WO2008035421A1 - Liquid crystal display panel and process for producing the same - Google Patents
Liquid crystal display panel and process for producing the same Download PDFInfo
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- WO2008035421A1 WO2008035421A1 PCT/JP2006/318716 JP2006318716W WO2008035421A1 WO 2008035421 A1 WO2008035421 A1 WO 2008035421A1 JP 2006318716 W JP2006318716 W JP 2006318716W WO 2008035421 A1 WO2008035421 A1 WO 2008035421A1
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- Prior art keywords
- liquid crystal
- substrate
- crystal display
- display panel
- slit
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Definitions
- Liquid crystal display panel and manufacturing method thereof Liquid crystal display panel and manufacturing method thereof
- the present invention relates to a liquid crystal display panel in which liquid crystal is sealed between a pair of opposing substrates, and a method for manufacturing the same.
- liquid crystal display elements using liquid crystals have deeply penetrated into daily life.
- TN Transmission Nematic
- STN Super Twisted Nematic
- TSTN Triple Super Twisted Nematic
- the liquid crystal display element has a pair of substrates each provided with an electrode and a liquid crystal sealed between the pair of substrates.
- a glass substrate As a substrate, a glass substrate is generally used.
- a liquid crystal display element using a film substrate (plastic substrate) formed of a transparent special resin can be realized.
- a liquid crystal display element using a plastic substrate can be made thinner and lighter than a liquid crystal display element using a glass substrate, and has sufficient flexibility, so it has high durability. High strength against bending! /.
- a liquid crystal display element is manufactured by bonding a pair of substrates each having an electrode, injecting liquid crystal between the pair of substrates to produce a liquid crystal display panel, and processing the liquid crystal display panel. Is done.
- a sealing agent is applied to one substrate, the other substrate is opposed to one substrate, both substrates are pressurized from both sides, and the sealing agent is cured.
- the pair of substrates is pressurized by physical pressing from both sides, sealing in a vacuum pack, or the like.
- Patent Document 1 Japanese Patent No. 3077404
- Patent Document 2 Japanese Patent Laid-Open No. 2002-287157
- Patent Document 3 Japanese Patent No. 2511341
- Patent Document 4 Japanese Patent Laid-Open No. 05-265014
- Patent Document 5 Japanese Patent Application Laid-Open No. 07-318957
- Patent Document 6 Japanese Patent Laid-Open No. 08-201747
- An object of the present invention is to provide a liquid crystal display panel that can be mass-produced with a high production yield and that can provide high display quality, and a method for manufacturing the same.
- the object is to form a first terminal portion for each of a plurality of panel regions on the first substrate, and to form a first on a portion facing the first terminal portion of the second substrate bonded to the first substrate.
- Forming a slit forming an opening in a region other than the plurality of panel regions of the first or second substrate, and surrounding the first slit or the portion facing the first slit without a break;
- a second seal part that seamlessly surrounds the opening or a portion that faces the opening and the plurality of panel regions, and a third seal part that surrounds the outer periphery of each of the plurality of panel regions.
- the first substrate and the second substrate are opposed via the first to third seal portions so that the first terminal portion and the first slit are opposed to each other. And reducing the pressure between the first and second substrates through the opening.
- the first and second substrates are bonded together, liquid crystal is injected into each panel region between the first and second substrates and sealed, and the first and second substrates are divided into each panel region. thing This is achieved by a method for manufacturing a liquid crystal display panel.
- the object is to form first and second substrates opposed to each other, liquid crystal sealed between the first and second substrates, and an outer peripheral portion between the first and second substrates.
- a liquid crystal display panel comprising: a seal portion that seals the liquid crystal; and a first projecting seal portion that branches from the seal portion and projects to the substrate end surfaces of the first and second substrates.
- liquid crystal display panel that can be mass-produced at a high production yield and has a high display quality.
- FIG. 1 is a flowchart showing a manufacturing process of a liquid crystal display panel 1 according to a first embodiment of the present invention.
- FIG. 2 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 2).
- FIG. 3 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 3)
- FIG. 4 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 2)
- FIG. 5 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
- FIG. 6 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
- FIG. 7 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
- FIG. 8 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
- FIG. 9 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
- FIG. 10 is a diagram (No. 9) showing a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the invention.
- FIG. 11 is a diagram (No. 10) showing a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the invention.
- FIG. 12 is a view (No. 11) showing a manufacturing step of the liquid crystal display panel 1 according to the first embodiment of the invention.
- FIG. 13 is a view (No. 12) showing a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the invention.
- FIG. 14 is a diagram showing a liquid crystal display panel 1 according to the first embodiment of the present invention.
- FIG. 15 is a diagram showing manufacturing steps of the liquid crystal display panel 101 according to the second embodiment of the present invention.
- FIG. 16 is a diagram showing a liquid crystal display panel 101 according to a second embodiment of the present invention. Explanation of symbols
- a liquid crystal display panel and a manufacturing method thereof according to the first embodiment of the present invention will be described with reference to FIGS.
- a manufacturing method of a liquid crystal display panel which is a premise of the present embodiment will be described.
- the following technologies are proposed.
- an opening is formed in one or both of the pair of substrates before the substrate bonding step.
- the opening is formed outside a region (panel region) to be a liquid crystal display panel.
- a sealant is applied to one substrate, and a seal portion surrounding the panel region and the opening is formed on the one substrate.
- the pair of substrates are opposed to each other through the seal portion, and the two substrates are aligned.
- the substrates are sealed.
- the pressure between the pair of substrates is reduced through the opening, for example, by vacuum suction.
- firing a pair of substrates thus, the bonding of the substrates is completed.
- the liquid crystal display panel has electrode terminal portions on one or both substrates.
- As one method of exposing the terminal portion there is a method of cutting and removing a portion of the substrate facing the terminal portion after bonding a pair of substrates.
- Patent Document 1 discloses a method for manufacturing a liquid crystal display device that solves the above-described problems.
- a slit is formed in a portion facing the terminal portion of the substrate facing the terminal portion.
- FIG. 1 is a flowchart showing the manufacturing process of the liquid crystal display panel according to the present embodiment.
- 2 to 13 are views showing a manufacturing process of the liquid crystal display panel according to the present embodiment.
- a multi-sided substrate (first substrate) 12 ′ having a plurality of panel regions 14 is prepared.
- the substrate 12 ′ for example, a plastic substrate such as a polycarbonate (PC) film substrate or a polyethylene terephthalate (PET) film substrate, or a glass substrate is used.
- the substrate 12 ′ has a rectangular planar shape.
- the thickness of the substrate 12 ′ is, for example, 0.2 mm.
- the plurality of panel regions 14 are arranged in a matrix of 3 rows in the long side direction (left and right direction in FIG.
- Each panel region 14 has, for example, a rectangular shape having a long side of 100 mm and a short side of 8 Omm.
- the short side direction of the substrate 12 ′ and the long side direction of the panel region 14 are the same direction, and the long side direction of the substrate 12 ′ and the short side direction of the panel region 14 are the same direction.
- a plurality of scan electrodes 17 are formed for each of the plurality of panel regions 14 on the substrate 12 ′ (step Sl (a) in FIG. 1; patterning step). Thereby, the lower substrate 12 is manufactured.
- the plurality of scanning electrodes 17 in the same panel region 14 extend in the long side direction of the panel region 14 in parallel with each other.
- the scanning electrode 17 is formed in a strip shape.
- the scan electrode 17 is made of, for example, indium tin oxide (ITO).
- One end portion (upper end portion in FIG. 2) of each scanning electrode 17 becomes a first electrode terminal 17a.
- a plurality of first electrode terminals 17a in the same panel region 14 constitute a first terminal portion 61 (enclosed by a rectangular frame in FIG. 2). Accordingly, each of the plurality of panel regions 14 has one first terminal portion 61.
- a predetermined gap is formed between adjacent panel regions 14.
- a second slit 67 is formed for each of the plurality of panel regions 14 of the lower substrate 12.
- the second slit 67 is formed in a portion facing the terminal portion (second terminal portion) on the upper substrate side when the lower substrate 12 and an upper substrate described later are bonded together. Moreover, you may also form the outer periphery of the said part.
- the second slit 67 extends in the long side direction of the panel region 14.
- the plurality of second slits 67 are formed at a time, for example, by punching.
- three second slits 67 of three panel regions 14 belonging to the same row are formed separately from each other, and slits are also formed between the second slits 67 adjacent to each other in the force train direction.
- the three second slits 67 may be formed as one integral second slit 67.
- one second slit 67 faces the three second terminal portions on the upper substrate side when the lower substrate 12 and the upper substrate are bonded.
- an internal film such as an alignment film (not shown) for controlling the alignment of liquid crystal molecules is formed on the lower substrate 12 as needed (step S3 (a) in FIG. 1; internal film) Forming step).
- the first to fourth seal portions 71, 73, 75, 77 may be formed by screen printing a sealing agent on the lower substrate 12.
- the sealant epoxy thermosetting resin, acrylic ultraviolet curable resin, or the like is used.
- the first, third, and fourth seal portions 71, 75, and 77 are integrally formed for each of the plurality of panel regions 14.
- the first seal portion 71 surrounds the first terminal portion 61 and its periphery without a break.
- the second seal portion 73 is formed on the outer peripheral portion of the lower substrate 12 and has a rectangular frame shape. The second seal portion 73 surrounds the plurality of panel regions 14 without a break.
- the third seal portion 75 surrounds each outer peripheral portion of the plurality of panel regions 14 and surrounds the plurality of scan electrodes 17 except for the first terminal portion 61.
- a portion surrounded by the third seal portion 75 is a display portion of the liquid crystal display panel 1.
- the third seal portion 75 has an injection port 75a for injecting liquid crystal.
- the first seal portion 71 and the third seal portion 75 partially overlap and are arranged adjacent to each other in the vertical direction in FIG.
- the fourth seal portion 77 surrounds the second slit 67 without a break.
- the third seal portion 75 and the fourth seal portion 77 partially overlap and are arranged adjacent to each other on the left and right in FIG.
- a multi-sided substrate (second substrate) 10 ′ having a plurality of panel regions 14 similar to the panel region 14 on the lower substrate 12 side is prepared.
- the substrate 10 ′ is formed of the same material as the substrate 12 ′, for example, and has substantially the same shape, size, and thickness as the substrate 12 ′.
- a plurality of data electrodes 19 are formed for each of a plurality of panel regions 14 on the substrate 10 ′ (in FIG. 1, step Sl (b); patterning step).
- the upper substrate 10 is formed.
- the plurality of data electrodes 19 in the same panel region 14 extend in the short side direction of the panel region 14 in parallel with each other.
- the data electrode 19 is formed in a strip shape.
- the data electrode 19 is made of, for example, ITO.
- One end of each data electrode 19 (the left end in FIG. 5) serves as the second electrode terminal 19a.
- a plurality of second electrode terminals 19a in the same panel region 14 constitute a second terminal portion 63. Accordingly, each of the plurality of panel regions 14 has one second terminal portion 63.
- a predetermined gap is formed between adjacent panel regions 14.
- the first slit 65 is formed for each of the plurality of panel regions 14 of the upper substrate 10 (in FIG. 1, step S2 (b); slit forming step).
- the first slit 65 is formed in a portion facing the first terminal portion 61 when the upper substrate 10 and the lower substrate 12 are bonded together. Moreover, you may also form the outer periphery of the said part.
- the first slit 65 extends in the short side direction of the panel region 14.
- the plurality of first slits 65 are formed at once, for example, by punching.
- first slits 65 in five panel regions 14 belonging to the same row are formed separately from each other, and slits are also formed between first slits 65 adjacent in the power running direction. Then, the five first slits 65 may be formed as one integral first slit 65. When the first slits 65 are formed in this way, one first slit 65 faces the five first terminal portions 61 when the upper substrate 10 and the lower substrate 12 are bonded together.
- An opening 13 is formed at the center lower portion in FIG.
- the opening 13 is formed in a region surrounded by the second seal portion 73 without a break when the upper substrate 10 and the lower substrate 12 are bonded together.
- the opening 13 has a circular shape with a diameter of 4 mm, for example.
- the opening 13 may be formed at a different location on the upper substrate 10 as long as it is an area other than the plurality of panel areas 14. Further, the opening 13 may be formed in the lower substrate 12 instead of the upper substrate 10.
- an inner film such as an alignment film (not shown) for controlling the alignment of liquid crystal molecules is formed on the upper substrate 10 as necessary (step S3 (b) in FIG. 1; inner film formation). Process).
- a spacer is sprayed on the upper substrate 10 (in FIG. 1, step S4 (b); spacer spraying step).
- the spacer is sprayed to keep the distance (cell gap) between the upper and lower substrates 10 and 12 uniform.
- the spacer has, for example, a spherical shape of 5. ⁇ ⁇ ⁇ .
- the process of forming the first and second slits 65 and 67 is performed at an arbitrary stage before the substrate alignment process (step S5 in FIG. 1). Can do.
- the first and second slits 65 and 67 may be formed before the scan electrode 17 and the data electrode 19 are formed (steps S I (a) and SI (b)).
- the first and second slits 65 and 67 may be formed after the inner film formation (steps S3 (a) and S3 (b)).
- the first and second seal portions 71, 73, 75, 77 may be formed by applying a sealant (step S4 (a)), and then the first and second slits 65, 67 may be formed. .
- the sealing agent application (step S4 (a)) and the spacer spraying (step S4 (b)) may be performed on either the upper substrate 10 or the lower substrate 12.
- a spacer may be spread on the lower substrate 12 instead of the upper substrate 10.
- the first to fourth seal portions 71, 73, 75, 77 may be formed on the upper substrate 10 instead of on the lower substrate 12.
- the first seal portion 71 surrounds the first slit 65 without a break.
- the fourth seal portion 77 is a portion (the second terminal portion 63 and the portion facing the second slit 67) when the upper substrate 10 and the lower substrate 12 are bonded together. Surround the surrounding area).
- FIG. 7 is a plan view illustrating the combined substrate 20 and the upper substrate 10 side force.
- the upper substrate 10 is arranged on the front side
- the lower substrate 12 is arranged on the back side.
- hidden lines are indicated by broken lines.
- the first terminal portion 61 and the first slit 65 are opposed to each other in the plurality of panel regions 14, and the second terminal portion 63 and the second Make sure that the slit 67 faces each other.
- the first slit 65 faces all of the plurality of first electrode terminals 17a.
- the second slit 67 faces all of the plurality of second electrode terminals 19a.
- the scanning electrode 17 excluding the first terminal portion 61 exposed through the first slit 65 and the data electrode excluding the second terminal portion 63 exposed through the second slit 67 are shown. Illustration of 19 is omitted.
- the first seal portion 71 surrounds the first slit 65 without break, and the fourth seal portion 77 surrounds the second slit 67 without break.
- the second seal portion 73 seamlessly surrounds the plurality of panel regions 14 and the opening 13. In the state in which the laminated substrate 20 is manufactured, the upper substrate 10 is merely positioned and temporarily placed on the lower substrate 12, and the upper substrate 10 and the lower substrate 12 are not completely bonded and fixed.
- thermosetting resin used as the sealant
- the entire laminated substrate 20 is heated using a thermostatic bath (not shown), and an ultraviolet curable resin is used as the sealant.
- the entire laminated substrate 20 is irradiated with ultraviolet rays from the outside to harden the first to fourth seal portions 71, 73, 75, 77 (in FIG. 1, step S6; Hard key process).
- FIG. 8 (a) the upper substrate 10 is turned up and the end portion of the laminated substrate 20 where the opening 13 is formed is placed on the holding plate 22.
- FIG. 8 (b) the end portion of the laminated substrate 20 where the opening 13 is formed is sandwiched between two holding plates 22 and 24.
- FIG. 8B shows a state in which the end portion of the laminated substrate 20 is sandwiched between the two holding plates 22 and 24.
- the holding plate 24 is provided with a tube 24a for vacuum suction.
- the tube 24a is connected to a vacuum pump (not shown).
- Silicone rubbers 23 and 25 are provided on the outer peripheral portions of the surfaces of the holding plates 22 and 24 facing each other.
- FIG. 9 is a plan view illustrating the laminated substrate 20 during vacuum suction from the upper substrate 10 side.
- the flow of air between the upper and lower substrates 10 and 12 during vacuum suction is schematically shown by white arrows.
- the holding plates 22 and 24 are not shown.
- FIG. 10 shows a cross section taken along line AA in FIG. In Fig. 10, the air flow during vacuum suction is shown schematically with relatively small white arrows.
- the upper and lower substrates 10 and 12 face each other at a predetermined interval (cell gap) via the first to fourth seal portions 71, 73, 75, 77 and the spacer 16. is doing.
- the upper and lower substrates 10 and 12 are surrounded by the second seal portion 73 without a break.
- the first slit 65 is surrounded by the first seal portion 71 without a break.
