WO2008035699A1

WO2008035699A1 - Electronic device

Info

Publication number: WO2008035699A1
Application number: PCT/JP2007/068157
Authority: WO
Inventors: Keiichi Aoki; Chiyoshi Sasaki; Takumi Kimura
Original assignee: Sony Computer Entertainment Inc.
Priority date: 2006-09-21
Filing date: 2007-09-19
Publication date: 2008-03-27
Also published as: JP4686427B2; JP2008077436A

Abstract

An electronic device (1) is provided with an object to be cooled, a cooling means (32) and a case (2). On a surface (2A) of the case (2), a first introduction port (2131) and exhaust ports (2221, 2222) are formed. The cooling means (32) is provided with an inlet port, an ejection port (327) for ejecting sucked air toward the exhaust ports (2221, 2222), and a partitioning member (6) for partitioning inside the case (2) into a first space (S1) on the side of the first introduction port (2131) and a second space (S2) on the side of the ejection ports (2221, 2222). A gap is formed between the surface opposite to the surface (2A) and a partitioning member (6). The cooling means is arranged in the second space (S2), air communicated in the first space (S1) flows into the second space (S2) through the gap, and the object to be cooled is arranged either on an air flow channel reaching the cooling means (32) from the first introduction port (2131) or on an air flow channel reaching the exhaust ports (2221, 2222) from the ejection port (327).

Description

Specification

Turtle equipment

Technical field

[0001] The present invention relates to an electronic device including a cooling target, a cooling unit that blows and cools the cooling target, and a casing that houses the cooling target and the cooling unit.

Yes

Background art

Conventionally, recording media such as optical discs such as CD (Compact Disc), DVD (Digital Versatile Disc) and BD (Blu-ray Disc; registered trademark), semiconductor memory cards, HDD (Hard Disk Drive), etc. An information processing apparatus such as a reproduction apparatus that reproduces image and sound information recorded or stored in a storage medium, and a personal computer (Personal Computer, PC) that reads and executes a program or the like recorded or stored in each medium. Known

[0003] In these electronic devices such as playback devices and information processing devices, a circuit board on which an integrated circuit such as a CPU (Central Processing Unit) that processes each information is mounted, or an electronic component constituting the electronic device. A power supply device for supplying power is provided. Each component that constitutes the power supply device of these circuit boards generally generates heat during driving, but is weak against heat. Therefore, in order to drive electronic devices appropriately, it is necessary to cool these components efficiently. There is. As such an electronic device, there is known an entertainment device that is used for games, music playback, video playback, communication, and the like and includes a cooling fan inside a casing (see, for example, Patent Document 1).

[0004] In the entertainment device described in Patent Document 1, an air inlet (vent hole) is formed on the front side of the housing, and an air outlet (through hole) is formed on the back side. Then, when the cooling fan arranged on the back side inside the casing is driven, air outside the casing is introduced into the inside through the air inlet. Then, the introduced air is blown to the electronic component in the process of being sucked by the fan, and the electronic component is cooled. Then, the air heated for cooling the electronic components is exhausted by the fan to the outside of the housing through the exhaust port. This makes the housing It is possible to cool electronic components and the like disposed inside.

Patent Document 1: Japanese Patent Application Laid-Open No. 2002-134968

Disclosure of the invention

Problems to be solved by the invention

[0006] However, in the entertainment device described in Patent Document 1, since the intake and exhaust ports are respectively formed on the front and back surfaces of the casing! /, Opposite to each other! /, The cooling air that cools the inside of the device will circulate in one direction from the front side to the back side. In such a configuration, the cooling air is not blown to the cooling target located on a straight line parallel to the one direction in the area where the air inlet is not formed in the width direction on the front side. Proper cooling may not be possible. On the other hand, in the case where the intake port is formed over the entire width direction of the intake side surface, the occupied area in the housing of the intake port and the exhaust port becomes large, so that the aesthetics of the case is impaired. Problems arise.

[0007] In addition, because of the above-mentioned possibility, since it is necessary to arrange all the cooling targets on the flow path of the cooling air from the intake port to the exhaust port, the degree of freedom of arrangement of the internal configuration of the apparatus is limited. There is a problem. At this time, if it is attempted to reduce the size of the device, it is necessary to closely arrange the components in the housing. Therefore, if these components are properly cooled, the degree of freedom of arrangement of the components is further limited. At the same time, there is a problem in that the cooling air flow is hindered by each component and the cooling efficiency of these components decreases.

Due to these problems, there has been a demand for a cooling structure for an electronic device that can reliably cool the object to be cooled inside the device and can improve the degree of freedom in designing the inside of the device.

[0008] An object of the present invention is to provide an electronic device that can reliably cool an object to be cooled and can improve the degree of freedom of design inside the device.

Means for solving the problem

In order to achieve the above-described object, an electronic device of the present invention includes a cooling target, a cooling unit that cools the cooling target, and a housing that houses the cooling target and the cooling unit inside. The electronic device is provided with a first introduction port for introducing air outside the housing into one surface of the housing, and discharging the air cooled inside the housing to the outside. The cooling means is formed with an intake port for sucking in air introduced into the housing and a discharge port for discharging air sucked from the intake port toward the exhaust port. A partition member that partitions the first space on the side where the first introduction port is formed in the housing and the second space on the side where the exhaust port is formed, on the side opposite to the one surface A gap is formed between the surface and the partition member, the cooling means is disposed in the second space, and the air flowing through the first space is sucked by the cooling means, and the gap The cooling object flows on the flow path from the first introduction port to the cooling means, and on the air flow path from the discharge port to the exhaust port of the cooling means. It is characterized by being placed on one of the two sides! /.

[0010] According to the present invention, when the cooling means is driven, the second space side where the cooling means is arranged is partitioned by the partition member in the housing, and the negative pressure is applied to the outside of the housing and the first space communicates. Air is introduced into the housing from the first inlet. This air flows through the first space, and flows into the second space through a gap between the surface opposite to the surface where the first introduction port is formed and the partition member. Then, the cooling means arranged in the second space sucks the air flowing into the second space into the intake loca and discharges it toward the discharge loca exhaust port, so that the air is discharged out of the housing. For this reason, the air introduced from the outside of the casing circulates in the inner space of the casing in a substantially U shape in a side view that opens to the side where the first inlet and the exhaust port are formed. .

Here, the object to be cooled is on the air flow path from the first introduction port formed in the housing to the intake port of the cooling means or on the air flow path from the discharge port of the cooling means to the exhaust port of the housing. It is arranged in either one. According to this, the air circulating by driving the cooling means can be surely blown to the object to be cooled. Therefore, the arrangement position in the casing to be cooled can be freely set, so that the degree of freedom in designing the electronic equipment can be improved, and cooling air can be blown to the object to be cooled reliably. The cooling target can be reliably cooled.

[0011] When the air discharged from the discharge port of the cooling means is directly blown to the object to be cooled to cool the object to be cooled, the wind pressure of the air is reduced when the air is blown to the object to be cooled. For this reason, the circulation state of the air heated by cooling the object to be cooled is deteriorated, and the temperature inside the housing is reduced. Tends to rise. Such a problem becomes conspicuous when the electronic device is downsized or when the cooling target is densely arranged in the housing.

On the other hand, in the present invention, when the object to be cooled is arranged on the upstream side in the flow path of the air sucked by the cooling means, it is possible to more reliably blow air to the object to be cooled. At the same time, the cooling means is surely sucked by the cooling means that is used for cooling the cooling target and can be reliably discharged out of the housing through the exhaust port. According to this, the temperature in the housing can be lowered. Therefore, the air circulation state can be improved, and the cooling efficiency of the cooling target can be improved.

Furthermore, the first introduction port and the exhaust port are respectively formed on one surface of the housing. According to this, unlike the entertainment device described in Patent Document 1, it is not necessary to form an inlet and an exhaust on the front side and the rear side of the casing, respectively. Aesthetics can be improved.

In addition, in the entertainment device described above, if the casing is not arranged so as to provide a predetermined space on the front side of the casing where the air inlet is formed and the rear side of the casing where the exhaust port is formed, Introducing air into the housing and exhausting air out of the housing are not performed properly. On the other hand, in the present invention, since the first introduction port and the exhaust port are formed on one surface of the housing, the degree of freedom in arranging the housing can be improved.

In the present invention, it is preferable that the object to be cooled is disposed in the vicinity of the gap.

Here, in the gap between the housing and the partition member that partitions the first space and the second space, the air that has circulated through the first space flows in an aggregated manner toward the second space. It will be. In such an air circulation state, in the present invention, since the object to be cooled is disposed in the vicinity of the gap between the partition member and the housing, the air collected on the object to be cooled can be reliably blown. The amount of air blown to the cooling target can be increased. Therefore, the object to be cooled can be cooled more reliably.

In the present invention, it is preferable that the object to be cooled is a power supply device that supplies electric power to an electronic component constituting the electronic device.

Here, the power supply device becomes hot as the power consumption of the electronic device increases, and the operation of the electronic device becomes unstable unless such a power supply device is cooled efficiently. On the other hand, in the present invention, as described above, air can be reliably blown to the power supply device to be cooled by driving the cooling means, so that the power supply device can be reliably and appropriately cooled. Therefore, the power supply device can be efficiently cooled, so that the operation of the electronic device can be stabilized.

In the present invention, the casing is formed with a second inlet for introducing air outside the casing, and the object to be cooled is a flow of air from the first inlet to the cooling means. Another cooling object is provided on the flow path until the air that has cooled the cooling object is sucked by the cooling means, and the air introduced from the second inlet is the cooling air. In the process of being sucked by the rejection means, it is preferable that the cooling target is mixed with the cooled air and blown to the other cooling target.

Here, the position of the housing in which the second introduction port is formed is that air outside the housing is cooled until the air that has cooled the cooling object reaches another cooling object. Any location that can be merged is acceptable. That is, it is preferable that the second introduction port is located at a position in the vicinity of another cooling target in the casing and at an upstream side in the cooling air flow path. Such a position of the second introduction port may be, for example, the surface on the surface opposite to the surface where the first introduction port and the exhaust port are formed in the housing or on the surface intersecting the surface on the opposite side. The position may be close to the opposite surface.

According to the present invention, in addition to the air that has cooled the object to be cooled, the air newly introduced from the outside of the housing through the second inlet can be blown to other objects to be cooled. Therefore, since the temperature of the air blown to the other cooling target can be lowered, the other cooling target can be appropriately cooled.

In the present invention, it is preferable that the object to be cooled is disposed in the first space, and the other object to be cooled is disposed in the second space! /.

According to the present invention, the cooling object and the other cooling object are arranged in the first space and the second space, respectively, so that mutual heat interference can be suppressed.

In addition, when the distance between the cooling target and the second cooling target is short, the air introduced into the housing from the second inlet described above is merged with the air that has cooled the cooling target and sent to the other cooling target. Difficult to wind. On the other hand, in this invention, it reaches from the cooling object to another cooling object. The air that has cooled the object to be cooled and the air that has been introduced from the second inlet can be reliably merged, and air with low temperature can be reliably blown to other objects to be cooled. can do. Therefore, the cooling target and other cooling targets can be cooled effectively.

In the present invention, it is preferable that the other cooling target is disposed in the vicinity of the gap.

Here, as described above, the air that has circulated through the first space is collected in the gap between the partition member and the housing and flows into the second space. For this reason, in the present invention, by arranging another cooling object in the vicinity of the gap, the air that has circulated through the first space flows to the other cooling object in a collective manner. Besides being able to blow air more reliably, it is possible to increase the amount of air blown. Therefore, power S can be used to improve the cooling efficiency of other cooling objects.

In the present invention, the object to be cooled is arranged on an air flow path from the first introduction port to the cooling means, and a third introduction for introducing air outside the case into the case. A circuit board on which an integrated circuit that performs a predetermined process is mounted is provided on a side of the partition member where the cooling unit is provided, and the cooling unit is in contact with the integrated circuit. And a heat dissipating part that is connected to the abutting part and radiates heat conducted from the integrated circuit through the abutting part, and a blower part that blows air sucked from the intake port to the heat dissipating part In addition to the air that has cooled the object to be cooled, air introduced from the third introduction port is preferably sucked into the intake port.

