WO2008026257A1

WO2008026257A1 - Electronic device and method for manufacturing shielding material for same

Info

Publication number: WO2008026257A1
Application number: PCT/JP2006/316994
Authority: WO
Inventors: Yuichi Tamura; Hirofumi Matsumura
Original assignee: Pioneer Corporation
Priority date: 2006-08-29
Filing date: 2006-08-29
Publication date: 2008-03-06

Abstract

Provided is an electronic device wherein a desired portion of an electronic component mounted on one surface of a printed wiring board is electromagnetically shielded. A method for manufacturing a shielding material for such electronic device is also provided. In the electronic device, the electronic component is mounted on the printed wiring board. The electronic component arranged in a target region to be electromagnetically shielded on the one surface of the printed wiring board is coated with the shielding material so that the material adheres to the electronic component.

Description

Specification

Electronic device and method for manufacturing shield material thereof

Technical field

[0001] This application relates to an electronic device in which a printed wiring board is provided with a shield material against electromagnetic waves in various consumer electronic devices such as notebook computers, mobile phones, digital cameras, car navigation systems, and the like that are required to be miniaturized. The present invention relates to the technical field of equipment and its shield material manufacturing method.

Background art

In recent years, various consumer electronic devices such as notebook computers, mobile phones, digital cameras, car navigation systems, and the like have been required to be smaller, lighter and thinner. At the same time, there is a risk of malfunction of the circuit due to electromagnetic noise generated from other electronic devices, and other electronic devices that are connected with the power of other electronic components in the device due to radioactive noise caused by the operation of electronic components mounted on the board. Therefore, it is necessary to provide an electromagnetic wave shielding layer to cover the printed wiring board.

[0003] As a printed wiring board provided with such an electromagnetic wave shielding layer, there is an invention disclosed in Patent Document 1, for example. The present invention prevents electromagnetic interference and the like by vacuum packaging a printed wiring board with a bag-like body made of a laminated film having an electromagnetic wave shielding layer.

Patent Document 1: Japanese Patent Laid-Open No. 5-170272

Disclosure of the invention

Problems to be solved by the invention

[0004] However, the invention disclosed in Patent Document 1 described above is a packaging form that covers the entire printed circuit board, that is, for packaging both sides of the printed circuit board at the same time V. There is a problem that it is not possible to shield only a desired part on one side of a printed wiring board. In other words, the invention disclosed in Patent Document 1 has a problem in that unnecessary portions other than the portion to be shielded against electromagnetic waves are also shielded against electromagnetic waves.

[0005] Further, in the invention disclosed in Patent Document 1, a laminated film having an electromagnetic wave shielding layer is provided. In order to cover the entire printed wiring board with a strong bag-like body, there is a problem that a bag-like body having a size corresponding to the size of the printed wiring board must be used.

[0006] The present application has been made in consideration of the above circumstances, and one example of the problem is to shield a desired portion of the mounted electronic component on one side of the printed wiring board by electromagnetic waves. It is an object of the present invention to provide an electronic device and a method for manufacturing a shielding material thereof.

Means for solving the problem

[0007] In order to solve the above-described problem, the electronic device according to claim 1 is an electronic device in which an electronic component is mounted on a printed wiring board, and an object to perform electromagnetic shielding on one side of the printed wiring board. The electronic component arranged in the region is covered with a shield material so as to be in close contact with the electronic component.

[0008] In order to solve the above-described problem, a method for manufacturing a shielding material for an electronic device according to claim 5 includes: mounting an electronic component on a printed wiring board; and shielding the electronic component with an electromagnetic wave. A manufacturing method comprising: a shielding material coating step for covering the electronic component disposed in a target region where electromagnetic shielding is performed on one side of the printed wiring board; and a shielding material coating step for covering the electronic component by the shielding material coating step. And an air exhausting process for exhausting air from the coated shield material.

Brief Description of Drawings

FIG. 1 is a perspective view showing a printed wiring board for electromagnetic wave shielding in a first embodiment of the present application.

2 is a plan view showing a through hole, an adhesive line region, and a conductive line region provided in the printed wiring board of FIG. 1. FIG.

3 is a cross-sectional view showing a state in which the printed wiring board of FIG. 2 is covered with an insulating material.

4 is a cross-sectional view showing a state where the printed wiring board of FIG. 3 is covered with a shielding material.

