece 10, solidified fluid 12 and tray 14 define a workpiece assembly.
  • Jet 16 ejects a cutting agent 18 which, in the example of Figure 1, is a fine fluid jet or fluid-abrasive jet mix in a direction orthogonal to workpiece 10.
  • Other possible cutting agents which have application with the described methods are, for example, lasers or mechanical saws.
  • Cutting agent 18 cuts solidified fluid 12 at point 20, the upper surface of solidified fluid 12 disposed between jet 16 nozzle and workpiece 10.
  • the cutting path of cutting agent 18 takes the fluid jet through solidified fluid 12 to workpiece 10 at point 22, cutting through workpiece 10 and exiting at point 26, the opposite side of workpiece 10.
  • the path of cutting agent 18 through workpiece 10 makes a hole 24 through workpiece 10.
  • Cutting agent 18 continues to cut through solidified fluid 12 at the lower surface at point 28, exiting the workpiece assembly through aperture 14a of tray 14. Thus, by providing an aperture 14a, cutting agent 18 does not damage the tray 14.
  • a cut 38 has been made by cutting agent 18 through solidified fluid 12 and workpiece 10 extending from point 20 to point 28, as described above.
  • Relative movement between jet 16 and the workpiece assembly is effected (i.e. either the jet 16 is moved relative to the workpiece assembly or vice versa) so that the jet is effectively moved from the first cutting position at cut 38 to a second cutting position where cutting agent 18 commences to cut through solidified fluid 12 at a second point 30 on the upper surface of solidified fluid 12.
  • the path of cutting agent 18 at the second cutting position takes the cutting agent 18 through workpiece 10 at an upper surface point 32 through lower surface point 34 where it commences to cut through solidified fluid 12, exiting solidified fluid 12 at point 36 on the lower surface.
  • Cutting agent 18 exits the workpiece assembly through aperture 14a of tray 14.
  • cut 38 has been repaired to ensure a holding function on workpiece 10 by solidified fluid 12 in the region of cut 38 is maintained. It is a particularly advantageous feature of the method of Figure 1 that reparation of cut 38 is effected while the cutting agent 18 is making the cut at the second position of Figure Ib.
  • reparation of hole 38 can be effected prior to commencement of the second cut at the second cutting position illustrated in Figure Ib. That means that the retaining function of the repair hole 38 is fully in place prior to the second cut being commenced.
  • repair cut 38 which can be used as an alternative to, or in conjunction with, one another.
  • a first method is that another fluid is introduced into the area of cut 38 (introduction of fluid not illustrated).
  • the fluid flows into the cut and cooling is applied either to the introduced fluid or to the solidified fluid 12, to solidify fluid in the area of the cut.
  • One example of this is to flush the area of hole 38 with water and cool it, preferably so that it freezes. If applied to solidified fluid 12, transmission of the cooling through solidified fluid 12 to residual fluid in the area of hole 38 is effected.
  • a second option is that further cooling specifically directed to the introduced fluid or solidified fluid 12 is not required.
  • the entire cutting operation of Figure 1 is carried out at a temperature at which the introduced fluid will solidify. If the introduced fluid is a liquid such as water and/or solidified fluid 12 is frozen water (i.e. ice) then the cutting operation is carried out at an ambient sub-zero temperature.
  • Suitable temperature ranges may comprise any or all of the following: between 0 and -5 degrees Celsius; between -5 and -10 degrees Celsius; between -10 and -15 degrees Celsius; between -15 and -20 degrees Celsius; between -20 and -30 degrees Celsius; between -30 and -40 degrees Celsius; between 0 to -10 degrees Celsius; between -10 to -20 degrees Celsius; between -10 to -30 degrees Celsius; between -10 to -40 degrees Celsius; between -20 to -40 degrees Celsius; or below.
  • Other relative temperature scales will be applicable for other solidified fluids which are not frozen water and/or introduced fluids which are not water.
  • a third option is that the solidified fluid can be at least partially immersed in fluid (not shown) which means that cooling of the introduced fluid and/or solidified fluid or carrying out of the cutting operation is effected at sub-solidifying temperatures, meaning that cut 38 is repaired by freezing of the liquid immersing the solidified fluid 12.
  • a fourth option comprises solidifying of fluid in the fluid jet or fluid-abrasive jet mix of cutting agent 18. Residual fluid from the jet, passing through hole 38, will remain in the region of cut 38 and cooling/freezing of this residual fluid can be effected to repair hole 38.
  • the solidified fluid is solid at normal room temperatures.
  • the solidified fluid is solid in the range of room temperature plus or minus 10 degrees Celsius.
  • the range may be from, say, 10 to 30 degrees Celsius.
  • the range may be different, say from 15 to 25 degrees Celsius, or 18 to 22 degrees Celsius or not a range per se, but solid at 20 degrees Celsius.
  • One such suitable solidified fluid is a wax, for example a candle wax or equivalent.
  • fluidised wax for example, liquefied wax is introduced into the region of the cut.
  • the fluidised wax is directed to flow into the area of the cut, preferably flowing into and at least partially filling the cut.
  • the wax is allowed to cool to the solid, substantially or partially solid state, thereby repairing the cut.
  • the wax is temporarily heated to a temperature in the range which liquefies (or partially liquefies) the wax. After the heating is removed, the wax will return to its previous, unheated state and the cut will be repaired.
  • a small quantity of heat may be generated from the cutting action. However, any amount of heat generated is relatively insignificant and any of the described or other cooling methods will ensure that the hole is repaired.
  • workpiece 10 is encapsulated in solidified fluid 12. It will be appreciated that full encapsulation is not required. It is simply sufficient for solidified fluid 12 to exert a holding function on workpiece 12. Workpiece 10 may be partially embedded in solidified fluid 12, for example, simply sitting on top of solidified fluid 12, being gripped by solidified fluid 12. However, encapsulation provides additional benefits.
  • Solidified fluid 12 exerts holding forces on workpiece 10 in all directions (X-, Y- and Z-axes) and thereby holds the workpiece 10 in three dimensions.
  • solidified fluid 12 supports workpiece 10 in the direction of arrows 12a against the force of gravity. This means that any piece cut out from workpiece 10 is prevented from falling away and other separate supports are not required.