[0020] Here, when air is directly blown to the integrated circuit on the circuit board, the cooling efficiency is not so high because the heat radiation area is limited to the casing of the integrated circuit. In such a case, if air is biased toward a part of the casing, only the portion where the air is blown is cooled, and the cooling efficiency of the entire integrated circuit is reduced. .

On the other hand, according to the present invention, the heat radiating portion of the cooling means radiates the heat conducted from the integrated circuit through the abutting portion that abuts the integrated circuit, thereby locally cooling the integrated circuit. The entire integrated circuit can be cooled. In addition, since the air sucked from the air inlet is blown to the heat radiating part by the air blowing part, the heat radiating part can be cooled. As a result, the integrated circuit can be cooled. Therefore, the integrated circuit mounted on the circuit board can be efficiently cooled.

In addition to the air that has cooled the object to be cooled, the heat generated in the integrated circuit is newly introduced into the housing through the third introduction port in the heat radiating portion that is conducted through the contact portion. Air is blown. According to this, since the temperature of the air blown to the heat radiating part can be lowered, the cooling efficiency of the heat radiating part is improved compared to the case where only the air that has cooled the cooling target and other cooling objects is blown to the heat radiating part. can do. Therefore, it is possible to effectively cool the heat dissipating part through which the heat of the integrated circuit is conducted, and as a result, the integrated circuit can be efficiently cooled. Thereby, the operation of the integrated circuit can be stabilized.

In the present invention, it is preferable that a frame member that sandwiches the circuit board together with the partition member is provided on the opposite side of the circuit board from the partition member.

According to the present invention, since the partition member that partitions the space in the housing into the first space and the second space sandwiches the circuit board together with the frame member, the circuit board is sandwiched in addition to the frame member. There is no need to provide a separate member. Therefore, the increase in the number of parts of the electronic device can be suppressed.

In addition, by configuring the partition member and the frame member for sandwiching the circuit board with metal or the like, it is possible to secure the strength for sandwiching the circuit board and to support the cooling target and other cooling targets. Therefore, the strength can be ensured. Furthermore, since unnecessary radiation noise flowing on the circuit board can be flowed to the partition member and the frame member, the occurrence of electromagnetic interference (Electro Magnetic Interference, EMI) of the electronic device can be suppressed.

In the present invention, it is preferable that a sealing member for sealing a gap is provided between the casing and the object to be cooled.

As such a sealing member, a member having elasticity is preferable so as to be in close contact with each of the casing and the object to be cooled, for example, sponge or rubber can be exemplified. According to the present invention, by providing the sealing member between the casing and the object to be cooled, the flow of air flowing through the casing can be adjusted. At this time, air can be reliably blown to the object to be cooled by providing the sealing member so as to concentrate the air 1S to be cooled on the object to be cooled. In addition, the air that blows to the object to be cooled is thus sealed. Therefore, the amount of air blown to the object to be cooled can be increased. Therefore, the object to be cooled can be cooled more efficiently.

In the present invention, it is preferable that a connection member for connecting the discharge port of the cooling means and the exhaust port is provided.

Here, when the cooling means is driven, the suction port side of the cooling means has a negative pressure, so air is sucked into the intake port from all directions. For this reason, the air discharged from the discharge port of the cooling means is not reliably discharged from the exhaust port of the housing! /, And the heated air is sucked into the intake port side. It will be. In such a case, the heated air is trapped in the casing, and the temperature in the casing rises.

On the other hand, in the present invention, since the discharge port of the cooling means and the exhaust port formed in the housing are connected by the connecting member, the air discharged from the discharge port is surely discharged out of the housing. The power to do S. Therefore, the temperature rise in the housing can be suppressed. This also allows the air to be discharged outside the casing without increasing the discharge pressure of the air from the cooling means, so that the power consumption of the cooling means can be suppressed.

[0025] In the present invention, the two surfaces of the casing that intersect each other are provided with leg portions that contact a predetermined installation surface, respectively, and the first introduction port and the exhaust port are formed. The surface is preferably a surface that is different from the two surfaces!

According to the present invention, the first introduction port and the exhaust port are formed on a surface different from two intersecting surfaces each provided with a leg portion. For this reason, even when it arrange | positions so that either surface provided with the leg part may oppose a predetermined installation surface, it can prevent a 1st inlet and an exhaust port being obstruct | occluded by an installation surface. Accordingly, since air can be introduced into the housing and air can be discharged outside the housing, it is possible to prevent a decrease in the cooling efficiency of the cooling target disposed in the housing.

Further, since the leg portions are provided on the two surfaces, the installation direction of the electronic device can be changed according to the place where the electronic device is installed. Therefore, it is possible to further improve the degree of freedom of installation of electronic equipment.

In the present invention, when the electronic device is placed with the legs provided on either of the two surfaces in contact with the installation surface, the first introduction port And the exhaust The one surface on which the mouth is formed is preferably opposed upward.

Here, the front side of the electronic device is often the side facing the user of the electronic device. When the first introduction port and the exhaust port are formed on the front side as described above, the exhausted air is directed toward the user, which is troublesome for the user.

In many cases, a connecting portion to which a terminal such as a power cord is connected is provided on the back side of the electronic device. In such a case, it is difficult to secure a space for forming the first introduction port and the exhaust port on the rear side!

[0027] On the other hand, in the present invention, when the leg portion of one surface of the two surfaces provided with the leg portions is brought into contact with the installation surface, the first introduction port and the exhaust port are provided. The formed surface faces upward, and when the leg of the other surface is in contact with the installation surface, the surface on which the first introduction port and the exhaust port are formed faces the side. . According to this, since the exhaust air is not directed to the user, it is possible to prevent the heated air from being blown to the user. In addition, since the first introduction port and the exhaust port are not formed on the back side, it is possible to ensure the space for forming the first introduction port and the exhaust port in the housing. Furthermore, when the electronic device is installed so that the surface where the first inlet and the outlet are formed faces upward, the heated air is discharged upward. It is possible to promote the diffusion of the air outside the housing.

Brief Description of Drawings

FIG. 1 is a perspective view of an information processing apparatus according to an embodiment of the present invention as viewed from the front side.

FIG. 2 is a perspective view of the information processing apparatus in the embodiment as viewed from the back side.

FIG. 3 is a perspective view showing an inner surface portion of an upper housing in the embodiment.

FIG. 4 is a perspective view of the information processing apparatus according to the embodiment as viewed from below.

FIG. 5 is a plan view showing an inner surface portion of the lower housing in the embodiment.

FIG. 6 is a schematic view showing a cross section of the lower housing in the embodiment.

FIG. 7 is a perspective view showing the information processing apparatus with the upper housing removed in the embodiment.

FIG. 8 is an exploded perspective view showing the apparatus main body in the embodiment.

FIG. 9 is a perspective view of the control unit according to the embodiment as viewed from above.

FIG. 10 is a perspective view of the control unit according to the embodiment as viewed from below. FIG. 11 is an exploded perspective view showing a control unit and a cooling unit in the embodiment.

FIG. 12 is a perspective view of the main frame in the embodiment as viewed from above.

FIG. 13 is a perspective view of the main frame in the embodiment as viewed from below.

FIG. 14 is a perspective view showing the HDD unit in the embodiment.

FIG. 15 is a perspective view of the control board in the embodiment as viewed from above.

FIG. 16 is a perspective view of the control board according to the embodiment as viewed from below.

FIG. 17 is a perspective view of the subframe according to the embodiment as viewed from above.

FIG. 18 is a perspective view of the control unit and the cooling unit in the embodiment as viewed from below.

FIG. 19 is a perspective view of the cooling unit according to the embodiment as viewed from above.

FIG. 20 is a view showing a flow path of cooling air flowing through the upper housing in the embodiment.

FIG. 21 is a schematic view showing a flow path of air flowing between the disk unit and the power supply unit and the subframe in the embodiment.

FIG. 22 is a schematic diagram showing a flow path of air flowing between the disk and power supply and the upper casing in the embodiment.

FIG. 23 is a view showing a flow path of cooling air flowing into the lower housing side in the embodiment.

FIG. 24 is a view showing a flow path of cooling air flowing into the lower housing side in the embodiment.

FIG. 25 is a schematic diagram showing a flow path of cooling air flowing between the main frame and the cooling unit in the embodiment.

FIG. 26 is a schematic diagram showing a flow path of cooling air flowing between the cooling unit and the lower housing in the embodiment.

FIG. 27 is a view showing a flow path of cooling air discharged by the cooling unit in the embodiment.

FIG. 28 is a view showing a flow path of cooling air discharged from the discharge port in the embodiment. Explanation of symbols

1. Information processing device (electronic equipment) 2. External casing (case) 4. Main frame (frame member) 5. Control board (circuit board) 6. Subframe (partition member), 2Α ····, 32 ··· Cooling unit (cooling means), 34 ··· Power unit (power supply, cooling target), 38—HDD unit (other cooling target) 51 CPU (Integrated circuit) 52 GPU (Integrated circuit) 321 Blower 325 (325C, 325G) ... heat receiving block (contact part), 327, 328 ... discharge port, 2131 ... intake port (first introduction port), 2141 ... leg part, 2155-2157 ... sponge (sealing member), 2212… Inlet (third inlet), 2221, 2222… Exhaust, 2231… Leg, 2233… Inlet (second inlet), 3231, 3244… Inlet, 3271, 3281… Sponge ), 22521… Legs, 22522 ··· Inlet (second inlet), S1… First space, Second space, S3 ··· Gap. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

(1) Configuration of information processing device 1

FIG. 1 is a perspective view of the information processing apparatus 1 according to the present embodiment as viewed from the front side. FIG. 1 shows a state where the lid member 23 attached to the upper housing 21 is opened! /, The information processing apparatus 1 of the present embodiment includes a controller ( Information recorded or stored in a recording medium such as an optical disc such as CD, DVD and BD, or in a storage medium such as various semiconductor memory cards and HDD (Hard Disk Drive) in response to an instruction from (not shown) or automatically And an electronic device that acquires information from a connected network, reproduces image information and audio information included in the acquired information, and executes a program included in the acquired information. In addition, the information processing apparatus 1 can record information on the optical disk depending on the type of the optical disk to be used, and can also record information on a storage medium such as a mounted semiconductor memory card or HDD. It is configured to be able to. Although not shown, the information processing apparatus 1 is electrically connected to an image display device such as a television receiver, and the user operates the controller in accordance with the operation of the user. Predetermined processing is performed, and an image signal and an audio signal are output to the image display device from the processing result.

The information processing apparatus 1 includes an exterior casing 2 (FIGS. 1 to 5) and an apparatus main body 3 (FIGS. 7 and 8) housed in the exterior casing 2.

[0031] (2) Configuration of exterior casing 2

The exterior casing 2 corresponds to the casing of the present invention, and as shown in FIG. Such an outer casing 2 is an upper casing to which the lid member 23 and the decorative plate 24 are attached. It is composed of a body 21 and a lower housing 22.

[0032] (2-1) Configuration of upper casing 21

The upper housing 21 is formed in a box shape having an arcuate curved portion, and is combined with the lower housing 22 and fixed by screws. The upper casing 21 has a front part 211 (FIG. 1), a top part 2 12 (FIGS. 1 and 2), a side part 213 (FIG. 1), 214 (FIG. 2), and an inner part 215 (FIG. 3). Is formed.

The front portion 211 is a front side surface shown in FIG. 1, and projecting portions 2111 and 2112 projecting in the out-of-plane direction are provided at substantially the center and the left end of the front portion 211. A card slot portion 2113 is formed in an area between the protruding portions 21 11 and 2112. The card slot portion 2113 may be abbreviated as various semiconductor memory cards (hereinafter abbreviated as “memory card”). There are three openings 21131 that can be punched. Through these openings 21131, insertion portions corresponding to various memory cards of a reader / writer 351, which will be described later, provided in the exterior casing 2 are exposed. The card slot portion 2113 is covered with an upper casing 21 by a lid member 23 supported by a rotating material.

