WO2008071576A3 - Ensemble de circuits et procédé de production d'un ensemble de circuits - Google Patents

Ensemble de circuits et procédé de production d'un ensemble de circuits Download PDF

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Publication number
WO2008071576A3
WO2008071576A3 PCT/EP2007/063165 EP2007063165W WO2008071576A3 WO 2008071576 A3 WO2008071576 A3 WO 2008071576A3 EP 2007063165 W EP2007063165 W EP 2007063165W WO 2008071576 A3 WO2008071576 A3 WO 2008071576A3
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WO
WIPO (PCT)
Prior art keywords
circuit arrangement
components
fact
advantage
contact surfaces
Prior art date
Application number
PCT/EP2007/063165
Other languages
German (de)
English (en)
Other versions
WO2008071576A2 (fr
Inventor
Frank Baur
Andreas Bernhardt
Roland Brey
Carsten Goette
Martin Goetzenberger
Andreas Rekofsky
Angelika Schingale
Original Assignee
Continental Automotive Gmbh
Frank Baur
Andreas Bernhardt
Roland Brey
Carsten Goette
Martin Goetzenberger
Andreas Rekofsky
Angelika Schingale
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102007021073.8A external-priority patent/DE102007021073B4/de
Application filed by Continental Automotive Gmbh, Frank Baur, Andreas Bernhardt, Roland Brey, Carsten Goette, Martin Goetzenberger, Andreas Rekofsky, Angelika Schingale filed Critical Continental Automotive Gmbh
Publication of WO2008071576A2 publication Critical patent/WO2008071576A2/fr
Publication of WO2008071576A3 publication Critical patent/WO2008071576A3/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Metallurgy (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention a pour objectif de relier mécaniquement et/ou électriquement au moins deux éléments structurels (10). Selon l'invention, cet objectif est atteint avec un ensemble de circuits doté d'au moins deux éléments structurels (10) qui présentent chacun une surface de contact (12), du fait qu'au moins l'une des surfaces de contact (12) est rugueuse et que les éléments structurels (10) sont reliés de manière galvanique et/ou mécanique par un assemblage à serrer des surfaces de contact (12). Un avantage de l'invention est que, pour la création de l'assemblage, un matériau auxiliaire (par exemple métal d'apport, colle, vis, rivets, etc.) n'est pas forcément nécessaire. La présente invention convient en particulier à une fixation automatisée ainsi qu'éventuellement à une fonction étanche. Des processus de brasage du type connu par exemple peuvent être remplacés ou améliorés avantageusement. De plus, la présente invention peut être utilisée avantageusement en rapport avec la réalisation et la liaison thermique de corps de refroidissement.
PCT/EP2007/063165 2006-12-11 2007-12-03 Ensemble de circuits et procédé de production d'un ensemble de circuits WO2008071576A2 (fr)

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WO2018145968A1 (fr) * 2017-02-09 2018-08-16 Siemens Aktiengesellschaft Module de puissance
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JPH07115108A (ja) * 1993-10-19 1995-05-02 Matsushita Electric Ind Co Ltd 回路基板の電極接続方法
US6133066A (en) * 1996-08-01 2000-10-17 Nec Corporation Semiconductor element mounting method
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US20040238602A1 (en) * 1998-09-17 2004-12-02 Kabushiki Kaisha Tamura Seisakusho Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
US20050112861A1 (en) * 2003-11-25 2005-05-26 International Business Machines Corporation Roughened bonding pad and bonding wire surfaces for low pressure wire bonding
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EP0352020A2 (fr) * 1988-07-21 1990-01-24 AT&T Corp. Schéma d'interconnexion puce-sur-puce pour circuit intégré semi-conducteur
JPH07115108A (ja) * 1993-10-19 1995-05-02 Matsushita Electric Ind Co Ltd 回路基板の電極接続方法
US6133066A (en) * 1996-08-01 2000-10-17 Nec Corporation Semiconductor element mounting method
US20040238602A1 (en) * 1998-09-17 2004-12-02 Kabushiki Kaisha Tamura Seisakusho Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
DE19958328A1 (de) * 1999-10-08 2001-07-12 Flexchip Ag Verfahren zum Herstellen einer elektrischen Verbindung zwischen Chip-Kontaktelemente-Einheiten und externen Kontaktanschlüssen
US20050112861A1 (en) * 2003-11-25 2005-05-26 International Business Machines Corporation Roughened bonding pad and bonding wire surfaces for low pressure wire bonding
US20060223231A1 (en) * 2005-04-05 2006-10-05 Oki Electric Industry Co., Ltd. Packing method for electronic components

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