- the second slit 67 is surrounded by the fourth seal portion 77 without any breaks.
- the sealed state between the upper and lower substrates 10 and 12 is obtained by vacuum suction through the space between the holding plates 22 and 24 and the opening 13.
- the part (in Fig. 10, space 81) is decompressed.
- both surfaces of the laminated substrate 20 are pressurized by atmospheric pressure, and the upper and lower substrates 10 and 12 are bonded and fixed.
- the laminated substrate 20 is fired.
- the upper and lower substrates 10 and 12 are uniformly pressurized by atmospheric pressure. Therefore, problems such as cell gap non-uniformity and damage to the upper and lower substrates 10 and 12 are not caused. Therefore, the upper and lower substrates 10 and 12 can be bonded and fixed satisfactorily.
- FIG. 12 shows the three laminated substrates 20 after cutting. As shown in FIG. 12, each laminated substrate 20 after cutting has five panel regions 14. The inlet 75a of each panel region 14 is exposed at the end face of the laminated substrate 20.
- liquid crystal injection process for each panel region 14, liquid crystal is injected between the upper and lower substrates 10 and 12 surrounded by the third seal portion 75 by, for example, a dip vacuum injection method (in FIG. 1, step S 9; liquid crystal injection) D)
- a dip vacuum injection method in FIG. 1, step S 9; liquid crystal injection
- D liquid crystal injection
- the alignment substrate 20 is placed in a vacuum chamber (not shown).
- the vacuum chamber is depressurized to make a vacuum.
- vacuum check While maintaining the inside of the chamber in a vacuum
- the inlet 75a of the alignment substrate 20 is immersed in the liquid crystal.
- release the vacuum in the vacuum chamber As a result, liquid crystal is injected between the upper and lower substrates 10 and 12.
- FIG. 1 dip vacuum injection method
- a sealing agent 79 is formed at the inlet 75a, and the inlet 75a is sealed with the sealing agent 79 (step S9 in FIG. 1; liquid crystal sealing step).
- the liquid crystal injected between the upper and lower substrates 10 and 12 surrounded by the third seal portion 75 is sealed between the upper and lower substrates 10 and 12.
- FIG. 13 shows the positions of the cutting lines L2, L3, and L4.
- the cutting line L2 is parallel to the long side direction of the laminated substrate 20, overlaps with the first slits 65 of the plurality of panel regions 14 when viewed in the normal direction of the substrate surface of the laminated substrate 20, and does not overlap with the first terminal portion 61. It is a straight line.
- the cutting lines L3 and L4 are provided for each panel region 14 (not shown in FIG. 13) and are straight lines parallel to the short side direction of the laminated substrate 20.
- Each cutting line L3 is a straight line passing through the vicinity of the left side of the third seal portion 75 in FIG.
- Each cutting line L4 is a straight line that overlaps the second slit 67 and does not overlap the second terminal portion 63 when viewed in the normal direction of the substrate surface of the laminated substrate 20.
- first slit 65 is surrounded by first seal portion 71 without a break
- second slit 67 is surrounded by the fourth seal portion 77 without any breaks. Therefore, by sandwiching the end portions of the upper and lower substrates 10 and 12 where the openings 13 are formed between the holding plates 22 and 24, the first seal is provided between the upper and lower substrates 10 and 12 surrounded by the second seal portion 73. Except for the portion surrounded by the portion 71 or the fourth seal portion 77, the holding plates 22, 24 and the first, second and fourth seal portions 71, 73, 77 are sealed.
- the display quality and the manufacturing yield of the liquid crystal display panel can be improved even when multi-paneling is performed.
- the holding plates 22 and 24 can be reduced in size. Therefore, the liquid crystal display panel 1 can be manufactured at a low cost. Further, since the second seal portion 73 is formed on the outer peripheral portion of the lower substrate 12, a large number of panel regions 14 can be formed in the upper and lower substrates 10 and 12. Therefore, the liquid crystal display panel 1 can be manufactured at a low cost. Further, since the first slit 65 faces all of the plurality of first electrode terminals 17a and exposes all of the first electrode terminals 17a, the connection between the first electrode terminal 17a and the outside becomes easy. Similarly, since the second slit 67 faces all of the plurality of second electrode terminals 19a and exposes all of the second electrode terminals 19a, the connection between the second electrode terminal 19a and the outside becomes easy.
- FIG. 14 is a plan view illustrating the liquid crystal display panel 1 manufactured by the method of manufacturing the liquid crystal display panel 1 according to the present embodiment from the upper substrate 10 side.
- the liquid crystal display panel 1 has an upper substrate (second substrate) 10 and a lower substrate (first substrate) 12 arranged to face each other.
- a third seal portion (seal portion) 75 is formed on the outer peripheral portion between the upper and lower substrates 10 and 12.
- the third seal portion 75 has an injection port 75a for injecting liquid crystal.
- the injection port 75a is sealed with a sealant 79.
- a liquid crystal (not shown) is sealed between the upper and lower substrates 10 and 12 surrounded by the third seal portion 75 and the sealant 79.
- a plurality of scanning electrodes 17 are formed on the lower substrate 12.
- a first terminal 61 is formed at one end of the plurality of scanning electrodes 17 and outside the third seal portion 75 (upper side in FIG. 14).
- a cut portion (first cut portion) 65a is formed in the portion of the upper substrate 10 facing the first terminal portion 61.
- the cut portion 65a is a part (or all) of the first slit 65 formed in the slit forming step.
- the cut portion 65a exposes the first terminal portion 61.
- a plurality of data electrodes 19 are formed on the upper substrate 10.
- a second terminal portion 63 is formed at one end of the plurality of data electrodes 19 and outside the third seal portion 75 (right side in FIG. 14).
- a notch (second notch) 67a is formed in the portion of the lower substrate 12 facing the second terminal portion 63.
- the cut portion 67a is a part (or all) of the second slit 67 formed in the slit forming step.
- the cut portion 67a exposes the second terminal portion 63.
- the liquid crystal display panel 1 includes a first projecting seal portion 71a and a second projecting seal portion 77a that are branched from the third seal portion 75 and project to the substrate end surfaces of the upper and lower substrates 10 and 12. It has a feature in that it has.
- the first projecting seal portion 71a is a part of the first seal portion 71 formed in the sealant application process.
- the first protruding seal portion 71a is formed such that two corners on the upper side in FIG. 14 of the third seal portion 75 also protrude toward the first terminal portion 61 side.
- the second projecting seal portion 77a is a part of the fourth seal portion 77 formed in the sealant application process.
- the second projecting seal portion 77a is formed to project from the two corners on the right side in FIG. 14 to the second terminal portion 63 side.
- the upper substrate 10 has the protruding portion 10a protruding to the first terminal portion 61 side at the two corners on the upper side in FIG. 14 is also characterized in that the lower substrate 12 is provided with a protruding portion 12a protruding to the second terminal portion 63 side at two corners on the right side in FIG.
- the protruding portion 10a is formed in the vicinity of the first protruding seal portion 71a.
- the protruding portion 12a is formed in the vicinity of the second protruding seal portion 77a.
- a conventional liquid crystal display panel using plastic substrates as the upper and lower substrates 10 and 12 can be reduced in thickness and weight, and can be bent with sufficient flexibility. There is a problem that corners are easily peeled off.
- the first and second projecting seal portions 71a and 77a and the projecting portions 10a and 12a are formed in the vicinity of the corner portion of the third seal portion 75. Is reinforced. Therefore, the corner portion of the third seal portion 75 is peeled. Accordingly, it is possible to realize a liquid crystal display panel 1 that can be reduced in thickness and weight, has sufficient flexibility, and has high strength. For this reason, the liquid crystal display panel 1 according to the present embodiment is suitable as a display element for electronic paper that is thin, lightweight, and requires high flexibility.
- a liquid crystal display panel according to a second embodiment of the present invention and a method for manufacturing the same will be described with reference to FIGS.
- the manufacturing method will be described with reference to FIGS.
- the manufacturing method of the liquid crystal display panel according to the present embodiment is the same as the manufacturing method of the liquid crystal display panel 1 according to the first embodiment, except for the sealing agent application step (step S4 (a) in FIG. 1). .
- steps S4 (a) in FIG. 1). the sealing agent application step.
- components having the same functions and operations as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
- FIG. 15 is a plan view illustrating the aligned substrate 20 at the end of the substrate alignment step (step S 5 in FIG. 1) from the upper substrate 10 side.
- the liquid crystal display panel manufacturing method according to the present embodiment is different from the liquid crystal display panel 1 manufacturing method according to the first embodiment in that the first and second slits in the same panel region 14 are the same. It is characterized in that the first seal portion 71 is formed so as to surround the 65 and 67 without a break. Accordingly, the first and second slits 65 and 67 in the same panel region 14 are surrounded by one first seal portion 71 without any break.
- the scan electrode 17 and the first terminal portion 61 are formed for each of the plurality of panel regions 14 on the substrate 12 ′ by a manufacturing method similar to the manufacturing method of the liquid crystal display panel 1 according to the first embodiment.
- the substrate 12 is manufactured, the second slit 67 is formed for each of the plurality of panel regions 14 of the lower substrate 12, and an internal film is formed on the lower substrate 12 (in FIG. 1, steps SI (a) to S3 (a) ).
- the second slit 67 is formed in a portion facing the second terminal portion 63 when the upper substrate 10 and the lower substrate 12 are bonded together.
- a sealant is applied onto the lower substrate 12 to form first to third seal portions 71, 73, 75 on the lower substrate 12 (in FIG. 1, step S4 (a); seal Agent coating process).
- the first seal portion 71 surrounds the portion facing the first slit 65 (the first terminal portion 61 and its surroundings) and the second slit 67 when the upper substrate 10 and the lower substrate 12 are bonded together.
- the shapes of the second and third seal portions are the same as those in the manufacturing method of the liquid crystal display panel 1 according to the first embodiment.
- fourth seal portion 77 is not formed.
- the data electrode 19 and the second terminal portion 63 are provided for each of the plurality of panel regions 14 on the substrate 10 ′ by a manufacturing method similar to the manufacturing method of the liquid crystal display panel 1 according to the first embodiment.
- the upper substrate 10 is formed to form a first slit 65 for each of the plurality of panel regions 14 of the upper substrate 10.
- an inner film and a spacer are formed on the upper substrate 10 (steps Sl (b) to S4 (b) in FIG. 1).
- the first slit 65 is formed in a portion facing the first terminal portion 61 when the upper substrate 10 and the lower substrate 12 are bonded together.
- step S5 to S11 in FIG. 1 The manufacturing process of the liquid crystal display panel using the upper and lower substrates 10 and 12 (steps S5 to S11 in FIG. 1) is the same as the manufacturing method of the liquid crystal display panel 1 according to the first embodiment, and thus the description thereof is omitted. To do. As a result, a plurality (15 in this embodiment) of liquid crystal display panels 101 each having the first and second terminal portions 61 and 63 are completed (step SI 1 in FIG. 1; single panel completed). Thereafter, peripheral circuits and the like are provided to complete the liquid crystal display element.
- first and second slits 65 and 67 in the same panel region 14 are surrounded by one first seal portion 71 without a break. Therefore, by sandwiching the ends where the openings 13 of the upper and lower substrates 10 and 12 are formed between the holding plates 22 and 24, the first seal portion is provided between the upper and lower substrates 10 and 12 surrounded by the second seal portion 73. Except for the portion surrounded by 71, the holding plates 22 and 24 and the first and second seal portions 71 and 73 are hermetically sealed. Therefore, it is possible to realize a manufacturing method that combines multiple chamfering and pasting by decompression. Therefore, the display quality and manufacturing yield of the liquid crystal display panel can be improved by the liquid crystal display panel manufacturing method according to the present embodiment, even if multiple layouts are performed.
- first and second slits 65 and 67 in the same panel region 14 are surrounded by one first seal portion 71 without a break.
- the formation of the fourth seal portion 77 is not necessary, and the shape of the seal portion can be simplified. Therefore, the liquid crystal display panel 101 can be manufactured at low cost.
- FIG. 16 is a plan view illustrating the liquid crystal display panel 101 manufactured by the method of manufacturing the liquid crystal display panel 101 according to the present embodiment from the upper substrate 10 side.
- the liquid crystal display panel 101 according to the present embodiment is different from the liquid crystal display panel 1 in that first and second projecting seal portions 71b and 71c are formed instead of the first and second projecting seal portions 71a and 77a. It has a feature in that.
- the first and second projecting seal portions 71b and 71c are formed so as to branch from the third seal portion 75 and project to the substrate end surfaces of the upper and lower substrates 10 and 12.
- First and second protruding seals 71b, 71c Is a part of the first seal portion 71 formed in the sealant application step.
- the first protruding seal portion 71b is formed so that the force in the vicinity of the upper left corner in FIG. 14 of the third seal portion 75 also protrudes to the left side of the liquid crystal display panel 101.
- the second projecting seal portion 71c is formed so as to project toward the second terminal portion 63 side of the third seal portion 75 at the lower right corner portion in FIG.
- the configuration of the liquid crystal display panel 101 excluding the first and second projecting seal portions 71b and 71c is the same as that of the liquid crystal display panel 1 according to the first embodiment.
- the liquid crystal display panel 101 according to the present embodiment can obtain the same effects as the liquid crystal display panel 1 according to the first embodiment.
- a noisy matrix liquid crystal display panel and a manufacturing method thereof have been described as examples.
- the present invention can also be applied to an active matrix type liquid crystal display panel provided with the above switching elements and a method for manufacturing the same.
- the scanning electrode 17 and the data electrode 19 are formed on the same substrate (for example, the lower substrate 12), and the common electrode is formed on the other substrate (for example, the upper substrate 10).
- the first and second terminal portions 61 and 63 are formed on the same substrate.
- the manufacturing method of the active matrix type liquid crystal display panel to which the manufacturing method of the liquid crystal display panel 1 according to the first embodiment is applied differs from the manufacturing method of the liquid crystal display panel 1 in the following points.
- the gate bus line and the first terminal portion 61 at one end thereof are formed for each of the plurality of panel regions 14 on the lower substrate 12.
- a drain bus line that intersects the gate bus line via an insulating film and a second terminal portion 63 at one end thereof are formed.
- a switching element and a pixel electrode are formed at each intersection of both bus lines.
- a second slit 67 is formed for each of the plurality of panel regions 14 of the upper substrate 10.
- the second slit 67 is formed in a portion facing the second terminal portion 63 when the upper substrate 10 and the lower substrate 12 are bonded together.
- the fourth seal portion 77 is placed on the lower substrate so as to surround the portion facing the second slit 67 (the second terminal portion 63 and its peripheral portion) without a break.
- a common electrode is formed for each panel area 14 on the upper substrate 10. To do. The common electrode is formed on almost the entire surface of each panel region 14.
- the data electrode 19 and the second terminal portion 63 are formed on the lower substrate 12 with respect to the liquid crystal display panel 1, and a notch (second The difference is that the cut portion 67a is formed in the upper substrate 10. Further, the data electrode 19 faces the scanning electrode 17 through an insulating film. An area defined by the scanning electrode 17 and the data electrode 19 is one pixel. On the lower substrate 12, a switching element and a pixel electrode are formed for each pixel. A common electrode is formed on the upper substrate 10.
- the manufacturing method of the active matrix type liquid crystal display panel to which the manufacturing method of the liquid crystal display panel 101 according to the second embodiment is applied differs from the manufacturing method of the liquid crystal display panel 101 in the following points.
- a gate bus line and a first terminal portion 61 at one end thereof are formed for each of a plurality of panel regions 14 on the lower substrate 12.
- a drain bus line intersecting with the gate bus line via an insulating film and a second terminal portion 63 at one end thereof are formed.
- a switching element and a pixel electrode are formed at each intersection of both bus lines.
- a second slit 67 is formed for each of the plurality of panel regions 14 of the upper substrate 10.
- the second slit 67 is formed in a portion facing the second terminal portion 63 when the upper substrate 10 and the lower substrate 12 are bonded together.
- the portions facing the first and second slits 65 and 67 are surrounded without a break.
- the first seal portion 71 is formed on the lower substrate 12.
- a common electrode is formed for each panel region 14 on the upper substrate 10. The common electrode is formed on almost the entire surface of each panel region 14.
- the bonding method using reduced pressure (step S7 in FIG. 1) is not limited to the method described in the above embodiment.
- PCTZJP2006Z304343 by the applicant of the present application, another method is proposed. The method will be briefly described. In this method, instead of forming the opening 13, a through-hole penetrating the upper and lower substrates 10 and 12 is formed in, for example, an end portion of the laminated substrate 20 after the upper and lower substrates 10 and 12 are bonded. Before bonding the upper and lower substrates 10 and 12, the opening 13 is formed at the same position of the upper and lower substrates 10 and 12, and the upper and lower substrates 13 and 12 are aligned with each other.