On the right side of the front portion 211, a disc slot inlet 2114 corresponding to an optical disc having a diameter of 12 cm is formed along the longitudinal direction of the front portion 211. The optical disk inserted into the disk inlet 2114 is inserted into a disk unit 33 that constitutes the main body 3 to be described later. Further, the right side surface 213 in FIG. A plurality of air inlets 2131 are formed through which cooling air for cooling the apparatus main body 3 is introduced from outside the outer casing 2. That is, the intake port 2131 corresponds to the first introduction port of the present invention.

FIG. 2 is a perspective view of the information processing apparatus 1 in a state in which the decorative plate 24 is shifted as viewed from the back side. The upper surface portion 212 of the upper housing 21 has the upper surface portion as shown in FIG. A decorative board 24 covering 212 is slidably attached. The decorative plate 24 is formed so as to follow the curved shape of the upper surface portion 212, and is attached to the upper surface portion 212 by sliding along the longitudinal direction of the upper surface portion 212.

Also, the length of the side portion 214 (the front side in FIG. 2 and the left side portion in FIG. 1) Legs 2141 made of rubber or the like are provided at both ends in the direction.

FIG. 3 is a perspective view of the inner surface 215 of the upper housing 21 as viewed from the front surface 211 side.

The inner surface portion 215 is a surface facing the lower housing 22 in the upper housing 21. As shown in FIG. 5, the inner surface portion 215 corresponds to the side portion 215A corresponding to the inner surface side of the front portion 211, the side portions 215B and 215C corresponding to the left and right side surface portions 213 and 214, and the upper surface portion 212. It consists of a bottom 215D.

Among these, a reader / writer 351 constituting a reader / writer unit 35 of the apparatus main body 3 described later is attached to a position on the front surface 211 side of the bottom 215D, that is, a position corresponding to the card slot 2113.

[0037] Further, in the approximate center of the bottom 215D, a sealing member that rectifies air introduced from the outside of the outer casing 2 through the air inlet 2131 that penetrates the side 215B and guides it to the power supply unit 34 described later. Sponges 2155 to 2157 are attached in a staircase pattern in plan view.

Specifically, the sponge 2155 is attached so as to extend in the longitudinal direction of the upper casing 21, that is, in the direction orthogonal to the side portion 215B, from the end portion force on the back side (upper side in FIG. 3) of the intake port 2131. It has been. This sponge 2155 abuts on the upper surface of the housing 332 of the disk unit 33 constituting the apparatus body 3 to be described later, the bottom 215D, the back side portion of the disk unit 33 and the back side portion of a part of the power supply unit 34. Seal the gap. The sponge 2155 can prevent the aerodynamic force introduced from the air inlet 2131 and flowing above the disk unit 33 from flowing to the back side in the upper casing 21.

[0038] The sponge 2156 is attached to the bottom 215D so as to extend from the end of the sponge 2155 opposite to the inlet 2131 side in a direction perpendicular to the sponge 2155. In other words, the sponge 2156 is disposed so as to be orthogonal to the sponge 2155 from the end of the sponge 2155 toward the approximate center of the bottom 215D.

The sponge 2157 is connected to the end of the sponge 2156 opposite to the sponge 2155 side, and is attached so as to extend along the longitudinal direction of the upper casing 21. That is, the sponge 2157 is disposed along the longitudinal direction from the approximate center of the bottom 215D.

[0039] These sponges 2156 and 2157 are in contact with the upper surface of a casing 341 of a power supply unit 34 to be described later. Then, the gap between the casing 341 and the bottom 215D is sealed. As a result, the air introduced from the air inlet 2131 and flowing above the disk unit 33 can be prevented from flowing to the back side of the power supply unit 34, and the air is formed in the housing 341. It can be circulated inside the housing 341 through a hole (not shown).

The flow path of the air introduced from the intake port 2131 will be described in detail later.

[0040] (2-2) Configuration of lower housing 22

As shown in FIG. 1, the lower housing 22 has a combination of a rectangular parallelepiped and a semi-cylinder, and is combined with the above-described upper housing 21 so that the semi-cylindrical portions face each other.

The lower casing 22 has an opening 22A (FIG. 5) for accommodating the apparatus body 3 described later on the side facing the upper casing 21, and the lower casing 22 includes a front portion 221 (FIG. 1), side portions 2 22 (FIG. 1), 223 (FIG. 2), back surface portion 224 (FIG. 2), bottom surface portion 225 (FIG. 4) and inner surface portion 226 (FIG. 5) are formed. The opening 22A is closed by the upper casing 21 described above.

[0041] On the left side of the front portion 221 (the portion on the near side in FIG. 1), four openings 2211 having a substantially rectangular shape are formed. Through these openings 2211, terminals 531 (FIG. 16) that are provided on the control board 5 constituting the apparatus body 3 and that can be connected to the A terminal conforming to the USB (Universal Serial Bus) standard are respectively exposed. . Further, a plurality of intake ports 2212 having a substantially rectangular shape are formed on the right side of the opening 2211 in the front portion 221, and air outside the exterior housing 2 is introduced into the inside through the intake ports 2212. The intake port 2212 corresponds to the third introduction port of the present invention.

Further, an intake port 2213 (FIG. 4) for introducing air outside the exterior casing 2 is formed on the lower surface of the extended portion of the front portion 221!

[0042] In addition, the right side surface portion 222 in FIG. 1, that is, the side surface portion 222 corresponding to the side surface portion 213 of the upper casing 21, the upper side protrudes by a first step portion 2251 (FIG. 4) described later, Steps in which the lower side is immersed are formed, and exhaust ports 222 1 and 2222 through which cooling air that cools the device body 3 is discharged are formed on the respective surfaces along the formation direction of the side surface portion 213 at the step. Has been. More specifically, an exhaust port 2221 is formed on the side surface of the upper protruding portion, and an exhaust port 2222 is formed on the side surface of the lower immersion portion.

These exhaust ports 2221 and 2222 correspond to the exhaust ports of the present invention, and are on the side of the outer casing 2. The surface formed by 222 ί 2 (this is that the air inlet 2131 and the air vents 2221, 222 2 are formed on the same surface.

[0043] As shown in FIG. 2, leg portions 2231 formed of rubber or the like are provided at both ends of the side surface portion 223. The leg portion 2231 formed on the side surface portion 223 and the leg portion 2141 formed on the side surface portion 214 of the upper housing 21 are arranged so as to abut on the installation surface. Placement is possible.

In addition, a substantially rectangular opening 2232 is formed at substantially the center of the side surface part 223, and an HDD (Hard Disk Drive) unit 38 (FIG. 14) to be described later is attached through the opening 2232. The opening 2232 is closed by a lid member 25 having a shape corresponding to the opening 2232.

Furthermore, a plurality of air inlets 2233 are formed below the opening 2232 along the longitudinal direction of the side surface portion 223. The intake port 2233 corresponds to the second introduction port of the present invention.

[0044] As shown in FIG. 2, the back surface 224 has openings 224;! To 2244 through which various terminals 59 (FIG. 16) provided on the control board 5 housed in the exterior housing 2 are exposed. The back portion 224 is formed along the longitudinal direction.

Specifically, in the openings 224 ;! to 2244, a terminal that can be connected to an HDMI (High-Definition Multimedia Interface) terminal 591, compliant with 802.3i, LAN (Local Area Network such as 10Base-T and 100Base-TX) ) Terminal 592 to which a cable can be connected, terminal 593 to which a B terminal conforming to the USB standard can be connected 593 (both in Fig. 16), and one terminal for video and two terminals for audio are provided on one end side Terminals (not shown) that can be connected to the other end of the coaxial cable are exposed.

[0045] Further, a power switch 2245 for turning on / off the main power supply is provided at the right end of the back surface portion 224, and an inlet connector 2247 to which a power cable (not shown) is connected is exposed below the power switch 2245. Opening 2246 is formed!

The device main body 3 in the outer casing 2 is cooled in an area other than the portion where the opening 224 in the side 224;! To 2244, 2246 and the power switch 2245 is provided. An exhaust port 2248 for discharging the cooling air to the outside is formed.

The back surface 224 is attached to a cooling unit 32 described later, and the back The air vent 2248 formed on the face 224 and the discharge port 328 (FIG. 18) of the cooling unit 32 are connected by a sponge 3281 provided around the discharge port 328. For this reason, the air discharged from the discharge port 328 is discharged outside the outer casing 2 without leakage.

FIG. 4 is a perspective view of the information processing apparatus 1 as viewed from below.

The bottom surface portion 225 of the lower housing 22 is a portion corresponding to the bottom surface of the rectangular parallelepiped portion on the opposite side to the upper housing 21 in the lower housing 22. As shown in FIG. 4, the bottom surface portion 225 is formed with a first step portion 2251 and a second step portion 2252 having two steps protruding downward.

Specifically, the first stepped portion 2251 is formed such that the front surface portion 221 and the side surface portion 222 side are shifted inward and the side surface portion 223 and the back surface portion 224 (FIG. 3) side are flush with each other at the bottom surface portion 225. Has been. Further, the second stepped portion 2252 is formed inside the first stepped portion 2251 so that the front surface portion 221 and the side surface portion 222 side are displaced inward, and the side surface portion 223 and the back surface portion 224 side are flush with each other. Among these, the opening 2211 and the intake port 2212 are formed on the front side of the first step portion 2251, and the exhaust port 2222 is formed on the side surface of the first step portion 2251. RU

[0047] At the four corners of the bottom surface of the second stepped portion 2252, a plurality of leg portions 225 21 formed of rubber are provided. By arranging the information processing apparatus 1 so that these leg portions 22521 are in contact with the installation surface, the information processing apparatus 1 can be placed horizontally.

In addition, the second stepped portion 2252 has an intake port 22522 similar to the intake port 2233 (FIG. 2) on the side close to the side surface portion 223, and a short side direction of the bottom surface portion 225 (a direction along the side surface portion 223). ). The intake port 22522 corresponds to a second introduction port of the present invention, and air is introduced into the exterior casing 2 by the intake port 22522 when the information processing apparatus 1 is in a vertically placed state.

FIG. 5 is a plan view showing the inner surface part 226 of the lower housing 22.

As described above, the inner surface 226 of the lower housing 2 'BR> Q is formed with the opening 22A for accommodating the device body 3, and the force of the lower housing 22 is omitted. A plurality of screw holes are formed along the outer periphery. Screws for fixing the apparatus main body 3 and the upper casing 21 to the lower casing 22 are screwed into these screw holes.

In addition, fitting holes 2261 and 2262 are formed at both ends of the lower housing 22 on the front part 221 side. Has been. In these fitting holes 2261 and 2262, pins 48 (48R and 48L) (FIG. 13) provided on a main frame 4 (to be described later) constituting the control unit 31 of the apparatus main body 3 are fitted. The control unit 31 is positioned in the housing 22.

[0049] Furthermore, a sponge 2263 is provided on the inner surface 226 on the side of the front surface 221 along the formation direction (longitudinal direction) of the front surface 221. More specifically, the sponge 2263 is disposed on the base end side of the extended portion of the front portion 221 in which the intake port 2213 is formed. This sponge 2263 comes into contact with the lower surface of the main frame 4 of the control unit 31 when a control unit 31 described later is housed in the lower housing 22. The sponge 2263 prevents the cooling air introduced from the outside of the outer casing 2 through the air inlet 2213 from directly flowing into the cooling unit 32 disposed below the control unit 31. It is out.

[0050] In addition, on the inner surface 226, on the back surface 224 side, at a position corresponding to the exhaust port 2248 formed in the back surface 224, along the formation direction (longitudinal direction) of the back surface 224, sponge is provided. 2264 is provided. The sponge 2264 is in contact with the periphery of a discharge port 328 (FIGS. 18 and 19) of the cooling unit 32, which will be described later, and increases the degree of adhesion between the discharge port 328 and the exhaust port 2248. For this reason, the cooling air discharged from the discharge port 328 is discharged out of the outer casing 2 from the exhaust port 2248 without leakage.