FIG. 5 is a cross-sectional view showing a state where an insulating material and a shield material are in close contact with the printed wiring board of FIG. 4 by air discharge.

6 is a cross-sectional view showing a state in which the outer peripheral portion of the shield material fixed to the printed wiring board shown in FIG. 5 is cut.

FIG. 7 is a schematic view showing a state in which two general printed wiring boards face each other. FIG. 8 is a schematic perspective view showing the height relationship of components in a state where two general printed wiring boards face each other.

[FIG. 9A] FIG. 9 is a view of the force in the direction of arrow A in FIG.

FIG. 9B is a view as seen from the direction of arrow B in FIG.

[Fig. 1 OA] Fig. 9 shows the two printed wiring boards in Fig. 9A covered with a general box-type shield.

FIG. 10B is a diagram showing a state in which the two printed wiring boards in FIG. 9B are covered with a general box-type shield.

FIG. 11A is a diagram showing a state where the shield of this embodiment is covered on the two printed wiring boards of FIG. 9A.

FIG. 11B is a diagram showing a state where the shield of this embodiment is covered on the two printed wiring boards of FIG. 9B.

FIG. 12 is a cross-sectional view showing a state where an insulating material and a shielding material are covered on a printed wiring board in a second embodiment of the present application.

FIG. 13 is a cross-sectional view showing a state where heat dissipation measures are taken in the third embodiment of the present application.

FIG. 14 is a cross-sectional view showing the operation in a state where the heat dissipation measure of FIG. 13 is taken.

FIG. 15 is a plan view showing an adhesive line region and a conductive line region provided on a printed wiring board according to a fourth embodiment of the present application.

Explanation of symbols

1 Printed wiring board

2 IC

3 Chip parts

4 Connector

5 Snoley Honore

6 Bond line area

7 Conduction line area

8 Insulation material

9 Adhesive 10 Pressure welding jig

11 Cutting jig

12 Shielding material

13 Pressure welding jig

14 Air discharge nozzle

15 Vacuum pump

16 Anisotropic conductive adhesive

17 Crimping jig

20 electronic components

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the best embodiment of the present application will be described with reference to the accompanying drawings. Each embodiment described below is applied to a printed wiring board on which a large number of electronic parts such as IC chip parts such as QFP (Quad Flat Package) and BGA (Ball Grid Allay) are mounted on both sides. In this embodiment, when the shield target surface is the front surface and the opposite surface is the back surface, the electronic device of the present application is applied to a printed wiring board provided with a shield material on the front surface side. Each embodiment described below is an embodiment when the present application is applied to a navigation apparatus as an electronic device.

[0012] (First embodiment)

With reference to FIGS. 1 to 6, a method for manufacturing a shielding material for an electronic device according to the first embodiment of the present application will be described. FIG. 1 is a perspective view showing a printed wiring board that shields electromagnetic waves according to the first embodiment of the present application, and FIG. 2 is a plan view showing through holes, an adhesive line area, and a conductive line area provided in the printed wiring board of FIG. FIG. The steps shown in FIGS. 1 and 2 are pretreatment steps for the printed wiring board in the shield material manufacturing method.

First, as shown in FIG. 1, on a surface la, which is a surface to be shielded against electromagnetic waves in a printed wiring board (hereinafter simply referred to as a board) 1, IC2 as an electronic component, chip component 3 and Connector 4 is mounted. This board 1 has four through holes 5 with a diameter of about 1.25 mm that penetrate from the front surface la to the rear surface lb at positions avoiding the IC 2, the chip component 3, and the connector 4. Use as a hole for air discharge . Here, the substrate 1 to be subjected to electromagnetic wave shielding is manufactured in such a manner that the solder does not enter the through hole 5 when performing soldering by a reflow furnace.

Further, as shown in FIG. 2, the region to be shielded against electromagnetic waves on the substrate 1 includes an adhesive line region 6 of an lmm-width insulating material previously formed in a rectangular shape on the outer periphery of the region. In addition, a conductive line region 7 of a lmm-width shield material similarly formed in a rectangular shape is provided on the outside, and these bonding line region 6 and conductive line region 7 include IC2, chip component 3 and connector 4 Design the electronic parts so that they do not overlap. It is to be noted that a pattern is not formed on the surface of the substrate 1 in the bonding line region 6. In the conductive line region 7, a copper foil pattern is formed on the surface of the substrate 1, and finally electrically connected to a shield material described later. Therefore, it is desirable that the conductive line region 7 be a ground pattern having the same potential as the GND pattern.

