WO2008014679A1 - Rare earth medium slurry for rare earth thick-film circuit based on metal substrate and producing process thereof - Google Patents

Rare earth medium slurry for rare earth thick-film circuit based on metal substrate and producing process thereof Download PDF

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Publication number
WO2008014679A1
WO2008014679A1 PCT/CN2007/002225 CN2007002225W WO2008014679A1 WO 2008014679 A1 WO2008014679 A1 WO 2008014679A1 CN 2007002225 W CN2007002225 W CN 2007002225W WO 2008014679 A1 WO2008014679 A1 WO 2008014679A1
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rare earth
slurry
metal substrate
organic solvent
glass
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PCT/CN2007/002225
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French (fr)
Chinese (zh)
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Ke Zheng Wang
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Ke Zheng Wang
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/0656—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of silicides

Definitions

  • the present invention relates to rare earth thick film circuit rare earth medium slurry based on metal substrate, and particularly relates to a ferritic stainless steel series substrate, for example: national standard lCrl5, lCrl7, 00Crl2 and other foreign brands such as 429#, 43Q#, 410IJ and other high-power rare earth thick film circuit rare earth medium slurry and its preparation technology.
  • the new heating element requires small volume, large power, small thermal inertia, large surface thermal load, low power consumption, high thermal efficiency, fast hot start, stable power, uniform temperature field, and process. Good performance, self-controlled temperature, safe and reliable operation, long life and wide adaptability; At present, there is no heating element that can meet the above requirements, so a new type of electric heating element such as rare earth thick film electric heating element is used to meet the above requirements. It is imperative.
  • the object of the present invention is to provide a high breakdown strength, good rim performance, printing characteristics, and burning
  • Another object of the present invention is to provide a method for preparing a rare earth dielectric slurry of the above rare earth thick film circuit.
  • the rare earth dielectric slurry of the rare earth thick film circuit based on the metal substrate is prepared by a solid phase component and an organic solvent carrier according to a certain preparation process, wherein the weight ratio of the solid phase component to the organic solvent is: 65 ⁇ 85: 35 ⁇ 15.
  • the solid phase component is: Si0 2 - Al 2 0 3 -Ca0-B 2 0 3 - L 0 3 based glass ceramics, and the distribution ratio of each oxide is: Si0 2 (30 ⁇ 70%), A1 2 0 3 (5 ⁇ 30%), Ca0 (20 ⁇ 40%), B 2 0 3 (1 ⁇ 15%), La 2 0 3 (0 ⁇ 3 ⁇ 15%), Co 2 0 3 (0. 05 ⁇ 10%), Ti0 2 (1 ⁇ 10 %), Zr0 2 (1 ⁇ 10%):
  • the distribution ratio (weight) of each group of the organic solvent carrier is: butyl carbitol (66 to 89%), tributyl citrate (5 to 15%), ethyl cellulose (0.5 to 10%), hydrogenation Castor oil (0. 1 ⁇ 5%), lecithin (0.1 to 5%).
  • the rare earth thick pancreatic circuit rare earth medium slurry based on the metal substrate of the invention and the preparation technology thereof are as follows:
  • organic solvent carrier The following main solvent, thickener, thixotropic agent, surface
  • the active agent is immersed in water at 80 to 100 ° C for several hours.
  • Butyl carbitol (66 to 89%), tributyl citrate (5 to: 15%), ethyl cellulose (0. 5 ⁇
  • the ethyl cellulose content was adjusted, and the viscosity of the organic solvent carrier was measured by a viscometer, and the viscosity of the organic vehicle was adjusted to be in the range of 150 to 280 mPas.
  • 3 medium slurry preparation the weight ratio of the solid phase component to the organic solvent carrier is: 65 ⁇ 85: 35 ⁇ : L5. After being placed in a three-dimensional mixer and stirred and dispersed, the product was rolled by a three-roll mill. The viscosity of the slurry was measured with a viscometer and the viscosity value was 60 to 250 PaS/RPM.
  • the REE slurry was determined by kinetic analysis of the swelling coefficient, glass transition temperature, glass softening temperature and nucleation growth of Si0 2 - ⁇ 1 2 0 3 - CaO - ⁇ 2 0 3 - La 2 0 3 system. Glass crystallizing formula and preparation process. The expansion coefficient is matched with the metal substrate, and the combination is firm, and the breakdown strength and the insulation performance are effectively improved.
  • Y203 rare earth yttrium oxide
  • Rare earth lanthanum (La) doping greatly changes the sintering properties, microstructure, density, phase composition and physical and mechanical properties of the glass-ceramic material phase. Thereby, the dielectric strength, electrical performance, process performance and wettability, compatibility and molecular bonding strength of the rare earth thick film circuit electric heating element are improved. Improve the process and significantly improve the product's excellent rate.
  • the rare earth dielectric paste of the rare earth dielectric film of the invention has excellent printing performance and sintering performance. versus The rare earth resistor paste and the conductor paste have excellent wettability and compatibility.
  • the rare earth functional electronic paste of the invention can be prepared not only on a metal substrate but also on a glass ceramic, ceramic and other metal non-metal substrates. It can be prepared not only on a flat surface but also on a curved surface. The scope of use is quite extensive.
  • the technical materials of the invention do not need to rely on imports. 100% localization, reducing the amount of precious metals, low cost, low material consumption and energy saving. It meets the requirements of the new industrialization road of circular economy advocated by China (high scientific and technological content, good economic benefit, low resource consumption, and low environmental pollution), and it has strong prospects for foreign exchange earning.
  • the invention is compatible with various metal substrates, resistive pastes, and point paste pastes by adjusting functional phase composition, content, and sintering process.