- the substrates 10 and 12 may be aligned to form a through hole.
- the plurality of laminated substrates 20 are arranged so that the through holes of the respective laminated substrates 20 overlap each other when viewed in the normal direction of the substrate surface of the laminated substrate 20.
- pipes having openings formed on the side surfaces are inserted into the plurality of through holes.
- one end of the pipe is closed, and the inside of the plurality of laminated substrates 20 is vacuum-sucked from the other end of the noise through the opening of the pipe and the plurality of through holes.
- the pressure inside the plurality of laminated substrates 20 is reduced simultaneously. According to this method, the inside of the plurality of laminated substrates 20 can be depressurized simultaneously.
- the manufacturing method of the liquid crystal display panel according to the present invention can improve the display quality and manufacturing yield of the liquid crystal display panel even if multiple processes are performed. Further, the liquid crystal display panel according to the present invention can be reduced in thickness and weight, has sufficient flexibility, and has high strength.
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Abstract
A liquid crystal display panel having a liquid crystal sealed between a pair of substrates opposite to each other; and a process for producing the same. In particular, there is provided a liquid crystal display panel that enables mass production with a high production yield, ensuring a high display quality, and provided a process for producing the same. A sealing agent is applied onto under substrate (12) with the use of a dispenser to thereby form first to fourth seal parts (71,73,75,77) on the under substrate (12). When upper and under substrates (10,12) are stuck together, first slit (65) is surrounded without discontinuity by the first seal part (71), and second slit (67) is surrounded without discontinuity by the fourth seal part (77).
Description
明 細 書 Specification
液晶表示パネル及びその製造方法 Liquid crystal display panel and manufacturing method thereof
技術分野 Technical field
[0001] 本発明は、対向する一対の基板間に液晶が封止された液晶表示パネル及びその 製造方法に関する。 The present invention relates to a liquid crystal display panel in which liquid crystal is sealed between a pair of opposing substrates, and a method for manufacturing the same.
背景技術 Background art
[0002] 近年、液晶を用いた液晶表示素子は日々の生活に深く浸透してきて 、る。液晶表 示素子の動作方式には、 TN (Twisted Nematic)方式、 STN (Super Twisted Nematic)方式、 TSTN (Triple Super Twisted Nematic)方式などがある。い ずれの動作方式においても、液晶表示素子は、それぞれ電極を備えた一対の基板と 一対の基板間に封止された液晶とを有している。 In recent years, liquid crystal display elements using liquid crystals have deeply penetrated into daily life. There are TN (Twisted Nematic) method, STN (Super Twisted Nematic) method, TSTN (Triple Super Twisted Nematic) method, and so on. In either operation method, the liquid crystal display element has a pair of substrates each provided with an electrode and a liquid crystal sealed between the pair of substrates.
[0003] 基板として、一般的にガラス基板が用いられている。また、透明な特殊樹脂で形成 されたフィルム基板 (プラスチック基板)を用いた液晶表示素子も実現されて ヽる。プ ラスチック基板を用いた液晶表示素子は、ガラス基板を用いた液晶表示素子に比べ て薄型化や軽量ィ匕が可能であり、さらに、十分な可撓性を備えているので、耐久性が 高く曲げに対する強度も大き!/、。 [0003] As a substrate, a glass substrate is generally used. In addition, a liquid crystal display element using a film substrate (plastic substrate) formed of a transparent special resin can be realized. A liquid crystal display element using a plastic substrate can be made thinner and lighter than a liquid crystal display element using a glass substrate, and has sufficient flexibility, so it has high durability. High strength against bending! /.
[0004] 液晶表示素子は一般に、それぞれ電極を有する一対の基板を貼り合わせ、一対の 基板間に液晶を注入して液晶表示パネルを作製し、当該液晶表示パネルを加工す ること〖こよって製造される。 [0004] Generally, a liquid crystal display element is manufactured by bonding a pair of substrates each having an electrode, injecting liquid crystal between the pair of substrates to produce a liquid crystal display panel, and processing the liquid crystal display panel. Is done.
[0005] 一対の基板を貼り合わせる工程では、一方の基板にシール剤を塗布し、他方の基 板を一方の基板に対向させ、両基板を両側から加圧し、シール剤を硬化させる。一 対の基板の加圧は、両側からの物理的な加圧や、真空パックへの封入等により行わ れる。 [0005] In the step of bonding a pair of substrates, a sealing agent is applied to one substrate, the other substrate is opposed to one substrate, both substrates are pressurized from both sides, and the sealing agent is cured. The pair of substrates is pressurized by physical pressing from both sides, sealing in a vacuum pack, or the like.
[0006] し力しながら、一対の基板を両側力も物理的に加圧する方法では、基板面内での 圧力の不均一が避けられない。このためセルギャップが不均一になり、液晶表示パネ ルの表示品質が低下してしまうという問題があった。また、基板上にパーティクル等の 異物があると、加圧により基板が損傷したり、基板に歪みが生じたりして、液晶表示パ
ネルの製造歩留まりが低下してしまうという問題があった。液晶表示素子の薄型化に より、上述した問題は一層深刻なものとなっている。また、プラスチック基板を用いる 場合には、ガラス基板を用いる場合に比べて上述の問題が顕著に生じる。 [0006] In the method of physically pressurizing both sides of a pair of substrates while applying a force, nonuniform pressure in the substrate surface is inevitable. As a result, the cell gap becomes non-uniform and the display quality of the liquid crystal display panel deteriorates. In addition, if there are foreign objects such as particles on the substrate, the substrate may be damaged by pressurization or the substrate may be distorted. There was a problem that the manufacturing yield of the flannel was lowered. With the thinning of liquid crystal display elements, the above-described problems are becoming more serious. In addition, when a plastic substrate is used, the above-described problem is noticeable as compared with the case where a glass substrate is used.
[0007] また、量産を視野に入れた場合、一対の基板から複数の液晶表示パネルを製造す る、いわゆる多面取りを行う必要がある。多面取りを行う場合においても上述の問題 が解決されることが望まれる。 [0007] When mass production is taken into consideration, it is necessary to perform so-called multi-sided manufacturing, in which a plurality of liquid crystal display panels are manufactured from a pair of substrates. It is desirable that the above-mentioned problems be solved even when multi-chamfering is performed.
[0008] 特許文献 1:特許第 3077404号公報 [0008] Patent Document 1: Japanese Patent No. 3077404
特許文献 2 :特開 2002— 287157号公報 Patent Document 2: Japanese Patent Laid-Open No. 2002-287157
特許文献 3:特許第 2511341号公報 Patent Document 3: Japanese Patent No. 2511341
特許文献 4:特開平 05 - 265014号公報 Patent Document 4: Japanese Patent Laid-Open No. 05-265014
特許文献 5:特開平 07— 318957号公報 Patent Document 5: Japanese Patent Application Laid-Open No. 07-318957
特許文献 6:特開平 08 - 201747号公報 Patent Document 6: Japanese Patent Laid-Open No. 08-201747
発明の開示 Disclosure of the invention
発明が解決しょうとする課題 Problems to be solved by the invention
[0009] 本発明の目的は、高い製造歩留まりで量産化でき、かつ高い表示品質が得られる 液晶表示パネル及びその製造方法を提供することにある。 An object of the present invention is to provide a liquid crystal display panel that can be mass-produced with a high production yield and that can provide high display quality, and a method for manufacturing the same.
課題を解決するための手段 Means for solving the problem
[0010] 上記目的は、第 1基板上の複数のパネル領域毎に第 1端子部を形成し、前記第 1 基板に貼り合わされる第 2基板の前記第 1端子部に対向する部分に第 1スリットを形 成し、前記第 1又は第 2基板の前記複数のパネル領域以外の領域に開口部を形成し 、前記第 1スリット又は前記第 1スリットに対向する部分を切れ目なく囲む第 1シール 部と、前記開口部又は前記開口部に対向する部分と前記複数のパネル領域とを切 れ目なく囲む第 2シール部と、前記複数のパネル領域のそれぞれ外周部を囲む第 3 シール部とを前記第 1又は第 2基板上に形成し、前記第 1端子部及び前記第 1スリツ トが対向するように前記第 1乃至第 3シール部を介して前記第 1基板と前記第 2基板 とを対向させ、前記開口部を介して前記第 1及び第 2基板間を減圧することにより前 記第 1及び第 2基板を貼り合わせ、前記第 1及び第 2基板間の前記パネル領域毎に 液晶を注入して封止し、前記第 1及び第 2基板を前記パネル領域毎に分断すること
を特徴とする液晶表示パネルの製造方法によって達成される。 [0010] The object is to form a first terminal portion for each of a plurality of panel regions on the first substrate, and to form a first on a portion facing the first terminal portion of the second substrate bonded to the first substrate. Forming a slit, forming an opening in a region other than the plurality of panel regions of the first or second substrate, and surrounding the first slit or the portion facing the first slit without a break; A second seal part that seamlessly surrounds the opening or a portion that faces the opening and the plurality of panel regions, and a third seal part that surrounds the outer periphery of each of the plurality of panel regions. Formed on the first or second substrate, the first substrate and the second substrate are opposed via the first to third seal portions so that the first terminal portion and the first slit are opposed to each other. And reducing the pressure between the first and second substrates through the opening. The first and second substrates are bonded together, liquid crystal is injected into each panel region between the first and second substrates and sealed, and the first and second substrates are divided into each panel region. thing This is achieved by a method for manufacturing a liquid crystal display panel.
[0011] また、上記目的は、対向配置された第 1及び第 2基板と、前記第 1及び第 2基板間 に封止された液晶と、前記第 1及び第 2基板間の外周部に形成されて前記液晶を封 止するシール部と、前記シール部から分岐し前記第 1及び第 2基板の基板端面まで 突出して形成された第 1突出シール部とを有することを特徴とする液晶表示パネルに よって達成される。 [0011] Further, the object is to form first and second substrates opposed to each other, liquid crystal sealed between the first and second substrates, and an outer peripheral portion between the first and second substrates. A liquid crystal display panel comprising: a seal portion that seals the liquid crystal; and a first projecting seal portion that branches from the seal portion and projects to the substrate end surfaces of the first and second substrates. To achieve this.
発明の効果 The invention's effect
[0012] 本発明によれば、高 、製造歩留まりで量産化でき、かつ高!、表示品質の液晶表示 パネルが得られる。 According to the present invention, it is possible to obtain a liquid crystal display panel that can be mass-produced at a high production yield and has a high display quality.
図面の簡単な説明 Brief Description of Drawings
[0013] [図 1]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示すフロー チャートである。 FIG. 1 is a flowchart showing a manufacturing process of a liquid crystal display panel 1 according to a first embodiment of the present invention.
[図 2]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(その FIG. 2 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 2).
1)である。 1).
[図 3]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(その FIG. 3 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 3)
2)である。 2).
[図 4]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(その FIG. 4 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 2)
3)である。 3).
[図 5]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(その FIG. 5 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
4)である。 4).
[図 6]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(その FIG. 6 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
5)である。 5).
[図 7]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(その FIG. 7 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
6)である。 6).
[図 8]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(その FIG. 8 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
7)である。 7).
[図 9]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(その FIG. 9 shows a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the present invention (part 1)
8)である。
[図 10]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(そ の 9)である。 8). FIG. 10 is a diagram (No. 9) showing a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the invention.
[図 11]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(そ の 10)である。 FIG. 11 is a diagram (No. 10) showing a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the invention.
[図 12]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(そ の 11)である。 FIG. 12 is a view (No. 11) showing a manufacturing step of the liquid crystal display panel 1 according to the first embodiment of the invention.
[図 13]本発明の第 1の実施の形態による液晶表示パネル 1の製造工程を示す図(そ の 12)である。 FIG. 13 is a view (No. 12) showing a manufacturing process of the liquid crystal display panel 1 according to the first embodiment of the invention.
[図 14]本発明の第 1の実施の形態による液晶表示パネル 1を示す図である。 FIG. 14 is a diagram showing a liquid crystal display panel 1 according to the first embodiment of the present invention.
[図 15]本発明の第 2の実施の形態による液晶表示パネル 101の製造工程を示す図 である。 FIG. 15 is a diagram showing manufacturing steps of the liquid crystal display panel 101 according to the second embodiment of the present invention.
[図 16]本発明の第 2の実施の形態による液晶表示パネル 101を示す図である。 符号の説明 FIG. 16 is a diagram showing a liquid crystal display panel 101 according to a second embodiment of the present invention. Explanation of symbols
1、 101 液晶表示パネル 1, 101 LCD panel
10 上基板 10 Upper substrate
10 '、 12' 多面取り用の基板 10 ', 12' multi-sided board
10a、 12a 突出部 10a, 12a Projection
12 下基板 12 Lower board
13 開口部 13 opening
14 パネル領域 14 Panel area
16 スぺーサ 16 Spacer
17 走査電極 17 Scan electrode
17a 第 1電極端子 17a 1st electrode terminal
19 データ電極 19 Data electrode
19a 第 2電極端子 19a Second electrode terminal
20 合わせ基板 20 Laminated board
22、 24 保持板
23、 25 シリコンゴム 22, 24 Retaining plate 23, 25 Silicone rubber
61 第 1端子部 61 Terminal 1
63 第 2端子部 63 2nd terminal
65 第 1スリット 65 1st slit
65a, 67a 切り込み部 65a, 67a notch
67 第 2スリット 67 2nd slit
71 第 1シール部 71 First seal
71a, 71b 第 1突出シール部 71a, 71b First protruding seal
71c, 77a 第 2突出シール部 71c, 77a Second protruding seal
73 第 2シーノレ咅 73 No. 2
75 第 3シール部 75 Third seal
75a 注入口 75a inlet
77 第 4シーノレ咅 77 No. 4
79 封止部 79 Sealing part
81 空間 81 space
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
[第 1の実施の形態] [First embodiment]
本発明の第 1の実施の形態による液晶表示パネル及びその製造方法について図 1 乃至図 14を用いて説明する。まず、本実施の形態の前提となる液晶表示パネルの 製造方法について説明する。本願出願人による国際出願 (PCTZJP2006Z3043 43)では以下のような技術を提案している。当該出願による液晶表示パネルの製造 方法では、基板貼り合わせ工程の前に一対の基板の一方又は両方に開口部を形成 する。開口部は、液晶表示パネルとなる領域 (パネル領域)の外側に形成する。次に 、シール剤を一方の基板に塗布して、パネル領域及び開口部を切れ目なく囲むシー ル部を一方の基板に形成する。次に、シール部を介して一対の基板を互いに対向さ せ、両基板の位置合わせを行う。次に、例えば一対の基板の開口部が形成された部 分を 2枚の保持板で挟むことにより、両基板間を密閉する。次に、例えば真空吸引に より、開口部を介して一対の基板間を減圧する。次に、一対の基板を焼成することに
より基板の貼り合わせが完了する。 A liquid crystal display panel and a manufacturing method thereof according to the first embodiment of the present invention will be described with reference to FIGS. First, a manufacturing method of a liquid crystal display panel which is a premise of the present embodiment will be described. In the international application (PCTZJP2006Z3043 43) by the present applicant, the following technologies are proposed. In the method for manufacturing a liquid crystal display panel according to the application, an opening is formed in one or both of the pair of substrates before the substrate bonding step. The opening is formed outside a region (panel region) to be a liquid crystal display panel. Next, a sealant is applied to one substrate, and a seal portion surrounding the panel region and the opening is formed on the one substrate. Next, the pair of substrates are opposed to each other through the seal portion, and the two substrates are aligned. Next, for example, by sandwiching the portion where the openings of the pair of substrates are formed between two holding plates, the substrates are sealed. Next, the pressure between the pair of substrates is reduced through the opening, for example, by vacuum suction. Next, firing a pair of substrates Thus, the bonding of the substrates is completed.
[0016] この液晶表示パネルの製造方法によれば、一対の基板間が減圧されることにより、 両基板は大気圧により均一に加圧される。よって、従来のようなセルギャップの不均 一や、基板の損傷等の問題が発生することはない。従って、一対の基板を良好に貼 り合わせ固定することができる。 [0016] According to this method for manufacturing a liquid crystal display panel, the pressure between the pair of substrates is reduced, so that both the substrates are uniformly pressurized by atmospheric pressure. Therefore, problems such as conventional cell gap non-uniformity and substrate damage do not occur. Therefore, the pair of substrates can be bonded and fixed satisfactorily.
[0017] ここで、量産を視野にいれた場合、当該出願による液晶表示パネルの製造方法を、 多面取りを行う液晶表示パネルの製造方法に適用する必要がある。 Here, when mass production is taken into consideration, it is necessary to apply the method for manufacturing a liquid crystal display panel according to the application to a method for manufacturing a liquid crystal display panel that performs multi-cavity.