[0051] Further, in the inner surface portion 226, a region corresponding to the second stepped portion 2252 (FIG. 4) formed in the bottom surface portion 225 and in the vicinity of the side surface portion 222 has a discharge port 327 of the cooling unit 32 described later. A contact portion 2265 with which a sponge 3271 (FIG. 18) provided around is in contact is formed. When the sponge 3271 comes into contact with the contact portion 2265, the discharge port 2222 (FIG. 1) formed in the side surface portion 222 of the cooling air force discharged from the discharge port 327 of the cooling unit 32 is discharged without leaking.

FIG. 6 is an enlarged cross-sectional view of the side surface 222 side of the lower housing 22.

A portion of the contact portion 2265 on the side surface portion 222 side has a double structure, and a first bottom portion 2266 and a second bottom portion 2267 are formed.

The first bottom portion 2266 is a portion corresponding to a part of the inner surface of the bottom surface portion 225. The first bottom portion 2266 is formed so as to penetrate the above-described exhaust ports 2221 and 2222 (or the first bottom 2266).

The second bottom portion 2267 is spaced apart from the first bottom portion 2266 by a predetermined distance along the first bottom portion 2266. And provided inside the lower housing 22. One end of the second bottom portion 2267 is connected to the inner surface of the side surface portion 222. When the cooling unit 32 described later is stored in the lower housing 22, the other end is connected to the contact portion 2265. It extends up. A sponge 3271 (FIG. 19) provided around the exhaust port 327 of the cooling mute 32 is connected to the surface facing the contact portion 2265 at the other end. A discharge port 327 (FIG. 19) of the cooling unit 32 is placed between the contact portion 2265 and the second bottom portion 2267, and a part of the cooling air discharged from the discharge port 327 The first bottom portion 2266 and the second bottom portion 2267 are circulated. The cooling air flow path will be described in detail later.

[0053] (3) Configuration of device body 3

FIG. 7 is a perspective view of the information processing apparatus 1 with the upper housing 21 removed as viewed from the front side. FIG. 8 is an exploded perspective view showing the apparatus body 3.

The apparatus main body 3 is housed in the outer casing 2 as described above. As shown in FIGS. 7 and 8, the apparatus body 3 includes a control unit 31, a cooling unit 32 (FIG. 8), a disk unit 33, a power supply unit 34, a reader / writer unit 35, and a leaf spring 36 (FIG. 8). Configured. In the apparatus main body 3, the units 3;! To 35 and the leaf spring 36 are fixed to each other by screws or the like, and are combined together.

Here, in the apparatus main body 3, a subframe 6 described later of the control unit 31 will be described in detail later, but the first space S1 that is a space on the upper housing 21 side in the exterior housing 2 (FIG. 20). Also, it functions as a partition member that partitions the second space S2 (FIG. 23), which is the space on the lower housing 22 side. Therefore, the disk unit 33, the power supply unit 34, and the reader / writer unit 35 are disposed in the first space S1, and the control unit 31 and the cooling unit 32 are disposed in the second space S2.

[0054] Among these, the disk unit 33 reads information such as images, videos, and programs recorded on the above-described various optical disks inserted under the control of the control unit 31 to be described later. It outputs to the control board 5 which comprises 31. The disc unit 33 records the information as described above on the inserted optical disc.

Although not shown in detail, the disk unit 33 includes a unit main body 331 and a metal casing 332 that accommodates the unit main body 331 therein. This In other words, an opening 3321 through which an optical disk having a diameter of 12 cm is punched is formed on the front surface of the housing 332.

The power supply unit 34 is a power supply device that supplies drive power to the apparatus main body 3. Specifically, the power supply unit 34 includes a power supply circuit (not shown) and an aluminum casing 341 that accommodates the power supply circuit therein, and an inlet connector 2247 provided in the outer casing 2 (FIG. 2). The commercial alternating current input to is converted into a direct current, and the voltage is increased and decreased to a voltage corresponding to each electronic component constituting the apparatus body 3 to be supplied to each electronic component. The power supply circuit of the power supply unit 34 is connected to a power supply pin 571 (FIG. 15) provided on a control board 5 (to be described later) constituting the control unit 31, and drive power is supplied to each electronic component via the control board 5. Supply. This power supply unit 34 blows cooling air by driving a cooling unit 32 to be described later, and is set as a cooling target of the present invention.

[0056] The reader / writer unit 35 receives information on various memory cards inserted through the respective openings 21131 formed in the card slot portion 2113 of the upper casing 21 under the control of the control board 5 described later. Is read and stored. The reader / writer unit 35 includes a reader / writer 351 from which a memory card is punched and a substrate 352 that controls the operation of the reader / writer 351. Among these, the substrate 352 receives a control signal from the control substrate 5 and causes the reader / writer 351 to execute an operation corresponding to the control signal. Such a reader / writer unit 35 is supported and fixed on a subframe 6 constituting a control unit 31 described later.

[0057] (4) Configuration of control unit 31

9 and 10 are perspective views of the control unit 31 as viewed from above and below. FIG. 11 is an exploded perspective view showing the control unit 31 and the cooling unit 32.

The control unit 31 is a unit that controls the driving of the apparatus main body 3 and eventually the information processing apparatus 1. As shown in FIGS. 9 to 11, the control unit 31 includes a main frame 4, a control board 5, and a subframe 6. The control board 5 and the subframe 6 are composed of the main frame. Positioned with respect to 4. The control unit 31 is combined with the cooling unit 32 by a plate spring 36 and a screw 37 (FIG. 11) to constitute a single unit. [4-1] Main frame 4 configuration

12 and 13 are perspective views of the main frame 4 as viewed from above and below.

The main frame 4 is a frame member that sandwiches the control board 5 together with a sub-frame 6 described later and is connected to a cooling unit 32 described later. The main frame 4 is formed in a flat plate shape having a substantially rectangular shape in plan view, and is formed of a metal such as aluminum in consideration of heat dissipation and electromagnetic interference (EMI). Further, as shown in FIG. 12, a recess 40 is formed in the center of the main frame 4 so as to be recessed on the lower surface side, that is, on the side opposite to the side facing the control board 5. The control board 5 is accommodated in a space formed by the recess 40 and a recess 60 of the subframe 6 described later, and the main frame 4 is arranged on the control board 5 attached to the main frame 4. The tip is formed so as not to be pressed. Further, the main frame 4 is formed with a plurality of substantially circular holes. The holes reduce the weight of the main frame 4 and are controlled by the main frame 4 and the subframe 6. Vent cooling air through 5.

[0059] Four pin rod inlets 401 are formed in the region where the recess 40 is formed. The positioning pins 329 formed in the cooling unit 32 pass through the pin insertion ports 401 when the main frame 4 is positioned on the cooling unit 32 described later.

At substantially the center of the main frame 4, openings 41 (left side in FIG. 12) and 42 (right side in FIG. 12) having a substantially rectangular shape in plan view are formed in parallel. In these openings 41 and 42, a CPU (Central Processing Unit) 51 and a GPU (Graphics Processing Unit) 52 disposed on a control board 5 described later are exposed. Extending portions 411 and 421 extending downward are formed on two opposite sides of the openings 41 and 42, and the extending portions 411 and 421 are exposed from the openings 41 and 42, respectively. A sandwiching piece 4A is provided for sandwiching a heat receiving block 325, which will be described later, of the cooling unit 32 that contacts the CPU 51 and the GPU 52.

In the vicinity of the openings 41, 42 of the main frame 4, two double hole portions 412, 422 forces S are formed, respectively. Specifically, each of these two holes 412 and 422 is formed on one diagonal line of the substantially rectangular openings 41 and 42. Screws 37 (FIG. 11) for attaching the cooling unit 32 to the control unit 31 are passed through these holes 412, 422.

Further, on the front side of the main frame 4 (front side in FIGS. 12 and 13), a substantially rectangular shape Two openings 43 are formed in parallel. The two terminal connection parts 53 (FIG. 16) provided in the control board 5 pass through these openings 43.

[0061] On the back side of the main frame 4 (upper side in Fig. 12), side surface portions 44 and 45 are formed to stand up from the edge of the main frame 4 in a substantially L-shaped cross section.

Among these, the side surface portion 44 formed on the left side in FIG. 12 has four openings 44;! To 444 having different dimensions, and elongated and substantially rectangular openings 445 to 4 above the openings 441, 443, and 444. 47, and an opening 451 similar to the openings 445 to 447 is formed in the side surface portion 45 formed on the right side in FIG. Terminals 59 (FIG. 16) provided in the control board 5 and exposed from the openings 224;! To 2244 formed in the lower housing 22 pass through these openings 441. In addition, the openings 445 to 447 and 451 engage with standing portions 65 formed on the subframe 6 described later, whereby the subframe 6 is attached to the main frame 4.

Yes

[0062] As shown in FIG. 12, at the both ends in the longitudinal direction on the front side of the upper surface of the main frame 4, pins 46 (the right side pin of the main frame 4 is 46R and the left side pin is 46L) is provided. These pins 46 position the control board 5 and the subframe 6 on the main frame 4 when they are placed.

[0063] Further, at the approximate center of the edge along the short direction on the upper surface of the main frame 4, an upright portion 47 having a substantially L-shaped cross-section standing from the end edge (the right-side standing portion of the main frame 4 is 47 R, and the left standing part is 47 L). Among these, the standing portion 47 L is formed at the edge of the notch 47 A that is recessed toward the center of the main frame 4. When the control board 5 is positioned on the main frame 4, the standing parts 47R and 47L guide the positioning so as to sandwich the substantial center of the edge along the short direction of the control board 5.

In addition, the notch 47A in which the upright portion 47L is formed and the notch 47B formed on the back side (the upper side in FIG. 12) of the notch 47A provide a space between the lower housing 22 and the main frame 4. A gap is formed, and the gap introduces air force S introduced from the inlet 2131 (FIG. 1) and circulated in the upper casing 21, and flows to the lower casing 22 side. Such air flow paths will be described in detail later. [0064] As shown in FIG. 13, a pin 48 that protrudes in the out-of-plane direction (the right pin of the main frame 4 is 48R and the left pin is located at the position corresponding to the pin 46 on the lower surface of the main frame 4). Is 48L). These pins 48R and 48L are fitted into fitting holes 2261 and 2262 (FIG. 5) formed in the lower housing 22 to position the main frame 4 on the lower housing 22.

Further, on the lower left side of the main frame 4 (right side in FIG. 13), an HDD mounting portion 49 to which the HDD unit 38 (FIG. 14) is mounted is provided. Specifically, the position of the HDD mounting portion 49 is in the vicinity of the notches 47A and 47B, and is arranged along the edge of the main frame 4 in which the notches 47A and 47B are formed. The HDD mounting portion 49 has a substantially rectangular parallelepiped shape as a whole, and a plurality of holes for introducing cooling air are formed on the surface. In addition, a substantially rectangular opening 4911 is formed on the left side of this HD D mounting portion 49 (the side facing the side surface portion 223 (FIG. 3) of the lower housing 22 and the right side in FIG. 13). The HDD unit 38 is housed in the HDD mounting portion 49 through the opening 4911 and the opening 2232 formed in the side surface portion 223 of the lower housing 22.

FIG. 14 is a perspective view showing the HDD unit 38.

The HDD unit 38 reads and stores information under the control of the control board 5. The HDD unit 38 is inserted into the HDD mounting portion 49, and slides in a direction perpendicular to the insertion direction, so that the connector 58 (at the end of the HDD mounting portion 49 on the sliding direction side) ( Connected to Fig. 16). That is, the HDD unit 38 is positioned in the vicinity of the notches 47A and 47B formed in the main frame 4 when housed in the HDD mounting portion 49.

The HDD unit 38 includes an HDD 381 as a storage medium and a support member 382 that supports the HDD 381.

Of these, the HDD 381 is a 2.5-inch HDD in this embodiment, and a terminal connected to a connection portion 581 of a connector 58 provided on the control board 5 described later is provided at one end. It has been.

[0068] The support member 382 is the longitudinal direction of the HDD 381, and the HDD mounting portion 4 of the HDD unit 38.