Next, the procedure of the shield material manufacturing method will be described with reference to FIGS.

3 is a cross-sectional view showing a state in which the printed wiring board of FIG. 2 is covered with an insulating material, FIG. 4 is a cross-sectional view showing a state in which the printed wiring board of FIG. 3 is covered with a shielding material, and FIG. FIG. 6 is a cross-sectional view showing a state in which the outer peripheral portion of the shield material fixed to the printed wiring board shown in FIG. 5 is cut. It is.

In the insulating material coating adhesion step shown in FIG. 3, first, a general-purpose adhesive 9 such as a UV (ultraviolet ray) curable adhesive is uniformly applied to the adhesive line region 6 of the insulating material 8. As the insulating material 8, a polyethylene sheet having a thickness of 10 to 30 / zm or the like is used. The insulating material 8 is provided so as to cover the electronic parts such as the IC 2 and the chip part 3 mounted on the surface 1 a of the shielded area 1 of the substrate 1, and the bonding line area of the insulating material 8 as shown in FIG. The insulating material 8 is bonded to the substrate 1 by pressing the insulating material 8 to the bonding line region 6 with a pressure welding jig 10 capable of pressure welding the entire circumference of 6. As a result, the electronic components such as the IC 2 and the chip component 3 mounted on the surface 1 a of the shield target region are covered with the insulating material 8. At this time, the insulating material 8 is formed with about four small-diameter air discharge holes 8a in predetermined portions such as the upper surface of the electronic component in the target region where electromagnetic wave shielding is performed. In addition, since air is exhausted from the insulating material 8 in the air exhausting process described later, problems such as damage to the insulating material 8 occur if the insulating material 8 is not wide enough. Therefore, before bonding the insulating material 8 with the pressure welding jig 10, it is desirable that the insulating material 8 that allows the insulating material 8 to enter between the electronic component and the electronic component has a sufficient margin. .

[0018] Then, in the insulating material cutting step, after bonding, the insulating material 8 is cut between the bonding wire region 6 and the conductive wire region 7 in a manner of cutting the outer periphery with a cutting jig 11 such as a cutter.

Next, in the shielding material covering and bonding step shown in FIG. 4, an aluminum foil of about 20 to 50 μm or a sheet-like metal foil having the same degree of flexibility is prepared as the shielding material 12. This shielding material 12 covers the electronic parts such as IC2 and chip part 3 mounted on the surface la in the same manner as the insulating material 8 from the upper side (surface la side) of the target area where the insulating material 8 has been bonded. 4 and a portion near the bonding line region 6 of the insulating material 8 is pressed by the pressure welding jig 13 having a roller 13a attached to the tip as shown in FIG.

[0020] At the same time, the rear surface lb side force of the substrate 1 is pressed against the substrate 1 with the air discharge nozzle 14 formed in an opening area including all the through holes 5 formed in the target region. This air discharge nozzle 14 is provided with a rubber cushion material 14a at the contact portion with the substrate 1, and the cushion material 14a prevents air leakage. Further, the air discharge nozzle 14 is connected to the vacuum pump 15 via V, a pipe line (not shown).

Further, in the air discharge process shown in FIG. 5, when the air discharge nozzle 14 is brought into contact with the back surface lb side of the substrate 1, the pressure welding jig 13 of the shield material 12 is formed on the back surface lb side of the substrate 1 from the back surface side. From the lb side, the air discharge nozzle 14 also presses the substrate 1 with symmetrical positional force, and the substrate 1 can be effectively fixed.

[0022] Since the vacuum pump 15 is connected to the air discharge nozzle 14 through a pipe line (not shown) as described above, the vacuum pump 15 is driven to suck air, and the substrate 1 Air is discharged from the shielding material 12 in the target area on the surface la side of the substrate 1 through the air discharge hole 8a of the through hole 5 and the insulating material 8. Here, the function of the roller 13a attached to the tip of the pressure welding jig 13 is to enable the shield material 12 to move in the horizontal direction when air is discharged.

