WO2008012131A1 - Sensor module for a vehicle tyre - Google Patents

Sensor module for a vehicle tyre Download PDF

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Publication number
WO2008012131A1
WO2008012131A1 PCT/EP2007/055303 EP2007055303W WO2008012131A1 WO 2008012131 A1 WO2008012131 A1 WO 2008012131A1 EP 2007055303 W EP2007055303 W EP 2007055303W WO 2008012131 A1 WO2008012131 A1 WO 2008012131A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
sensor module
antenna
module according
sensor
Prior art date
Application number
PCT/EP2007/055303
Other languages
German (de)
French (fr)
Inventor
Joerg Muchow
Thorsten Pannek
Gustav Klett
Thomas Buck
Sonja Knies
Ulrike Scholz
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2008012131A1 publication Critical patent/WO2008012131A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B60C23/0491—Constructional details of means for attaching the control device
    • B60C23/0493—Constructional details of means for attaching the control device for attachment on the tyre
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
    • B60C23/0422—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver characterised by the type of signal transmission means
    • B60C23/0433—Radio signals
    • B60C23/0447—Wheel or tyre mounted circuits
    • B60C23/0452—Antenna structure, control or arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2241—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in or for vehicle tyres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • Tire sensors are used in particular for measuring tire pressure, i. used as so-called Tire Pressure Monitoring Systems (TPMS). They are usually mounted as sensor modules on the rim or on the valve of the tire and transmit their data wirelessly by means of an antenna to a receiving device of the vehicle, which forwards them to a central control unit of the vehicle.
  • TPMS Tire Pressure Monitoring Systems
  • the antenna is generally provided as a wire outside the sensor.
  • Vulcanization When mounting the sensor module in the tire by e.g. Vulcanization is therefore the antenna to align their construction accordingly, which has correspondingly complicated assembly steps result.
  • the invention is based on the idea to design the antenna with a substantially homogeneous emission property or antenna property in one plane.
  • it is formed in or on the circuit carrier as a loop antenna or loop antenna, ie in a substantially closed form, which comprises a loop region.
  • it is substantially round or completely round and extends in an outer region of the circuit carrier.
  • the antenna can be arranged, for example, on the rear side, the front side or in an intermediate plane of the circuit carrier receiving the components. This is based on the finding that an antenna having a homogeneous radiation in a plane, even with any placement in the vehicle tire can deliver a sufficient antenna signal to the receiver provided on the vehicle chassis.
  • the circuit carrier can be accommodated in particular in a housing; Alternatively, however, he can also z. B. be poured. Furthermore, z. As well as two substrates such interconnected, z. B. be soldered or glued that forms a cavity between them, in which the elements are included.
  • the circuit carrier of the sensor module is formed rotationally symmetrical about the axis of symmetry of the loop antenna; When accommodated in a housing, this is also formed correspondingly rotationally symmetrical.
  • the antenna can be formed on the outer circumference of the circular circuit carrier and thus exploit the available surface with rotationally symmetrical radiation characteristic.
  • a shape without corners and edges, in particular a round shape of the housing, allows the integration into the rubber material of the vehicle tire, without being bothersome for the occurring during operation deformations of the vehicle tire.
  • the sensor module can thus be vulcanized into the rubber material, in particular in the tread or in the region of the tread.
  • a relatively small RF range on the upper side of the circuit carrier for example, less than / equal to 40%, preferably less than / equal to 25% of the top of the circuit substrate occupies.
  • no large-area metal areas are formed in or on the circuit carrier; also preferably closed interconnects are avoided.
  • the sensor element and a sensor control circuit are provided, which is preferably designed as a sensor ASIC; as high-frequency components, an oscillator and an RF circuit are provided, the z. B. is designed as an RF ASIC.
  • the populated circuit carrier is in a housing made of e.g. Plastic used.
  • FIG. 1 shows a sensor module according to the invention before the inserted circuit carrier is inserted into the housing in a perspective view
  • FIG. 2 shows the rear side of the circuit carrier with the antenna
  • FIG. 3 shows the emission characteristic of the antenna.
  • a sensor module 1 has, as a circuit carrier, a printed circuit board 2 with a plurality of components mounted on its front side 2 a.
  • a sensor element 3 for example a pressure sensor element, temperature sensor element and / or acceleration sensor element, and a sensor ASIC 4 for receiving the measurement signals of the sensor element 3 are provided as low-frequency components.
  • an RF components an oscillator 5 and an RF ASIC 6 are mounted and contacted in each case via conductor tracks 8.
  • the HF components 5, 6 and the interconnects 8 connecting them define an HF region 10 on the front side 2a which is illustrated by a drawn line in FIG. 1 and occupies a maximum of 30, preferably not more than 25% of the area of the front side 2a.
  • an antenna 12 is designed as a loop antenna or loop antenna with at least substantially circular shape and feed point (feed point) 13 and end point 14 lying close to one another on or in the circuit carrier 2. It can according to FIG. 2 e.g. the back 2b of the circuit substrate 2 is formed. Basically, an embodiment of the antenna 12 on the front side 2a or in a plane of the circuit substrate 2 is possible. In this case, the antenna 12 extends along the outer circumference of the circular circuit carrier 2 in order to enclose the largest possible area. Its feed point 13 is connected to the circuit on the front side 2a of the circuit carrier 2 by means of a through-connection 16 indicated in FIG.
  • no large-area metal surfaces are formed in or on the circuit carrier 2 and furthermore no closed conductor tracks are formed in order not to impair the emission characteristic of the antenna as a result.
  • Fig. 3 is substantially isotropic within the X-plane or circuit carrier level or antenna plane, with differences in the attenuation of eg maximum 12 dB.
  • the circuit substrate 2 and the housing 15 according to the invention have no corners or edges, but are rounded.
  • the round or rotationally symmetrical shape shown is advantageous, but in principle also e.g. elliptical training possible.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