[0018] 液晶表示パネルは、一方又は両方の基板上に電極の端子部を有している。多面取 りを行う場合、端子部をどのように露出させるかが通常問題となる。端子部を露出させ る方法の一つとして、一対の基板を貼り合わせた後に、端子部に対向する部分の基 板を切断して除去する方法がある。し力しながら、端子部を傷つけないように一対の 基板の片方のみを切断することは、極めて困難であるという問題がある。 The liquid crystal display panel has electrode terminal portions on one or both substrates. When multi-sided is used, it is usually a problem how to expose the terminal part. As one method of exposing the terminal portion, there is a method of cutting and removing a portion of the substrate facing the terminal portion after bonding a pair of substrates. However, there is a problem that it is extremely difficult to cut only one of the pair of substrates so as not to damage the terminal portion.
[0019] 特許文献 1には、上述の問題を解決する液晶表示装置の製造方法が開示されてい る。特許文献 1に開示された液晶表示装置の製造方法では、一対の基板を貼り合わ せる前に、端子部に対向する基板の端子部に対向する部分にスリットを形成する。こ のようにスリットを形成して一対の基板を貼り合わせると、端子部はスリットにより露出 する。 Patent Document 1 discloses a method for manufacturing a liquid crystal display device that solves the above-described problems. In the method of manufacturing a liquid crystal display device disclosed in Patent Document 1, before bonding a pair of substrates, a slit is formed in a portion facing the terminal portion of the substrate facing the terminal portion. When a slit is formed in this way and a pair of substrates are bonded together, the terminal portion is exposed by the slit.
[0020] よって、一対の基板を貼り合わせた後に、一方の基板だけを切断する工程が不要 になるので、端子部を傷つけてしまうことがなくなる。従って、多面取りを行っても、液 晶表示パネルの表示品質や製造歩留まりを向上することができる。 [0020] Therefore, after bonding the pair of substrates, a step of cutting only one of the substrates is not necessary, so that the terminal portion is not damaged. Therefore, the display quality and manufacturing yield of the liquid crystal display panel can be improved even when multi-planarization is performed.
[0021] し力しながら、本願出願人による液晶表示パネルの製造方法及び特許文献 1に開 示された液晶表示装置の製造方法を組み合わせた場合、以下の課題が生じる。一 方又は両方の基板にスリットが形成されるので、 2枚の保持板により開口部が形成さ れた部分を挟まれただけでは、一対の基板間は密閉されない。密閉するためには、 さらにスリットを塞がなければいけない。従って、一対の基板間を密閉状態とすること が困難である。従って、仮に真空吸引しても、一対の基板間は減圧されないので、両 基板間を減圧することによる基板貼り合わせ (減圧による貼り合わせ)を実現すること ができない。
[0022] 本実施の形態による液晶表示パネルの製造方法は当該課題を解決し、多面取りを 行う液晶表示パネルの製造方法において減圧による貼り合わせを実施することを可 能とする。 However, when the manufacturing method of the liquid crystal display panel by the applicant of the present application and the manufacturing method of the liquid crystal display device disclosed in Patent Document 1 are combined, the following problems arise. Since a slit is formed in one or both of the substrates, the pair of substrates is not sealed only by sandwiching the portion where the opening is formed by the two holding plates. In order to seal it, it is necessary to close the slit. Therefore, it is difficult to seal between the pair of substrates. Accordingly, even if vacuum suction is performed, the pressure between the pair of substrates is not reduced, so that it is not possible to realize substrate bonding (bonding by reduced pressure) by reducing the pressure between the two substrates. [0022] The method for manufacturing a liquid crystal display panel according to the present embodiment solves the problem and makes it possible to perform bonding by reducing pressure in the method for manufacturing a liquid crystal display panel that performs multi-cavity.
[0023] 本実施の形態による液晶表示パネルの製造方法について図 1乃至図 13を用いて 説明する。図 1は、本実施の形態による液晶表示パネルの製造工程を示すフローチ ヤートである。図 2乃至図 13は、本実施の形態による液晶表示パネルの製造工程を 示す図である。 A method for manufacturing the liquid crystal display panel according to the present embodiment will be described with reference to FIGS. FIG. 1 is a flowchart showing the manufacturing process of the liquid crystal display panel according to the present embodiment. 2 to 13 are views showing a manufacturing process of the liquid crystal display panel according to the present embodiment.
[0024] まず、図 1乃至図 4を用いて、液晶表示パネルの一方の基板側の製造工程(図 1の ステップ SI (a)〜S4 (a) )について説明する。図 2に示すように、複数のパネル領域 1 4を有する多面取り用の基板 (第 1基板) 12'を用意する。基板 12'としては、例えば ポリカーボネート (PC)フィルム基板やポリエチレンテレフタレート(PET)フィルム基 板等のプラスチック基板、又はガラス基板が用いられる。基板 12'は、長方形状の平 面形状を有している。基板 12'の厚さは例えば 0. 2mmである。複数のパネル領域 1 4は、基板 12'の長辺方向(図 2中、左右方向)に 3行、短辺方向(図 2中、上下方向) に 5列のマトリクス状に配置される。各パネル領域 14は、例えば長辺 100mm、短辺 8 Ommの長方形形状を有している。基板 12'の短辺方向及びパネル領域 14の長辺 方向は同一方向であり、基板 12'の長辺方向及びパネル領域 14の短辺方向は同一 方向である。 First, the manufacturing process (steps SI (a) to S4 (a) in FIG. 1) on one substrate side of the liquid crystal display panel will be described with reference to FIGS. As shown in FIG. 2, a multi-sided substrate (first substrate) 12 ′ having a plurality of panel regions 14 is prepared. As the substrate 12 ′, for example, a plastic substrate such as a polycarbonate (PC) film substrate or a polyethylene terephthalate (PET) film substrate, or a glass substrate is used. The substrate 12 ′ has a rectangular planar shape. The thickness of the substrate 12 ′ is, for example, 0.2 mm. The plurality of panel regions 14 are arranged in a matrix of 3 rows in the long side direction (left and right direction in FIG. 2) and 5 columns in the short side direction (up and down direction in FIG. 2) of the substrate 12 ′. Each panel region 14 has, for example, a rectangular shape having a long side of 100 mm and a short side of 8 Omm. The short side direction of the substrate 12 ′ and the long side direction of the panel region 14 are the same direction, and the long side direction of the substrate 12 ′ and the short side direction of the panel region 14 are the same direction.
[0025] 次に、基板 12'上の複数のパネル領域 14毎に、複数の走査電極 17をそれぞれ形 成する(図 1中、ステップ Sl (a);パターニング工程)。これにより、下基板 12が作製さ れる。同一パネル領域 14内の複数の走査電極 17は、互いに平行にパネル領域 14 の長辺方向に延びている。走査電極 17は、帯状に形成される。走査電極 17は、例 えばインジウム錫酸化物(Indium Tin Oxide ;ITO)で形成される。各走査電極 1 7の一端部(図 2中、上側の端部)は、第 1電極端子 17aとなる。同一パネル領域 14 内の複数の第 1電極端子 17aで第 1端子部 61 (図 2では長方形の枠で囲んでいる) が構成される。従って、複数のパネル領域 14のそれぞれは、 1つの第 1端子部 61を 有している。隣り合うパネル領域 14間には、所定の間隙が形成される。 Next, a plurality of scan electrodes 17 are formed for each of the plurality of panel regions 14 on the substrate 12 ′ (step Sl (a) in FIG. 1; patterning step). Thereby, the lower substrate 12 is manufactured. The plurality of scanning electrodes 17 in the same panel region 14 extend in the long side direction of the panel region 14 in parallel with each other. The scanning electrode 17 is formed in a strip shape. The scan electrode 17 is made of, for example, indium tin oxide (ITO). One end portion (upper end portion in FIG. 2) of each scanning electrode 17 becomes a first electrode terminal 17a. A plurality of first electrode terminals 17a in the same panel region 14 constitute a first terminal portion 61 (enclosed by a rectangular frame in FIG. 2). Accordingly, each of the plurality of panel regions 14 has one first terminal portion 61. A predetermined gap is formed between adjacent panel regions 14.
[0026] 次に、図 3に示すように、下基板 12の複数のパネル領域 14毎に第 2スリット 67を形
成する(図 1中、ステップ S2 (a);スリット形成工程)。第 2スリット 67は、下基板 12と後 述する上基板とが貼り合わされた時に、上基板側の端子部 (第 2端子部)に対向する 部分に形成する。また、当該部分の外周隨こも形成してよい。第 2スリット 67は、パネ ル領域 14の長辺方向に延びている。複数の第 2スリット 67は、例えばパンチングによ り一度に形成される。 Next, as shown in FIG. 3, a second slit 67 is formed for each of the plurality of panel regions 14 of the lower substrate 12. (Step S2 (a) in FIG. 1; slit forming step). The second slit 67 is formed in a portion facing the terminal portion (second terminal portion) on the upper substrate side when the lower substrate 12 and an upper substrate described later are bonded together. Moreover, you may also form the outer periphery of the said part. The second slit 67 extends in the long side direction of the panel region 14. The plurality of second slits 67 are formed at a time, for example, by punching.
[0027] 本実施の形態では、同一列に属する 3つのパネル領域 14の 3つの第 2スリット 67が 互いに分離して形成される力 列方向に隣り合う第 2スリット 67の間にもスリットを形成 して 3つの第 2スリット 67を一体的な 1つの第 2スリット 67として形成してもよい。このよ うに第 2スリット 67を形成した場合、 1つの第 2スリット 67は、下基板 12及び上基板の 貼り合わせ時に上基板側の 3つの第 2端子部に対向する。 In the present embodiment, three second slits 67 of three panel regions 14 belonging to the same row are formed separately from each other, and slits are also formed between the second slits 67 adjacent to each other in the force train direction. Thus, the three second slits 67 may be formed as one integral second slit 67. When the second slits 67 are formed in this way, one second slit 67 faces the three second terminal portions on the upper substrate side when the lower substrate 12 and the upper substrate are bonded.
[0028] 次に、下基板 12上に液晶分子の配列を制御するための配向膜 (不図示)等の内部 膜を必要に応じて形成する(図 1中、ステップ S3 (a);内部膜形成工程)。 Next, an internal film such as an alignment film (not shown) for controlling the alignment of liquid crystal molecules is formed on the lower substrate 12 as needed (step S3 (a) in FIG. 1; internal film) Forming step).
[0029] 次に、図 4に示すように、下基板 12上にシール剤をデイスペンサにより塗布して、第 1乃至第 4シール部 71、 73、 75、 77を下基板 12上に形成する(図 1中、ステップ S4 ( a);シール剤塗布工程)。第 1乃至第 4シール部 71、 73、 75、 77は、シール剤を下 基板 12上にスクリーン印刷することにより形成してもよい。シール剤としては、ェポキ シ系の熱硬化性榭脂や、アクリル系の紫外線硬化性榭脂等が用いられる。 Next, as shown in FIG. 4, a sealant is applied onto the lower substrate 12 with a dispenser to form first to fourth seal portions 71, 73, 75, 77 on the lower substrate 12 (see FIG. 4). In FIG. 1, step S4 (a): sealant application process). The first to fourth seal portions 71, 73, 75, 77 may be formed by screen printing a sealing agent on the lower substrate 12. As the sealant, epoxy thermosetting resin, acrylic ultraviolet curable resin, or the like is used.
[0030] 第 1、第 3、第 4シール部 71、 75、 77は、複数のパネル領域 14毎に一体的に形成 される。第 1シール部 71は、第 1端子部 61及びその周囲を切れ目なく囲む。第 2シー ル部 73は、下基板 12の外周部に形成され、長方形の枠形状を有している。第 2シー ル部 73は、複数のパネル領域 14を切れ目なく囲む。 [0030] The first, third, and fourth seal portions 71, 75, and 77 are integrally formed for each of the plurality of panel regions 14. The first seal portion 71 surrounds the first terminal portion 61 and its periphery without a break. The second seal portion 73 is formed on the outer peripheral portion of the lower substrate 12 and has a rectangular frame shape. The second seal portion 73 surrounds the plurality of panel regions 14 without a break.
[0031] 第 3シール部 75は、複数のパネル領域 14のそれぞれの外周部を囲み、第 1端子 部 61を除いて複数の走査電極 17を囲む。第 3シール部 75で囲まれた部分は、液晶 表示パネル 1の表示部となる。第 3シール部 75は、液晶注入用の注入口 75aを有し ている。第 1シール部 71及び第 3シール部 75は一部が重複し、図 4中上下に隣り合 つて配置される。第 4シール部 77は、第 2スリット 67を切れ目なく囲む。第 3シール部 75及び第 4シール部 77は一部が重複し、図 4中左右に隣り合って配置される。 The third seal portion 75 surrounds each outer peripheral portion of the plurality of panel regions 14 and surrounds the plurality of scan electrodes 17 except for the first terminal portion 61. A portion surrounded by the third seal portion 75 is a display portion of the liquid crystal display panel 1. The third seal portion 75 has an injection port 75a for injecting liquid crystal. The first seal portion 71 and the third seal portion 75 partially overlap and are arranged adjacent to each other in the vertical direction in FIG. The fourth seal portion 77 surrounds the second slit 67 without a break. The third seal portion 75 and the fourth seal portion 77 partially overlap and are arranged adjacent to each other on the left and right in FIG.
[0032] 次に、図 5及び図 6を用いて、液晶表示パネルの他方の基板側の製造工程(図 1の
ステップ31 (1))〜340)) )にっぃて説明する。図 5に示すように、下基板 12側のパネ ル領域 14と同様の複数のパネル領域 14を有する多面取り用の基板 (第 2基板) 10' を用意する。基板 10'は、例えば基板 12'と同一材料で形成され、基板 12'とほぼ同 一の形状、大きさ及び厚さを有している。まず、図 5に示すように、基板 10'上の複数 のパネル領域 14毎に、複数のデータ電極 19をそれぞれ形成する(図 1中、ステップ Sl (b);パターニング工程)。これにより、上基板 10が形成される。同一パネル領域 1 4内の複数のデータ電極 19は、互いに平行にパネル領域 14の短辺方向に延びてい る。データ電極 19は、帯状に形成される。データ電極 19は、例えば ITOで形成され る。各データ電極 19の一端部(図 5中、左側の端部)は、第 2電極端子 19aとなる。同 一パネル領域 14内の複数の第 2電極端子 19aで第 2端子部 63が構成される。従つ て、複数のパネル領域 14のそれぞれは、 1つの第 2端子部 63を有している。隣り合う パネル領域 14間には、所定の間隙が形成される。 Next, referring to FIGS. 5 and 6, the manufacturing process of the other substrate side of the liquid crystal display panel (FIG. 1) Steps 31 (1 ) ) to 340 ) ))) will be described. As shown in FIG. 5, a multi-sided substrate (second substrate) 10 ′ having a plurality of panel regions 14 similar to the panel region 14 on the lower substrate 12 side is prepared. The substrate 10 ′ is formed of the same material as the substrate 12 ′, for example, and has substantially the same shape, size, and thickness as the substrate 12 ′. First, as shown in FIG. 5, a plurality of data electrodes 19 are formed for each of a plurality of panel regions 14 on the substrate 10 ′ (in FIG. 1, step Sl (b); patterning step). Thereby, the upper substrate 10 is formed. The plurality of data electrodes 19 in the same panel region 14 extend in the short side direction of the panel region 14 in parallel with each other. The data electrode 19 is formed in a strip shape. The data electrode 19 is made of, for example, ITO. One end of each data electrode 19 (the left end in FIG. 5) serves as the second electrode terminal 19a. A plurality of second electrode terminals 19a in the same panel region 14 constitute a second terminal portion 63. Accordingly, each of the plurality of panel regions 14 has one second terminal portion 63. A predetermined gap is formed between adjacent panel regions 14.
[0033] 次に、図 6に示すように、上基板 10の複数のパネル領域 14毎に第 1スリット 65を形 成する(図 1中、ステップ S2 (b);スリット形成工程)。第 1スリット 65は、上基板 10及び 下基板 12が貼り合わされた時に、第 1端子部 61に対向する部分に形成する。また、 当該部分の外周隨こも形成してよい。第 1スリット 65は、パネル領域 14の短辺方向 に延びている。複数の第 1スリット 65は、例えばパンチングにより一度に形成される。 Next, as shown in FIG. 6, the first slit 65 is formed for each of the plurality of panel regions 14 of the upper substrate 10 (in FIG. 1, step S2 (b); slit forming step). The first slit 65 is formed in a portion facing the first terminal portion 61 when the upper substrate 10 and the lower substrate 12 are bonded together. Moreover, you may also form the outer periphery of the said part. The first slit 65 extends in the short side direction of the panel region 14. The plurality of first slits 65 are formed at once, for example, by punching.