9 side surfaces 3821, 3823 covering both side surfaces along the sliding direction in 9 and the side surface 3821 And a bottom surface portion 3822 that supports the bottom portion of the HDD 381. For this reason, the support member 382 is formed in a substantially U shape in a side view opened upward.

Among these, a screw 384 for fixing the HDD 381 is attached to the side surface 3821 formed on the front side in FIG. 14, and a handle 385 is provided at the approximate center.

The bottom surface 3822 has notches 38223 and 38224 formed in the direction of the movement of the HDD panel 38 at the end on the side where the terminal 3811 of the HDD 381 is provided, and the notches 38223 and 38224 The HDD 381 is positioned with respect to the connector 58 by fitting into a protrusion (not shown) formed in the portion 49.

Such an HDD unit 38 corresponds to another cooling object of the present invention, and air circulated in the 1S upper casing 21 described later in detail is blown and cooled.

(4-2) Configuration of control board 5

15 and 16 are perspective views of the control board 5 as viewed from above and below.

The control board 5 includes integrated circuits CPU51 (right side in FIG. 16) and GPU52 (left side in FIG. 16), as well as power RAM (Random Access Memory), ROM (Read Only Memory), and chip not shown in detail. It is configured as a circuit board on which various IC (Integrated Circuit) chips such as sets are mounted. Such a control board 5 controls the apparatus main body 3 and thus the information processing apparatus 1 as a whole. For example, the control board 5 simply performs a drawing process, an arithmetic process, and the like. The rotation speed of the motor that composes (Fig. 18) is controlled.

Specifically, the CPU 51 of the control board 5 obtains the temperature of each heating element from temperature sensors attached to various IC chips such as the CPU 51 and the GPU 52, respectively. Then, the CPU 51 obtains the rotational speed corresponding to the temperature of each IC chip for each IC chip from the LUT (Look Up Table) force stored in the ROM, and the highest rotational speed among the respective rotational speeds. The motor of the blower 321 is driven at a speed. As a result, the cooling unit 32 is driven in accordance with the driving state of the information processing apparatus 1, and the air flow rate in the exterior casing 2 is controlled. The temperature sensor may be provided in a heating element such as the power supply unit 34.

Such control board 5 is mounted with various IC chips including CPU51 and GPU52. In other words, the lower surface on which the casing of each IC chip is placed faces the main frame 4 and the upper surface where the terminals of resistors and other elements are exposed faces the sub frame 6. Placed.

[0070] On the front side of the control board 5 (front side in FIGS. 15 and 16), as shown in FIGS. 15 and 16, a terminal connection portion 53 provided with two USB terminals 531 is arranged in parallel. Two are set up like this. Each USB terminal 531 of the terminal connection portion 53 is exposed from the opening 2211 of the lower housing 22 through the opening 43 of the main frame 4.

Four holes 54 through which screws 37 (FIG. 11) for fixing the control unit 31 and a cooling unit 32 to be described later pass are formed in the approximate center of the control board 5.

Further, at both longitudinal ends of the front side of the control board 5, holes 46 through which the pins 46R and 46L formed on the main frame 4 pass respectively (the right side hole on the control board 5 is 55R, Each hole is made 55!).

[0071] Furthermore, a cutting center that is immersive toward the center at the substantially center of the edge along the short direction of the control board 5, that is, at a position corresponding to the standing portion 47 of the main frame 4 on the control board 5. A notch 56 (the right notch on the control board 5 is 56R and the left notch is 56L) is formed.

Similarly, on the back side of the notch 56L, a notch 56B is formed in which the end edge of the control board 5 is directed to the center, and thus is recessed. These notches 56L and 56B are positions corresponding to the notches 47A and 47B formed in the main frame 4 described above, and the control unit 31 is placed in the lower housing 22 by the notches 56B and 56L. When housed, a clearance force S is generated between the control board 5 and the lower housing 22. Through this gap, the air that has circulated in the upper housing 21 circulates in the lower housing 22. Such an air flow path will be described in detail later.

Further, a power connection terminal 57 connected to the power unit 34 is fitted in the opening 50 on the upper surface of the control board 5 (surface facing the subframe 6). The power connection terminal 57 includes a pair of power supply pins 571 (FIG. 15) inserted into the power supply unit 34 and a housing 572 (FIGS. 15 and 16) in which the power supply pins 571 are housed. The power connection terminal 57 is connected to the control board 5 so that the power pins 571 protrude from the upper surface side of the control board 5. It is attached from the lower surface side.

[0073] On the lower surface side of the control board 5 (the side facing the main frame 4), as shown in FIG. 16, the connector 58 to which the HD D unit 38 (FIG. 14) is connected, and the side surface of the main frame 4 Opening 44 formed in the portion 44;! To 444 and an opening 224 formed in the rear portion 224 of the lower housing 22; various terminals 59 (59;! To 593) exposed from the opening 2244 (exposed to the opening 2244) The terminal is provided with V, etc. (not shown)!

Of these, the connector 58 includes a support portion 582 having a substantially L shape in side view and a connection in a substantially inverted L shape in side view supported by the support portion 582 so that one end protrudes along the lower surface of the control board 5. Part 581 is combined. Among these, the connection unit 581 is connected to the terminal 3811 of the HDD unit 38 described above.

[0074] (4-3) Configuration of subframe 6

FIG. 17 is a perspective view of the subframe 6 as viewed from above.

The sub frame 6 is a frame member that supports the control board 5 together with the main frame 4 and supports the disk unit 33, the power supply unit 34, and the reader / writer unit 35 described above. Further, as described above, the subframe 6 serves as a partition member that partitions the first space S1 on the upper housing 21 side and the second space S2 on the lower housing 22 side in the space in the exterior housing 2. It has the function of Similar to the main frame 4, the subframe 6 is made of metal such as aluminum in consideration of heat dissipation and electromagnetic interference. As shown in FIG. 17, the subframe 6 is formed in a flat plate shape having a substantially rectangular shape in plan view, and a concave portion 60 that is recessed on the side opposite to the side facing the control board 5 is formed in a substantially central portion. Is formed. As described above, the control board 5 is accommodated in the space formed by the recess 60 and the recess 40 of the main frame 4.

[0075] In the approximate center of the subframe 6, openings 6 1 (left side in Fig. 17) and 62 (right side in Fig. 17) corresponding to the leaf spring 36 (Fig. 11) are formed. . The positions where the openings 61 and 62 are formed correspond to the CPU 51 and the GPU 52 when the control board 5 is sandwiched between the subframe 6 and the main frame 4. Inside these openings 61 and 62, plate-like bodies 63 and 64 each having a substantially square shape in plan view corresponding to the dimensions of the CPU 51 and the GPU 52 are provided. These plate-like bodies 63 and 64 are interposed between the control board 5 and the leaf spring 36. As shown in FIG. 17, a plurality of upright portions 65 that rise upward are formed at the rear edge of the subframe 6. These standing portions 65 are the openings 445 to 447, 451 formed on the side surfaces 4 4, 45ί of the main frame 4 (Fig. 12). It is attached.

At the longitudinal ends of the front side of the subframe 6, there is a hole 66 through which the pin 46 (Fig. 12) provided on the main frame 4 passes (the right hole of the subframe 6 is 66R, the left hole The part is 66L)!

[0077] Further, at the substantially center of the edge along the short direction of the subframe 6, there is a notch 67 (notch on the right side of the subframe 6) similar to the notch 56 (Fig. 15) formed on the control board 5. Is 67R, and the left notch is 67L). These notches 67 are fitted with standing portions 47 formed on the main frame 4 when positioning the subframe 6 on the main frame 4. Thereby, the positioning of the sub-frame 6 with respect to the main frame 4 is guided.

A similar notch 67 Β is formed on the back side of the notch 67L. These notches 67L and 67Β are positions corresponding to the notches 47Α and 47Β formed in the main frame 4 described above, and these notches 67L and 67Β are located when the control unit 31 is stored in the lower housing 22. In addition, a gap is formed between the lower casing 22 and the lower casing 22. Through this gap, the air flowing through the upper casing 21 side flows into the lower casing 22 side. Such an air flow path will be described in detail later.

[0078] Further, a position near the center of the subframe 6 from the position where the notch 67L is formed is a substantially rectangular shape through which the power supply pin 571 (FIG. 15) of the power supply connection terminal 57 provided on the control board 5 passes. An opening 601 is formed.

Further, a pedestal member 68 for supporting and fixing the reader / writer unit 35 (FIG. 7) is provided on the front left side of the upper surface of the subframe 6.

In addition, a support portion 69 that supports the power supply unit 34 is provided on the left side of the back surface of the upper surface of the subframe 6 along the edge of the back surface. When the power supply unit 34 is supported by the support portion 69, the power supply unit 34 is disposed in the vicinity of the notches 67L and 67Β formed in the subframe 6.

[0079] Further, a plurality of sponges 7;! To 73 are provided on the upper surface of the subframe 6. Specifically, the sponge 71 is attached to the back side in the area where the disk unit 33 is placed, and the sponge 72 is attached to the approximate center of the area. Further, the sponge 73 is attached obliquely from the center of the back side of the subframe 6 toward the center of the side where the notch 67L is formed. Among these, the sponge 72 presses a flexible substrate (not shown) attached to the lower surface of the disk unit 33 against the disk unit 33 side.

Sponges 71 and 72 are members that fill the gaps between the subframe 6 and the housings 332 and 341 of the disk unit 33 and the power supply unit 34. The sponges 71 and 72 are introduced from the air inlet 2131, and the subframe 6 This is a member for preventing the aerodynamic force flowing between the disk unit 33 and the power supply unit 34 from flowing to the back side.

Of these, the sponge 72 is provided obliquely on the subframe 6, so that the air flowing between the subframe 6 and the power supply unit 34 is the upper casing 21 in which the air inlet 2131 is formed. From the side surface 213 side (right side in FIG. 17) to the side surface portion 214 side (left side in FIG. 17) opposite to the side surface portion 213, the front portion 211 side (front side in FIG. 17) The flow path is changed. As a result, air is introduced into the casing 341 through a hole (not shown) formed on the front portion 211 side of the casing 341 of the power supply unit 34, and air is supplied to the power circuit in the casing 341. Are gathered and blown. Such an air flow path will be described in detail later.

[0081] (5) Configuration of cooling unit 32

FIG. 18 is a perspective view of the cooling unit 32 combined with the control unit 31 as viewed from below. FIG. 19 is a perspective view of the cooling unit 32 as viewed from above.

As described above, the cooling unit 32 is integrated with the control unit 31 by the leaf spring 36, and cools the CPU 51 and the GPU 52 of the control board 5 constituting the control unit 31, and also supplies cooling air from the outside of the outer casing 2. It is a cooling means for cooling the power supply unit 34 and the like located on the flow path of the cooling air during the introduction process. As shown in FIG. 18, the cooling unit 32 is arranged so that a part thereof covers the HDD mounting portion 49 of the main frame 4.

The cooling unit 32 includes blade members 3211 formed radially on the rotation shaft, and a blower 321 including a motor (not shown) that rotates the rotation shaft and the blade members 3211. And a housing 322 for storing them inside.

Among these, the driving of the blower 321 is controlled by the control board 5 as described above. The housing 322 is formed in a substantially rectangular parallelepiped shape as a whole, and is formed of a metal such as aluminum in order to improve heat dissipation and strength. A lower surface portion 323 of the housing 322, that is, a lower surface portion 323 facing the lower housing 22, is formed with an inlet 3231 force S having a substantially circular shape in plan view, as shown in FIG.

As shown in FIG. 19, the upper surface portion 324 of the cooling unit 32, that is, the upper surface portion 324 opposed to the control unit 31 is formed by two plate members 3241 and 3242. An air inlet 3244 having a substantially circular shape in a plan view is formed at a substantially center of the upper surface 324 so as to straddle the two plate members 3241 and 3242.