The invention relates to a sensor module for a vehicle tyre which has at least: a circuit carrier (2), a sensor element (3) which is mounted on the circuit carrier (2), an evaluation and control device (4) which is mounted on the circuit carrier (2), an antenna (12) for transmitting antenna signals to a reception device which is provided on the vehicle, wherein the antenna (12) is embodied in or on the circuit carrier (2) as a loop antenna, preferably with an essentially round, continuous shape. The circuit carrier (2) is advantageously accommodated in a housing (15). The circuit carrier (2), and if appropriate also the housing (15), are preferably embodied here in an essentially rotational symmetrical fashion.

Description

Titel title
Sensormodul für einen FahrzeugreifenSensor module for a vehicle tire
Stand der TechnikState of the art
Reifensensoren werden insbesondere zur Messung des Reifendrucks, d.h. als so genannte Reifendruckkontrollsysteme (TPMS) verwendet. Sie werden üblicherweise als Sensormodule an der Felge oder am Ventil des Reifens angebracht und übertragen ihre Daten drahtlos mit Hilfe einer Antenne an eine Empfangseinrichtung des Fahrzeuges, die sie zu einem zentralen Steu- ergerät des Fahrzeuges weiterleitet.Tire sensors are used in particular for measuring tire pressure, i. used as so-called Tire Pressure Monitoring Systems (TPMS). They are usually mounted as sensor modules on the rim or on the valve of the tire and transmit their data wirelessly by means of an antenna to a receiving device of the vehicle, which forwards them to a central control unit of the vehicle.
Die Antenne ist im Allgemeinen als Draht außerhalb des Sensors vorgesehen. Bei der Montage des Sensormoduls im Reifen durch z.B. Einvulkanisieren ist die Antenne daher ihrer Konstruktion entsprechend auszurichten, was entsprechend aufwendige Montageschritte zur Folge hat.The antenna is generally provided as a wire outside the sensor. When mounting the sensor module in the tire by e.g. Vulcanization is therefore the antenna to align their construction accordingly, which has correspondingly complicated assembly steps result.
Offenbarung der ErfindungDisclosure of the invention
Der Erfindung liegt der Gedanke zugrunde, die Antenne mit einer weitgehend homogenen Abstrahleigenschaft bzw. Antenneneigenschaft in einer Ebene auszubilden. Hierzu wird sie in oder auf dem Schaltungsträger als Schleifenantenne bzw. Loop-Antenne, d. h. in einer im wesentlichen geschlossenen Form ausgebildet, die einen Schleifenbereich umfasst. Vorteilhafterweise ist sie im Wesentlichen rund oder ganz rund ausgebildet und erstreckt sich in einem Außenbereich des Schaltungsträgers. Die Antenne kann hierbei z.B. auf der Rückseite, der Vorderseite oder in einer Zwischenebene des die Bauelemente aufnehmenden Schaltungsträgers angeordnet sein. Dem liegt die Erkenntnis zugrunde, dass eine Antenne, die eine homogene Abstrahlung in einer Ebene aufweist, auch bei einer beliebigen Platzierung im Fahrzeugreifen ein hinreichendes Antennensignal zu der am Fahrzeugchassis vorgesehenen Empfangseinrichtung abgeben kann.The invention is based on the idea to design the antenna with a substantially homogeneous emission property or antenna property in one plane. For this purpose, it is formed in or on the circuit carrier as a loop antenna or loop antenna, ie in a substantially closed form, which comprises a loop region. Advantageously, it is substantially round or completely round and extends in an outer region of the circuit carrier. In this case, the antenna can be arranged, for example, on the rear side, the front side or in an intermediate plane of the circuit carrier receiving the components. This is based on the finding that an antenna having a homogeneous radiation in a plane, even with any placement in the vehicle tire can deliver a sufficient antenna signal to the receiver provided on the vehicle chassis.
Der Schaltungsträger kann insbesondere in einem Gehäuse aufgenommen werden; alternativ hierzu kann er jedoch auch z. B. eingegossen werden. Weiterhin können z. B. auch zwei Substrate derartig miteinander verbunden, z. B. verlötet oder verklebt werden, dass zwischen ihnen eine Kavität ausge- bildet wird, in der die Elemente aufgenommen sind.The circuit carrier can be accommodated in particular in a housing; Alternatively, however, he can also z. B. be poured. Furthermore, z. As well as two substrates such interconnected, z. B. be soldered or glued that forms a cavity between them, in which the elements are included.