  • an alumina substrate A1 2 0 3
  • an aluminum nitride (AIN) substrate AIN
  • AIN aluminum nitride
  • the rare earth medium slurry for the rare earth thick film circuit of the invention and the preparation technique thereof are suitable for the ferrite series stainless steel substrate.
  • the electric heating element adopting the invention completely satisfies the small volume, large power, small thermal inertia, large surface heat load, low power consumption, high thermal efficiency, fast hot start, stable power, uniform temperature field, good processability, and body self-control temperature. It is safe and reliable to operate, has a long service life, and meets the requirements of new heating elements with a wide range of applications. Specific implementation plan:
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • This embodiment is a rare earth thick film circuit rare earth medium slurry for lCrl5 (429#) series stainless steel metal substrate. It is composed of solid phase component composed of glass ceramic powder and organic solvent carrier.
  • the composition and formulation process are as follows: :
  • the solid phase composition is made of Si0 2 - A1 2 0 3 - CaO- B 2 0 3 - La 2 0 3 glass ceramics.
  • the formula is: Si0 2 (36%), A1 2 0 3 (16%), Ca0 (25%), B 2 0 3 (7%), L3 ⁇ 40 3 (6%), Co 2 0 3 (2%), Ti0 2 (5%), Zr0 2 (3):
  • the melting temperature is: 1350 ⁇ After 120 minutes of heat preservation, it is quickly discharged and quenched to obtain glass micro slag.
  • the glass slag was placed in a two-stage ball mill ball mill to prepare a glass-ceramic powder having a particle diameter of less than 3 ⁇ m.
  • the ethyl cellulose content was adjusted, and the viscosity of the organic solvent carrier was measured by a viscometer, and the viscosity of the organic vehicle was adjusted to be in the range of 150 to 280 mPas.
  • Rare earth thick film circuit rare earth medium slurry for 1 7 (430#) series stainless steel metal substrate the medium slurry is composed of solid phase component composed of glass ceramic powder and organic solvent carrier, and the process steps and formula are as follows:
  • the melting temperature is: 1350 ⁇ After 120 minutes of heat preservation, it is quickly discharged and quenched to obtain glass micro slag.
  • the glass slag was placed in a two-stage ball mill ball mill to prepare a glass-ceramic powder having a particle diameter of less than 3 ⁇ m.
  • the thickness of the rare earth dielectric slurry film layer is: 85 ⁇ ⁇
  • rare earth lanthanum significantly improves the electrical properties, adhesion, puncture strength and insulation properties of thick film circuits, and improves thick film.
  • the preparation process of circuit electronic paste improves product quality and efficiency. Therefore, it is called rare earth thick film circuit rare earth dielectric paddle.
  • the rare earth medium slurry for rare earth thick film circuit of the invention and the preparation process thereof are suitable for the ferrite series stainless steel substrate.
  • ferrite series stainless steel substrate For example: National standard number lCrl5, lCrl7, 00Crl2, etc. Foreign brands 429#, 430#, 410L# and so on.

Abstract

A rare earth medium slurry for the rare earth thick-film circuit based on the metal substrate and producing process thereof, the slurry is composed of a solid phase component and an organic solvent carrier in wt ratio of (70-90):(30-10). The solid phase component is SiO2-Al2O3-CaO-B2O3-La2O3-based microcrystal glass in wt ratio of SiO2: 30%-65%, Al2O3: 5%-26%, CaO: 18%-38%, B2O3: 2%-16%, La2O3:0. 3%-15%, Co2O3:0. 05%-6%, TiO2: 1%-10%, ZrO2: 1-10%. Its producing process includes following steps: (1) preparing the rare earth microcrystal glass powder;(2) preparing the organic solvent carrier;(3) roller trio mixing and roller trio rolling;(4) preparing the rare earth slurry. The slurry is in use of ferrite-based stainless steel substrate.

Description

基于金属基板的稀土厚膜电路用稀土介质浆料及其制备工艺 技术领域： 本发明涉及基于金属基板的稀土厚膜电路稀土介质浆料， 特别涉及基 于铁素体不锈钢系列基板,例如： 国标牌号 lCrl5、 lCrl7、 00Crl2等国外 牌号 429#、 43Q#、 410IJ等大功率稀土厚膜电路用稀土介质浆料及其制备 工艺技术。  Rare earth medium slurry for rare earth thick film circuit based on metal substrate and preparation process thereof TECHNICAL FIELD The present invention relates to rare earth thick film circuit rare earth medium slurry based on metal substrate, and particularly relates to a ferritic stainless steel series substrate, for example: national standard lCrl5, lCrl7, 00Crl2 and other foreign brands such as 429#, 43Q#, 410IJ and other high-power rare earth thick film circuit rare earth medium slurry and its preparation technology.
背景技术： Background technique:
在我国确立的可持续发展战略中， 涉及到的两个方面是环境保护和提 高能量利用率、 改善能量结构。 在电加热领域中， 新型的加热元件要求体 积要小、功率要大、热惰性要小、表面热负荷要大、耗电低、热效率要高、 热启动快、 功率稳定、 温度场均匀、 工艺性好、 本体自控温、 运行安全可 靠， 寿命长,适应范围广； 目前， 还没有能满足上述要求的加热元件， 因而 采用新型电热元件如稀土厚膜电路电热元件， 使之满足上述要求势在必 行。  In the sustainable development strategy established in China, the two aspects involved are environmental protection and improving energy efficiency and improving energy structure. In the field of electric heating, the new heating element requires small volume, large power, small thermal inertia, large surface thermal load, low power consumption, high thermal efficiency, fast hot start, stable power, uniform temperature field, and process. Good performance, self-controlled temperature, safe and reliable operation, long life and wide adaptability; At present, there is no heating element that can meet the above requirements, so a new type of electric heating element such as rare earth thick film electric heating element is used to meet the above requirements. It is imperative.
