WO2008073432A3 - No flow underfill process, composition, and reflow carrier - Google Patents

No flow underfill process, composition, and reflow carrier Download PDF

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Publication number
WO2008073432A3
WO2008073432A3 PCT/US2007/025337 US2007025337W WO2008073432A3 WO 2008073432 A3 WO2008073432 A3 WO 2008073432A3 US 2007025337 W US2007025337 W US 2007025337W WO 2008073432 A3 WO2008073432 A3 WO 2008073432A3
Authority
WO
WIPO (PCT)
Prior art keywords
mechanical pressure
electronic device
flow underfill
composition
reflow carrier
Prior art date
Application number
PCT/US2007/025337
Other languages
French (fr)
Other versions
WO2008073432A2 (en
Inventor
Martin Sobczak
Mark Wilson
Michaels A Previti
Senthil Kanagavel
Original Assignee
Fry Metals Inc
Martin Sobczak
Mark Wilson
Michaels A Previti
Senthil Kanagavel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fry Metals Inc, Martin Sobczak, Mark Wilson, Michaels A Previti, Senthil Kanagavel filed Critical Fry Metals Inc
Publication of WO2008073432A2 publication Critical patent/WO2008073432A2/en
Publication of WO2008073432A3 publication Critical patent/WO2008073432A3/en

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A method for forming an electrical interconnection between an active surface of a semiconductor integrated circuit device and a surface of an electronic device substrate involving applying mechanical pressure between the device and the substrate during heating to enhance collapse of the reflowed solder. A reflow carrier having a mechanical pressure device for applying mechanical pressure between an electronic device and an electronic device substrate. A polymer-based no flow underfill comprising an organic component, a fluxing component, and a compression stop.
PCT/US2007/025337 2006-12-11 2007-12-11 No flow underfill process, composition, and reflow carrier WO2008073432A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86946306P 2006-12-11 2006-12-11
US60/869,463 2006-12-11

Publications (2)

Publication Number Publication Date
WO2008073432A2 WO2008073432A2 (en) 2008-06-19
WO2008073432A3 true WO2008073432A3 (en) 2008-08-14

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PCT/US2007/025337 WO2008073432A2 (en) 2006-12-11 2007-12-11 No flow underfill process, composition, and reflow carrier

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011000866A1 (en) 2011-02-22 2012-08-23 Friedrich-Alexander-Universität Erlangen-Nürnberg Electrical component with an electrical connection arrangement and method for its production
JP6104518B2 (en) * 2012-04-27 2017-03-29 日産自動車株式会社 Semiconductor device manufacturing method, adiabatic load jig, and adiabatic load jig installation method
CN103212763A (en) * 2013-04-11 2013-07-24 中国电子科技集团公司第十四研究所 LTCC (Low Temperature Co-fired Ceramic) device assembly welding method
DE102015006981B4 (en) * 2015-05-29 2018-09-27 Mühlbauer Gmbh & Co. Kg Thermocompression device and method for connecting electrical components to a substrate
CN110961740A (en) * 2019-12-05 2020-04-07 中国科学院电子学研究所 Welding method of Au-based LTCC substrate with deep cavity structure
CN110961741A (en) * 2019-12-19 2020-04-07 中国科学院电子学研究所 LTCC substrate brazing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6003757A (en) * 1998-04-30 1999-12-21 International Business Machines Corporation Apparatus for transferring solder bumps and method of using
US6631078B2 (en) * 2002-01-10 2003-10-07 International Business Machines Corporation Electronic package with thermally conductive standoff
US6774497B1 (en) * 2003-03-28 2004-08-10 Freescale Semiconductor, Inc. Flip-chip assembly with thin underfill and thick solder mask

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6003757A (en) * 1998-04-30 1999-12-21 International Business Machines Corporation Apparatus for transferring solder bumps and method of using
US6631078B2 (en) * 2002-01-10 2003-10-07 International Business Machines Corporation Electronic package with thermally conductive standoff
US6774497B1 (en) * 2003-03-28 2004-08-10 Freescale Semiconductor, Inc. Flip-chip assembly with thin underfill and thick solder mask

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