Vorteilhafterweise wird der Schaltungsträger des Sensormoduls rotationssymmetrisch um die Symmetrieachse der Schleifenantenne ausgebildet; bei Aufnahme in einem Gehäuse wird auch dieses entsprechend rotationssym- metrisch ausgebildet. Hierdurch ergeben sich mehrere Vorteile:Advantageously, the circuit carrier of the sensor module is formed rotationally symmetrical about the axis of symmetry of the loop antenna; When accommodated in a housing, this is also formed correspondingly rotationally symmetrical. This results in several advantages:
Die Antenne kann am Außenumfang des runden Schaltungsträgers ausgebildet werden und somit die zur Verfügung stehende Fläche bei rotationssymmetrischer Abstrahlungscharakteristik ausnutzen.The antenna can be formed on the outer circumference of the circular circuit carrier and thus exploit the available surface with rotationally symmetrical radiation characteristic.
Eine Form ohne Ecken und Kanten, insbesondere eine runde Form des Gehäuses, ermöglicht die Einbindung in das Gummimaterial des Fahrzeugreifens, ohne störend für die im Betrieb auftretenden Verformungen des Fahrzeugreifens zu sein.A shape without corners and edges, in particular a round shape of the housing, allows the integration into the rubber material of the vehicle tire, without being bothersome for the occurring during operation deformations of the vehicle tire.
Es ist eine hierdurch eine Anbringung des Sensormoduls bzw. Reifensensormoduls im Gummimaterial ohne aufwendige Montage in grundsätzlich beliebiger Ausrichtung ermöglicht. Das Sensormodul kann somit in das Gummimaterial einvulkanisiert werden, insbesondere auch in der Lauffläche oder im Bereich der Lauffläche. Vorteilhaft ist die Ausbildung eines relativ kleinen HF-Bereichs auf der Oberseite des Schaltungsträgers, der z.B. kleiner/gleich 40 %, vorzugsweise kleiner/gleich 25 % der Oberseite des Schaltungsträgers einnimmt. Weiterhin sind vorteilhafterweise keine großflächigen Metallbereiche in oder an dem Schaltungsträger ausgebildet; auch werden vorzugsweise geschlossene Leiterbahnen vermieden. Erfindungsgemäß wurde erkannt, dass durch diese an sich nicht aufwendigen Maßnahmen in überraschender Weise eine sehr homogene Abstrahlcharakteristik einer Loop-Antenne erreicht werden konnte.This makes it possible to mount the sensor module or tire sensor module in the rubber material without complicated assembly in basically any orientation. The sensor module can thus be vulcanized into the rubber material, in particular in the tread or in the region of the tread. Advantageously, the formation of a relatively small RF range on the upper side of the circuit carrier, for example, less than / equal to 40%, preferably less than / equal to 25% of the top of the circuit substrate occupies. Furthermore, advantageously no large-area metal areas are formed in or on the circuit carrier; also preferably closed interconnects are avoided. According to the invention, it was recognized that a very homogeneous emission characteristic of a loop antenna could be achieved in a surprising manner by these measures, which are in themselves not complex.
Als niederfrequente Bauelemente sind das Sensorelement und ein Sensor- Steuerschaltkreis vorgesehen, der vorzugsweise als Sensor-ASIC ausgebildet ist; als hochfrequente Bauelemente sind ein Oszillator und ein HF- Schaltkreis vorgesehen, der z. B. als RF-ASIC ausgebildet ist. Bei der Herstellung des erfindungsgemäßen Sensormoduls wird der bestückte Schal- tungsträger in ein Gehäuse aus z.B. Kunststoff eingesetzt.As low-frequency components, the sensor element and a sensor control circuit are provided, which is preferably designed as a sensor ASIC; as high-frequency components, an oscillator and an RF circuit are provided, the z. B. is designed as an RF ASIC. In the manufacture of the sensor module according to the invention, the populated circuit carrier is in a housing made of e.g. Plastic used.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Fig. 1 zeigt ein erfindungsgemäßes Sensormodul vor Einsetzen des be- stückten Schaltungsträgers in das Gehäuse in perspektivischer1 shows a sensor module according to the invention before the inserted circuit carrier is inserted into the housing in a perspective view
Ansicht von oben;View from above;
Fig. 2 zeigt die Rückseite des Schaltungsträgers mit der Antenne, Fig. 3 zeigt die Abstrahlcharakteristik der Antenne.FIG. 2 shows the rear side of the circuit carrier with the antenna, FIG. 3 shows the emission characteristic of the antenna.