二十一世纪初， 美国杜邦公司已经将其用于咔啡壶的不锈钢发热盘推 向中国市场， 国内科研院校 2003年也陆续推出用于不锈钢基板的厚膜电 路电子浆料， 但都使用同一种基板， 同一类电子浆料， 包括介质浆料、 贵 金属电阻浆料 （银钯）、 导电浆料。 技术成本、 质量成本、 产品质量、 应 用范围都受到限制。 由其是介质浆料制备效率低、 电器性能、 湿润性差， 电阻浆料稳定性欠佳、 成本高居不下， 电极浆料易氧化、 高温下银离子易 迁移、 附着力不牢等。 致使该技术推广应用发展缓慢。  At the beginning of the 21st century, DuPont of the United States has introduced its stainless steel heating plate for scented syrup pots to the Chinese market. Domestic research institutes have also introduced thick film electronic pastes for stainless steel substrates in 2003, but they all use The same type of substrate, the same type of electronic paste, including dielectric paste, noble metal resistance paste (silver palladium), conductive paste. Technical costs, quality costs, product quality, and application range are all limited. It is low in productivity of dielectric slurry, poor in electrical properties and wettability, poor in stability of resistive paste, high in cost, easy to oxidize electrode paste, easy migration of silver ions at high temperature, and poor adhesion. As a result, the promotion and application of this technology has been slow.
据查证， 岂今为止， 国内外还没有基于 lCrl5、 1 17、 00Crl2 (国外 牌号 430#、 429#、 410L#) 系列不锈钢基片的稀土厚膜电路， 稀土系列电 子桨料及其制备技术的文献、 专利和成果的相关报道。 '  According to the investigation, there are no rare earth thick film circuits based on lCrl5, 1 17 and 00Crl2 (foreign brand 430#, 429#, 410L#) series of stainless steel substrates, rare earth series electronic paddles and their preparation techniques. Reports on patents and results. '
发明内容 Summary of the invention
本发明的目的在于提供一种击穿强度高、 决缘性能好、 印刷特性、 烧  The object of the present invention is to provide a high breakdown strength, good rim performance, printing characteristics, and burning
1  1
―献本 结特性、 环保性能优良且与金属基板、 电阻浆料、 导电浆料湿润性相容性 优良的基于金属基板的稀土厚膜电路稀土介质浆料。 ―Offer A metal substrate-based rare earth thick film circuit rare earth medium paste excellent in junction characteristics and environmental performance and excellent in wettability with a metal substrate, a resistive paste, and a conductive paste.
本发明的另一目的还在于提供一种上述稀土厚膜电路稀土介质浆料的 制备方法。  Another object of the present invention is to provide a method for preparing a rare earth dielectric slurry of the above rare earth thick film circuit.
本发明采用下列技术方案来达到上述目的的：  The present invention adopts the following technical solutions to achieve the above objectives:
本发明基于金属基板的稀土厚膜电路稀土介质浆料， 由固相组分和有 机溶剂载体按一定制备工艺制成， 其中固相组分与有机溶剂的重量配比 为： 65〜85： 35〜15。  The rare earth dielectric slurry of the rare earth thick film circuit based on the metal substrate is prepared by a solid phase component and an organic solvent carrier according to a certain preparation process, wherein the weight ratio of the solid phase component to the organic solvent is: 65~85: 35 ~15.
所述的固相成分为： Si02- Al203-Ca0-B203- L 03系微晶玻璃， 各氧化物 的成分配比为: Si02 ( 30〜70%)、 A1203 (5〜30%)、 Ca0 (20〜40%)、 B203 ( 1〜 15%)、 La203 (0· 3〜15%)、 Co203 (0. 05〜10%)、 Ti02 ( 1〜10%)、 Zr02 ( 1〜 10%)： The solid phase component is: Si0 2 - Al 2 0 3 -Ca0-B 2 0 3 - L 0 3 based glass ceramics, and the distribution ratio of each oxide is: Si0 2 (30~70%), A1 2 0 3 (5~30%), Ca0 (20~40%), B 2 0 3 (1~15%), La 2 0 3 (0· 3 ~15%), Co 2 0 3 (0. 05 ~10%), Ti0 2 (1~10 %), Zr0 2 (1~ 10%):
有机溶剂载体各组分配比 （重量） 为： 丁基卡必醇 （66〜89%)、 柠檬 酸三丁酯 （5〜15%)、 乙基纤维素 （0. 5〜10%)、 氢化篦麻油 （0. 1〜5%)、 卵磷脂 (0. 1〜5%)。  The distribution ratio (weight) of each group of the organic solvent carrier is: butyl carbitol (66 to 89%), tributyl citrate (5 to 15%), ethyl cellulose (0.5 to 10%), hydrogenation Castor oil (0. 1~5%), lecithin (0.1 to 5%).
本发明基于金属基板的稀土厚胰电路稀土介质浆料及其制备工艺技术 为:  The rare earth thick pancreatic circuit rare earth medium slurry based on the metal substrate of the invention and the preparation technology thereof are as follows:
①制备稀土微晶玻璃粉： 按百分比重量配比将下列氧化物： Si02 ( 30〜 65%)、 A1203 (5〜26%)、 Ca0 (18〜38%)、 B203 (2〜16%)、 La203 (0. 3〜15%)、 Co203 (0· 05〜10%)、 Ti02 ( 1〜10%)、 Zr02 ( 1〜10%) : .经三维混料机混合 均匀后置于白金坩埚在高温熔炉中熔炼， 熔炼温度为： 1100〜1450°C保温 90〜180分钟后， 迅速出炉水淬， 得到玻璃微渣。 将玻璃渣置于两级球磨 机球磨， 制备出粒径小于 3微米的微晶玻璃粉。 1 Preparation of rare earth glass-ceramic powder: The following oxides are proportioned by weight: Si0 2 (30~65%), A1 2 0 3 (5~26%), Ca0 (18~38%), B 2 0 3 (2~16%), La 2 0 3 (0. 3 ~15%), Co 2 0 3 (0· 05~10%), Ti0 2 (1~10%), Zr0 2 (1~10%) After mixing by a three-dimensional mixer, it is placed in a platinum crucible and smelted in a high-temperature furnace. The melting temperature is: 1100~1450 °C for 90 to 180 minutes, and then rapidly quenched to obtain glass micro-slag. The glass slag was placed in a two-stage ball mill ball mill to prepare a glass-ceramic powder having a particle diameter of less than 3 μm.