[0084] Inside the housing 322, there are provided heat radiating fins 3245, 3246, which are connected to the plate members 3241 and 3242, respectively, and serve as heat radiating portions for radiating the heat conducted to the plate members 324 1 and 3242. Yes. More specifically, the radiating fin 3246 is connected to the plate member 3241, and the radiating fin 3245 is connected to the plate member 3242. These heat radiation fins 3245 and 3246 are formed of a plurality of metal thin plates and have a hierarchical structure connected to each other. Then, the air sucked into the housing 322 is blown to the heat radiating fins 3245 and 3246 by the rotation of the ridge material 3211, and the heat radiating fins 3245 and 3246 are cooled. Further, at this time, the cooling air flows between the thin plates by the heat radiation fins 3245 and 3246, so that the cooling air can be rectified. These radiating fins 3245 and radiating fins 3246 are separated from each other and are provided to be thermally independent.

Further, the upper surface portion 324 is provided with a heat receiving block 325 (325C, 325G) force S as two contact portions. The CPU 51 and GPU 52 are in contact with the heat receiving blocks 325C (left side in FIG. 19) and 325G (right side in FIG. 19) through the openings 41 and 42 of the main frame 4, and heat generated by the CPU 51 and GPU 52 is generated. Is conducted. Screw holes 32521 are formed at both ends of each heat receiving block 325. The screw holes 32521 have leaf springs 36, openings 61 and 62 in the subframe 6, holes 54 in the control board 5 (FIG. 15). And Fig. 16) and screw 37 (Fig. 11) passing through holes 412, 422 (Fig. 12 and Fig. 13) of main frame 4 are screwed together. [0086] Each of the heat receiving blocks 325 is provided with a plurality of heat pipes 326 (326C, 326G) passing therethrough.

Among these, the three heat pipes 326C connect the heat receiving block 325C and the plate member 3241, and conduct the heat of the CPU 51 to the plate member 3241. Further, the two heat pipes 326G connect the heat receiving / lock 325G and the board 3242, and conduct the heat of the GPU 52 to the board 3242.

Then, the heat of the GPU 52 and the CPU 51 conducted to the plate members 3241 and 3242 is conducted to the heat radiating fins 3246 and 3245, and the heat is cooled by the air blown by the driving of the blower 321.

[0087] Of the four side surfaces excluding the lower surface portion 323 and the upper surface portion 324 of the housing 322, two adjacent side surfaces receive air taken into the housing 322 as shown in FIGS. Discharge to be discharged P 327, 328 are formed.

Discharge port 327 (While the bottom of the lower case 22 is facing the formed air vent 2221, 2222 (01), the heat dissipation of the GPU52 is conducted through the exhaust ports 2221, 2222) The air that has cooled the fin 3 245 is discharged, and on the lower surface and side surface of the housing 322 that forms the discharge port 327, there are contact portions 2265 (FIG. 5) formed on the inner surface portion 226 of the lower housing 22 and Sponge 3271 force S to be in contact with the second bottom 2267. This sponge 3271 applies to the connection of the present invention] and connects the discharge port 327 and the vent 2222 and [3] The lower surface of the second bottom portion 2267 provided in the lightning body 22 is connected to the discharge port 327. Therefore, a part of the cooling air discharged from the discharge port 327 is discharged from the exhaust port 2222 or The other part flows through the space between the first bottom portion 2266 and the second bottom portion 2267, and the exhaust port 2221 is discharged without leakage.

[0088] The discharge port 328 is connected to the exhaust port 2248 (Fig. 2) formed in the back surface part 224 of the lower housing 22 attached to the cooling unit 32 as described above, and through the exhaust port 2248, G The air that has cooled the heat dissipating fins 3246 through which the heat of the PU 51 is conducted is exhausted. A sponge 3281 is provided around the discharge port 328, and the discharge port 328 and the air vent 2248 are provided by the sponge 3281 and the sponge 2264 (FIG. 5) provided on the inner surface 226 of the lower housing 22. (Figure 3) is connected. Thereby, the cooling air discharged from the discharge port 328 is The exhaust port 2248 can be discharged out of the outer casing 2 without leakage.

In addition, the upper surface portion 324 includes a positioning pin 32 protruding from the upper surface portion 324 in the out-of-plane direction.

There are a total of four nine. The positioning of the main frame 4 with respect to the cooling unit 32 is performed by passing the positioning pins 329 through the pin inlets 401 formed in the main frame 4.

[0090] (6) Cooling air flow path

Hereinafter, the flow paths of the cooling air A to J generated by driving the cooling unit 32 will be described. FIG. 20 is a diagram illustrating the flow paths of the cooling air flowing through the upper housing 21.

When the cooling unit 32 is driven, air outside the outer casing 2 is introduced into the upper casing 21 from the air inlet 2131 formed in the side surface 213 of the upper casing 21, as shown in FIG.

Yes

More specifically, when the cooling unit 32 is driven, the lower casing in the cooling unit 32 is driven.

As shown in FIG. 20, the side surface portion 21 3 of the upper casing 21 becomes a pressure close to the suction port 3231 of the lower surface portion 323 facing 22 and the suction port 3244 of the upper surface portion 324 facing the control unit 31. Air inlet A outside the outer housing 2 from the air inlet 2131 formed as the first inlet, and air B outside the outer housing 2 from the air inlet 2213 formed in the front portion 221 of the lower housing 22. Each is introduced into the first space S1 in the upper casing 21. The first space S1 is a space on the upper housing 21 side that is partitioned by the subframe 6 that constitutes the control unit 31 in the internal space of the exterior housing 2. In the following description, the second space S2 indicates a space on the lower housing 22 side similarly partitioned by the subframe 6.

FIG. 21 is a schematic diagram showing the flow paths of air Al and B1 that flow between the disk unit 33 and the power supply unit 34 and the subframe 6.

The cooling air A and B introduced into the first space S1 through the intake ports 2131 and 2213 flows between the disk unit 33 and the subframe 6 at the end of the disk unit 33 on the intake port 2131 side. The air is divided into air Al and B1, and air A2 and B2 flowing between the disk unit 33 and the inner surface 215 of the upper housing 21.

Of these, cooling air A1 and cooling air introduced from the disk unit 33 side of the intake port 2213 As shown in FIG. 21, the air Bl cools below the disk unit 33 and merges between the disk unit 33 and the subframe 6 to become cooling air C1 and moves below the power supply unit 34. And circulate.

At this time, the sub-frame 6 is provided with a sponge 71 that abuts the region on the back side of the disk unit 33 and seals the gap between the sub-frame 6 and the disk unit 33. Therefore, the cooling air A1 flowing under the disk unit 33 is prevented from flowing to the back side of the disk unit 33 and flowing through the back side of the upper housing 21.

Furthermore, the inner surface 226 of the lower housing 22 is provided with a sponge 2263 that contacts the front side of the lower surface of the main frame 4 and seals the gap between the main frame 4 and the lower housing 22. . For this reason, the cooling air B (B1, B2) introduced through the intake port 2213 does not flow below the main frame 4, but flows into the first space S1 on the upper housing 21 side.

On the other hand, the cooling air B 1 introduced from the reader / writer unit 35 side of the intake port 2213 flows along the reader / writer unit 35 and cools the substrate 352. Thereafter, the cooling air B1 flows between the power supply unit 34 and the subframe 6 and merges with the cooling air C1 to become the cooling air C2.

This cooling air C2 is a force that circulates below the power supply unit 34. Since a sponge 73 is provided between the power supply unit 34 and the subframe 6 to seal the gap formed by them. 73, the flow path of the cooling air C2 is changed upward. Therefore, the cooling air C2 flows into the casing 341 through a hole (not shown) formed in the casing 341 (FIG. 7) of the power supply unit 34, and the power supply board provided in the casing 341. Cool down.

[0095] After that, the cooling air C2 flows from the casing 341 of the power supply unit 34 to the side surface 214 side, merges with the cooling air D2 (Fig. 22) described later, and then the cooling air E (Figs. 23 and 24). ). Then, this cooling air E is divided into the notches 67L and 67B (Fig. 17) of the subframe 6, the notches 56L and 56B (Fig. 15) of the control board 5, and the notches 47A and 47B (Fig. 12) of the main frame. It flows into the second space S2 on the lower housing 22 side through the gap S3 with the lower housing 22.

FIG. 22 is a schematic diagram showing the flow paths of air A 2 and B 2 flowing between the disk unit 33 and the power supply unit 34 and the upper housing 21. As shown in FIG. 22, the cooling air A2 introduced from the air inlet 2131 passes between the disk unit 33 and the inner surface 215 (FIG. 3) of the upper housing 21 along the housing 332 of the disk unit 33. Circulate. Similarly, the cooling air B2 introduced from the air inlet 2213 flows between the disk unit 33 and the inner surface 215 of the upper housing 21. These cooling airs A2 and B2 merge while cooling the disk unit 33 to become cooling air D1, and the cooling air D1 flows to the power supply unit 34 side.

At this time, as shown in FIG. 3 and FIG. 22, the inner surface 215 is in contact with the disk unit 33 and the power supply unit 34 and seals the gap between each unit 34 and the upper housing 21 with a sponge 2 155- 2157 is provided. Of these, the sponge 2155 in contact with the back side portion of the disk unit 33 prevents the cooling air A2 and B2 from flowing to the back side of the upper casing 21.

[0097] Further, provided along the short direction of the upper casing 21, and in contact with the edge on the disk unit 33 side on the upper surface of the casing 34 1 of the power supply unit 34, the casing 341 and the upper casing The sponge 2156 that seals the gap with the body 21 prevents the cooling air D1 from flowing between the casing 341 and the upper casing 21. Further, as described above, the sponge 2155 prevents the cooling air D1 from flowing to the back side. For this reason, the cooling air D1 combined with the cooling air A2 and B2 flows into the housing 341 of the power supply unit 34 when flowing from the disk unit 33 to the power supply unit 34 side, and enters the housing 341. Cool the power circuit.

[0098] Further, the cooling air B2 introduced from the reader / writer unit 35 side of the intake port 2213 circulates along the reader / writer 351 of the reader / writer unit 35, and the casing 341 of the power supply unit 34 and the upper casing It circulates between the inner surface part 215 of the body 21.

Here, the clearance between the casing 341 and the upper casing 21 is provided on the inner surface 215 of the upper casing 21 and in contact with the front edge of the upper surface of the casing 341 of the power supply unit 34. Due to the sealing sponge 2157, the cooling air B2 cannot flow along the upper surface of the casing 341 to the back side. For this reason, the cooling air B2 flows into the casing 341 through a hole formed in the casing 341, and cools the power supply circuit.

[0099] Thereafter, the cooling air D1 and the cooling air B2 merge to become the cooling air D2, and flow to the side surface portion 214 side of the housing 341. The cooling air D2 is the above-described cooling air in the housing 341. Combined with C2, it becomes cooling air E (Fig. 23), subframe 6 cutouts 67L and 67B (Fig.17), control board 5 cutouts 56L and 56B (Fig.15), and mainframe cutouts 47A and 47B (Fig. 12) flows into the second space S2 on the lower housing 22 side through a gap S3 between the lower housing 22 and the lower housing 22.

FIG. 23 and FIG. 24 are diagrams showing the flow path of the cooling air flowing into the lower housing 22 side. Specifically, FIG. 23 is a diagram showing the flow path of cooling air when the information processing apparatus 1 is placed horizontally, and FIG. 24 is the flow of cooling air when the information processing apparatus 1 is installed vertically. It is a figure showing a road.

As described above, the cooling air E is divided into notches 67L (Fig. 17), 56L (Fig. 15), 47A (Fig. 12), and notches 67B (Fig. 17), 56B (Fig. 15), 47B (Fig. 12). It flows into the second space S2 on the lower housing 22 side through the gap S3 with the lower housing 22. At this time, when the information processing apparatus 1 is in a horizontal state, that is, in a horizontal state in which the legs 22521 (FIG. 4) provided on the bottom surface part 225 of the lower housing 22 are in contact with the installation surface. In this case, since the side surface portion 223 of the lower housing 22 does not face the installation surface, as shown in FIG. 23, the air intake port 2233 as the second introduction port formed in the side surface portion 223 (FIG. 2) From the outside, the intake air outside the outer casing 2 is introduced into the lower casing 22. The cooling air F (F1) introduced into the lower housing 22 through the intake port 2233 merges with the cooling air E. Then, the air is located in the second space S2 on the lower housing 22 side partitioned by the subframe 6 constituting the control unit 31, and the HDD mounted on the lower surface side of the main frame 4 is installed. It circulates in part 49.