[0034] 本実施の形態では、同一行に属する 5つのパネル領域 14の 5つの第 1スリット 65が 互いに分離して形成される力 行方向に隣り合う第 1スリット 65の間にもスリットを形成 して 5つの第 1スリット 65を一体的な 1つの第 1スリット 65として形成してもよい。このよ うに第 1スリット 65を形成した場合、 1つの第 1スリット 65は、上基板 10及び下基板 12 の貼り合わせ時に 5つの第 1端子部 61に対向する。 In the present embodiment, five first slits 65 in five panel regions 14 belonging to the same row are formed separately from each other, and slits are also formed between first slits 65 adjacent in the power running direction. Then, the five first slits 65 may be formed as one integral first slit 65. When the first slits 65 are formed in this way, one first slit 65 faces the five first terminal portions 61 when the upper substrate 10 and the lower substrate 12 are bonded together.
[0035] また、図 6に示すように、複数の第 1スリット 65の形成と同工程で、上基板 10の端部 Further, as shown in FIG. 6, in the same process as the formation of the plurality of first slits 65, the end of the upper substrate 10 is
(図 6中、中央下部)に開口部 13を形成する。開口部 13は、上基板 10及び下基板 1 2が貼り合わされた時に、第 2シール部 73により切れ目なく囲まれる領域内に形成さ れる。開口部 13は、例えば 4mm径の円形形状を有している。開口部 13は、複数の パネル領域 14以外の領域であれば上基板 10の別の場所に形成してもよ 、。また、 開口部 13は、上基板 10でなく下基板 12に形成してもよい。
[0036] 次に、上基板 10に液晶分子の配列を制御するための配向膜 (不図示)等の内部膜 を必要に応じて形成する(図 1中、ステップ S3 (b);内部膜形成工程)。 An opening 13 is formed at the center lower portion in FIG. The opening 13 is formed in a region surrounded by the second seal portion 73 without a break when the upper substrate 10 and the lower substrate 12 are bonded together. The opening 13 has a circular shape with a diameter of 4 mm, for example. The opening 13 may be formed at a different location on the upper substrate 10 as long as it is an area other than the plurality of panel areas 14. Further, the opening 13 may be formed in the lower substrate 12 instead of the upper substrate 10. [0036] Next, an inner film such as an alignment film (not shown) for controlling the alignment of liquid crystal molecules is formed on the upper substrate 10 as necessary (step S3 (b) in FIG. 1; inner film formation). Process).
[0037] 次に、上基板 10上にスぺーサを散布する(図 1中、ステップ S4 (b);スぺーサ散布 工程)。スぺーサは、上基板 10及び下基板 12が貼り合わされた時に、上下基板 10、 12間の距離 (セルギャップ)を均一に保持するために散布する。スぺーサは、例えば 5. Ο μ ηι の球形形状を有して 、る。 Next, a spacer is sprayed on the upper substrate 10 (in FIG. 1, step S4 (b); spacer spraying step). When the upper substrate 10 and the lower substrate 12 are bonded to each other, the spacer is sprayed to keep the distance (cell gap) between the upper and lower substrates 10 and 12 uniform. The spacer has, for example, a spherical shape of 5. Ο μ ηι.
[0038] 第 1及び第 2スリット 65、 67を形成する工程 (ステップ S2 (a)、 S2 (b) )は、基板位置 合わせ工程(図 1中、ステップ S5)前の任意の段階で行うことができる。例えば、走査 電極 17及びデータ電極 19を形成する (ステップ S I (a)、 SI (b) )前に第 1及び第 2ス リット 65、 67を形成してもよい。また、内部膜形成 (ステップ S3 (a)、 S3 (b) )後に第 1 及び第 2スリット 65、 67を形成してもよい。また、シール剤を塗布して第 1乃至第 4シ ール部 71、 73、 75、 77を形成した (ステップ S4 (a) )後に第 1及び第 2スリット 65、 67 を形成してもよい。 [0038] The process of forming the first and second slits 65 and 67 (steps S2 (a) and S2 (b)) is performed at an arbitrary stage before the substrate alignment process (step S5 in FIG. 1). Can do. For example, the first and second slits 65 and 67 may be formed before the scan electrode 17 and the data electrode 19 are formed (steps S I (a) and SI (b)). Further, the first and second slits 65 and 67 may be formed after the inner film formation (steps S3 (a) and S3 (b)). Further, the first and second seal portions 71, 73, 75, 77 may be formed by applying a sealant (step S4 (a)), and then the first and second slits 65, 67 may be formed. .
[0039] また、シール剤塗布 (ステップ S4 (a) )及びスぺーサ散布 (ステップ S4 (b) )は、上基 板 10及び下基板 12のどちらの基板にしてもよい。例えば、上基板 10上ではなく下基 板 12上にスぺーサを散布してもよい。また、下基板 12上ではなく上基板 10上に第 1 乃至第 4シール部 71、 73、 75、 77を形成してもよい。 [0039] The sealing agent application (step S4 (a)) and the spacer spraying (step S4 (b)) may be performed on either the upper substrate 10 or the lower substrate 12. For example, a spacer may be spread on the lower substrate 12 instead of the upper substrate 10. In addition, the first to fourth seal portions 71, 73, 75, 77 may be formed on the upper substrate 10 instead of on the lower substrate 12.
[0040] 上基板 10上にシール剤を塗布する場合、第 1シール部 71は第 1スリット 65を切れ 目なく囲む。また、上基板 10上にシール剤を塗布する場合、第 4シール部 77は、上 基板 10及び下基板 12が貼り合わされた時に、第 2スリット 67に対向する部分 (第 2端 子部 63及びその周囲)を切れ目なく囲む。 [0040] When a sealing agent is applied on the upper substrate 10, the first seal portion 71 surrounds the first slit 65 without a break. Further, when a sealing agent is applied on the upper substrate 10, the fourth seal portion 77 is a portion (the second terminal portion 63 and the portion facing the second slit 67) when the upper substrate 10 and the lower substrate 12 are bonded together. Surround the surrounding area).
[0041] 次に、上下基板 10、 12を用いた液晶表示パネルの製造工程(図 1のステップ S5〜 S 11)について説明する。まず、図 7に示すように、第 1乃至第 4シール部 71、 73、 75 、 77を介して上基板 10と下基板 12とを対向させ、上基板 10及び下基板 12の位置 合わせを行い、合わせ基板 20を作製する(図 1中、ステップ S5 ;基板位置合わせェ 程)。図 7は、合わせ基板 20を上基板 10側力も図示する平面図である。図 7では、表 側に上基板 10が配置され、裏側に下基板 12が配置されている。また、図 7及び以降 の図では、隠れ線を破線で示す。
[0042] 図 7に示すように、合わせ基板 20を作製する際、複数のパネル領域 14のそれぞれ で第 1端子部 61及び第 1スリット 65が対向するようにし、第 2端子部 63及び第 2スリツ ト 67が対向するようにする。第 1スリット 65は、複数の第 1電極端子 17aの全てに対向 する。第 2スリット 67は、複数の第 2電極端子 19aの全てに対向する。なお、図 7及び 以降の図では、第 1スリット 65を介して露出する第 1端子部 61を除く走査電極 17、及 び第 2スリット 67を介して露出する第 2端子部 63を除くデータ電極 19の図示を省略 する。 Next, a process for manufacturing a liquid crystal display panel using the upper and lower substrates 10 and 12 (steps S5 to S11 in FIG. 1) will be described. First, as shown in FIG. 7, the upper substrate 10 and the lower substrate 12 are opposed to each other through the first to fourth seal portions 71, 73, 75, 77, and the upper substrate 10 and the lower substrate 12 are aligned. Then, the alignment substrate 20 is manufactured (step S5 in FIG. 1; substrate alignment step). FIG. 7 is a plan view illustrating the combined substrate 20 and the upper substrate 10 side force. In FIG. 7, the upper substrate 10 is arranged on the front side, and the lower substrate 12 is arranged on the back side. In Fig. 7 and subsequent figures, hidden lines are indicated by broken lines. As shown in FIG. 7, when the laminated substrate 20 is manufactured, the first terminal portion 61 and the first slit 65 are opposed to each other in the plurality of panel regions 14, and the second terminal portion 63 and the second Make sure that the slit 67 faces each other. The first slit 65 faces all of the plurality of first electrode terminals 17a. The second slit 67 faces all of the plurality of second electrode terminals 19a. In FIG. 7 and the subsequent figures, the scanning electrode 17 excluding the first terminal portion 61 exposed through the first slit 65 and the data electrode excluding the second terminal portion 63 exposed through the second slit 67 are shown. Illustration of 19 is omitted.
[0043] 第 1シール部 71は第 1スリット 65を切れ目なく囲み、第 4シール部 77は第 2スリット 6 7を切れ目なく囲む。第 2シール部 73は、複数のパネル領域 14及び開口部 13を切 れ目なく囲む。合わせ基板 20を作製した状態では、下基板 12上に上基板 10を位置 合わせして仮に載置しただけであり、上基板 10及び下基板 12は完全に貼り合わせ 固定されてはいない。 The first seal portion 71 surrounds the first slit 65 without break, and the fourth seal portion 77 surrounds the second slit 67 without break. The second seal portion 73 seamlessly surrounds the plurality of panel regions 14 and the opening 13. In the state in which the laminated substrate 20 is manufactured, the upper substrate 10 is merely positioned and temporarily placed on the lower substrate 12, and the upper substrate 10 and the lower substrate 12 are not completely bonded and fixed.
[0044] 次に、シール剤として熱硬化性榭脂を用いた場合には、合わせ基板 20全体を恒温 槽 (不図示)を用いて加熱して、また、シール剤として紫外線硬化性榭脂を用いた場 合には、外部から合わせ基板 20全体に紫外線を照射して、第 1乃至第 4シール部 7 1、 73、 75、 77を硬ィ匕する(図 1中、ステップ S6 ;シーノレ剤硬ィ匕工程)。 [0044] Next, when a thermosetting resin is used as the sealant, the entire laminated substrate 20 is heated using a thermostatic bath (not shown), and an ultraviolet curable resin is used as the sealant. When used, the entire laminated substrate 20 is irradiated with ultraviolet rays from the outside to harden the first to fourth seal portions 71, 73, 75, 77 (in FIG. 1, step S6; Hard key process).
[0045] 次に、図 8 (a)乃至図 10を用いて、基板貼り合わせ工程(図 1中、ステップ S7 ;減圧 貼り合わせ工程)について説明する。シール剤硬化工程の次に、図 8 (a)に示すよう に、上基板 10を上にして、合わせ基板 20の開口部 13が形成された端部を保持板 2 2に載置する。次に、図 8 (b)に示すように、合わせ基板 20の開口部 13が形成された 端部を 2枚の保持板 22、 24で挟む。図 8 (b)は、合わせ基板 20の端部が 2枚の保持 板 22、 24によって挟まれた状態を示している。保持板 24には真空吸引用の管 24a が設けられている。管 24aは真空ポンプ (不図示)に接続されている。保持板 22、 24 の互いに対向する側の面の外周部にはシリコンゴム 23、 25が設けられている。 Next, the substrate bonding step (step S7 in FIG. 1; reduced pressure bonding step) will be described with reference to FIGS. Next to the sealing agent curing step, as shown in FIG. 8 (a), the upper substrate 10 is turned up and the end portion of the laminated substrate 20 where the opening 13 is formed is placed on the holding plate 22. Next, as shown in FIG. 8 (b), the end portion of the laminated substrate 20 where the opening 13 is formed is sandwiched between two holding plates 22 and 24. FIG. 8B shows a state in which the end portion of the laminated substrate 20 is sandwiched between the two holding plates 22 and 24. The holding plate 24 is provided with a tube 24a for vacuum suction. The tube 24a is connected to a vacuum pump (not shown). Silicone rubbers 23 and 25 are provided on the outer peripheral portions of the surfaces of the holding plates 22 and 24 facing each other.
[0046] 次に、真空ポンプ (不図示)により開口部 13を介して管 24aから上下基板 10、 12間 を真空吸引する。図 9は、真空吸引時の合わせ基板 20を上基板 10側から図示する 平面図である。図 9では、真空吸引時の上下基板 10、 12間の空気の流れを白抜き の矢印で模式的に示している。また、図 9では保持板 22、 24の図示を省略している。
図 10は、図 9の A— A線で切断した断面を示している。図 10では、真空吸引時の空 気の流れを相対的に小さ ヽ白抜きの矢印で模式的に示して 、る。 Next, vacuum suction is performed between the upper and lower substrates 10 and 12 from the tube 24 a through the opening 13 by a vacuum pump (not shown). FIG. 9 is a plan view illustrating the laminated substrate 20 during vacuum suction from the upper substrate 10 side. In FIG. 9, the flow of air between the upper and lower substrates 10 and 12 during vacuum suction is schematically shown by white arrows. In FIG. 9, the holding plates 22 and 24 are not shown. FIG. 10 shows a cross section taken along line AA in FIG. In Fig. 10, the air flow during vacuum suction is shown schematically with relatively small white arrows.
[0047] 図 10に示すように、上下基板 10、 12は、第 1乃至第 4シール部 71、 73、 75、 77及 びスぺーサ 16を介して、所定の間隔(セルギャップ)で対向している。図 9に示すよう に、上下基板 10、 12間は第 2シール部 73によって切れ目なく囲まれている。図 9及 び図 10に示すように、第 1スリット 65は第 1シール部 71によって切れ目なく囲まれて いる。また、図 9に示すように、第 2スリット 67は第 4シール部 77によって切れ目なく囲 まれている。従って、第 2シール部 73により囲まれた上下基板 10、 12間は、第 1シー ル部 71又は第 4シール部 77により囲まれた部分を除いて、保持板 22、 24並びに第 1、第 2及び第 4シール部 71、 73、 77によって密閉状態になっている。 As shown in FIG. 10, the upper and lower substrates 10 and 12 face each other at a predetermined interval (cell gap) via the first to fourth seal portions 71, 73, 75, 77 and the spacer 16. is doing. As shown in FIG. 9, the upper and lower substrates 10 and 12 are surrounded by the second seal portion 73 without a break. As shown in FIGS. 9 and 10, the first slit 65 is surrounded by the first seal portion 71 without a break. In addition, as shown in FIG. 9, the second slit 67 is surrounded by the fourth seal portion 77 without any breaks. Therefore, between the upper and lower substrates 10 and 12 surrounded by the second seal portion 73, except for the portion surrounded by the first seal portion 71 or the fourth seal portion 77, the holding plates 22 and 24 and the first and first substrates Sealed by 2 and 4th seal parts 71, 73, 77.
[0048] 従って、図 9及び図 10に示すように、真空吸引により、保持板 22、 24間の空間及 び開口部 13を介して、上下基板 10、 12間の当該密閉状態になっている部分(図 10 では、空間 81)が減圧される。これにより、図 10で相対的に大きい白抜きの矢印で模 式的に示すように、合わせ基板 20の両面は大気圧により加圧され、上下基板 10、 1 2が貼り合わせ固定される。次に、合わせ基板 20を焼成する。 Therefore, as shown in FIG. 9 and FIG. 10, the sealed state between the upper and lower substrates 10 and 12 is obtained by vacuum suction through the space between the holding plates 22 and 24 and the opening 13. The part (in Fig. 10, space 81) is decompressed. Accordingly, as schematically shown by relatively large white arrows in FIG. 10, both surfaces of the laminated substrate 20 are pressurized by atmospheric pressure, and the upper and lower substrates 10 and 12 are bonded and fixed. Next, the laminated substrate 20 is fired.
[0049] 上下基板 10、 12間の密閉状態になっている部分が減圧されることにより、上下基 板 10、 12は大気圧により均一に加圧される。よって、従来のようなセルギャップの不 均一や、上下基板 10、 12の損傷等の問題が発生することはない。従って、上下基板 10、 12を良好に貼り合わせ固定することができる。 [0049] When the sealed portion between the upper and lower substrates 10 and 12 is depressurized, the upper and lower substrates 10 and 12 are uniformly pressurized by atmospheric pressure. Therefore, problems such as cell gap non-uniformity and damage to the upper and lower substrates 10 and 12 are not caused. Therefore, the upper and lower substrates 10 and 12 can be bonded and fixed satisfactorily.
[0050] 次に、図 11に示すように、合わせ基板 20の長辺方向に平行で注入口 75aの配列 方向に沿った 3本の切断線 L1で合わせ基板 20を切断する(図 1中、ステップ S8 ;第 1切断工程)。図 12は、切断後の 3つの合わせ基板 20を示している。図 12に示すよう に、切断後の各合わせ基板 20は 5つのパネル領域 14を有している。各パネル領域 1 4の注入口 75aは合わせ基板 20の端面に露出する。 Next, as shown in FIG. 11, the laminated substrate 20 is cut along three cutting lines L1 parallel to the long side direction of the laminated substrate 20 and along the arrangement direction of the injection ports 75a (in FIG. 1, Step S8: First cutting step). FIG. 12 shows the three laminated substrates 20 after cutting. As shown in FIG. 12, each laminated substrate 20 after cutting has five panel regions 14. The inlet 75a of each panel region 14 is exposed at the end face of the laminated substrate 20.