②配制有机溶剂载体： 将下列配比的主溶剂、 增稠剂、 触变剂、 表面 活性剂， 再 80〜100°C的水中溶浴数小时。 2 Formulation of organic solvent carrier: The following main solvent, thickener, thixotropic agent, surface The active agent is immersed in water at 80 to 100 ° C for several hours.
丁基卡必醇（66〜89%)、柠檬酸三丁酯（5〜： 15%)、 乙基纤维素（0. 5〜 Butyl carbitol (66 to 89%), tributyl citrate (5 to: 15%), ethyl cellulose (0. 5~
10%)、 氢化篦麻油 (0. 1〜5%)、 卵磷脂 (0. 1〜5%)。 10%), hydrogenated castor oil (0.11% to 5%), lecithin (0.1% to 5%).
调整乙基纤维素含量， 用粘度计检测有机溶剂载体粘度， 将有机载体 的粘度调整在 150〜280mPas的范围内。  The ethyl cellulose content was adjusted, and the viscosity of the organic solvent carrier was measured by a viscometer, and the viscosity of the organic vehicle was adjusted to be in the range of 150 to 280 mPas.
③介质浆料调制： 将固相成分与有机溶剂载体的重量比按： 65〜85： 35〜： L5。置于三维混料机搅拌分散后用三棍轧机轧制得到成品。 用粘度计 测试浆料粘度， 粘度值为： 60〜250PaS/RPM。  3 medium slurry preparation: the weight ratio of the solid phase component to the organic solvent carrier is: 65~85: 35~: L5. After being placed in a three-dimensional mixer and stirred and dispersed, the product was rolled by a three-roll mill. The viscosity of the slurry was measured with a viscometer and the viscosity value was 60 to 250 PaS/RPM.
本发明的主要优点在于： The main advantages of the invention are:
1. 通过对国内外厚膜电路用电子浆料物理、 化学性能及工艺性能研 究分析， 决定在电子浆料中参杂稀土镧（La)和钇（Y)， 实验证明介质桨 料中由于稀土的加入， 浆料的电性能、 湿润性、 相溶性、 分子间键结合强 度及工艺性都有很大提高。通过对 Si02— Α1203— CaO— Β203— La203系微 晶玻璃膨涨系数、 玻璃化温度、 玻璃软化温度及形核长大的动力学分析， 确定稀土介质浆料微晶玻璃配方及制备工艺。使之膨胀系数和金属基板匹 配， 结合牢靠， 有效提高击穿强度和绝缘性能。 1. Through the analysis of the physical, chemical properties and process properties of electronic paste for thick film circuits at home and abroad, it is decided to dope rare earth lanthanum (La) and yttrium (Y) in the electronic slurry. With the addition, the electrical properties, wettability, compatibility, intermolecular bond strength and processability of the slurry are greatly improved. The REE slurry was determined by kinetic analysis of the swelling coefficient, glass transition temperature, glass softening temperature and nucleation growth of Si0 2 - Α1 2 0 3 - CaO - Β 2 0 3 - La 2 0 3 system. Glass crystallizing formula and preparation process. The expansion coefficient is matched with the metal substrate, and the combination is firm, and the breakdown strength and the insulation performance are effectively improved.
. 2. 采用稀土氧化钇（Y203，）， 降低烧结温度， 促进烧结， 改进工艺， 提高效率， 节省能源。 增强不锈钢的抗氧化性和延展性， 提高结合强度。  2. Use rare earth yttrium oxide (Y203,) to reduce sintering temperature, promote sintering, improve process, improve efficiency and save energy. Enhances the oxidation resistance and ductility of stainless steel and improves the bonding strength.
3. 稀土镧 （La) 掺杂极大地改变微晶玻璃材料相的烧结性能、 微观 结构、 致密度、 相组成及物理和机械性能。 从而提高稀土厚膜电路电热 元件的介质强度、 电器性能、 工艺性能及电子桨料的湿润性、 兼容性和分 子健结合强度。 改善工艺， 显著提高产品优良率。  3. Rare earth lanthanum (La) doping greatly changes the sintering properties, microstructure, density, phase composition and physical and mechanical properties of the glass-ceramic material phase. Thereby, the dielectric strength, electrical performance, process performance and wettability, compatibility and molecular bonding strength of the rare earth thick film circuit electric heating element are improved. Improve the process and significantly improve the product's excellent rate.
4. 本发明稀土厚膜电路稀土介质浆料印刷性能、 烧结性能优良。 与 稀土电阻浆料、 导体浆料有优良的湿润性和相溶性。 4. The rare earth dielectric paste of the rare earth dielectric film of the invention has excellent printing performance and sintering performance. versus The rare earth resistor paste and the conductor paste have excellent wettability and compatibility.