  • Fluid jets tend to diverge rapidly in air, the farther the distance from the nozzle tip of jet 16 to the workpiece 10, the wider the cut width of cutting agent 18 will be and the poorer the cut quality.
  • One method provides for forming solidified fluid 12 so that it presents a uniform or substantially uniform (e.g. flat) surface to the cutting agent 18 and jet 16. This overcomes problems where the workpiece 10 (a particular example being a semi conductor substrate) has components of differing dimensions which, when viewed from the perspective of jet 16 appear to be at different heights to one another.
  • Known methods for overcoming this problem include changing the stand-off distance between the nozzle of the jet 16 and the workpiece 10 to account for differences in component dimensions.
  • encapsulation in a solidified fluid or workpiece 10 provides a very significant advantage in that unwanted damage of the workpiece 10 can be significantly reduced.
  • the solidified fluid 12 can bear the brunt of any divergence described above.
  • cutting agents 18 such fluid jets are switched on - e.g. in spot drilling - overpressure can occur mean that ejected fluid causes damage to the substrate.
  • workpiece 10 is encapsulated in solidified fluid 12 this damage can be minimised as solidified fluid 12 will bear the brunt of this over pressure.
  • Encapsulating a workpiece 10 in a solidified fluid 12 may provide a further advantage in that protection of the workpiece 10 during a transition from a first cutting point to a second cutting point when no cutting is desired is provided. If the cutting agent is not fully switched off stray fluid from the cutting agent might otherwise damage the workpiece. Therefore, it is not necessary actually to turn off the cutting agent 18 fully during the transition. At the very least, after first cutting at the first cutting position, switching off of the cutting agent 18 can be initiated while also initiating simultaneously, or even before, the transition to the second cutting position.
  • solidified fluid 12 can act as a mask to workpiece 10.
  • a further very significant advantage of the method of Figure 1 is that as cutting agent 18 is able to cut through solidified fluid 12, there is no concern over damaged solidified fluid 12 acting as a fixture as solidified fluid 12 is simply fluid, for example, water or wax which is normally very easily obtained, frozen/solidified and re-frozen/resolidified. Indeed, in the method of Figure 1, solidified fluid 12 can be viewed as a truly disposable support fixture for the workpiece.
  • the workpiece assembly can simply be left to thaw/liquefy or heated in order to allow the cut product of workpiece 10 to be removed from the workpiece assembly.
  • One method allows for workpiece assembly 10 to be frozen and then transferred to a cutting apparatus. Alignment of workpiece assembly with the cutting apparatus takes place prior to commencement of the cutting operation, as will be described below.
  • the method of Figure 1 lends itself particularly well when a portion is to be cut from workpiece 10.
  • a partial cut can be made and refreezing/re-solidifying of at least of one part of the cut can take place prior to the full cut being made.
  • the cut out portion will not fall away and will be supported by solidified fluid 12 at at least one point.
  • sealing can be provided around aperture 14a.
  • waste from the cutting operation of cutting agent 18 and any excess fluid from the flooding of the area around hole 38 can simply drain away into a catchment reservoir (not shown).
  • FIG 2 a second method for cutting a workpiece is illustrated.
  • the method of Figure 2 operates in exactly the same manner as that of Figure 1 and detailed discussion of the cutting method is not reproduced here.
  • workpiece 10 has further support within workpiece assembly by tray extension 50 fixed to and extending from the main part of tray 14 at point 54 as shown in Figure 2a.
  • Workpiece 10 simply rests on tray extension 50 and supported by this in addition to the support function of the solidified fluid 12 or it can be further supported and aligned by dowels 52 as illustrated in Figure 2.
  • workpiece 10 can be held with mechanical aid from above (in the direction of jet 16) whilst being located on tray extension 50.
  • workpiece 10 can be dropped into the tray and aligned with tray extension 50 and, optionally, dowels 52 prior to the solidified fluid, when in liquid state, being introduced into the tray prior to being solidified.
  • tray extension 50 and, optionally, dowels 52 prior to the solidified fluid, when in liquid state, being introduced into the tray prior to being solidified.
  • FIG. 3 a third method for cutting a workpiece will now be described. Again, the method of Figure 3 is similar to that of the methods of Figures 1 and 2. However, in this method, reparation of hole 38 is not required. A reason for this is that the solidified fluid 12 and/or tray 14 has a depth of a pre-determined thickness chosen to be greater than a depth in the solidified fluid which jet 16 and cutting agent 18 can cut. As cutting agent 18 cuts through solidified fluid 12 at point 20, workpiece 10 at points 22 and 26 (thereby making hole 24 in workpiece 10) it borrows to a depth 28 before the energy of the cutting agent is dissipated.
  • the thickness of the solidified fluid is never cut through completely and, therefore, the cut-out portion of workpiece 10 does not drop away; and solidified fluid 12 retains its support force 12a on workpiece 10 at all times.
  • the solidified fluid and Figures 1 and 2 will dissipate the energy of cutting agent 12 to some extent, but in the method of Figure 3, the solidified fluid 12 and/or tray 14 has a pre-determined depth or thickness 56 in order that the cutting agent energy is fully dissipated within the depth 56 of the solidified fluid 12. This is a particularly advantageous feature and is provided independently.
  • Workpiece 10 is placed in tray extension 50 and, optionally, located on dowels 52.
  • Tray 14 is flooded with fluid (for example water or liquefied wax) up to a level 62 corresponding to an upper surface of workpiece 10. This is shown in Figure 4b.
  • video camera 60 of the cutting apparatus (not shown) is located adjacent workpiece 10 to effect alignment of workpiece 10 in the cutting apparatus.
  • tray 14 is topped up with fluid so that the level of fluid rises to level 64 meaning workpiece 10 is fully encapsulated in the liquid.
  • the fluid is solidified (or re-solidified) in order to provide the holding function in all directions on workpiece 10 from solidified fluid 12.
  • Video camera 60 can effect alignment prior to any solidifying or a first solidifying step can be effected at the step of Figure 4b when tray 14 is filled with fluid to the level 62. Subsequent "top-up" filling to the level 64 and re-solidifying can take place after alignment. Alternatively, a single solidifying step can take place after alignment and top-up with fluid to level 64.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