[0051] 次に、パネル領域 14毎に、第 3シール部 75に囲まれた上下基板 10、 12間に液晶 を例えばディップ式の真空注入法により注入する(図 1中、ステップ S9;液晶注入ェ 程)。液晶注入工程について簡単に説明する。まず、合わせ基板 20を真空チャンバ (不図示)内に入れる。次に、真空チャンバ内を減圧して真空にする。次に、真空チヤ
ンバ内を真空に保ったまま、合わせ基板 20の注入口 75aを液晶内へ浸す。次に、真 空チャンバ内の真空を解除する。これにより、上下基板 10、 12間に液晶が注入され る。次に、図 13に示すように、注入口 75aに封止剤 79を形成し、注入口 75aを封止 剤 79により封止する(図 1中、ステップ S9 ;液晶封止工程)。これにより、第 3シール部 75に囲まれた上下基板 10、 12間に注入された液晶は、上下基板 10、 12間に封止 される。 Next, for each panel region 14, liquid crystal is injected between the upper and lower substrates 10 and 12 surrounded by the third seal portion 75 by, for example, a dip vacuum injection method (in FIG. 1, step S 9; liquid crystal injection) D) The liquid crystal injection process will be briefly described. First, the alignment substrate 20 is placed in a vacuum chamber (not shown). Next, the vacuum chamber is depressurized to make a vacuum. Next, vacuum check While maintaining the inside of the chamber in a vacuum, the inlet 75a of the alignment substrate 20 is immersed in the liquid crystal. Next, release the vacuum in the vacuum chamber. As a result, liquid crystal is injected between the upper and lower substrates 10 and 12. Next, as shown in FIG. 13, a sealing agent 79 is formed at the inlet 75a, and the inlet 75a is sealed with the sealing agent 79 (step S9 in FIG. 1; liquid crystal sealing step). Thereby, the liquid crystal injected between the upper and lower substrates 10 and 12 surrounded by the third seal portion 75 is sealed between the upper and lower substrates 10 and 12.
[0052] 次に、図 13に示すように、切断線 L2、切断線 L3及び切断線 L4で合わせ基板 20 を切断する(図 1中、ステップ S 10 ;第 2切断工程)。図 13は、切断線 L2、 L3、 L4の 位置を示している。切断線 L2は、合わせ基板 20の長辺方向に平行で、合わせ基板 20の基板面法線方向に見て複数のパネル領域 14の第 1スリット 65と重なり、第 1端 子部 61と重ならない直線である。切断線 L3、 L4はパネル領域 14 (図 13では不図示 )毎に設けられ、合わせ基板 20の短辺方向に平行な直線である。各切断線 L3は、 第 3シール部 75の図 13中左側近傍を通る直線である。各切断線 L4は、合わせ基板 20の基板面法線方向に見て第 2スリット 67と重なり、第 2端子部 63と重ならない直線 である。切断線 L2、 L3、 L4で合わせ基板 20を切断することより、合わせ基板 20がパ ネル領域 14毎に分断される。これにより、それぞれ第 1及び第 2端子部 61、 63を有 する複数 (本実施の形態では 15個)の液晶表示パネル 1が完成する(図 1中、ステツ プ S11 ;パネル完成)。なお、本実施の形態では液晶を注入した後にパネル領域 14 毎に分断している力 パネル領域 14毎に分断した後に液晶を注入してもよい。その 後、周辺回路等を設けて、液晶表示素子が完成する。 Next, as shown in FIG. 13, the laminated substrate 20 is cut along the cutting line L2, the cutting line L3, and the cutting line L4 (in FIG. 1, step S10; second cutting step). FIG. 13 shows the positions of the cutting lines L2, L3, and L4. The cutting line L2 is parallel to the long side direction of the laminated substrate 20, overlaps with the first slits 65 of the plurality of panel regions 14 when viewed in the normal direction of the substrate surface of the laminated substrate 20, and does not overlap with the first terminal portion 61. It is a straight line. The cutting lines L3 and L4 are provided for each panel region 14 (not shown in FIG. 13) and are straight lines parallel to the short side direction of the laminated substrate 20. Each cutting line L3 is a straight line passing through the vicinity of the left side of the third seal portion 75 in FIG. Each cutting line L4 is a straight line that overlaps the second slit 67 and does not overlap the second terminal portion 63 when viewed in the normal direction of the substrate surface of the laminated substrate 20. By cutting the laminated substrate 20 along the cutting lines L2, L3, and L4, the laminated substrate 20 is divided for each panel region 14. As a result, a plurality (15 in this embodiment) of liquid crystal display panels 1 each having the first and second terminal portions 61 and 63 are completed (step S11 in FIG. 1; panel completion). In this embodiment, the liquid crystal is injected after being divided for each panel region 14 after the liquid crystal is injected. After that, peripheral circuits and the like are provided to complete the liquid crystal display element.
[0053] 本実施の形態による液晶表示パネル 1の製造方法によれば、上下基板 10、 12を 貼り合わせたときに、第 1スリット 65は第 1シール部 71によって切れ目なく囲まれ、第 2スリット 67は第 4シール部 77によって切れ目なく囲まれる。よって、上下基板 10、 1 2の開口部 13が形成されている端部を保持板 22、 24で挟むことにより、第 2シール 部 73により囲まれた上下基板 10、 12間は、第 1シール部 71又は第 4シール部 77に より囲まれた部分を除いて、保持板 22、 24並びに第 1、第 2及び第 4シール部 71、 7 3、 77によって密閉される。よって、第 1及び第 2スリット 65、 67が形成されても、上下 基板 10、 12間を減圧することによる基板貼り合わせ (減圧による貼り合わせ)を実現
することができる。従って、多面取りと減圧による貼り合わせとを組み合わせた製造方 法を実現することができる。従って、本実施の形態による液晶表示パネル 1の製造方 法によれば、多面取りを行っても液晶表示パネルの表示品質や製造歩留まりを向上 することができる。 According to the method for manufacturing liquid crystal display panel 1 according to the present embodiment, when upper and lower substrates 10 and 12 are bonded together, first slit 65 is surrounded by first seal portion 71 without a break, and second slit 67 is surrounded by the fourth seal portion 77 without any breaks. Therefore, by sandwiching the end portions of the upper and lower substrates 10 and 12 where the openings 13 are formed between the holding plates 22 and 24, the first seal is provided between the upper and lower substrates 10 and 12 surrounded by the second seal portion 73. Except for the portion surrounded by the portion 71 or the fourth seal portion 77, the holding plates 22, 24 and the first, second and fourth seal portions 71, 73, 77 are sealed. Therefore, even if the first and second slits 65 and 67 are formed, substrate bonding (bonding by reduced pressure) is realized by reducing the pressure between the upper and lower substrates 10 and 12. can do. Therefore, it is possible to realize a manufacturing method that combines multiple chamfering and pasting with reduced pressure. Therefore, according to the method for manufacturing the liquid crystal display panel 1 according to the present embodiment, the display quality and the manufacturing yield of the liquid crystal display panel can be improved even when multi-paneling is performed.
[0054] また、上基板 10の端部に開口部 13を形成するので、保持板 22、 24を小型化する ことができる。従って、低コストで液晶表示パネル 1を製造することができる。また、第 2 シール部 73を下基板 12の外周部に形成するので、上下基板 10、 12内にパネル領 域 14を多く形成することができる。従って、低コストで液晶表示パネル 1を製造するこ とができる。また、第 1スリット 65は複数の第 1電極端子 17aの全てに対向し、第 1電 極端子 17aの全てを露出させるので、第 1電極端子 17aと外部との接続が容易になる 。同様に、第 2スリット 67は複数の第 2電極端子 19aの全てに対向し、第 2電極端子 1 9aの全てを露出させるので、第 2電極端子 19aと外部との接続が容易になる。 In addition, since the opening 13 is formed at the end of the upper substrate 10, the holding plates 22 and 24 can be reduced in size. Therefore, the liquid crystal display panel 1 can be manufactured at a low cost. Further, since the second seal portion 73 is formed on the outer peripheral portion of the lower substrate 12, a large number of panel regions 14 can be formed in the upper and lower substrates 10 and 12. Therefore, the liquid crystal display panel 1 can be manufactured at a low cost. Further, since the first slit 65 faces all of the plurality of first electrode terminals 17a and exposes all of the first electrode terminals 17a, the connection between the first electrode terminal 17a and the outside becomes easy. Similarly, since the second slit 67 faces all of the plurality of second electrode terminals 19a and exposes all of the second electrode terminals 19a, the connection between the second electrode terminal 19a and the outside becomes easy.
[0055] 図 14は、本実施の形態による液晶表示パネル 1の製造方法により製造された液晶 表示パネル 1を上基板 10側から図示する平面図である。図 14に示すように、液晶表 示パネル 1は、対向配置された上基板 (第 2基板) 10及び下基板 (第 1基板) 12を有 している。上下基板 10、 12間の外周部には、第 3シール部(シール部) 75が形成さ れている。第 3シール部 75は、液晶注入用の注入口 75aを有している。注入口 75a は、封止剤 79によって封止されている。第 3シール部 75及び封止剤 79により囲まれ た上下基板 10、 12間には、液晶(不図示)が封止されている。 FIG. 14 is a plan view illustrating the liquid crystal display panel 1 manufactured by the method of manufacturing the liquid crystal display panel 1 according to the present embodiment from the upper substrate 10 side. As shown in FIG. 14, the liquid crystal display panel 1 has an upper substrate (second substrate) 10 and a lower substrate (first substrate) 12 arranged to face each other. A third seal portion (seal portion) 75 is formed on the outer peripheral portion between the upper and lower substrates 10 and 12. The third seal portion 75 has an injection port 75a for injecting liquid crystal. The injection port 75a is sealed with a sealant 79. A liquid crystal (not shown) is sealed between the upper and lower substrates 10 and 12 surrounded by the third seal portion 75 and the sealant 79.
[0056] 下基板 12上には、複数の走査電極 17 (図 14では不図示)が形成されている。複数 の走査電極 17の一端部であって、第 3シール部 75の外側(図 14中上側)には、第 1 端子部 61が形成されている。第 1端子部 61と対向する上基板 10の部分には、切り 込み部(第 1切り込み部) 65aが形成されている。切り込み部 65aは、スリット形成工程 で形成した第 1スリット 65の一部(又は全部)である。切り込み部 65aは、第 1端子部 6 1を露出させている。 A plurality of scanning electrodes 17 (not shown in FIG. 14) are formed on the lower substrate 12. A first terminal 61 is formed at one end of the plurality of scanning electrodes 17 and outside the third seal portion 75 (upper side in FIG. 14). A cut portion (first cut portion) 65a is formed in the portion of the upper substrate 10 facing the first terminal portion 61. The cut portion 65a is a part (or all) of the first slit 65 formed in the slit forming step. The cut portion 65a exposes the first terminal portion 61.
[0057] 上基板 10上には、複数のデータ電極 19 (図 14では不図示)が形成されている。複 数のデータ電極 19の一端部であって、第 3シール部 75の外側(図 14中右側)には、 第 2端子部 63が形成されている。第 2端子部 63と対向する下基板 12の部分には、
切り込み部(第 2切り込み部) 67aが形成されている。切り込み部 67aは、スリット形成 工程で形成した第 2スリット 67の一部(又は全部)である。切り込み部 67aは、第 2端 子部 63を露出させている。 A plurality of data electrodes 19 (not shown in FIG. 14) are formed on the upper substrate 10. A second terminal portion 63 is formed at one end of the plurality of data electrodes 19 and outside the third seal portion 75 (right side in FIG. 14). In the portion of the lower substrate 12 facing the second terminal portion 63, A notch (second notch) 67a is formed. The cut portion 67a is a part (or all) of the second slit 67 formed in the slit forming step. The cut portion 67a exposes the second terminal portion 63.
[0058] 本実施の形態による液晶表示パネル 1は、第 3シール部 75から分岐し上下基板 10 、 12の基板端面まで突出して形成された第 1突出シール部 71a及び第 2突出シール 部 77aを備えている点に特徴を有している。第 1突出シール部 71aは、シール剤塗布 工程で形成した第 1シール部 71の一部である。第 1突出シール部 71aは、第 3シー ル部 75の図 14中上側の角部 2ケ所カも第 1端子部 61側に突出して形成されている 。第 2突出シール部 77aは、シール剤塗布工程で形成した第 4シール部 77の一部で ある。第 2突出シール部 77aは、図 14中右側の角部 2ケ所から第 2端子部 63側に突 出して形成されている。 The liquid crystal display panel 1 according to the present embodiment includes a first projecting seal portion 71a and a second projecting seal portion 77a that are branched from the third seal portion 75 and project to the substrate end surfaces of the upper and lower substrates 10 and 12. It has a feature in that it has. The first projecting seal portion 71a is a part of the first seal portion 71 formed in the sealant application process. The first protruding seal portion 71a is formed such that two corners on the upper side in FIG. 14 of the third seal portion 75 also protrude toward the first terminal portion 61 side. The second projecting seal portion 77a is a part of the fourth seal portion 77 formed in the sealant application process. The second projecting seal portion 77a is formed to project from the two corners on the right side in FIG. 14 to the second terminal portion 63 side.
[0059] また、本実施の形態による液晶表示パネル 1は、第 3シール部 75の図 14中上側の 角部 2ケ所カも第 1端子部 61側に突出した突出部 10aを上基板 10が備え、図 14中 右側の角部 2ケ所カも第 2端子部 63側に突出した突出部 12aを下基板 12が備えて いる点にも特徴を有している。突出部 10aは、第 1突出シール部 71aの近傍に形成さ れている。突出部 12aは、第 2突出シール部 77aの近傍に形成されている。 [0059] In addition, in the liquid crystal display panel 1 according to the present embodiment, the upper substrate 10 has the protruding portion 10a protruding to the first terminal portion 61 side at the two corners on the upper side in FIG. 14 is also characterized in that the lower substrate 12 is provided with a protruding portion 12a protruding to the second terminal portion 63 side at two corners on the right side in FIG. The protruding portion 10a is formed in the vicinity of the first protruding seal portion 71a. The protruding portion 12a is formed in the vicinity of the second protruding seal portion 77a.
[0060] 上下基板 10、 12としてプラスチック基板を用いた従来の液晶表示パネルは、薄型 化や軽量ィ匕が可能であり、かつ十分な可撓性を備え折り曲げ可能であるが、一般に シール部の角部が剥離しやすいという問題がある。本実施の形態による液晶表示パ ネル 1では、第 3シール部 75の角部近傍に第 1及び第 2突出シール部 71a、 77a並 びに突出部 10a、 12aが形成されているので、当該角部が補強される。よって、第 3シ ール部 75の角部が剥離しに《なる。従って、薄型化や軽量ィ匕が可能であり、十分な 可撓性を備え、かつ強度が強い液晶表示パネル 1を実現できる。このため本実施の 形態による液晶表示パネル 1は、薄型、軽量で高い可撓性が求められる電子ぺーパ 一の表示素子として適して 、る。 [0060] A conventional liquid crystal display panel using plastic substrates as the upper and lower substrates 10 and 12 can be reduced in thickness and weight, and can be bent with sufficient flexibility. There is a problem that corners are easily peeled off. In the liquid crystal display panel 1 according to the present embodiment, the first and second projecting seal portions 71a and 77a and the projecting portions 10a and 12a are formed in the vicinity of the corner portion of the third seal portion 75. Is reinforced. Therefore, the corner portion of the third seal portion 75 is peeled. Accordingly, it is possible to realize a liquid crystal display panel 1 that can be reduced in thickness and weight, has sufficient flexibility, and has high strength. For this reason, the liquid crystal display panel 1 according to the present embodiment is suitable as a display element for electronic paper that is thin, lightweight, and requires high flexibility.