5. 基于对稀土电子浆料中各有机溶剂机理的深刻认识， 将不同沸点 及挥发速度的主溶剂按比例合理配制使浆料在印刷、 烘干、 烧结等过程中 均匀挥发并排出， 避免溶剂集中挥发形成开裂、 针孔等缺陷。 有效提高成 品合格率。  5. Based on the deep understanding of the mechanism of various organic solvents in rare earth electronic pastes, the main solvents with different boiling points and volatilization speeds are proportioned reasonably, so that the slurry is uniformly volatilized and discharged during printing, drying and sintering, avoiding solvents. Concentrate volatilization to form defects such as cracks and pinholes. Effectively improve the qualified rate of finished products.
6. 在有机溶剂配方中选用氢化篦麻油等优良溶剂作触变剂以形成良 好的胶体结构， 使浆料具有良好的触变性和防沉效果。'  6. Use an excellent solvent such as hydrogenated castor oil as a thixotropic agent in the organic solvent formulation to form a good colloidal structure, so that the slurry has good thixotropy and anti-settling effect. '
本发明所配稀土功能电子浆料不仅能制备在金属基板上， 还能制备在 微晶玻璃、 陶瓷及其它金属非金属基板上。 不仅能制备在平面上， 还能制 备在曲面上。 用途范围相当广泛。  The rare earth functional electronic paste of the invention can be prepared not only on a metal substrate but also on a glass ceramic, ceramic and other metal non-metal substrates. It can be prepared not only on a flat surface but also on a curved surface. The scope of use is quite extensive.
本发明技术材料不需依赖进口.， 100%国产化， 减少贵金属用量， 成本 低廉，材料消耗少，节能。符合我国倡导的循环经济的新型工业化道路（科 技含量高、 经济效益好、 资源消耗低、 环境污染少） 的要求， 而且有很强 的出口创汇前景。  The technical materials of the invention do not need to rely on imports. 100% localization, reducing the amount of precious metals, low cost, low material consumption and energy saving. It meets the requirements of the new industrialization road of circular economy advocated by China (high scientific and technological content, good economic benefit, low resource consumption, and low environmental pollution), and it has strong prospects for foreign exchange earning.
本发明通过调整功能相成分、含量及烧结工艺， 该介质浆料可和多种 金属基板、 电阻浆料、 点极浆料相容。 例如： 氧化铝基板 （A1203)、 氮化 铝 （AIN) 基板、 微晶玻璃基板、 金属合金铝、 钛合金基板等。 本发明稀 土厚膜电路用稀土介质浆料及其制备技术适用于铁素体系列不锈钢基板。 例如： 国标牌号 lCrl5、 lCrl7、 00Crl2等。 国外牌号 429#、 430#、 410L# 等。 The invention is compatible with various metal substrates, resistive pastes, and point paste pastes by adjusting functional phase composition, content, and sintering process. For example, an alumina substrate (A1 2 0 3 ), an aluminum nitride (AIN) substrate, a glass-ceramic substrate, a metal alloy aluminum, a titanium alloy substrate, or the like. The rare earth medium slurry for the rare earth thick film circuit of the invention and the preparation technique thereof are suitable for the ferrite series stainless steel substrate. For example: National standard number lCrl5, lCrl7, 00Crl2, etc. Foreign brands 429#, 430#, 410L#, etc.
采用了本发明的电热元件完全满足体积小、 功率大、 热惰性小、 表面 热负荷大、 耗电低、 热效率高、 热启动快、 功率稳定、 温度场均匀、 工艺 性好、本体自控温、运行安全可靠， 寿命长，适应范围广的新型加热元件要 求。 具体实施方案： The electric heating element adopting the invention completely satisfies the small volume, large power, small thermal inertia, large surface heat load, low power consumption, high thermal efficiency, fast hot start, stable power, uniform temperature field, good processability, and body self-control temperature. It is safe and reliable to operate, has a long service life, and meets the requirements of new heating elements with a wide range of applications. Specific implementation plan:
实施例一： Embodiment 1:
本实施例为用于 lCrl5 (429#) 系列不锈钢金属基板的稀土厚膜电路 稀土介质浆料， 它由微晶玻璃粉组成的固相成分和有机溶剂载体制备构 成， 其组份及配方工艺如下：  This embodiment is a rare earth thick film circuit rare earth medium slurry for lCrl5 (429#) series stainless steel metal substrate. It is composed of solid phase component composed of glass ceramic powder and organic solvent carrier. The composition and formulation process are as follows: :
1. 固相成分采用 Si02- A1203- CaO- B203- La203系微晶玻璃， 配方为： Si02 (36%)、 A1203 ( 16%)、 Ca0 (25%)、 B203 (7%)、 L¾03 (6%)、 Co203 (2%)、 Ti02 (5%)、 Zr02 ( 3)： 1. The solid phase composition is made of Si0 2 - A1 2 0 3 - CaO- B 2 0 3 - La 2 0 3 glass ceramics. The formula is: Si0 2 (36%), A1 2 0 3 (16%), Ca0 (25%), B 2 0 3 (7%), L3⁄40 3 (6%), Co 2 0 3 (2%), Ti0 2 (5%), Zr0 2 (3):
2. 熔炼工艺： 熔炼温度为： 1350Ό 保温 120分钟后， 迅速出炉水淬， 得到玻璃微渣。将玻璃渣置于两级球磨机球磨， 制备出粒径小于 3微米的 微晶玻璃粉。  2. Melting process: The melting temperature is: 1350 Ό After 120 minutes of heat preservation, it is quickly discharged and quenched to obtain glass micro slag. The glass slag was placed in a two-stage ball mill ball mill to prepare a glass-ceramic powder having a particle diameter of less than 3 μm.
3. 配制有机溶剂载体：  3. Formulation of organic solvent carrier:
将下列配比的主溶剂、 增稠剂、 触变剂、 表面活性剂， 再 85°C的水中 溶浴数小时。  The following main solvent, thickener, thixotropic agent, and surfactant were dissolved in water at 85 ° C for several hours.