[0023] When air is discharged from the inside of the shielding material 12, the insulating material 8 is formed with four air discharge holes 8a, so that the insulating material 8 and the substrate 1 are interposed between the insulating material 8 and the shielding material 12. The air pressure between and The shape is such that it adheres along the outer shape of C2 and chip part 3.

Furthermore, when air is exhausted from the inside of the shield material 12 and the shape in which the shield material 12 is in close contact with the outer shape of the electronic component is completed, the process proceeds to the anisotropic conductive adhesive application step shown in FIG.

In this anisotropic conductive adhesive application step, as shown in FIG. 5, in the conductive line region 7 of the shield material 12, the outer periphery of the shield material 12 is lifted to the upper outside of the roller 13 a while the substrate 1 Apply anisotropically conductive adhesive 16 (for example, 3373 manufactured by Three Bond) 16 to the conductive line region 7 on the ground pattern of the surface la.

Here, the anisotropic conductive adhesive (ACP) 16 is a material having functions of both mechanical connection and electrical connection, and has a conductive filler. In addition, the anisotropic conductive adhesive 16 is effective in this embodiment because the temperature at which the pressure bonding is short and the temperature at which the pressure bonding is performed is as low as about 120 ° C. More specifically, the anisotropic conductive adhesive (ACP) 16 has a conductive filler mixed in an adhesive (binder), and both members to be bonded by thermocompression bonding are mechanical, Electrically connected. On the other hand, since the binder is an insulator, insulation is maintained between conductive binders existing in adjacent circuits. Thermosetting resin, thermoplastic resin, thermosetting Z thermoplastic mixed resin, etc. are generally used for adhesives, and conductive balls generally used are gold-plated resin balls. .

Then, as shown in FIG. 6, in the shielding material adhering step, the crimping jig 17 is configured to descend from the upper part of the conductive line region 7, and the different coating applied to the conductive line region 7 by the crimping jig 17. In order to pressure-bond the shielding material 12 to the anisotropic conductive adhesive 16, the shielding material 12 is bonded to the anisotropic conductive adhesive 16 by covering heat and pressure.

[0028] Since the shield material 12 is covered and fixed on the surface la side of the substrate 1 through the above steps, the outer periphery of the shield material 12 is further cut by the cutting jig 11 in the shield material cutting step. Then, the manufacturing process of the shielding material 12 is completed.

[0029] Here, since the shielding material 12 is a metal foil having a single layer structure, it retains the uneven shape formed by exhausting the air inside. As for the insulating material 8, it is convenient to fix the insulating material 8 by applying a small amount of adhesive between the substrate 1 and the insulating material 8 in advance in the recess between the electronic components. [0030] The electronic device completed through the above steps covers the insulating material 8 in the target region of the electromagnetic wave shield on the surface la side of the substrate 1 on which the IC2 and the chip component 3 which are electronic components are mounted. The shield material 12 is covered on the upper surface of 8, and the air inside the shield material 12 is discharged to form the shield material 12 in close contact with the IC 2 and the chip component 3 that are electronic components.

Next, the operation and effect of this embodiment will be described with reference to FIGS.

FIG. 7 is a schematic diagram showing a state in which two general printed wiring boards are opposed to each other, FIG. 8 is a schematic perspective view showing a height relationship of components in a state in which two general printed wiring boards are opposed to each other, and FIG. 9A Fig. 9 is a view from the direction of arrow A in Fig. 8, Fig. 9B is a view from the direction of arrow B in Fig. 8, and Fig. 10 A is a state in which two printed wiring boards in Fig. 9A are covered with a general box-type shield. Fig. 10B is a diagram showing a state where two printed wiring boards in Fig. 9B are covered with a general box type shield. Fig. 11A is a state where two printed wiring boards in Fig. 9A are covered with the shield of this embodiment. FIG. 11B is a diagram showing a state in which the shield of this embodiment is covered on the two printed wiring boards of FIG. 9B. In the following description, IC2 and chip component 3 are collectively referred to as electronic component 20.

[0033] As shown in FIGS. 7 and 8, two substrates 1A and 1B are arranged so that the electronic component 20 faces each other. In this case, the two substrates 1A and 1B are arranged using 3D-CAD or the like. The electronic components 20 do not interfere with each other. The height relationship between the electronic components 20 of the two substrates 1A and 1B is as shown in FIGS. 9A and 9B.