Ein Sensormodul 1 weist als Schaltungsträger eine Leiterplatte 2 mit mehreren auf ihrer Vorderseite 2a angebrachten Bauelementen auf. Hierbei sind als niederfrequente Bauelemente ein Sensorelement 3, z.B. ein Drucksensorelement, Temperatursensorelement und/oder Beschleunigungssensorelement, und ein Sensor-ASIC 4 zur Aufnahme der Messsignale des Sen- sorelementes 3 vorgesehen. Weiterhin sind als HF-Bauelemente ein Oszillator 5 und ein RF-ASIC 6 montiert und jeweils über Leiterbahnen 8 kontaktiert. Die HF-Bauelemente 5, 6 und die sie verbindenden Leiterbahnen 8 definieren hierbei einen in Fig. 1 durch eine eingezeichnete Linie verdeutlichten HF- Bereich 10 auf der Vorderseite 2a, der maximal 30, vorzugsweise maximal 25 % der Fläche der Vorderseite 2a einnimmt.A sensor module 1 has, as a circuit carrier, a printed circuit board 2 with a plurality of components mounted on its front side 2 a. In this case, a sensor element 3, for example a pressure sensor element, temperature sensor element and / or acceleration sensor element, and a sensor ASIC 4 for receiving the measurement signals of the sensor element 3 are provided as low-frequency components. Furthermore, as an RF components, an oscillator 5 and an RF ASIC 6 are mounted and contacted in each case via conductor tracks 8. In this case, the HF components 5, 6 and the interconnects 8 connecting them define an HF region 10 on the front side 2a which is illustrated by a drawn line in FIG. 1 and occupies a maximum of 30, preferably not more than 25% of the area of the front side 2a.
Gemäß Fig. 2b ist eine Antenne 12 als Schleifenantenne bzw. Loop-Antenne mit zumindest im Wesentlichen Kreisform und nahe beieinander liegenden Zuführungspunkt (Feed-Punkt) 13 und Endpunkt 14 auf oder in dem Schaltungsträger 2 ausgebildet. Sie kann gemäß Fig. 2 z.B. der Rückseite 2b des Schaltungsträgers 2 ausgebildet. Grundsätzlich ist auch eine Ausbildung der Antenne 12 auf der Vorderseite 2a oder in einer Ebene des Schaltungsträgers 2 möglich. Die Antenne 12 erstreckt sich hierbei entlang des äußeren Umfangs des runden Schaltungsträgers 2, um eine möglichst große Fläche einzuschließen. Ihr Zuführungspunkt 13 ist mit der Schaltung auf der Vorder- seite 2a des Schaltungsträgers 2 mittels einer in Fig. 1 angedeuteten Durch- kontaktierung 16 verbunden.According to FIG. 2 b, an antenna 12 is designed as a loop antenna or loop antenna with at least substantially circular shape and feed point (feed point) 13 and end point 14 lying close to one another on or in the circuit carrier 2. It can according to FIG. 2 e.g. the back 2b of the circuit substrate 2 is formed. Basically, an embodiment of the antenna 12 on the front side 2a or in a plane of the circuit substrate 2 is possible. In this case, the antenna 12 extends along the outer circumference of the circular circuit carrier 2 in order to enclose the largest possible area. Its feed point 13 is connected to the circuit on the front side 2a of the circuit carrier 2 by means of a through-connection 16 indicated in FIG.
Erfindungsgemäß sind in oder auf dem Schaltungsträger 2 keine großflächigen Metallflächen und weiterhin keine geschlossenen Leiterbahnen ausge- bildet, um die Abstrahlcharakteristik der Antenne hierdurch nicht zu beeinträchtigen.According to the invention, no large-area metal surfaces are formed in or on the circuit carrier 2 and furthermore no closed conductor tracks are formed in order not to impair the emission characteristic of the antenna as a result.
Durch die erfindungsgemäße Anordnung der Bauelemente auf der Vorderseite 2a und die Ausbildung einer Schleifen-Antenne 12 ergibt sich die in Fig. 3 gezeigte Abstrahlcharakteristik, die innerhalb der X-Ebene bzw. Schaltungsträgerebene bzw. Antennenebene weitgehend isotrop ist, mit Unterschieden in der Dämpfung von z.B. maximal 12 dB.The inventive arrangement of the components on the front side 2a and the formation of a loop antenna 12 results in the emission characteristic shown in Fig. 3, which is substantially isotropic within the X-plane or circuit carrier level or antenna plane, with differences in the attenuation of eg maximum 12 dB.
Der Schaltungsträger 2 und das Gehäuse 15 weisen erfindungsgemäß keine Ecken bzw. Kanten auf, sondern sind abgerundet. Vorteilhaft ist die gezeigte runde bzw. rotationssymmetrische Form, grundsätzlich sind jedoch auch z.B. elliptische Ausbildungen möglich. The circuit substrate 2 and the housing 15 according to the invention have no corners or edges, but are rounded. The round or rotationally symmetrical shape shown is advantageous, but in principle also e.g. elliptical training possible.