丁基卡必醇（78%)、 柠檬酸三丁酯 （10%)、 乙基纤维素 （5)、 氢化篦 麻油 （4%)、 卵磷脂（3%)。 调整乙基纤维素含量， 用粘度计检测有机溶剂 载体粘度， 将有机载体的粘度调整在 150〜280mPas的范围内。  Butyl carbitol (78%), tributyl citrate (10%), ethyl cellulose (5), hydrogenated castor oil (4%), lecithin (3%). The ethyl cellulose content was adjusted, and the viscosity of the organic solvent carrier was measured by a viscometer, and the viscosity of the organic vehicle was adjusted to be in the range of 150 to 280 mPas.
4. 介质浆料调制： 将固相成分（微晶玻璃粉）与有机溶剂载体的重量 比按： 72 : 28。 置于三维混料机搅拌分散后用三棍轧机轧制得到成品。  4. Medium slurry preparation: The weight ratio of the solid phase component (glass-ceramic powder) to the organic solvent carrier is: 72:28. After being placed in a three-dimensional mixer and stirred and dispersed, the product was rolled by a three-roll mill.
5. 本实施例的稀土介质桨料的性能- 稀土介质浆料膜层厚度为： 85 m  5. Performance of the rare earth dielectric paddle of this embodiment - the thickness of the rare earth dielectric slurry film layer is: 85 m
①物理性能：
Figure imgf000006_0001
1 physical properties:
Figure imgf000006_0001
②电器性能:  2 electrical performance:
泄漏电流 绝缘电阻 ' 击穿强度  Leakage current insulation resistance ' breakdown strength
<3raA ( 250VDC) >50 Ω ( 500VDC) >1800VAC 实施例二： <3raA (250VDC) >50 Ω (500VDC) >1800VAC Embodiment 2:
用于 1 7 (430#)系列不锈钢金属基板的稀土厚膜电路稀土介质浆料， 该介质浆料由微晶玻璃粉组成的固相成分和有机溶剂载体制备构成，其工 艺步骤及配方如下：  Rare earth thick film circuit rare earth medium slurry for 1 7 (430#) series stainless steel metal substrate, the medium slurry is composed of solid phase component composed of glass ceramic powder and organic solvent carrier, and the process steps and formula are as follows:
• 1 - Si02- A1203- CaO- B203- La203系微晶玻璃配方为： Si02(34%)、 A1203( 19%)、 Ca0 (22%)、 B203 ( 10%)、 La203 (4%)、 Co203 ( 1%)、 Ti02 (6%)、 Zr02 (4%)：• 1 - Si0 2 - A1 2 0 3 - CaO- B 2 0 3 - La 2 0 3 series of glass-ceramics are: Si0 2 (34%), A1 2 0 3 (19%), Ca0 (22%) , B 2 0 3 (10%), La 2 0 3 (4%), Co 2 0 3 (1%), Ti0 2 (6%), Zr0 2 (4%):
2. 熔炼工艺： 熔炼温度为： 1350Ό 保温 120分钟后， 迅速出炉水淬, 得到玻璃微渣。 将玻璃渣置于两级球磨机球磨， 制备出粒径小于 3微米的 微晶玻璃粉。 2. Melting process: The melting temperature is: 1350 Ό After 120 minutes of heat preservation, it is quickly discharged and quenched to obtain glass micro slag. The glass slag was placed in a two-stage ball mill ball mill to prepare a glass-ceramic powder having a particle diameter of less than 3 μm.
3. 配制有机溶剂载体：  3. Formulation of organic solvent carrier:
将下列配比的主溶剂、 增稠剂、 触变剂、 表面活性剂， 再 85°C的水中 丁基卡必醇 （76%)、 柠檬酸三丁酯 （11%)、 乙基纤维素 （6%)、 氢化篦 麻油 （4)、 卵磷脂 （3%)。 调整乙基纤维素含量， 用粘度计检测有机溶剂 载体粘度， 将有机载体的粘度调整在 150〜280mPaS的范围内。 The following main solvents, thickeners, thixotropic agents, surfactants, butyl carbitol (76%), tributyl citrate (11%), ethyl cellulose in water at 85 ° C (6%), hydrogenated castor oil (4), lecithin (3%). Adjusting the content of ethylcellulose with an organic solvent carrier viscometer detector viscosity, the viscosity of the organic carrier is adjusted in the range of 150~280mP aS.
4. 介质浆料调制： 将固相成分（微晶玻璃粉）与有机溶剂载体的重量 比按： 70 : 30。 置于三维混料机搅拌分散后用三棍轧机轧制得到成品。  4. Medium slurry preparation: The weight ratio of the solid phase component (glass ceramic powder) to the organic solvent carrier is 70:30. After being placed in a three-dimensional mixer and stirred and dispersed, the product was rolled by a three-roll mill.
5. 稀土介质浆料的性能：  5. Performance of rare earth media slurry:
稀土介质浆料膜层厚度为： 85 μ ιη  The thickness of the rare earth dielectric slurry film layer is: 85 μ ιη
①物理性能：
Figure imgf000007_0001
1 physical properties:
Figure imgf000007_0001
②电器性能: 泄漏电流 绝缘电阻 击穿强度 2 electrical performance: Leakage current insulation resistance breakdown strength
<3mA (250VDC) >50Μ Ω ( 500VDC) >1800VAC 本发明配方中， 添加稀土镧 （La) 的应用显著提升了厚膜电路的电性 能，附着力、击穿强度和绝缘性能， 改善了厚膜电路电子浆料的制备工艺， 提升产品质量和效率。 故而称其为稀土厚膜电路稀土介质桨料。  <3mA (250VDC) >50Μ Ω (500VDC) >1800VAC In the formulation of the invention, the addition of rare earth lanthanum (La) significantly improves the electrical properties, adhesion, puncture strength and insulation properties of thick film circuits, and improves thick film. The preparation process of circuit electronic paste improves product quality and efficiency. Therefore, it is called rare earth thick film circuit rare earth dielectric paddle.