[0101] On the other hand, when the information processing apparatus 1 is in the vertical state, that is, the side surface of the upper casing 21

When the leg portion 2141 formed on 213 and the leg portion 223 1 formed on the side surface portion 223 of the lower housing 22 are in a vertically placed state in contact with the installation surface, formed on the side surface portion 223. The air inlet 2233 is blocked by the installation surface. In such a case, as shown in FIG. 24, through the inlet 22522 (FIG. 4) as the second inlet formed on the side of the bottom surface 225 of the lower housing 22 on the side close to the side surface 223, Air outside the outer casing 2 is introduced into the lower casing 22. The cooling air F (F2) introduced through the intake port 22522 merges with the cooling air E that has circulated through the first space S1 in the upper casing 21 as in the case of the cooling air F1 described above. It becomes cooling air H (HI, H2) (FIGS. 25 and 26) and circulates in the HDD mounting portion 49 of the main frame 4. [0102] In this way, the cooling air H flowing along the HDD mounting portion 49 is newly introduced into the cooling air E that has cooled the power supply unit 34 from the outside of the outer casing 2 as a second inlet. The cooling air F introduced through the inlet 2233 or the inlet 22522 and having a temperature lower than that of the cooling air E is combined. As a result, the temperature of the air that cools the HDD unit 38 housed in the HDD mounting portion 49 can be lowered, and the force S that cools the HDD unit 38 efficiently can be reduced.

Further, as shown in FIGS. 23 and 24, the second space S2 on the lower housing 22 side has an intake port 2212 as a third introduction port formed in the front portion 221 of the lower housing 22 (FIG. 1). ), Air G outside the outer casing 2 is newly introduced.

FIG. 25 is a schematic view showing a flow path of the cooling air HI flowing between the main frame 4 and the cooling unit 32, and is a schematic view of the lower housing 22 and the cooling unit 32 as viewed from above. . As described above, the cooling air H flows along the HDD mounting portion 49 and is sucked by the cooling unit 32. This cooling air H is divided into a cooling air HI that flows through the main frame 4 side of the HDD mounting portion 49 and a cooling air H2 that flows through the lower housing 22 side of the HDD mounting portion 49.

[0104] Among them, as shown in Fig. 25, the cooling air HI is generated by the upper surface of the HDD 381 (Fig. 14) of the HDD unit 38 mounted in the HDD mounting portion 49 and the upper surface of the HDD mounting portion 49 (main frame 4). ) And between the HDD mounting portion 49 and the lower surface of the main frame 4 to cool the HDD unit 38. The branched air HI merges on the upper surface 324 of the cooling unit 32 and becomes cooling air H3. The cooling air H3 is sucked by the intake port 3244 formed in the upper surface portion 324, and the cooling air H3 flows into the housing 322 of the cooling unit 32. In this process, the cooling air H3 cools the heat receiving blocks 325C and 325G (FIG. 19) provided on the upper surface portion 324.

FIG. 26 is a schematic view showing a flow path of the cooling air H2 flowing between the cooling unit 32 and the lower housing 22, and a schematic view of the cooling unit 32 and the lower housing 22 as viewed from below. It is. In addition, as shown in FIG. 26, the cooling air H2 is provided between the bottom surface of the HDD 381 of the HDD unit 38 (FIG. 14) and the bottom surface of the HDD mounting portion 49 (surface on the lower housing 22 side), and the HDD mounting portion. 49 and the lower housing 22 are circulated to cool the HDD unit 38. These branched air H2 Are combined on the lower surface portion 323 of the cooling unit 32 to become cooling air H4. The cooling air H4 is sucked into the air inlet 3231 formed in the lower surface portion 323 and flows into the housing 322 of the cooling unit 32.

[0106] Further, the cooling air G introduced into the lower housing 22 through the intake port 2212 as the third introduction port is disposed on the front surface 221 side of the inner surface 226 of the lower housing 22 described above. The sponge 2263 (FIG. 5) restricts the flow to the first space S 1 on the upper housing 21 side, and flows in the second space S2 of the lower housing 22. Then, this cooling air G hits the housing 322 of the cooling unit 32, and the cooling air G1, which flows between the upper surface portion 324 of the housing 322 and the lower surface of the main frame 4, the lower surface portion 323, and the lower housing It is divided into cooling air G2 that circulates between the inner surface portion 226 of 22.

Of these, as shown in FIG. 25, the cooling air G1 flows along the upper surface portion 324 and is sucked by the air inlet 3244 formed in the upper surface portion 324. Further, as shown in FIG. 26, the cooling air G2 flows along the lower surface portion 323, and is sucked by the intake port 3231 formed in the lower surface portion 323.

As a result, the cooling air G newly introduced through the air inlet 2212 serving as the third inlet is added to the air flowing into the housing 322 of the cooling unit 32. The temperature of the sky can be lowered.

FIG. 27 is a view showing a flow path of cooling air discharged by the cooling unit 32.

The cooling air in the housing 322 of the cooling unit 32 where the cooling air G and H merged is divided into cooling airs Ul and J2, as shown in FIG. 27, and the cooling air Jl and J2 are formed in the cooling unit 32. Are discharged from the discharged outlets 327 and 328, respectively. At this time, as described above, the heat radiation fins 3246 and 3245 (both in FIG. 19) through which the heat of the CPU 51 and the GPU 52 are conducted are arranged in the housing 322, and the cooling air blown from the air blower 321 is arranged. The heat release fins 3245 and 3246 are cooled by the empty Ul and J2, respectively.

Here, as described above, the discharge port 328 is provided around the discharge port 328 and has a sponge 3281 that seals the gap between the cooling unit 32 and the inner surface portion 226 of the lower housing 22. Thus, the exhaust port 2248 formed in the back surface part 224 of the lower housing 22 is connected. For this reason, the cooling air J2 that has cooled the radiating fin 3246 in the process of being discharged from the discharge port 328 The gas is discharged from the exhaust port 2248 without leakage.

FIG. 28 is a view showing the flow path of the cooling air Ul discharged from the discharge port 327, and is a view schematically showing a cross section on the surface 2A side of the information processing apparatus 1. FIG.

On the other hand, the discharge port 327 is positioned between the contact portion 2265 and the second bottom portion 2267 in the lower housing 22 as described above. The sponge 3271 provided around the discharge port 327 contacts the contact portion 2265 and the second bottom portion 2267 of the inner surface portion 226 of the lower housing 22, and the inner surface portion 226 of the lower housing 22 and the cooling unit 32. The gap with the housing 322 is sealed. Therefore, as shown in FIG. 28, a part of the cooling air Ul discharged from the discharge port 327 is discharged without any leakage of the exhaust port 2222, and the rest flows between the first bottom portion 2266 and the second bottom portion 2267. And discharged from the exhaust port 2221.

Here, one end of the second bottom portion 2267 is connected to the vicinity of the upper end of the inner surface of the side surface portion 222, and the other end is connected to the sponge 3271 of the cooling unit 32. That is, one of the spaces between the first bottom portion 2266 and the second bottom portion 2267 communicates with the outside of the exterior housing 2 through the exhaust port 2222, and the other communicates with the inside of the discharge port 327. For this reason, the cooling air Ul discharged from the discharge port 327 does not flow into the first space S 1 formed by the upper casing 21 and the subframe 6 of the control unit 31, and the subframe 6 The second space S2 formed by the lower housing 22 is discharged to the outside of the exterior housing 2 through the exhaust port 2222.

[0111] (7) Effects of the embodiment

According to the information processing apparatus 1 of the present embodiment as described above, the following effects can be obtained.

That is, the space in the exterior housing 2 is partitioned by the subframe 6 of the control unit 31, and in the space, the first space S1 formed by the subframe 6 and the upper housing 21 and the space A second space S2 formed by the subframe 6 and the lower housing 22 is formed. Here, notches 67L and 67B, notches 56L and 56B, and notches 47A and 47B are formed on the end opposite to the surface 2A side in the subframe 6, the control board 5, and the main frame 4, respectively. A gap S3 is formed between the notches 67L, 56L, 47A, the notches 67B, 56B, 47B, and the side surface portion 223 of the lower housing 22.

For this reason, the cooling air introduced from the outside of the outer casing 2 through the intake port 2131 as the first introduction port. The rejection air flows through the first space SI, cools the power supply unit 34, and then flows through the gap S3 into the second space S2. The cooling air is sucked by the cooling unit 32 after cooling the HDD unit 38 arranged in the second space S2. The air sucked by the cooling unit 32 is discharged toward the heat radiating fins 3245 and 3246, and the air that has cooled the heat radiating fins 3245 passes through the discharge port 327 and the exhaust ports 2221 and 2222. It is discharged outside the exterior housing 2.

[0112] According to this, since the cooling air can be circulated to every corner in the exterior casing 2, it is ensured that the power supply unit 34 and the HDD unit 3 8 which are heating elements are in the process of circulating the cooling air. The cooling air can be sent to other heating elements as well as the cooling air. Therefore, each power supply unit 34 and HDD unit 38 can be appropriately cooled, and each electronic component can be properly cooled.

Further, the power supply unit 34 to be cooled is disposed on the cooling air flow path in the first space S1. According to this, it is possible to reliably blow the cooling air to the power supply unit 34 that tends to become high temperature when the information processing apparatus 1 is driven. Therefore, the power supply unit 34 can be reliably cooled.

Further, the power supply unit 34 that is the object to be cooled and the HDD unit 38 that is the other object to be cooled are located on the upstream side of the air sucked by the cooling unit 32. That is, the power supply unit 34 and the HDD unit 38 are positioned on the flow path until the air introduced from the air inlet 2131 as the first inlet is sucked into the cooling unit 32.

According to this, compared with the case where air is directly discharged to the power supply unit 34 and the HDD unit 38 by the cooling unit 32, the air circulation state can be improved. In addition, since the circulating air flows along the power supply unit 34 and the HDD unit 38, the power supply unit 34 and the HDD unit 38 can be cooled as a whole, and if they are on the flow path, Even if the arrangement positions of the power supply unit 34 and the HDD unit 38 are changed, they can be appropriately cooled. Therefore, it is possible to improve the cooling efficiency of the power supply unit 34 and the HDD unit 38 and the degree of freedom in arrangement, thereby improving the degree of design freedom of the information processing apparatus 1.

[0114] When the cooling air E flowing through the first space S1 flows into the second space S2, the cooling air E The cooling air F introduced from the inlet 2233 as the second inlet formed in the side surface 223 or the inlet 22522 as the second inlet formed in the bottom 225 joins the rejection air E. To do. According to this, the cooling air E whose temperature has risen by cooling the power supply unit 34 can be added with the low temperature! / Cooling air F newly introduced from outside the outer casing 2, so that the main frame 4 It is possible to lower the temperature of the cooling air H that circulates along the HDD unit 38 attached to the HDD attachment part 49 and cools the HDD unit 38. Therefore, the HDD unit 38 can be efficiently cooled.

[0115] Further, the cooling unit 32 includes heat receiving blocks 325C and 325G with which the CPU 51 and the GPU 52 of the control board 5 abut, heat radiating fins 3 246 and 3245 that conduct heat of the heat receiving blocks 325C and 325G, and these heat radiating. The fins 3246 and 3245 are provided with a blowing force S for blowing the cooling air. According to this, since the heat S of the CPU 51 and the GPU 52 can be dissipated by the radiation fins 3246 and 3245, the heat radiation area can be increased.