[0034] In this case, the general box-shaped shield 21 is manufactured in accordance with the highest part among the electronic parts 20 as shown in FIGS. 10A and 10B. Is extremely difficult to manufacture.

On the other hand, when the manufacturing method of the shielding material 12 of the present embodiment is used, the electronic components 20 are manufactured with a slight gap at the height as shown in FIGS. 11A and 11B. Therefore, it is possible to easily manufacture a shield suitable for the product specification that is desired to be thin. Note that the insulating material 8 is not shown in FIGS. 10A and 10B, and FIGS. 11A and 11B.

As described above, according to the electronic apparatus of the present embodiment, the shield material 12 is brought into close contact with the electronic component 20 arranged in the target region where the electromagnetic wave shielding of the surface la that is one side of the substrate 1 is performed. As a result of the coating, a desired portion of the mounted electronic component 20 can be shielded against electromagnetic waves on the surface la of the substrate 1. That is, according to the present embodiment, it is possible to effectively shield only the important blocks on which noise countermeasures on the surface la of the substrate 1 should be taken. As a result, unnecessary portions other than the portion to be shielded against electromagnetic waves are not shielded, and the shield material 12 having the minimum necessary size is sufficient.

[0037] Further, according to the electronic apparatus of the present embodiment, the insulating material 8 is provided on the side of the shielding material 12 that is covered with the electronic component 20, thereby providing the shielding material 12 with respect to the electronic component 20, solder, or the like. It can be reliably insulated electrically.

[0038] Furthermore, according to the electronic device of the present embodiment, the air inside the shield material 12 is exhausted and the shield material 12 is formed so as to be in close contact with the electronic component 20, whereby the electronic component 20 and the shield are formed. The distance from the material 12 can be made extremely small, and it is close to the shape along the height of the electronic component 20 while having irregularities, so that it is possible to increase the structural volume due to the shielding material 12 in the product specifications. Less. As a simple example, the dead space caused by the mismatch of the height of the electronic component 20 as in the product specifications shown in Fig. 11A and Fig. 11B can be eliminated, and while the shielding performance is secured, The box-shaped shield material can eliminate structural limitations that cannot be achieved.

[0039] Further, according to the electronic device of the present embodiment, the target region can be completely shielded, so that no slits or holes are generated, and the shielding effect against radioactive noise from the electronic component 20 or pattern is achieved. Will be close to perfection. In addition, it is effective in suppressing electromagnetic interference between the electronic components 20.

[0040] On the other hand, according to the method for manufacturing a shielding material for an electronic device of the present embodiment, the shielding material coating that covers the shielding material 12 on the electronic component 20 disposed in the target region for electromagnetic wave shielding of the surface la of the substrate 1 The shielding material 12 is covered with the electronic component 20 by the shielding material coating step, and the shielding material 12 is closely attached to the electronic component 20 by providing an air exhausting process in which the internal force is also discharged. The desired portion of the mounted electronic component can be shielded against electromagnetic waves on the surface la of the substrate 1.

[0041] Further, according to the method for manufacturing a shielding material for an electronic device of the present embodiment, the bonding step of bonding the shielding material 12 covered with the electronic component 20 to the substrate 1 with the anisotropic conductive adhesive 16 is performed. By providing, both mechanical connection and electrical connection of the shielding material 12 to the substrate 1 can be performed.

[0042] Furthermore, according to the shield material manufacturing method for an electronic device of the present embodiment, by performing the insulating material coating step of covering the insulating material 8 in advance before the shielding material coating step of covering the shield material 12, The shield material 12 can be reliably electrically insulated from the electronic component 20 and solder.

[0043] Further, according to the method for manufacturing a shielding material for an electronic device of the present embodiment, the cost for carrying out the equipment can be reduced and the manufacturing cost can be easily reduced. In addition, there is no need for a mold and there is little impact on the environment due to the use of special solvents.

[0044] Further, according to the electronic device of the present embodiment and the method for manufacturing the electronic device shielding material, the vacuum pump 15 is driven to suck air from the shielding material 12, so that the electronic material 20 has the shielding material 12 It can coat | cover so that it may adhere | attach firmly.

In the present embodiment, the anisotropic conductive adhesive (ACP) 16 is applied to the conductive line region 7 to adhere the shield material 12, but the present invention is not limited to this and is formed on the substrate 1. Solder can be used as it is.