本发明稀土厚膜电路用稀土介质漿料及其制备工艺技术适用于铁素体 系列不锈钢基板。 例如： 国标牌号 lCrl5、 lCrl7、 00Crl2等。 国外牌号 429#、 430#、 410L#等。  The rare earth medium slurry for rare earth thick film circuit of the invention and the preparation process thereof are suitable for the ferrite series stainless steel substrate. For example: National standard number lCrl5, lCrl7, 00Crl2, etc. Foreign brands 429#, 430#, 410L# and so on.

Claims

& 利 要 泉 书 & Lee Spring Book
1. 一种基于金属基板的稀土厚膜电路稀土介质浆料， 其特征在于， 该 浆料是由微晶玻璃粉组成的固相成分和有机溶剂载体制备构成，其固相成 分与有机溶剂载体的重量比为： （65〜85 ) ： ( 35〜15)。  A rare earth thick film rare earth dielectric slurry based on a metal substrate, characterized in that the slurry is composed of a solid phase component composed of glass ceramic powder and an organic solvent carrier, and the solid phase component and the organic solvent carrier are prepared. The weight ratio is: (65~85): (35~15).
2. 根据权利要求 1所述基于金属基板的稀土厚膜电路稀土介质浆料， 其特征在于， 所述固相成分为 Si02-Al203- CaO- B - L¾03系微晶玻璃，各类 氧化物的重量配比为： The rare earth thick film circuit rare earth medium slurry based on a metal substrate according to claim 1, wherein the solid phase component is Si0 2 -Al 2 0 3 - CaO-B - L3⁄40 3 type glass ceramics. The weight ratio of various oxides is:
Si02 30〜65%、 A1203 5〜26%、 CaO 18〜38%、 Β20, 2〜1696、 La203 0. 3〜15%.、 Co203 0. 05〜6% 、 Ti02 1〜10% 、 Zr02 1〜10% 。 Si0 2 30~65%, A1 2 0 3 5 ~26%, CaO 18~38%, Β 2 0, 2 ~1696, La 2 0 3 0. 3 ~15%., Co 2 0 3 0. 05~ 6%, Ti0 2 1 ~10%, Zr0 2 1 ~10%.
3.根椐权利要求 1或 2所述基于金属基板的稀土厚膜电路稀土介质浆 料， 其特征在于， 所述固相成分中还含有稀土元素镧 （La)， 其重量配比 为： L 03 0. 3〜15% 。 The rare earth thick film rare earth dielectric slurry based on a metal substrate according to claim 1 or 2, wherein the solid phase component further contains a rare earth element lanthanum (La), and the weight ratio thereof is: L 0 3 0. 3 ~15%.
4.根椐权力要求 1或 2所述基于金属基板的稀土厚膜电路稀土介质浆 料， 其特征在于， 所述有机溶剂载体中各组分重量配比为： 丁基卡必醇 66〜89% 、 柠檬酸三丁酯 5〜15% 、 乙基纤维素 0. 5〜10% 、 氢化篦麻油 0. 1〜5% 、 卵磷脂 0. 1〜5% 。  4. The metal substrate-based rare earth thick film circuit rare earth medium slurry according to claim 1 or 2, wherein the weight ratio of each component in the organic solvent carrier is: butyl carbitol 66 to 89 1〜5%。 Lithium citrate 0. 5~10%, hydrogenated castor oil 0. 1~5%, lecithin 0. 1~5%.
5.一种制备权利要求 1-4所述的基于金属基板的稀土厚膜电路稀土介 质浆料的工艺， 其特征在于： 它包括如下工艺步骤： '  A process for preparing a rare earth thick film rare earth dielectric paste based on a metal substrate according to any one of claims 1 to 4, characterized in that it comprises the following process steps:
①制备稀土微晶玻璃粉： 按百分比重量配比将下列氧化物： Si02 30〜 65% 、 A1203 5〜26% 、 CaO 18〜38% 、 B203 2〜16% 、 La203 0· 3〜15% 、 Co203 0. 05〜6% 、 Ti02 1〜10% 、 Zr02 1〜10% ： 经混合均匀后高温熔炼， 熔炼温度为： 1100〜1450°C 保温 90〜180分钟后， 迅速出炉水淬， 得到 玻璃微渣； 将玻璃渣球磨， 制备出粒径小于 3微米的微晶玻璃粉； ②配制有机溶剂载体： 将下列配比的主溶剂、 增稠剂、 触变剂、 表面 活性剂， 再 80〜100°C的水中溶浴数小时： 1 Preparation of rare earth glass-ceramic powder: The following oxides are ratio by weight: Si0 2 30~ 65%, A1 2 0 3 5 ~26%, CaO 18~38%, B 2 0 3 2 ~16%, La 2 0 3 0· 3 ~15%, Co 2 0 3 0. 05~6%, Ti0 2 1 ~10%, Zr0 2 1 ~10% : After mixing and homogenizing, the melting temperature is: 1100~1450° After C is kept for 90~180 minutes, it is quickly quenched and quenched to obtain glass micro-slag; the glass slag is ball milled to prepare a glass-ceramic powder having a particle diameter of less than 3 microns; 2 Formulation of organic solvent carrier: The following main solvent, thickener, thixotropic agent and surfactant are dissolved in water at 80~100 °C for several hours:
丁基卡必醇 66〜89% 、 柠檬酸三丁酯 5〜15% 、 乙基纤维素 0. 5〜 10% 、 氢化篦麻油 0. 1〜5% 、 卵磷脂 0. 1〜5% 。 调整乙基纤维素含量， 用粘度计检测有机溶剂载体粘度，将有机载体的粘度调整在 150〜280mPaS 的范围内； 1〜5%。 The butyl carbitol, the butyl ketone, the butyl ketone. Adjusting the ethyl cellulose content, measuring the viscosity of the organic solvent carrier by a viscometer, adjusting the viscosity of the organic carrier in the range of 150 to 280 mPa S ;
③介质浆料调制：将固相成分与有机溶剂载体的重量比按：（65〜85 ) ： ( 35〜15 ) ;. 经搅拌分散后轧制得到成品。  3 medium slurry preparation: the weight ratio of the solid phase component to the organic solvent carrier is: (65~85): (35~15);. After being dispersed and dispersed, the product is obtained by rolling.
