WO2008007860A1

WO2008007860A1 - Method of manufacturing heat sink for memory module

Info

Publication number: WO2008007860A1
Application number: PCT/KR2007/002711
Authority: WO
Inventors: Yun Kyung Myung
Original assignee: Phoenix Icp Co., Ltd.
Priority date: 2006-07-14
Filing date: 2007-06-05
Publication date: 2008-01-17
Also published as: US20090241340A1; KR100778022B1; KR20060090206A

Abstract

A method of manufacturing a heat sink for a memory module is provided to remarkably improve its productivity by treating a plurality of heat sinks, which are arranged at a pre-determined interval, as a single body in detaching, painting and adhesive pad adhering steps to reduce a manufacturing cost, and improve its merchantability by interrupting direct contact between the heat sinks to prevent scratch of the heat sinks. The method of manufacturing a heat sink for a memory module comprises cutting and detaching the heat sink from a metal plate coil by using a press device. The heat sinks are connected to a heat sink molded sheet at a pre-determined interval through a bridge, and are detached from the heat sink molded sheet by the press device. After the cutting and detaching steps, the heat sink molded sheet (10) is painted, an adhesive pad (5) is adhered to the painted heat sink molded sheet (10), and the heat sink is separated by cutting the bridge (12).

Description

METHOD OF MANUFACTURING HEAT SINK FOR MEMORY

MODULE

Technical Field

[1] The present invention relates to manufacture of a heat sink for a memory module, and more particularly to a method of manufacturing a heat sink for a memory module which can remarkably improve its productivity by treating a plurality of heat sinks, which are arranged at a predetermined interval, as a single body in detaching, painting and adhesive pad adhering steps to reduce a manufacturing cost, and can improve its merchantability by interrupting direct contact between the heat sinks to prevent scratch of the heat sinks. Background Art

[2] In general, a semiconductor memory module consists of semiconductor chips mounted on a printed circuit board having a plurality of pins which are electrically connected to a main board.

[3] As the semiconductor device is downsized, high-integrated, and lightened, DDR

(Double Data Rate) modules which transmit data at fast speed have been commonly used long ago. A recently developed memory module can be operated at data transmission rate several times as faster as that of the DDR module.

[4] Since the speedup of the memory module is boosted up and a board of the memory module becomes light and thin, it is required to effectively radiate the heat generated from the board and to increase the productivity thereof through mass production.

[5] A heat sink for a memory module includes, as shown in FIGs. 1 and 2, heat sinks 11 adhered on both sides of a memory module 2 by an adhesive pad 5 having high thermal conductivity, and a clip 3 fixing the both heat sinks 11.

[6] Explaining the process of manufacturing the heat sink 11 according to the prior art, a metal plate is cut one by one by using a press molding device having shape corresponding to the heat sink. After the cut metal plates are painted, the painted metal plates are adhered to the memory module.

[7] According to the conventional process, since the heat sinks 11 are cut and painted as a single body, the productivity is too low. In addition, since a body of the heat sink is directly pulled in the painting or adhering step, there is a problem in that scratch is produced on the surface of the heat sink, thereby lowering the merchantability.

[8] Also, since adhering the adhesive pad and assembling other components are conducted for each piece, the assembling productivity is lowered to increase a manufacturing cost. Disclosure of Invention

Technical Problem

[9] Therefore, the present invention has been made to solve the above-mentioned problems occurring in the prior art, and an object of the present invention is to provide a method of manufacturing a heat sink for a memory module which can remarkably improve its productivity by treating a plurality of heat sinks, which are arranged at a predetermined interval, as single body in detaching, painting and adhesive pad adhering steps to reduce a manufacturing cost.

[10] Another object of the present invention is to provide a method of manufacturing a heat sink for a memory module which can improve its merchantability by interrupting direct contact between heat sinks when transferring the heat sinks to prevent scratch of the heat sinks. Technical Solution

[11] In order to accomplish the above-mentioned objects, there is provided a method of manufacturing a heat sink for a memory module, the method comprising cutting and detaching the heat sink from a metal plate coil by using a press device, in which the heat sinks are connected to a heat sink molded sheet at a predetermined interval through a bridge, and are detached from the heat sink molded sheet by the press device.

[12] In one embodiment of the present invention, the method further comprises painting the heat sink molded sheet after the cutting and detaching steps; adhering an adhesive pad to the painted heat sink molded sheet; and separating the heat sink by cutting the bridge.

Advantageous Effects

[13] According to the present invention, the method of manufacturing the heat sink for the memory module can remarkably improve the productivity by treating a plurality of the heat sinks, which are arranged at a predetermined interval, as single body in detaching, painting and adhesive pad adhering steps. [14] Also, the heat sink are not directly contacted when transferring, thereby preventing scratch from being produced on the heat sink, thereby improving the merchantability.

