WO2007142600A1 - Composition adhésive pouvant être fragilisée de façon électrochimique - Google Patents

Composition adhésive pouvant être fragilisée de façon électrochimique Download PDF

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Publication number
WO2007142600A1
WO2007142600A1 PCT/SE2007/050401 SE2007050401W WO2007142600A1 WO 2007142600 A1 WO2007142600 A1 WO 2007142600A1 SE 2007050401 W SE2007050401 W SE 2007050401W WO 2007142600 A1 WO2007142600 A1 WO 2007142600A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
adhesive composition
electrochemically
weakable
composition according
Prior art date
Application number
PCT/SE2007/050401
Other languages
English (en)
Inventor
Tommi Remonen
Petronella Norberg
Original Assignee
Stora Enso Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stora Enso Ab filed Critical Stora Enso Ab
Publication of WO2007142600A1 publication Critical patent/WO2007142600A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/122—Ionic conductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Definitions

  • the present invention relates to an electrochemically weakable adhesive.
  • the invention further relates to a laminate structure comprising said electrically weakable adhesive, a method of producing the laminate structure, a method of preparing an electrically weakable adhesive and a method for delaminating a laminate structure.
  • US 6,620,308 B2 discloses a material for use in the airplane industry.
  • the composition disclosed in US 6,620,308 B2 is developed for use as coatings and adhesives and is capable of releasing when subjected to a voltage current.
  • the composition has a matrix functionality and an electrolyte functionality, wherein the electrolyte functionality is provided by a block copolymer or a graft copolymer.
  • the matrix functionality provides an adhesive bond to a substrate, and the electrolyte functionality provides sufficient ionic conductivity to the composition to support a faradic reaction at an interface with an electrically conductive surface in contact with the composition, whereby the adhesive bond is weakened at the interface.
  • the composition may be a phase-separated composition having first regions of substantially matrix functionality and second regions of substantially electrolyte functionality.
  • US 6,620,308 further relates to a bonded structure comprising two electrically conductive surfaces and the electrochemically disbondable composition.
  • the electrochemically disbondable composition disclosed in US 6,620,308 is suitable for use in various industrial applications.
  • the voltage required to break the adhesive bonds in the composition disclosed in US 6,620,308 is quite high and the releasing time, i.e. the time needed to supply voltage to the adhesive for the adhesive bonds to be broken, is long. This limits its field of applications and makes it unsuitable for use in, e.g., packaging or distribution of products.
  • Another problem with the electrochemically disbondable composition disclosed in US 6,620,308 is that it exhibits inconsistent disbonding, especially when one or both of the conductive surfaces to which it is bonded to is not a continuously conducting material, e.g. when the surfaces consist of graphite or conducting polymers printed on a non-conducting surface.
  • the composition disclosed in US 6,620,308 is complex since it requires several additives in order to provide sufficient ion conductivity and plasticizers to achieve proper viscous properties.
  • WO20070115675 provides a package adapted to be opened by the application of a voltage.
  • the package comprises an electrically weakable adhesive incorporated in its opening. When a voltage is applied across the electrically weakable adhesive, the adhesive bonds are weakened or broken whereby the package can be opened.
  • the electrically weakable adhesives previously known in the art such as the one described in US 6,620,308, are developed for industrial use and not particularly suitable for use in packages in contact with a consumer.
  • Another object of the invention is to provide an electrically weakable adhesive suitable for a wide field of applications and which adhesive enables a wide range of materials of the conductive surface to which the adhesive is bound.
  • Yet another object of the invention is to provide an electrically weakable adhesive suitable for use in packaging- and or distribution of products, e.g. in the opening of a package.
  • an electrochemically weakable adhesive composition possessing adhesive properties to provide at least one adhesive bond to an electrically conducting surface and sufficient ion conductive properties to enable a weakening of said adhesive bond at the application of a voltage across the adhesive composition, wherein said composition comprises at least one ionic compound in an effective amount to give said ion conductive properties and wherein said ion compound has a melting point of no more than 120 0 C
  • electrochemically weakable adhesive as used herein is an adhesive that possesses adhesive properties as well as ion conductive properties, which adhesive forms adhesive bonds to an electrically conductive surface in contact with said composition and which bonds are weakened or broken at the application of a voltage to said adhesive.
  • the adhesive thus possesses sufficient ion conductive properties to enable an electrochemical reaction, e.g. a faradic reaction, to occur at the adhesive bonds. Most preferably, the adhesive bond is broken by the electrochemical reaction. Thus, most preferably the adhesive is an electrochemically breakable adhesive.
  • the adhesive comprising an ionic compound with a melting point of no more than 120 0 C of the present invention enhances the contact between the compounds providing the conductive properties of the adhesive and the conductive surfaces to which the adhesive is bound.