Specifically, the reflow solder for mounting the electronic component 20 on the surface la side of the substrate 1 is placed in advance in the conductive line region 7 by removing the mask, and the temperature of the crimping jig 17 is increased to the melting point of the solder. In the conductive line region 7, the shield material 12, which is also solder and metal foil, is conducted by thermocompression bonding. As the metal foil of the shield material 12 used at this time, it is desirable to use a copper foil or the like to be joined to solder. This eliminates the need to apply the anisotropic conductive adhesive (ACP) 16 and bond the shield material 12.

Further, in this embodiment, after the insulating material 8 is bonded to the bonding line region 6 with an adhesive, the shield material 12 is anisotropically conductive bonded so that the conductive wire region 7 covers the upper surface of the insulating material 8. Adhesive (AC P) 16 is used for bonding, but it is not limited to this. Adhering laminated materials in which metal layers such as copper foil are laminated using polyethylene as a base material in the target area for electromagnetic wave shielding. You may make it do. In this case, if the laminated material is heated up to the melting temperature of the solder in the same manner as described above and then subjected to pressure bonding, the heat resistance temperature of the base material such as polyethylene will be exceeded. The solder on one side of the substrate and the metal layer of the shielding material 12 are brought into conduction by pressure bonding through the base material portion. As a result, the step of bonding the insulating material 8 to the bonding line region 6 with an adhesive can be omitted.

[0048] (Second Embodiment)

FIG. 12 is a cross-sectional view showing a state where the printed wiring board is covered with an insulating material and a shielding material in the second embodiment of the present application. Note that the same reference numerals are used for the same or corresponding parts as those in the first embodiment. The same applies to other embodiments.

In this embodiment, as shown in FIG. 12, the insulating material 8 and the shield material 12 are pressed by the pressing jig 23 without using the vacuum pump 15 of the first embodiment.

That is, in the present embodiment, the insulating material 8 and the shielding material 12 are pressed against the surface la side force of the base plate 1 using the pressing jig 23, and the air in the insulating material 8 and the shielding material 12 is passed through the through-hole 5 or the like. By discharging the force as well, the shielding material 12 is approximated to a shape formed by discharging air by the vacuum pump 15 of the first embodiment.

[0051] In this case, the pressing jig 23 is not necessarily a hard material such as a press die, and a slightly soft material is used for the contact surface with the shield material 12. In addition, a plurality of recesses 24 are formed on the front end surface of the pressing jig 23 corresponding to the arrangement form of the electronic component 20.

As described above, according to the present embodiment, the air inside the shield material 12 can be discharged by the pressing jig 23 so that the shield material 12 is brought into close contact with the electronic component 20. And miniaturization can be achieved. Since other configurations and operations are the same as those of the first embodiment, description thereof will be omitted.

[0053] (Third embodiment)

FIG. 13 is a cross-sectional view showing a state in which a heat dissipation measure is taken in the third embodiment of the present application, and FIG. 14 is a cross-sectional view showing an operation in a state in which the heat dissipation measure is taken in FIG.

In the present embodiment, as shown in FIG. 13, an opening 26 for heat dissipation is formed in the insulating material 8 located above the electronic component 20 serving as a representative heat source. In the case of an IC package as the electronic component 20, it is not necessary to insulate the upper part with the insulating material 8. A size that can be worn, or a size that is slightly smaller than the size of the heat conductive sheet material 27, and is formed in advance. Stick material 27.

[0055] By the way, the above-described conventional invention has a configuration in which the printed wiring board is vacuum-packed with a bag-like body having a laminated film force having an electromagnetic wave shielding layer, and therefore, a heat sink is provided on the electronic component mounted on the printed wiring board. There is a problem that internal heat dissipation measures cannot be taken.

On the other hand, in the present embodiment, as indicated by an arrow in FIG. 14, the upper force of the electronic component 20 serving as a representative heat source also transfers heat to the shield material 12 via the heat conductive sheet material 27. If a heat radiating member such as a heat sink (not shown) is disposed outside the shield material 12, for example, the heat of the electronic component 20 serving as a typical heat source can be absorbed by the heat radiating member and radiated.