L'invention concerne un procédé et un appareil destinés à couper une pièce de fabrication portée par un fluide solidifié, comprenant l'étape consistant à couper une première partie de la pièce de fabrication à l'aide d'un agent de coupe et une première partie du fluide solidifié qui porte la première partie de la pièce de fabrication. Cela permet une coupe du fluide solidifié. La coupe du fluide solidifié est réparée. Un procédé comprend l'étape consistant à couper une pièce de fabrication qui est portée par un fluide solidifié ayant une profondeur prédéterminée. Un agent de coupe coupe une première partie de la pièce de fabrication et un premier fluide solidifié, ce qui engendre une coupe de fluide solidifié. L'épaisseur prédéterminée du fluide solidifié est telle qu'une profondeur de la coupe du fluide solidifié est inférieure à l'épaisseur prédéterminée.
PCT/SG2007/000439 2006-12-22 2007-12-24 Procédé et appareil servant à porter une pièce de fabrication à couper WO2008079098A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009542726A JP2010513044A (ja) 2006-12-22 2007-12-24 切削すべき被加工物を支持する方法および装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200609003-9 2006-12-22
SG200609003-9A SG143998A1 (en) 2006-12-22 2006-12-22 Method and apparatus for supporting a workpiece to be cut

Publications (1)