[0061] [第 2の実施の形態] [0061] [Second Embodiment]
本発明の第 2の実施の形態による液晶表示パネル及びその製造方法について図 1 、図 15及び図 16を用いて説明する。まず、本実施の形態による液晶表示パネルの
製造方法について図 1及び図 15を用いて説明する。本実施の形態による液晶表示 パネルの製造方法は、シール剤塗布工程(図 1中、ステップ S4 (a) )を除いて、第 1の 実施の形態による液晶表示パネル 1の製造方法と同様である。なお、以下の説明に おいて、第 1の実施の形態と同一の機能、作用を奏する構成要素には同一の符号を 付して詳細な説明を省略する。 A liquid crystal display panel according to a second embodiment of the present invention and a method for manufacturing the same will be described with reference to FIGS. First, the liquid crystal display panel according to the present embodiment The manufacturing method will be described with reference to FIGS. The manufacturing method of the liquid crystal display panel according to the present embodiment is the same as the manufacturing method of the liquid crystal display panel 1 according to the first embodiment, except for the sealing agent application step (step S4 (a) in FIG. 1). . In the following description, components having the same functions and operations as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
[0062] 図 15は、基板位置合わせ工程(図 1中、ステップ S 5)終了時の合わせ基板 20を上 基板 10側から図示する平面図である。図 15に示すように、本実施の形態による液晶 表示パネルの製造方法は、第 1の実施の形態による液晶表示パネル 1の製造方法に 対して、同一パネル領域 14内の第 1及び第 2スリット 65、 67を切れ目なく囲むように 第 1シール部 71を形成する点に特徴を有している。従って、同一パネル領域 14内の 第 1及び第 2スリット 65、 67は、一つの第 1シール部 71によって切れ目なく囲まれる。 FIG. 15 is a plan view illustrating the aligned substrate 20 at the end of the substrate alignment step (step S 5 in FIG. 1) from the upper substrate 10 side. As shown in FIG. 15, the liquid crystal display panel manufacturing method according to the present embodiment is different from the liquid crystal display panel 1 manufacturing method according to the first embodiment in that the first and second slits in the same panel region 14 are the same. It is characterized in that the first seal portion 71 is formed so as to surround the 65 and 67 without a break. Accordingly, the first and second slits 65 and 67 in the same panel region 14 are surrounded by one first seal portion 71 without any break.
[0063] 本実施の形態による液晶表示パネルの製造方法について簡単に説明する。まず、 第 1の実施の形態による液晶表示パネル 1の製造方法と同様の製造方法により、基 板 12'上の複数のパネル領域 14毎に走査電極 17及び第 1端子部 61を形成して下 基板 12を作製し、下基板 12の複数のパネル領域 14毎に第 2スリット 67を形成し、下 基板 12上に内部膜を形成する(図 1中、ステップ SI (a)乃至 S3 (a) )。第 2スリット 67 は、上基板 10及び下基板 12を貼り合わせた時に、第 2端子部 63に対向する部分に 形成する。 A method for manufacturing the liquid crystal display panel according to the present embodiment will be briefly described. First, the scan electrode 17 and the first terminal portion 61 are formed for each of the plurality of panel regions 14 on the substrate 12 ′ by a manufacturing method similar to the manufacturing method of the liquid crystal display panel 1 according to the first embodiment. The substrate 12 is manufactured, the second slit 67 is formed for each of the plurality of panel regions 14 of the lower substrate 12, and an internal film is formed on the lower substrate 12 (in FIG. 1, steps SI (a) to S3 (a) ). The second slit 67 is formed in a portion facing the second terminal portion 63 when the upper substrate 10 and the lower substrate 12 are bonded together.
[0064] 次に、下基板 12上にシール剤を塗布して、第 1乃至第 3シール部 71、 73、 75を下 基板 12上に形成する(図 1中、ステップ S4 (a);シール剤塗布工程)。第 1シール部 7 1は、上基板 10及び下基板 12が貼り合わされた時に、第 1スリット 65に対向する部分 (第 1端子部 61及びその周囲)と第 2スリット 67とを切れ目なく囲む。第 2及び第 3シー ル部の形状は、第 1の実施の形態による液晶表示パネル 1の製造方法での形状と同 様である。本実施の形態による液晶表示パネル 1の製造方法では、第 4シール部 77 が形成されない。 [0064] Next, a sealant is applied onto the lower substrate 12 to form first to third seal portions 71, 73, 75 on the lower substrate 12 (in FIG. 1, step S4 (a); seal Agent coating process). The first seal portion 71 surrounds the portion facing the first slit 65 (the first terminal portion 61 and its surroundings) and the second slit 67 when the upper substrate 10 and the lower substrate 12 are bonded together. The shapes of the second and third seal portions are the same as those in the manufacturing method of the liquid crystal display panel 1 according to the first embodiment. In the method for manufacturing liquid crystal display panel 1 according to the present embodiment, fourth seal portion 77 is not formed.
[0065] また、第 1の実施の形態による液晶表示パネル 1の製造方法と同様の製造方法によ り、基板 10'上の複数のパネル領域 14毎にデータ電極 19及び第 2端子部 63を形成 して上基板 10を作製し、上基板 10の複数のパネル領域 14毎に第 1スリット 65を形成
し、上基板 10上に内部膜及びスぺーサを形成する(図 1中、ステップ Sl (b)乃至 S4 ( b) )。第 1スリット 65は、上基板 10及び下基板 12を貼り合わせた時に、第 1端子部 61 に対向する部分に形成する。 In addition, the data electrode 19 and the second terminal portion 63 are provided for each of the plurality of panel regions 14 on the substrate 10 ′ by a manufacturing method similar to the manufacturing method of the liquid crystal display panel 1 according to the first embodiment. The upper substrate 10 is formed to form a first slit 65 for each of the plurality of panel regions 14 of the upper substrate 10. Then, an inner film and a spacer are formed on the upper substrate 10 (steps Sl (b) to S4 (b) in FIG. 1). The first slit 65 is formed in a portion facing the first terminal portion 61 when the upper substrate 10 and the lower substrate 12 are bonded together.
[0066] 上下基板 10、 12を用いた液晶表示パネルの製造工程(図 1のステップ S5〜S11) は、第 1の実施の形態による液晶表示パネル 1の製造方法と同様であるので説明を 省略する。これにより、それぞれ第 1及び第 2端子部 61、 63を有する複数 (本実施の 形態では 15個)の液晶表示パネル 101が完成する(図 1中、ステップ SI 1;単パネル 完成)。その後、周辺回路等を設けて、液晶表示素子が完成する。 [0066] The manufacturing process of the liquid crystal display panel using the upper and lower substrates 10 and 12 (steps S5 to S11 in FIG. 1) is the same as the manufacturing method of the liquid crystal display panel 1 according to the first embodiment, and thus the description thereof is omitted. To do. As a result, a plurality (15 in this embodiment) of liquid crystal display panels 101 each having the first and second terminal portions 61 and 63 are completed (step SI 1 in FIG. 1; single panel completed). Thereafter, peripheral circuits and the like are provided to complete the liquid crystal display element.
[0067] 本実施の形態による液晶表示パネル 101の製造方法によれば、同一パネル領域 1 4内の第 1及び第 2スリット 65、 67は、一つの第 1シール部 71によって切れ目なく囲ま れる。よって、上下基板 10、 12の開口部 13が形成されている端部を保持板 22、 24 で挟むことにより、第 2シール部 73により囲まれた上下基板 10、 12間は、第 1シール 部 71により囲まれた部分を除いて、保持板 22、 24並びに第 1、第 2シール部 71、 73 によって密閉される。従って、多面取りと減圧による貼り合わせとを組み合わせた製 造方法を実現することができる。従って、本実施の形態による液晶表示パネルの製 造方法によっても、多面取りを行っても液晶表示パネルの表示品質や製造歩留まり を向上することができる。 According to the method for manufacturing liquid crystal display panel 101 according to the present embodiment, first and second slits 65 and 67 in the same panel region 14 are surrounded by one first seal portion 71 without a break. Therefore, by sandwiching the ends where the openings 13 of the upper and lower substrates 10 and 12 are formed between the holding plates 22 and 24, the first seal portion is provided between the upper and lower substrates 10 and 12 surrounded by the second seal portion 73. Except for the portion surrounded by 71, the holding plates 22 and 24 and the first and second seal portions 71 and 73 are hermetically sealed. Therefore, it is possible to realize a manufacturing method that combines multiple chamfering and pasting by decompression. Therefore, the display quality and manufacturing yield of the liquid crystal display panel can be improved by the liquid crystal display panel manufacturing method according to the present embodiment, even if multiple layouts are performed.
[0068] また、同一パネル領域 14内の第 1及び第 2スリット 65、 67は、一つの第 1シール部 71によって切れ目なく囲まれる。これにより、第 4シール部 77の形成が不要になるの で、シール部の形状を単純にすることができる。従って、低コストで液晶表示パネル 1 01を製造することができる。 In addition, the first and second slits 65 and 67 in the same panel region 14 are surrounded by one first seal portion 71 without a break. As a result, the formation of the fourth seal portion 77 is not necessary, and the shape of the seal portion can be simplified. Therefore, the liquid crystal display panel 101 can be manufactured at low cost.
[0069] 図 16は、本実施の形態による液晶表示パネル 101の製造方法により製造された液 晶表示パネル 101を上基板 10側から図示する平面図である。本実施の形態による 液晶表示パネル 101は、液晶表示パネル 1に対して、第 1及び第 2突出シール部 71 a、 77aの代わりに、第 1及び第 2突出シール部 71b、 71cが形成されている点に特徴 を有している。 FIG. 16 is a plan view illustrating the liquid crystal display panel 101 manufactured by the method of manufacturing the liquid crystal display panel 101 according to the present embodiment from the upper substrate 10 side. The liquid crystal display panel 101 according to the present embodiment is different from the liquid crystal display panel 1 in that first and second projecting seal portions 71b and 71c are formed instead of the first and second projecting seal portions 71a and 77a. It has a feature in that.
[0070] 第 1及び第 2突出シール部 71b、 71cは、第 3シール部 75から分岐し上下基板 10、 12の基板端面まで突出して形成されている。第 1及び第 2突出シール部 71b、 71c
は、シール剤塗布工程で形成した第 1シール部 71の一部である。第 1突出シール部 71bは、第 3シール部 75の図 14中左上の角部近傍力も液晶表示パネル 101左側に 突出して形成されている。第 2突出シール部 71cは、第 3シール部 75の図 14中右下 の角部近傍力 第 2端子部 63側に突出して形成されている。第 1及び第 2突出シー ル部 71b、 71cを除いた液晶表示パネル 101の構成は、第 1の実施の形態による液 晶表示パネル 1と同様である。本実施の形態による液晶表示パネル 101は、第 1の実 施の形態による液晶表示パネル 1と同様の効果が得られる。 [0070] The first and second projecting seal portions 71b and 71c are formed so as to branch from the third seal portion 75 and project to the substrate end surfaces of the upper and lower substrates 10 and 12. First and second protruding seals 71b, 71c Is a part of the first seal portion 71 formed in the sealant application step. The first protruding seal portion 71b is formed so that the force in the vicinity of the upper left corner in FIG. 14 of the third seal portion 75 also protrudes to the left side of the liquid crystal display panel 101. The second projecting seal portion 71c is formed so as to project toward the second terminal portion 63 side of the third seal portion 75 at the lower right corner portion in FIG. The configuration of the liquid crystal display panel 101 excluding the first and second projecting seal portions 71b and 71c is the same as that of the liquid crystal display panel 1 according to the first embodiment. The liquid crystal display panel 101 according to the present embodiment can obtain the same effects as the liquid crystal display panel 1 according to the first embodiment.
[0071] 本発明は、上記実施の形態に限らず種々の変形が可能である。 The present invention is not limited to the above-described embodiment, and various modifications can be made.
例えば、上記実施の形態では、ノッシブマトリクス型の液晶表示パネル及びその製 造方法を例に挙げたが、本発明はこれに限らず、画素毎に薄膜トランジスタ (TFT) または薄膜ダイオード (TFD)などのスイッチング素子が備えられたアクティブマトリク ス型の液晶表示パネル及びその製造方法にも適用できる。 For example, in the above-described embodiment, a noisy matrix liquid crystal display panel and a manufacturing method thereof have been described as examples. The present invention can also be applied to an active matrix type liquid crystal display panel provided with the above switching elements and a method for manufacturing the same.
[0072] アクティブマトリクス型の液晶表示パネルでは、同一基板 (例えば下基板 12)上に 走査電極 17及びデータ電極 19が形成され、他方の基板 (例えば上基板 10)には共 通電極が形成される。従って、同一基板上に第 1及び第 2端子部 61、 63が形成され る。 In the active matrix liquid crystal display panel, the scanning electrode 17 and the data electrode 19 are formed on the same substrate (for example, the lower substrate 12), and the common electrode is formed on the other substrate (for example, the upper substrate 10). The Therefore, the first and second terminal portions 61 and 63 are formed on the same substrate.
[0073] 上記第 1の実施の形態による液晶表示パネル 1の製造方法を適用したアクティブマ トリタス型の液晶表示パネルの製造方法は、液晶表示パネル 1の製造方法と以下の 点で異なる。当該アクティブマトリクス型の液晶表示パネルの製造方法では、下基板 12上の複数のパネル領域 14毎にゲートバスラインとその一端部の第 1端子部 61とを 形成する。また、下基板 12上の複数のパネル領域 14毎に、絶縁膜を介してゲートバ スラインに交差するドレインバスラインとその一端部の第 2端子部 63とを形成する。さ らに、両バスラインの交差部毎にスイッチング素子及び画素電極を形成する。また、 上基板 10の複数のパネル領域 14毎に第 2スリット 67を形成する。第 2スリット 67は、 上基板 10及び下基板 12が貼り合わされた時に、第 2端子部 63に対向する部分に形 成される。また、上基板 10及び下基板 12が貼り合わされた時に、第 2スリット 67に対 向する部分 (第 2端子部 63及びその周辺部)を切れ目なく囲むように第 4シール部 7 7を下基板 12上に形成する。また、上基板 10上のパネル領域 14毎に共通電極を形
成する。共通電極は、各パネル領域 14のほぼ全面に形成される。 The manufacturing method of the active matrix type liquid crystal display panel to which the manufacturing method of the liquid crystal display panel 1 according to the first embodiment is applied differs from the manufacturing method of the liquid crystal display panel 1 in the following points. In the manufacturing method of the active matrix type liquid crystal display panel, the gate bus line and the first terminal portion 61 at one end thereof are formed for each of the plurality of panel regions 14 on the lower substrate 12. In addition, for each of the plurality of panel regions 14 on the lower substrate 12, a drain bus line that intersects the gate bus line via an insulating film and a second terminal portion 63 at one end thereof are formed. Further, a switching element and a pixel electrode are formed at each intersection of both bus lines. Further, a second slit 67 is formed for each of the plurality of panel regions 14 of the upper substrate 10. The second slit 67 is formed in a portion facing the second terminal portion 63 when the upper substrate 10 and the lower substrate 12 are bonded together. Further, when the upper substrate 10 and the lower substrate 12 are bonded together, the fourth seal portion 77 is placed on the lower substrate so as to surround the portion facing the second slit 67 (the second terminal portion 63 and its peripheral portion) without a break. Form on 12. A common electrode is formed for each panel area 14 on the upper substrate 10. To do. The common electrode is formed on almost the entire surface of each panel region 14.
[0074] 上記製造方法により製造されたアクティブマトリクス型の液晶表示パネルは、液晶 表示パネル 1に対して、データ電極 19及び第 2端子部 63が下基板 12上に形成され 、切り込み部(第 2切り込み部) 67aが上基板 10に形成される点が異なる。また、デー タ電極 19は、絶縁膜を介して走査電極 17と対向する。走査電極 17及びデータ電極 19によって画定される領域が 1画素となる。下基板 12上には、画素毎にスイッチング 素子及び画素電極が形成される。また、共通電極が上基板 10上に形成される。 In the active matrix type liquid crystal display panel manufactured by the above manufacturing method, the data electrode 19 and the second terminal portion 63 are formed on the lower substrate 12 with respect to the liquid crystal display panel 1, and a notch (second The difference is that the cut portion 67a is formed in the upper substrate 10. Further, the data electrode 19 faces the scanning electrode 17 through an insulating film. An area defined by the scanning electrode 17 and the data electrode 19 is one pixel. On the lower substrate 12, a switching element and a pixel electrode are formed for each pixel. A common electrode is formed on the upper substrate 10.