Claims

Ansprüche claims
1. Sensormodul für einen Fahrzeugreifen, das mindestens aufweist: einen Schaltungsträger (2), ein auf dem Schaltungsträger (2) angebrachtes Sensorelement (3), eine auf dem Schaltungsträger (2) angebrachte Auswerte- und Steuereinrichtung (4), und eine Antenne (12) zur Aussendung von Antennensignalen an eine amA sensor module for a vehicle tire, comprising at least: a circuit carrier (2), a sensor element (3) mounted on the circuit carrier (2), an evaluation and control device (4) mounted on the circuit carrier (2), and an antenna ( 12) for transmitting antenna signals to an am
Fahrzeug vorgesehene Empfangseinrichtung, wobei die Antenne (12) in oder auf dem Schaltungsträger (2) als Schleifenantenne ausgebildet ist.Vehicle provided receiving device, wherein the antenna (12) is formed in or on the circuit carrier (2) as a loop antenna.
2. Sensormodul nach Anspruch 1 , dadurch gekennzeichnet, dass es ein Gehäuse (15) aufweist, in dem der Schaltungsträger (2) vorgesehen ist.2. Sensor module according to claim 1, characterized in that it comprises a housing (15) in which the circuit carrier (2) is provided.
3. Sensormodul nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Schaltungsträger (2) und/oder das Gehäuse (15) eine rotationssymmetrische Form aufweist.3. Sensor module according to claim 1 or 2, characterized in that the circuit carrier (2) and / or the housing (15) has a rotationally symmetrical shape.
4. Sensormodul nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Antenne (12) in einer im Wesentlichen runden, geschlossenen Form ausgebildet ist.4. Sensor module according to one of the preceding claims, characterized in that the antenna (12) is formed in a substantially round, closed shape.
5. Sensormodul nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Abstrahlcharakteristik der Antenne (12) in der Sensorebene (x) innerhalb eines Dämpfungsbereichs von klei- ner/gleich 20 dB, vorzugsweise kleiner/gleich 15 dB homogen ist.5. Sensor module according to one of the preceding claims, characterized in that the radiation characteristic of the antenna (12) in the sensor plane (x) within a damping range of smaller / equal to 20 dB, preferably less than / equal to 15 dB is homogeneous.
6. Sensormodul nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Antenne (12) an einer Seite (2a, 2b) des Schaltungsträgers (2) ausgebildet und mit Bauelementen (3, 4, 5, 6) auf der anderen Seite (2b, 2a) des Schaltungsträgers mittels einer Durchkontaktierung (11 ) verbunden ist.6. Sensor module according to one of the preceding claims, characterized in that the antenna (12) is formed on one side (2a, 2b) of the circuit carrier (2) and connected to components (3, 4, 5, 6) on the other side (2b, 2a) of the circuit carrier by means of a via (11 ) connected is.
7. Sensormodul nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Schaltungsträger (2) frei von geschlossenen Leiterbahnen (8) und/oder großflächigen Metallbereichen ist.7. Sensor module according to one of the preceding claims, characterized in that the circuit carrier (2) is free of closed conductor tracks (8) and / or large-area metal areas.
