WO2008005094A3 - Process for increasing the adhesion of a metal surface to a polymer - Google Patents
Process for increasing the adhesion of a metal surface to a polymer Download PDFInfo
- Publication number
- WO2008005094A3 WO2008005094A3 PCT/US2007/010340 US2007010340W WO2008005094A3 WO 2008005094 A3 WO2008005094 A3 WO 2008005094A3 US 2007010340 W US2007010340 W US 2007010340W WO 2008005094 A3 WO2008005094 A3 WO 2008005094A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesion
- increasing
- copper
- polymer
- metal surface
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Abstract
A process for increasing the adhesion between a copper or copper alloy surface and a polymeric material is disclosed. The process comprises treating the copper or copper alloy surface with an aqueous solution of cupric ions at a pH from 2.8 to 4.2 to form an oxide conversion coating on the copper or copper alloy surface. The so treated surface can then be bonded to the polymeric material.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/479,692 US20080000552A1 (en) | 2006-06-30 | 2006-06-30 | Process for increasing the adhesion of a metal surface to a polymer |
US11/479,692 | 2006-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008005094A2 WO2008005094A2 (en) | 2008-01-10 |
WO2008005094A3 true WO2008005094A3 (en) | 2008-03-13 |
Family
ID=38875348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/010340 WO2008005094A2 (en) | 2006-06-30 | 2007-04-27 | Process for increasing the adhesion of a metal surface to a polymer |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080000552A1 (en) |
WO (1) | WO2008005094A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11061819B2 (en) | 2019-05-28 | 2021-07-13 | Micron Technology, Inc. | Distributed computing based on memory as a service |
CN112752428A (en) * | 2020-11-30 | 2021-05-04 | 深圳明阳电路科技股份有限公司 | Surface pretreatment method of metal material and production process of PCB (printed Circuit Board) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6221176B1 (en) * | 1999-03-17 | 2001-04-24 | Gould Electronics, Inc. | Surface treatment of copper to prevent microcracking in flexible circuits |
US6746547B2 (en) * | 2002-03-05 | 2004-06-08 | Rd Chemical Company | Methods and compositions for oxide production on copper |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2364993A (en) * | 1942-12-29 | 1944-12-12 | Walter R Meyer | Process for blackening copper or copper alloy surfaces |
US2460896A (en) * | 1944-08-19 | 1949-02-08 | Enthone | Composition for blackening copper and copper alloy surfaces |
US2460898A (en) * | 1944-11-04 | 1949-02-08 | Enthone | Process and composition for coloring copper and copper alloy surfaces |
US2481854A (en) * | 1946-02-14 | 1949-09-13 | Enthone | Composition to blacken surfaces of copper and of alloys containing copper |
US3198672A (en) * | 1960-08-18 | 1965-08-03 | Internat Protected Metals Inc | Preparation of cupric oxide surfaces |
US3240662A (en) * | 1961-01-23 | 1966-03-15 | Exxon Research Engineering Co | Impregnated reinforcing element bonded to an oxide coating on a copper foil |
US3177103A (en) * | 1961-09-18 | 1965-04-06 | Sauders Associates Inc | Two pass etching for fabricating printed circuitry |
US3318758A (en) * | 1963-02-18 | 1967-05-09 | Tellite Corp | Method of making a printed circuit board which includes low temperature saturation and the product |
US3374129A (en) * | 1963-05-02 | 1968-03-19 | Sanders Associates Inc | Method of producing printed circuits |
US3292109A (en) * | 1964-07-14 | 1966-12-13 | Bell Telephone Labor Inc | Nonreciprocal elastic wave coupling network |
US3434889A (en) * | 1965-12-27 | 1969-03-25 | Budd Co | Copper foil surface treatment |
US3518168A (en) * | 1966-11-18 | 1970-06-30 | Revere Copper & Brass Inc | Electrolytic process of preparing a copper foil for a plastic coat |
US3481777A (en) * | 1967-02-17 | 1969-12-02 | Ibm | Electroless coating method for making printed circuits |
US3544389A (en) * | 1967-12-18 | 1970-12-01 | Bell Telephone Labor Inc | Process for surface treatment of copper and its alloys |
US3677828A (en) * | 1970-07-30 | 1972-07-18 | Olin Corp | Tarnish resistant copper and copper alloys |
JPS5856758B2 (en) * | 1975-12-17 | 1983-12-16 | ミツイアナコンダドウハク カブシキガイシヤ | Douhakuhiyoumenshiyorihouhou |
FR2390517A1 (en) * | 1977-05-10 | 1978-12-08 | Coppertron Sa | INSTALLATION FOR THE ELECTRO-PRODUCTION OF COPPER IN SHEETS INTENDED TO BE APPLIED IN PARTICULAR TO DIELECTRIC MATERIALS |
US4131517A (en) * | 1977-06-03 | 1978-12-26 | Nippon Mining Co., Ltd. | Surface treating process for copper foil for use in printed circuit |
-
2006
- 2006-06-30 US US11/479,692 patent/US20080000552A1/en not_active Abandoned
-
2007
- 2007-04-27 WO PCT/US2007/010340 patent/WO2008005094A2/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6221176B1 (en) * | 1999-03-17 | 2001-04-24 | Gould Electronics, Inc. | Surface treatment of copper to prevent microcracking in flexible circuits |
US6746547B2 (en) * | 2002-03-05 | 2004-06-08 | Rd Chemical Company | Methods and compositions for oxide production on copper |
Also Published As
Publication number | Publication date |
---|---|
WO2008005094A2 (en) | 2008-01-10 |
US20080000552A1 (en) | 2008-01-03 |
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