Brief Description of the Drawings [15] The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: [16] FIG. 1 is an exploded perspective view illustrating a mounting of heat sinks to a memory module; [17] FIG. 2 is a perspective illustrating the heat sinks in FIG. 1; [18] FIG. 3 is a perspective view illustrating a heat sink molded sheet according to the present invention; and

[19] FIG. 4 is a flowchart explaining the process of manufacturing a heat sink according to the present invention. Best Mode for Carrying Out the Invention

[20] Now, a method of manufacturing a heat sink for a memory module according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the same drawing reference numerals are used for the same elements even in different drawings, and the duplicate explanation thereof will be omitted.

[21] FIG. 3 is a perspective view illustrating a heat sink molded sheet according to the present invention, and FIG. 4 is a flowchart explaining the process of manufacturing the heat sink.

[22] Referring to FIGs. 3 and 4, the method of manufacturing the heat sink for the memory module according to the present invention comprises cutting and detaching the heat sink from a metal plate coil by using a press device, in which the heat sinks 11 are connected to a heat sink molded sheet 10 at a predetermined interval through a bridge 12, and are detached from the heat sink molded sheet 10 by the press device.

[23] In this embodiment of the present invention, after the cutting and detaching steps, the heat sink molded sheet 10 is painted, an adhesive pad 5 is adhered on the painted heat sink molded sheet 10, and then, the bridge 12 is cut.

[24] The bridge 12 of the heat sink molded sheet 10 consists of first bridges 12a connected to left and right ends of the heat sink 11, and second bridges 12b connected to the first bridges 12a to maintain an arranging interval of the heat sinks 11.

[25] In the cutting and detaching steps, a cut line 12c is formed on each front end of the first bridges 12a, and through-holes 12d are formed on the second bridge 12b at a predetermined pitch.

[26] The through-holes 12d serve as reference points when the heat sink molded sheet is transferred in the cutting and detaching steps, and is received with jig pins which fix the heat sink molded sheet when adhering the adhesive pad or assembling other components.

[27] The method of manufacturing the heat sink for the memory module according to the present invention will now be explained.

[28] In the cutting and detaching steps, first of all, a space 15 between the heat sinks 11 is punched out from the metal plate coil, and desired portions of both ends of the heat sinks 11 are bent to form ear-ring portions 11a which guides the heat sink 11 when the heat sink is assembled to the memory module. [29] In this instance, the metal plate coil of a determined length is periodically supplied to the press device, and the press device punches the spaces 15 in one unit or plural units by using a die cut. If the heat sinks of set units, for example, 10 or 15, are arranged, the second bridge 12b is cut so that the heat sink molded sheet 10 is made.

[30] Next, after the heat sink molded sheet is painted in the painting step, the adhesive pad is adhered on the painted heat sink molded sheet. At that time, other components for the heat sink are assembled to the heat sink molded sheet.

[31] More specifically, a plurality of heat sinks arranged in parallel at a regular interval are handled as a single body in the detaching, painting, and adhesive pad adhering steps, thereby remarkably increasing its productivity. Also, the second bridge 12b is held when the heat sink is transferred. Therefore, the heat sink is not directly contacted, thereby preventing scratch form being formed on the heat sink.

[32] Each of the complete heat sinks 11 connected in parallel to each other is supported by the bridge 12.

[33] In a separating step, the manufacturing process is completed by cutting the first bridge 12a from the heat sinks 11.

[34] In this instance, if the cut lines 12c are formed on a connection portion between the first bridge 12a and the heat sink, the first bridge 12a can be easily cut from the heat sinks.

[35] The forgoing embodiments are merely exemplary and are not to be construed as limiting the present invention. The present teachings can be readily applied to other types of apparatuses. The description of the present invention is intended to be illustrative, and not to limit the scope of the claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art. Industrial Applicability

[36] As apparent from the above description, the method of manufacturing the heat sink for the memory module can remarkably improve the productivity by treating a plurality of the heat sinks, which are arranged at a predetermined interval, as single body in detaching, painting and adhesive pad adhering steps.

[37] Also, the heat sink are not directly contacted when transferring, thereby preventing scratch from being produced on the heat sink, thereby improving the merchantability.

Claims

[1] A method of manufacturing a heat sink for a memory module, the method comprising cutting and detaching the heat sink from a metal plate coil by using a press device, in which the heat sinks 11 are connected to a heat sink molded sheet 10 at a predetermined interval through a bridge 12, and are detached from the heat sink molded sheet 10 by the press device.

[2] The method as claimed in claim 1, further comprising painting the heat sink molded sheet 10 after the cutting and detaching steps; adhering an adhesive pad 5 to the painted heat sink molded sheet 10; and separating the heat sink by cutting the bridge 12.

[3] The method as claimed in claim 1, wherein the bridge 12 of the heat sink molded sheet 10 consists of first bridges 12a connected to left and right ends of the heat sink 11, and second bridges 12b connected to the first bridges 12a to maintain an arranging interval of the heat sinks 11.

[4] The method as claimed in claim 1, wherein in the cutting and detaching steps, a cut line 12c is formed on each front end of the first bridges 12a, and through- holes 12d are formed on the second bridge 12b at a predetermined pitch.