[0116] Further, the cooling air sucked into the cooling unit 32 is newly introduced into the cooling air H that has cooled the HDD unit 38 from the outside of the outer casing 2 through the intake port 2212 as the third introduction port. Cooled air G is added air. According to this, the cooling air having a temperature lower than that of the cooling air H that has cooled the HDD unit 38 can be blown to the radiation fins 3245 and 3246, so that the radiation fins 3245 and 3246 can be reliably cooled. Accordingly, since the CPU 51 and the GPU 52 can be efficiently cooled, the operations of the CPU 51 and the GPU 52, and consequently the apparatus main body 3, can be stabilized.

[0117] The power supply unit 34 and the HDD unit 38 are arranged in the first space S1 and the second space S2, respectively. According to this, the heat generated in each of the power supply unit 34 and the HDD unit 38 can be prevented from affecting each other. Further, since the air flow path from the power supply unit 34 to the HDD unit 38 can be lengthened, the power supply unit 34 is cooled by the air inlet 2233, 22522 force as the second introduction port. The air can be blown to the HDD unit 38 after the air is surely merged. Therefore, the cooling efficiency of the HDD unit 38 can be further improved.

[0118] The power supply unit 34 is arranged in the vicinity of the notches 67L and 67B formed in the subframe 6, and the HDD unit 38 is arranged in the vicinity of the notches 47A and 47B formed in the main frame 4. It is stored and arranged in the HDD mounting part 49.

Here, the air that has circulated through the first space S 1 passes through the gap S3 between the control unit 31 formed by the cutouts 67L, 56L, and 47A and the cutouts 67B, 56B, and 47B and the exterior housing 2, and then passes through the second space S2. The air is collected in the gap S3. For this reason, by disposing the power supply unit 34 and the HDD unit 38 in the vicinity of the gap S3, air can be reliably blown to the power supply unit 34 and the HDD unit 38. The air volume can be increased. Accordingly, the cooling efficiency of the power supply unit 34 and the HDD unit 38 can be further improved.

[0119] In addition, the subframe 6 that partitions the space in the exterior housing 2 into the first space S1 and the second space S2 holds the control board 5 together with the main frame 4. According to this, since there is no need to separately prepare a member for holding the control board 5 together with the main frame 4 and a member for partitioning the first space S1 and the second space S2, the number of parts of the information processing apparatus 1 can be reduced. Use force S to suppress the increase.

Furthermore, since the subframe 6 is made of metal, the strength required to support the power supply unit 34 can be secured, and the subframe 6 can be connected to the control board 5 together with the metal main frame 4. Since it is clamped, it is possible to apply radiation countermeasures to the information processing device 1.

[0120] The inner surface 215 of the upper housing 21 is in contact with the disk unit 33 and the power supply unit 34, and serves as a sealing member that seals the gap between the inner surface 215, the disk unit 33, and the power supply unit 34. Sponges 2155 to 2157 are provided. These sponges 2155 to 2157 are introduced from the intake port 2131 and the intake port 2213 as the first introduction ports, and the cooling air Al, B 1 flowing between the inner surface 215, the disk unit 33, and the power supply unit 34. , C1 is rectified, and the cooling air is circulated so as to be concentrated in the casing 341 of the power supply unit 34. According to this, the amount of cooling air blown to the power supply unit 34 can be increased. Therefore, the power supply unit 34 can be cooled more reliably.

[0121] Further, around the discharge ports 327 and 328 of the cooling unit 32, sponges 3271 and 3281 force S are provided around the discharge ports 327 and 328 as connection talents for connecting the discharge ports 327 and 328 to the air ports 2222 and 2248. It is. According to this, the cooling air discharged from the discharge port 328 by the sponge 3281. J2 can be reliably discharged outside the exterior housing 2. Further, with the sponge 3271, a part of the cooling air Ul discharged from the discharge port 327 can be surely discharged from the exhaust port 2222, and the rest can be discharged from the exhaust port 2221. Accordingly, there is no possibility that the cooling air to be discharged in the outer casing 2 is accumulated, so that the temperature increase in the outer casing 2 can be suppressed. In addition, this makes it possible to reduce the discharge pressure of the cooling air by the cooling unit 32, so that power consumption can be reduced.

[0122] In addition, leg portions 2141 and 2231 forces S are provided on the side surface portion 214 of the upper housing 21 and the side surface portion 223 of the lower housing 22 on the same side as the side surface portion 214, respectively. The bottom part 225 of the 22 is also provided with a leg 22521 force S. The side surface portions 214 and 223 and the bottom surface portion 225 are different from the surface 2A on which the intake port 2131 and the exhaust ports 2221 and 2222 are formed. Then, when the legs 2141 and 2231 are placed vertically in contact with the installation surface, the surface 2A faces upward and the legs 22521 are placed in contact with the installation surface. In some cases, face 2A faces the side.

[0123] According to this, since the intake port 2131 and the exhaust ports 2221 and 2222 are not blocked in both the vertical and horizontal positions of the information processing apparatus 1, the inside of the exterior casing 2 is not blocked. It is possible to reliably introduce the cooling air and to discharge the cooling air to the outside of the outer casing 2. Therefore, it is possible to prevent the cooling efficiency from being lowered by the cooling unit 32.

Furthermore, by providing Ji rejects 2141, 2231, and 22521 on two different surfaces, it is possible to further improve the degree of freedom of installation of the Tosei processing apparatus 1.

[0124] Further, when the information processing apparatus 1 is set in the vertical state, as described above, the surface 2A on which the air inlet 2131 and the air outlets 2221 and 2222 are formed is positioned above the air inlet. 2131 and vents 2221 and 2222 (directly upward, thus opening.

According to this, since the cooling air is not discharged to the front side, even when the user is located on the front side of the information processing apparatus 1, the cooling air heated by the user should be discharged. Can power to prevent. Further, since the intake port 2131 and the exhaust ports 2221 and 2222 are formed on the surface 2A facing upward, openings for intake and exhaust can be surely formed in the exterior housing 2.

[0125] (8) Modification of Embodiment The best configuration for implementing the present invention has been disclosed in the above description, but the present invention is not limited to this. That is, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such is included in this invention.

In the embodiment, the power unit 34 is cited as a cooling target, and the power that arranges the power unit 34 in the first space S 1 is not limited to this. In addition, the HDD unit 38 is cited as another cooling target, and the HDD unit 38 is disposed in the second space S2. The present invention is not limited to this. In other words, the cooling target arranged in the first space S1 and the other cooling target arranged in the second space S2 may be other units, respectively, and other configurations are arranged as the cooling target. Do it!

In the above embodiment, the power supply unit 34 as the cooling target is disposed in the vicinity of the notches 67L and 67B of the subframe 6 in the first space S1, and the HDD unit 38 as the other cooling target 38 is provided. Is arranged in the vicinity of the notches 47A and 47B of the main frame 4 in the second space S2, but the present invention is not limited to this. In other words, these objects to be cooled may be arranged at other locations as long as they are on the flow path of the air sucked and discharged by the cooling unit 32.

[0128] In the embodiment, as the second introduction port, the intake ports 2233 and 22522 are respectively side portions.

The force formed on 223 and bottom surface portion 225 The present invention is not limited to this. That is, in the information processing apparatus 1 according to the embodiment, when the leg portions 2231 and 22521 are respectively provided on the side surface portion 223 and the bottom surface portion 225, the leg portions are provided on either side. The intake port may be formed on the other surface.

[0129] In the above embodiment, the radiation fins 3245, 3246 provided in the cooling unit 32 are arranged in the housing 322 of the cooling unit 32, but the present invention is not limited to this. That is, if the heat of the CPU 51 and the GPU 52 is conducted through the heat receiving block 325 and the air from the air blowing unit 321 is in the position where the air is blown, the positions of the radiation fins 3245, 3246 Does not matter. Further, instead of the radiating fins 3245 and 3246, a heat sink or the like may be employed as the radiating portion, and other configurations and shapes may be used as long as the radiating area can be increased. [0130] In the embodiment, the force adopting the sponges 2155 to 2157 as the sealing member is not limited to this. That is, as long as the space between the disk unit 33 and the power supply unit 34 and the inner surface portion 215 of the upper housing 21 can be sealed, it may be made of other materials. For example, it may be made of rubber or the like. The same applies to the sponge 3271 provided as a connecting member.

[0131] In the embodiment, the electronic device is configured to be able to reproduce information acquired from an optical disc or a memory card, and image information and audio information included in the information acquired via a network. Although the information processing apparatus 1 configured to be able to execute the included program is illustrated, the present invention is not limited to this. For example, the present invention can also be applied to an electronic device having at least one of these functions, such as an optical disk reproducing device, or an electronic device having other functions.

Industrial applicability

[0132] The present invention can be used suitably for electronic devices, and in particular, can be suitably used for electronic devices including an external housing having legs on different surfaces.

Claims

The scope of the claims

[1] An electronic device comprising: a cooling target; a cooling means for cooling the cooling target; and a casing that houses the cooling target and the cooling means.

On one side of the housing,

A first inlet for introducing air outside the housing into the interior;

An exhaust port for discharging the air that has cooled the inside of the housing to the outside is formed, and the cooling means includes

An intake port for sucking in air introduced into the housing and a discharge port for discharging air sucked from the intake port toward the exhaust port are formed,

A partition member for partitioning the first space on the side where the first introduction port is formed in the housing and the second space on the side where the exhaust port is formed;

A gap is formed between the surface opposite to the one surface and the partition member, and the cooling means is disposed in the second space,

The air flowing through the first space is sucked by the cooling means, flows into the second space through the gap,

The object to be cooled is arranged either on the air flow path from the first introduction port to the cooling means or on the air flow path from the discharge port to the exhaust port of the cooling means. Electronic devices characterized by that!

[2] In the electronic device according to claim 1,

The electronic device, wherein the object to be cooled is disposed in the vicinity of the gap.

[3] In the electronic device according to claim 1 or claim 2,

The electronic device characterized in that the object to be cooled is a power supply device that supplies electric power to the electronic components that constitute the electronic device.

[4] The electronic device according to claim 1 to claim 3! /

The casing is formed with a second inlet for introducing air outside the casing, and the cooling object is disposed on an air flow path from the first inlet to the cooling means,

On the flow path until the air that has cooled the object to be cooled is sucked into the cooling means, Cooling target is provided,

The air introduced from the second introduction port is mixed with the air that has cooled the cooling target in the process of being sucked by the cooling means, and is blown to the other cooling target. .

[5] In the electronic device according to claim 4,

The object to be cooled is disposed in the first space,

The other cooling object is disposed in the second space.

[6] In the electronic device according to claim 5,

The other cooling object is disposed in the vicinity of the gap.

[7] The electronic device according to claim 1 to claim 6! /

The object to be cooled is disposed on an air flow path from the first inlet to the cooling means,

A third inlet for introducing air outside the casing is formed in the casing, and an integrated circuit that performs predetermined processing is mounted on the side of the partition member on which the cooling means is provided. A circuit board is provided,

The cooling means is

A contact portion that contacts the integrated circuit;

A heat dissipating part connected to the abutting part and dissipating heat conducted from the integrated circuit via the abutting part;

An air blower that blows air sucked from the air intake to the heat radiating unit, and in addition to air that has cooled the object to be cooled, air introduced from the third inlet is sucked into the air intake Electronic device characterized by being made.

[8] In the electronic device according to claim 7,

An electronic apparatus comprising a frame member that sandwiches the circuit board together with the partition member on the opposite side of the circuit board from the partition member.

[9] The electronic device according to claim 1 to claim 8! / An electronic device, wherein a sealing member that seals a gap is provided between the casing and the object to be cooled.

[10] Claim 1 to Claim 9! /, Or any of the electronic devices described in any one! /,

An electronic device comprising: a connecting member for connecting the discharge port of the cooling means and the exhaust port!

[11] In the electronic device according to any one of claims 1 to 10,

Legs that come into contact with a predetermined installation surface are respectively provided on two surfaces of the casing that intersect each other,

The electronic device according to claim 1, wherein the one surface on which the first introduction port and the exhaust port are formed is a surface different from the two surfaces.

[12] The electronic device according to claim 11,

The first introduction port and the exhaust port are formed when the electronic device is placed with the legs provided on one of the two surfaces in contact with the installation surface. The electronic device according to claim 1, wherein the one surface faces upward.