6、根据权利要求 5所述的基于金属基板的稀土厚膜电路稀土介质浆料 的制备工艺， 其特征在于， 所述第①步骤中， 所述氧化物是经三维混料机 混合均匀后置于白金坩埚在高温熔炉中熔炼，得到的玻璃微渣是置于两级 球磨机球磨制备出粒径小于 3微米的微晶玻璃粉。  The process for preparing a rare earth dielectric slurry of a rare earth thick film circuit based on a metal substrate according to claim 5, wherein in the first step, the oxide is uniformly mixed after being mixed by a three-dimensional mixer. The slag is smelted in a high-temperature furnace, and the obtained glass slag is placed in a two-stage ball mill to prepare a glass-ceramic powder having a particle diameter of less than 3 μm.
7、根据权利要求 5所述的基于金属基板的稀土厚膜电路稀土介质桨料 的制备工艺， 其特征在于， 所述第③步骤中， 所述固相成分与有机溶剂载 体是置于三维混料机搅拌分散后用三棍轧机轧制得到成品。  The metal substrate-based rare earth thick film circuit rare earth medium slurry preparation process according to claim 5, wherein in the third step, the solid phase component and the organic solvent carrier are placed in a three-dimensional mixture After the machine is stirred and dispersed, it is rolled by a three-bar rolling mill to obtain a finished product.
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* Cited by examiner, † Cited by third party
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CN101106842B (en) * 2007-07-24 2011-12-21 王晨 Thick film circuit heating part based on minicrystal glass base plate and its making technology
CN101613209B (en) * 2009-07-16 2013-02-06 中国人民解放军国防科学技术大学 High temperature anti-oxidation coating and slurry for same of Cf/SiC composite material and preparation method thereof
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CN102685942B (en) * 2012-05-29 2014-05-07 王克政 Intelligent electric-heating element with PTC (Positive Temperature Coefficient) rare-earth thick film circuit and preparation method thereof
CN104318979A (en) * 2014-09-19 2015-01-28 王晨 Composite-material-based thick-film circuit rare earth electrode slurry and preparation process thereof
CN105472791A (en) * 2015-12-23 2016-04-06 东莞珂洛赫慕电子材料科技有限公司 Rare earth-doped semiconductor infrared radiation thick-film electronic paste and preparation method therefor
CN106601392B (en) * 2016-11-14 2018-11-27 东莞珂洛赫慕电子材料科技有限公司 A kind of dielectric paste and preparation method thereof being adapted to aluminium silicon carbide substrate
CN107068244A (en) * 2016-12-09 2017-08-18 东莞珂洛赫慕电子材料科技有限公司 It is a kind of applied to dielectric slurry of aluminium base thick film circuit and preparation method thereof
CN106653151A (en) * 2017-01-12 2017-05-10 东莞珂洛赫慕电子材料科技有限公司 High-temperature infrared frequency-modulation dielectric paste and preparation method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5277844A (en) * 1993-03-29 1994-01-11 Rainey Clifford S Resistor composition
JPH08186006A (en) * 1994-12-28 1996-07-16 Du Pont Kk Thick film resistor composition
JPH1012406A (en) * 1996-06-18 1998-01-16 Marcon Electron Co Ltd Laminated ceramic varistor
JP2002367804A (en) * 2001-06-11 2002-12-20 K-Tech Devices Corp Resistor
CN1424728A (en) * 2002-12-30 2003-06-18 中国人民解放军国防科学技术大学 Conductive sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate
CN1424727A (en) * 2002-12-30 2003-06-18 中国人民解放军国防科学技术大学 Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate
CN1424729A (en) * 2002-12-30 2003-06-18 中国人民解放军国防科学技术大学 Medium sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate
CN1588573A (en) * 2004-07-28 2005-03-02 王克政 PTC thick film curc uit controllable electric heating element

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5277844A (en) * 1993-03-29 1994-01-11 Rainey Clifford S Resistor composition
JPH08186006A (en) * 1994-12-28 1996-07-16 Du Pont Kk Thick film resistor composition
JPH1012406A (en) * 1996-06-18 1998-01-16 Marcon Electron Co Ltd Laminated ceramic varistor
JP2002367804A (en) * 2001-06-11 2002-12-20 K-Tech Devices Corp Resistor
CN1424728A (en) * 2002-12-30 2003-06-18 中国人民解放军国防科学技术大学 Conductive sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate
CN1424727A (en) * 2002-12-30 2003-06-18 中国人民解放军国防科学技术大学 Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate
CN1424729A (en) * 2002-12-30 2003-06-18 中国人民解放军国防科学技术大学 Medium sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate
CN1588573A (en) * 2004-07-28 2005-03-02 王克政 PTC thick film curc uit controllable electric heating element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116535893A (en) * 2023-04-28 2023-08-04 有研稀土新材料股份有限公司 Organic slurry with gradient volatilization rate and preparation method thereof

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