As described above, according to the present embodiment, the opening 26 for heat dissipation is formed in the insulating material 8 located on the upper part of the electronic component 20 that is a representative heat source, and the opening 26 is closed. Even if the internal space of the shield material 12 is narrowed by forming the shield material 12 in close contact with the electronic component 20 by sticking the heat conductive sheet material 27, the electronic component 20 is not impaired. It is possible to provide a route for transferring the heat of the outside to the outside, and the heat of the electronic component 20 can be reliably radiated. Other configurations and operations are the same as those in the first embodiment, and thus description thereof is omitted.

[0058] (Fourth embodiment)

FIG. 15 is a plan view showing an adhesive line region and a conductive line region provided on the printed wiring board according to the fourth embodiment of the present application.

In the present embodiment, as shown in FIG. 14, rounded portions 6a and 7a are formed at the corners of the bonding line region 6 and the conductive line region 7, respectively. In accordance with this, the corners of the insulating material 8 and the shielding material 12 are also rounded.

[0060] In this way, the rounded portions 6a and 7a are formed at the respective corners of the bonding wire region 6 and the conductive wire region 7, and the corners of the insulating material 8 and the shielding material 12 are also rounded in accordance with this. As a result, the corners of the insulating material 8 bonded to the adhesive 9 in the bonding line region 6 and the shielding material bonded to the anisotropic conductive adhesive (ACP) 16 applied to the conductive line region 7 are obtained. It is possible to prevent cracks and breaks from occurring in the 12 corners during the production process. Other structures Since the composition and operation are the same as those of the first embodiment, the description thereof is omitted.

[0061] Although the navigation apparatus is applied to each of the above embodiments as an example of an electronic device, the present invention is not limited to this. For example, a notebook computer, a mobile phone, a digital camera, etc. It can also be applied to various consumer electronic devices that are required to be downsized.

[0062] The present invention is not limited to the above embodiments. Each of the above-described embodiments is an exemplification, and has any configuration that is substantially the same as the technical idea described in the claims of the present invention, and that has the same functions and effects. It is included in the technical scope of the present invention.

Claims

The scope of the claims

[1] An electronic device having electronic components mounted on a printed circuit board,

An electronic apparatus, wherein a shield material is coated so as to be in close contact with the electronic component disposed in a target region for electromagnetic wave shielding on one side of the printed wiring board.

[2] In the electronic device according to claim 1,

An electronic device comprising an insulating material provided on a side of the shield material that covers the electronic component.

[3] In the electronic device according to claim 2,

The electronic device is characterized in that the insulating material is laminated on the shield material.

[4] In the electronic device according to claim 1,

An electronic device comprising: a heat conductive sheet provided on the electronic component; and the heat generated in the electronic component via the heat conductive sheet is dissipated from the shield material.

[5] A method for manufacturing a shielding material for an electronic device, in which an electronic component is mounted on a printed wiring board and electromagnetic shielding is performed on the electronic component.

A shielding material coating step of coating a shielding material on the electronic component arranged in a target area for performing electromagnetic wave shielding on one side of the printed wiring board;

An air discharging step of discharging air from within the shielding material coated on the electronic component by the shielding material coating step;

A method for manufacturing a shielding material for electronic equipment, comprising:

[6] The method for manufacturing a shielding material for electronic equipment according to claim 5,

The method for producing a shielding material for an electronic device, wherein the air discharging step sucks air from within the shielding material by driving a vacuum pump.

[7] In the method for manufacturing a shielding material for electronic equipment according to claim 5,

The method of manufacturing a shielding material for an electronic device, wherein the air discharging step includes pressing a pressing member against the shielding material to discharge air from the shielding material.

[8] The method for manufacturing a shielding material for electronic equipment according to claim 5,

A shielding material for electronic equipment, comprising: an adhesion step of adhering the shielding material coated on the electronic component to the printed wiring board with an anisotropic conductive adhesive. Manufacturing method.

[9] In the method for manufacturing a shielding material for an electronic device according to claim 5,

A method for manufacturing a shield material for an electronic device, comprising: an adhesion step of bonding the shield material covered with the electronic component to a solder formed in advance on the printed wiring board by thermocompression bonding.

[10] The method for manufacturing a shielding material for electronic equipment according to claim 5,

An electronic device shield comprising: an insulating material coating step of previously covering the electronic component disposed in a target region for electromagnetic wave shielding on one side of the printed wiring board before the shielding material is coated. Material manufacturing method.