  • the viscous properties of the ionic compound with such a low melting point enable it to migrate into all irregularities of the conductive surface. This enables weakening of the adhesive bonds at low voltages and the use of a wide range of materials of the conducting surface to which the adhesive can be bound.
  • An enhanced contact between the compounds that provide the ionic properties of the adhesive and the conductive surface enables weakening of the adhesive bonds at lower voltages and at shorter releasing times.
  • the hydrophilicity can be changed by choosing an appropriate ionic liquid or a blend of ionic liquids.
  • the ionic compound with a melting point of no more than 120 0 C, providing the ion conductive properties is hydrophobic.
  • hydrophobic ionic compounds include, but are not limited to; l-hexyl-3- methylimidazolium 2- (2-fluoroanilino) -pyridinate, 1- hexyl-3-methylimidazolium imide, 1-butyl-l-methyl- pyrrolidinium 2- (2-fluoroanilino) -pyridinate, 1-butyl-l- methyl-pyrrolidinium imide, trihexyl (tetradecyl) phospholium 2- (2-fluoroanilino) - pyridinate or mixtures of any of the above.
  • Hydrophobic ionic compounds with a melting point of no more than 120 0 C are less sensitive to humidity changes and wet conditions that are usual in, e.g., the packaging industry.
  • electrically weakable adhesives comprising hydrophobic ionic compounds with a melting point of no more than 120 0 C are suitable for use in ,e.g., packaging or in distribution of products.
  • hydrophobic ionic compounds improve the wetting of hydrophobic materials whereby the adhesive can be used in laminates with a wider range of materials of the conductive surface. This is especially advantageous when the conducting surface consists of conducting polymer inks, since conducting polymer inks used in wet conditions usually are hydrophobic.
  • the possibility to set/choose the hydrophilicity of the ionic compound with a melting point of no more than 120 0 C enables the formation of nano-sized co-continous networks in the adhesive, with ion conducting channels, without the need of further additives.
  • This can be achieved by choosing the right combination of solvents and ionic liquids, e.g. by dispersing a hydrophobic ionic liquid in a water based adhesive or vice versa.
  • the formation of ion conducting channels in the adhesive facilitates the electrochemical reaction at the adhesive bonds and, thus, enables weakening of the adhesive bonds at lower voltages and at shorter releasing times.
  • An ionic compound having a melting point of no more than 120 0 C provides softening properties to the composition, whereby additives such as plasticizers, are not necessary.
  • the ionic properties of an electrochemically weakable composition normally increase with increased softening properties.
  • plasticizers usually give rise to weakened adhesive properties.
  • the addition of an ionic compound with a melting point below 120 0 C provides the necessary softening properties to the adhesive, but makes it possible to achieve an unaffected or even an increased adhesive strength of the adhesive.
  • the adhesive can comprise high amounts of the ionic compounds, whereby the ionic conductivity can be increased and, consequently, lower voltages are needed to break the adhesive bonds.
  • the adhesive comprises an ionic compound having a melting point below 120 0 C in an amount of at least 10 %, most preferably 20%, by weight. In another preferred embodiment, the ionic compound is present in an amount of at least 30 % by weight.
  • the ionic compound is in a liquid state when the adhesive is to be weakened or broken by applying of a voltage across the adhesive.
  • the desired ionic conductive and viscous properties of the adhesive are achieved.
  • the weakening of the adhesive usually is performed at temperatures at or below 120 0 C.
  • the ionic compound providing the ionic conductive properties of the adhesive has a melting point of no more than 100 0 C, most preferably of no more than 80 0 C. This enables the use of the adhesive also at lower temperatures without affecting the ion- conductive properties.
  • the ionic compound providing the ionic conductive properties has a melting point of no more than 50 0 C, or as low as 25 0 C or 0 0 C.
  • the possibility to choose the melting point by choosing the appropriate ionic compound can, e.g., be used in packages for frozen food.
  • the package can be provided with an electrically weakable adhesive and an electrical circuit providing voltage to the adhesive.
  • the ionic conductive properties of the adhesive might not be sufficient to give rise to an electrochemical reaction and, consequently, the adhesive bonds are not weakened or broken.
  • the ionic compound turn into a liquid phase and, consequently, provides sufficient ionic properties to the adhesive to enable an electrochemical reaction weakening or breaking the adhesive bond, whereby the package can be opened.
  • the ionic compound providing the ionic conductive properties of the adhesive can be an ionic liquid.
  • Ionic liquids are salts that are liquid at low temperatures - many at room temperature or below - and that in a molten form are composed wholly of ions.
  • Conventional molten salts exhibit a high melting point (i.e., 801 0 C for sodium chloride and 614 °C for lithium chloride Ionic liquids, however, remain liquid at or below room temperature.
  • the adopted upper melting temperature limit for the classification "ionic liquid" is 100 0 C.