Publication Number Publication Date
WO2008079098A1 true WO2008079098A1 (fr) 2008-07-03

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PCT/SG2007/000439 WO2008079098A1 (fr) 2006-12-22 2007-12-24 Procédé et appareil servant à porter une pièce de fabrication à couper

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JP (1) JP2010513044A (fr)
SG (1) SG143998A1 (fr)
WO (1) WO2008079098A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2956057A1 (fr) * 2010-02-10 2011-08-12 Snecma Decoupe de preformes avant injection rtm par jet d'eau et cryogenisation
WO2017071870A1 (fr) * 2015-10-30 2017-05-04 Siemens Aktiengesellschaft Procédé et machine de découpage au jet d'eau, et montage d'usinage

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5941942B2 (ja) * 2014-05-02 2016-06-29 下田　一喜 切削方法、切削装置及びチャック

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US6267364B1 (en) * 1999-07-19 2001-07-31 Xuesong Zhang Magnetorheological fluids workpiece holding apparatus and method
JP2003146678A (ja) * 2001-11-07 2003-05-21 Nippon Electric Glass Co Ltd 脆性材料の切断方法及び切断装置
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US7144299B2 (en) * 2005-05-09 2006-12-05 Intel Corporation Methods and devices for supporting substrates using fluids

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JP3008344B2 (ja) * 1997-02-17 2000-02-14 禧享 垂水 凍結式ワーク固定法および凍結式ワーク固定装置
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US6267364B1 (en) * 1999-07-19 2001-07-31 Xuesong Zhang Magnetorheological fluids workpiece holding apparatus and method
JP2003146678A (ja) * 2001-11-07 2003-05-21 Nippon Electric Glass Co Ltd 脆性材料の切断方法及び切断装置
US6634928B2 (en) * 2001-11-09 2003-10-21 International Business Machines Corporation Fluid jet cutting method and apparatus
JP2003251539A (ja) * 2001-12-25 2003-09-09 Murata Mfg Co Ltd ワークの固定方法およびワークの加工方法
US7144299B2 (en) * 2005-05-09 2006-12-05 Intel Corporation Methods and devices for supporting substrates using fluids

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2956057A1 (fr) * 2010-02-10 2011-08-12 Snecma Decoupe de preformes avant injection rtm par jet d'eau et cryogenisation
WO2011098734A1 (fr) * 2010-02-10 2011-08-18 Snecma Decoupe de preformes avant injection rtm par jet d'eau et cryogenisation
GB2490469A (en) * 2010-02-10 2012-10-31 Snecma Cutting of preforms prior to RTM injection by means of a water jet and cryonics
GB2490469B (en) * 2010-02-10 2014-11-19 Snecma Cutting of preforms prior to RTM injection by means of a water jet and cryonics
US9108331B2 (en) 2010-02-10 2015-08-18 Snecma Cutting of preforms prior to RTM injection by means of a water jet and cryonics
WO2017071870A1 (fr) * 2015-10-30 2017-05-04 Siemens Aktiengesellschaft Procédé et machine de découpage au jet d'eau, et montage d'usinage

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Publication number Publication date
SG143998A1 (en) 2008-07-29
JP2010513044A (ja) 2010-04-30

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