8. Sensormodul nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass ein HF-Bauelemente (5, 6) enthaltender HF- Bereich (10) auf der Schaltungsträgervorderseite (2a) weniger als 40 %, vorzugsweise kleiner/gleich 25 % der Schaltungsträgervorderseite (2a) einnimmt.8. Sensor module according to one of the preceding claims, characterized in that an HF components (5, 6) containing RF region (10) on the circuit carrier front side (2a) less than 40%, preferably less than / equal to 25% of the circuit board front side (2a ) occupies.
9. Sensormodul nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass es in das Gummimaterial eines Fahrzeugreifens einvulkanisierbar ist.9. Sensor module according to one of the preceding claims, characterized in that it is vulcanizable into the rubber material of a vehicle tire.
10. Fahrzeug reifen mit einem Sensormodul nach einem der vorhergehenden Ansprüche, wobei das Sensormodul in das Gummimaterial der Lauffläche des Fahrzeugreifens einvulkanisiert ist. 10. vehicle tire with a sensor module according to one of the preceding claims, wherein the sensor module is vulcanized into the rubber material of the tread of the vehicle tire.
PCT/EP2007/055303 2006-07-26 2007-05-31 Sensor module for a vehicle tyre WO2008012131A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200610034517 DE102006034517A1 (en) 2006-07-26 2006-07-26 Sensor module for a vehicle tire
DE102006034517.7 2006-07-26

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WO2008012131A1 true WO2008012131A1 (en) 2008-01-31

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PCT/EP2007/055303 WO2008012131A1 (en) 2006-07-26 2007-05-31 Sensor module for a vehicle tyre

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DE102012223639A1 (en) 2012-10-12 2014-04-17 Robert Bosch Gmbh Method for producing an antenna on a mold module and antenna on a mold module
DE102020211228A1 (en) 2020-09-08 2022-03-10 Robert Bosch Gesellschaft mit beschränkter Haftung Transmission device and method for producing a transmission device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1223056A2 (en) * 2001-01-12 2002-07-17 The Yokohama Rubber Co., Ltd. Transponder for tire, tire with transponder and manufacturing method of tire with transponder
US20040055371A1 (en) * 2002-09-25 2004-03-25 Sanchez Ramon A. Packaging for rf signal sensor with battery changing capabilities and method of using
US20060077051A1 (en) * 2004-09-29 2006-04-13 Universal Scientific Industrial Co., Ltd. Tire pressure monitoring device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1223056A2 (en) * 2001-01-12 2002-07-17 The Yokohama Rubber Co., Ltd. Transponder for tire, tire with transponder and manufacturing method of tire with transponder
US20040055371A1 (en) * 2002-09-25 2004-03-25 Sanchez Ramon A. Packaging for rf signal sensor with battery changing capabilities and method of using
US20060077051A1 (en) * 2004-09-29 2006-04-13 Universal Scientific Industrial Co., Ltd. Tire pressure monitoring device

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