[0075] 上記第 2の実施の形態による液晶表示パネル 101の製造方法を適用したァクティ ブマトリクス型の液晶表示パネルの製造方法は、液晶表示パネル 101の製造方法と 以下の点で異なる。当該アクティブマトリクス型の液晶表示パネルの製造方法では、 下基板 12上の複数のパネル領域 14毎にゲートバスラインとその一端部の第 1端子 部 61とを形成する。また、下基板 12上の複数のパネル領域 14毎に、絶縁膜を介し てゲートバスラインに交差するドレインバスラインとその一端部の第 2端子部 63とを形 成する。さらに、両バスラインの交差部毎にスイッチング素子及び画素電極を形成す る。また、上基板 10の複数のパネル領域 14毎に第 2スリット 67を形成する。第 2スリツ ト 67は、上基板 10及び下基板 12が貼り合わされた時に、第 2端子部 63に対向する 部分に形成される。また、上基板 10及び下基板 12が貼り合わされた時に、第 1及び 第 2スリット 65、 67に対向する部分 (第 1及び第 2端子部 61、 63並びにそれらの周辺 部)を切れ目なく囲むように第 1シール部 71を下基板 12上に形成する。また、上基板 10上のパネル領域 14毎に共通電極を形成する。共通電極は、各パネル領域 14の ほぼ全面に形成される。 The manufacturing method of the active matrix type liquid crystal display panel to which the manufacturing method of the liquid crystal display panel 101 according to the second embodiment is applied differs from the manufacturing method of the liquid crystal display panel 101 in the following points. In the manufacturing method of the active matrix type liquid crystal display panel, a gate bus line and a first terminal portion 61 at one end thereof are formed for each of a plurality of panel regions 14 on the lower substrate 12. Further, for each of the plurality of panel regions 14 on the lower substrate 12, a drain bus line intersecting with the gate bus line via an insulating film and a second terminal portion 63 at one end thereof are formed. Further, a switching element and a pixel electrode are formed at each intersection of both bus lines. A second slit 67 is formed for each of the plurality of panel regions 14 of the upper substrate 10. The second slit 67 is formed in a portion facing the second terminal portion 63 when the upper substrate 10 and the lower substrate 12 are bonded together. In addition, when the upper substrate 10 and the lower substrate 12 are bonded together, the portions facing the first and second slits 65 and 67 (the first and second terminal portions 61 and 63 and their peripheral portions) are surrounded without a break. The first seal portion 71 is formed on the lower substrate 12. A common electrode is formed for each panel region 14 on the upper substrate 10. The common electrode is formed on almost the entire surface of each panel region 14.
[0076] また、本発明による液晶表示パネルの製造方法では、減圧による貼り合わせ方法( 図 1中、ステップ S7)は上記実施の形態に記載された方法に限られない。本願出願 人による国際出願 (PCTZJP2006Z304343)では、別の方法が提案されている。 当該方法について簡単に説明する。当該方法では、開口部 13を形成する代わりに、 上下基板 10、 12の貼り合わせ後に、合わせ基板 20の例えば端部に上下基板 10、 1 2を貫通する貫通孔を形成する。なお、上下基板 10、 12の貼り合わせ前に上下基板 10、 12の同じ位置に開口部 13を形成し、 2つのの開口部 13がー致するように上下
基板 10、 12の位置合わせして貫通孔としてもよい。次に、複数枚の合わせ基板 20を 、合わせ基板 20の基板面法線方向に見て各合わせ基板 20の貫通孔が重なるように 並べる。次に、側面に開口が形成されたパイプを複数の貫通孔に挿入する。次に、 パイプの一端を閉じ、パイプの開口及び複数の貫通孔を介して、ノイブの他端から 複数枚の合わせ基板 20内部を真空吸引する。これにより、複数枚の合わせ基板 20 内部が同時に減圧される。当該方法によれば、複数枚の合わせ基板 20内部を同時 に減圧できる。 Further, in the method for manufacturing a liquid crystal display panel according to the present invention, the bonding method using reduced pressure (step S7 in FIG. 1) is not limited to the method described in the above embodiment. In the international application (PCTZJP2006Z304343) by the applicant of the present application, another method is proposed. The method will be briefly described. In this method, instead of forming the opening 13, a through-hole penetrating the upper and lower substrates 10 and 12 is formed in, for example, an end portion of the laminated substrate 20 after the upper and lower substrates 10 and 12 are bonded. Before bonding the upper and lower substrates 10 and 12, the opening 13 is formed at the same position of the upper and lower substrates 10 and 12, and the upper and lower substrates 13 and 12 are aligned with each other. The substrates 10 and 12 may be aligned to form a through hole. Next, the plurality of laminated substrates 20 are arranged so that the through holes of the respective laminated substrates 20 overlap each other when viewed in the normal direction of the substrate surface of the laminated substrate 20. Next, pipes having openings formed on the side surfaces are inserted into the plurality of through holes. Next, one end of the pipe is closed, and the inside of the plurality of laminated substrates 20 is vacuum-sucked from the other end of the noise through the opening of the pipe and the plurality of through holes. As a result, the pressure inside the plurality of laminated substrates 20 is reduced simultaneously. According to this method, the inside of the plurality of laminated substrates 20 can be depressurized simultaneously.
産業上の利用可能性 Industrial applicability
本発明による液晶表示パネルの製造方法は、多面取りを行っても液晶表示パネル の表示品質や製造歩留まりを向上することができる。また、本発明による液晶表示パ ネルは、薄型化や軽量ィ匕が可能であり、十分な可撓性を備え、かつ強度が強い。
The manufacturing method of the liquid crystal display panel according to the present invention can improve the display quality and manufacturing yield of the liquid crystal display panel even if multiple processes are performed. Further, the liquid crystal display panel according to the present invention can be reduced in thickness and weight, has sufficient flexibility, and has high strength.
Claims
[1] 第 1基板上の複数のパネル領域毎に第 1端子部を形成し、 [1] A first terminal portion is formed for each of a plurality of panel regions on the first substrate,
前記第 1基板に貼り合わされる第 2基板の前記第 1端子部に対向する部分に第 1ス リットを形成し、 Forming a first slit in a portion facing the first terminal portion of the second substrate bonded to the first substrate;
前記第 1又は第 2基板の前記複数のパネル領域以外の領域に開口部を形成し、 前記第 1スリット又は前記第 1スリットに対向する部分を切れ目なく囲む第 1シール 部と、前記開口部又は前記開口部に対向する部分と前記複数のパネル領域とを切 れ目なく囲む第 2シール部と、前記複数のパネル領域のそれぞれ外周部を囲む第 3 シール部とを前記第 1又は第 2基板上に形成し、 Forming an opening in an area other than the plurality of panel areas of the first or second substrate, and surrounding the first slit or the portion facing the first slit without any break; and the opening or The first or second substrate includes a second seal portion that seamlessly surrounds the portion facing the opening and the plurality of panel regions, and a third seal portion that surrounds an outer peripheral portion of each of the plurality of panel regions. Formed on and
前記第 1端子部及び前記第 1スリットが対向するように前記第 1乃至第 3シール部を 介して前記第 1基板と前記第 2基板とを対向させ、 The first substrate and the second substrate are opposed to each other through the first to third seal portions so that the first terminal portion and the first slit are opposed to each other,
前記開口部を介して前記第 1及び第 2基板間を減圧することにより前記第 1及び第 2基板を貼り合わせ、 The first and second substrates are bonded together by reducing the pressure between the first and second substrates through the opening,
前記第 1及び第 2基板間の前記パネル領域毎に液晶を注入して封止し、 前記第 1及び第 2基板を前記パネル領域毎に分断すること Injecting and sealing liquid crystal for each panel region between the first and second substrates, and dividing the first and second substrates for each panel region
を特徴とする液晶表示パネルの製造方法。 A manufacturing method of a liquid crystal display panel characterized by the above.
[2] 請求項 1記載の液晶表示パネルの製造方法にぉ 、て、 [2] A method for manufacturing a liquid crystal display panel according to claim 1, wherein
前記開口部を前記第 1又は第 2基板の端部に形成すること Forming the opening at an end of the first or second substrate;
を特徴とする液晶表示パネルの製造方法。 A manufacturing method of a liquid crystal display panel characterized by the above.
[3] 請求項 1又は 2に記載の液晶表示パネルの製造方法にぉ 、て、 [3] In the method for manufacturing a liquid crystal display panel according to claim 1 or 2,
前記第 2シール部を前記第 1又は第 2基板の外周部に形成すること Forming the second seal portion on the outer periphery of the first or second substrate;
を特徴とする液晶表示パネルの製造方法。 A manufacturing method of a liquid crystal display panel characterized by the above.
[4] 請求項 1乃至 3のいずれか 1項に記載の液晶表示パネルの製造方法において、 前記開口部を介した真空吸引により前記第 1及び第 2基板間を減圧すること を特徴とする液晶表示パネルの製造方法。 [4] The method of manufacturing a liquid crystal display panel according to any one of claims 1 to 3, wherein the pressure between the first and second substrates is reduced by vacuum suction through the opening. Manufacturing method of display panel.
[5] 請求項 1乃至 4のいずれか 1項に記載の液晶表示パネルの製造方法において、 前記第 1端子部は複数の第 1電極端子を有し、 [5] In the method of manufacturing a liquid crystal display panel according to any one of claims 1 to 4, the first terminal portion includes a plurality of first electrode terminals,
前記第 1スリットは、前記複数の第 1電極端子の全てに対向すること
を特徴とする液晶表示パネルの製造方法。 The first slit faces all of the plurality of first electrode terminals. A manufacturing method of a liquid crystal display panel characterized by the above.
[6] 請求項 1乃至 5のいずれか 1項に記載の液晶表示パネルの製造方法において、 前記第 2基板上の前記複数のパネル領域毎に第 2端子部を形成し、 [6] In the method of manufacturing a liquid crystal display panel according to any one of claims 1 to 5, a second terminal portion is formed for each of the plurality of panel regions on the second substrate,
前記第 1基板の前記第 2端子部に対向する部分に第 2スリットを形成し、 前記第 2スリット又は前記第 2スリットに対向する部分を切れ目なく囲む第 4シール 部を前記第 1又は第 2基板上に形成すること A second slit is formed in a portion of the first substrate facing the second terminal portion, and a fourth seal portion surrounding the second slit or the portion facing the second slit without any breaks is formed in the first or second. Form on the substrate
を特徴とする液晶表示パネルの製造方法。 A manufacturing method of a liquid crystal display panel characterized by the above.
[7] 請求項 1乃至 5のいずれか 1項に記載の液晶表示パネルの製造方法において、 前記第 1基板上の前記複数のパネル領域毎に第 2端子部を形成し、 [7] In the method of manufacturing a liquid crystal display panel according to any one of claims 1 to 5, a second terminal portion is formed for each of the plurality of panel regions on the first substrate,
前記第 2基板の前記第 2端子部に対向する部分に第 2スリットを形成し、 前記第 2スリット又は前記第 2スリットに対向する部分を切れ目なく囲む第 4シール 部を前記第 1又は第 2基板上に形成すること A second slit is formed in a portion facing the second terminal portion of the second substrate, and the fourth seal portion surrounding the second slit or the portion facing the second slit without any breaks is the first or second. Form on the substrate
を特徴とする液晶表示パネルの製造方法。 A manufacturing method of a liquid crystal display panel characterized by the above.
[8] 請求項 1乃至 5のいずれか 1項に記載の液晶表示パネルの製造方法において、 前記第 2基板上の前記複数のパネル領域毎に第 2端子部を形成し、 [8] In the method of manufacturing a liquid crystal display panel according to any one of claims 1 to 5, a second terminal portion is formed for each of the plurality of panel regions on the second substrate,
前記第 1基板の前記第 2端子部に対向する部分に第 2スリットを形成し、 前記第 1シール部は、前記第 1スリット又は前記第 1スリットに対向する部分と前記第 2スリット又は前記第 2スリットに対向する部分とを切れ目なく囲むように形成すること を特徴とする液晶表示パネルの製造方法。 A second slit is formed in a portion of the first substrate facing the second terminal portion, and the first seal portion includes the first slit or the portion facing the first slit and the second slit or the second 2. A method of manufacturing a liquid crystal display panel, characterized in that it is formed so as to surround a portion facing the slit without any breaks.
[9] 請求項 1乃至 5のいずれか 1項に記載の液晶表示パネルの製造方法において、 前記第 1基板上の前記複数のパネル領域毎に第 2端子部を形成し、 [9] In the method of manufacturing a liquid crystal display panel according to any one of claims 1 to 5, a second terminal portion is formed for each of the plurality of panel regions on the first substrate,
前記第 2基板の前記第 2端子部に対向する部分に第 2スリットを形成し、 前記第 1シール部は、前記第 1スリット又は前記第 1スリットに対向する部分と前記第 2スリット又は前記第 2スリットに対向する部分とを切れ目なく囲むように形成すること を特徴とする液晶表示パネルの製造方法。 A second slit is formed in a portion of the second substrate facing the second terminal portion, and the first seal portion includes the first slit or the portion facing the first slit and the second slit or the second 2. A method of manufacturing a liquid crystal display panel, characterized in that it is formed so as to surround a portion facing the slit without any breaks.
[10] 請求項 1乃至 9のいずれか 1項に記載の液晶表示パネルの製造方法において、 前記第 1スリットは複数の前記第 1端子部に対向すること 10. The method for manufacturing a liquid crystal display panel according to claim 1, wherein the first slit faces a plurality of the first terminal portions.
を特徴とする液晶表示パネルの製造方法。
A manufacturing method of a liquid crystal display panel characterized by the above.
[11] 対向配置された第 1及び第 2基板と、 [11] first and second substrates disposed opposite to each other;
前記第 1及び第 2基板間に封止された液晶と、 A liquid crystal sealed between the first and second substrates;
前記第 1及び第 2基板間の外周部に形成されて前記液晶を封止するシール部と、 前記シール部から分岐し前記第 1及び第 2基板の基板端面まで突出して形成され た第 1突出シール部と A seal portion formed on an outer peripheral portion between the first and second substrates to seal the liquid crystal; and a first protrusion formed to protrude from the seal portion to the substrate end surfaces of the first and second substrates. Seal part and
を有することを特徴とする液晶表示パネル。 A liquid crystal display panel comprising:
[12] 請求項 11記載の液晶表示パネルにぉ 、て、 [12] The liquid crystal display panel according to claim 11, wherein
前記第 1基板上の前記シール部外側に形成された第 1端子部をさらに有し、 前記第 1突出シール部は前記第 1端子部側に突出して形成されていること を特徴とする液晶表示パネル。 The liquid crystal display further comprising a first terminal portion formed outside the seal portion on the first substrate, wherein the first projecting seal portion is formed to project toward the first terminal portion. panel.
[13] 請求項 12記載の液晶表示パネルにおいて、 [13] The liquid crystal display panel according to claim 12,
前記第 2基板上の前記シール部外側に形成された第 2端子部と、 A second terminal portion formed outside the seal portion on the second substrate;
前記シール部から前記第 2端子部側に分岐し、前記第 1及び第 2基板の基板端面 まで突出して形成された第 2突出シール部とをさらに有すること A second projecting seal portion that branches from the seal portion to the second terminal portion side and projects to the substrate end surfaces of the first and second substrates.
を特徴とする液晶表示パネル。 A liquid crystal display panel characterized by
[14] 請求項 12記載の液晶表示パネルにぉ 、て、 [14] The liquid crystal display panel according to claim 12, wherein
前記第 1基板上の前記シール部外側に形成された第 2端子部と、 A second terminal portion formed outside the seal portion on the first substrate;
前記シール部から前記第 2端子部側に分岐し、前記第 1及び第 2基板の基板端面 まで突出して形成された第 2突出シール部とをさらに有すること A second projecting seal portion that branches from the seal portion to the second terminal portion side and projects to the substrate end surfaces of the first and second substrates.
を特徴とする液晶表示パネル。 A liquid crystal display panel characterized by
[15] 請求項 12乃至 14のいずれ力 1項に記載の液晶表示パネルにおいて、 [15] The liquid crystal display panel according to any one of claims 12 to 14, wherein
前記第 2基板は、前記第 1端子部を露出させる第 1切り込み部を有すること を特徴とする液晶表示パネル。 The liquid crystal display panel, wherein the second substrate has a first cut portion that exposes the first terminal portion.
[16] 請求項 13記載の液晶表示パネルにおいて、 [16] The liquid crystal display panel according to claim 13,
前記第 1基板は、前記第 2端子部を露出させる第 2切り込み部を有すること を特徴とする液晶表示パネル。 The liquid crystal display panel according to claim 1, wherein the first substrate has a second cut portion that exposes the second terminal portion.
[17] 請求項 14記載の液晶表示パネルにぉ 、て、 [17] The liquid crystal display panel according to claim 14, wherein
前記第 2基板は、前記第 2端子部を露出させる第 2切り込み部を有すること
を特徴とする液晶表示パネル。
The second substrate has a second cut portion that exposes the second terminal portion. A liquid crystal display panel characterized by
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US20160165648A1 (en) * | 2013-08-19 | 2016-06-09 | Fujitsu Limited | Mobile communication system, communication method for mobile communication system, and terminal apparatus |
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US10312315B2 (en) | 2013-12-02 | 2019-06-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US10355067B2 (en) | 2013-12-02 | 2019-07-16 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US10763322B2 (en) | 2013-12-02 | 2020-09-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US10854697B2 (en) | 2013-12-02 | 2020-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US10872947B2 (en) | 2013-12-02 | 2020-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US10879331B2 (en) | 2013-12-02 | 2020-12-29 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US11004925B2 (en) | 2013-12-02 | 2021-05-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US11672148B2 (en) | 2013-12-02 | 2023-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US12048207B2 (en) | 2013-12-02 | 2024-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
Also Published As
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JPWO2008035421A1 (en) | 2010-01-28 |
JP5131196B2 (en) | 2013-01-30 |
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