  • suitable ionic liquids include, but are not limited to; ammonium ionic liquids, e.g.
  • alkylammonium salts such as cyclohexyltrimethylammonium bis (trifluormethylsulfonyl) imid or methyltrioctylammonium bis (trifluormethylsulfonyl) imide, di (2- hydrozyethyl) ammonium trifluoroaetate, N, N-dimethyl (2- hydroxyethyl) ammonium octanoate, methyltrioctylammonium bis (trifluoromethylsulfonyl) imide, guanidium ionic liquids, such as N-ethyl-N-N-N-N-tetramethylguanidinium trifluorometanesulfonate, guanidinium trifluoromethanesulfonate, pyridines, e.g.
  • alkylpyridinium salts such as 1- butyl-4-methylpyridinium bromide, l-buthyl-3- methylpyridinium tetrafluoroborate or l-butyl-3- hydroxymethylpyridinium ethylsulfate, pyrrolidines, such as 1-butyl-l-methylpyrrolidinium bis (trifluoromethylsulfonyl) imide, 1-butyl- methylpyrrolidinium tris (pentafluoroethyl) trifluorophosphate, or imidazoles, e.g., N-N .
  • pyrrolidines such as 1-butyl-l-methylpyrrolidinium bis (trifluoromethylsulfonyl) imide, 1-butyl- methylpyrrolidinium tris (pentafluoroethyl) trifluorophosphate, or imidazoles, e.g., N-N .
  • -dialkylimidazolium salts such as -3-methyl imidazolium ethylsulfate, 1. -ethyl-3-methylimidazolium chloride, l-ethyl-31-ethyl -methylimidazolium bromide, 1- butyl-3-methylimidazolium chloride, l-hexyl-3- methylimidazolium chloride, l-octyl-3-methylimidazolium chloride, l-methyl-3-octylimidazolium chloride, 1-propyl- 3-methylimidazolium iodide, l-butyl-3-methylimidazolium tetrafluoroborate, l-butyl-3-methylimidazolium trifluoromethanesulfonate, l-butyl-3-methylimidazolium hexafluorophosphate, l-butyl-2, 3-dimethylimid
  • the ionic liquid comprises a surface active ionic liquid, i.e. an ionic liquid comprising both hydrophobic groups and hydrophilic groups.
  • This group of ionic liquids include, but are not limited to, ionic liquids consisting of an imidazolium cation polar group and a hydrophobic tail, such as l-dodecyl-3-methylimidazolium bromide or 1- (2-acrylolyxyundecyl) -3-methylimidazole, and ionic liquids formulated from imidazole cations with appended perfluoro tails.
  • the surface active ionic liquid forms micelle networks in the adhesive composition without the need of further additives. This facilitates the electrochemical reaction at the adhesive bonds and enables weakening of the bonds at lower voltages and at shorter releasing times.
  • the ionic compound providing the ionic properties of the adhesive is an ionic eutectic mixture or a eutectic solvent.
  • a eutectic mixture is a mixture of two or more solid phases at a composition that gives rise to a melting point that is lower than the individual components, i.e. at a composition that has the lowest melting point or a melting point close to the lowest melting point of the mixture.
  • the eutectic mixture suitable for use in an electrochemically weakable adhesive include, but are not limited to; Fenline 200 (phenol/Choline Cholride) , Clycerine 200 (Glycerol/Choline Choliride) , Fluoline 200 (Trifluoroacetic Acid/Choline Chloride) , Maline 200 (Malonic Acid (Choline Chloride), Ethaline 197 (Ethylene Glycol/Choline Chloride), Reline 203 (Urea/Choline Chloride), Oxaline 100 (Oxalic Acid/Choline Chloride), Ciline 200 (Citric Acid/Choline Chloride) , all supplied by ScioniX Ltd.
  • the ionic liquid or the eutectic mixture can be eatable or nearly eatable. This enables the use of the electrochemically weakable adhesive in contact with a consumer, e.g. in packaging or in distribution of products.
  • nearly eatable ionic liquids suitable are Reline203 (urea/chlorine chloride), Ciline 200 (citric acid/chlorine chloride) or D- Fructose/chlorine chloride (supplied by ScioniX Ltd) .
  • the adhesive properties of the adhesive composition can be provided by at least one polymer, including, but not limited to, a polymer selected from the group consisting of epoxies, acrylics, polyesters, urethanes, polyamides, vinyls and phenolics.
  • the polymer should be present in an amount of at least 10%, preferably in an amount of at least 25 % by weight of the total adhesive composition .
  • the electrochemically weakable adhesive can, e.g., be an electrochemically weakable hot-melt adhesive, an electrochemically weakable contact adhesive, an electrochemically weakable pressure sensitive adhesive or an electrochemicaly weakable thermoset adhesive.
  • the adhesive can comprise further additives, such as hardeners, solvents, plasticizers, etc. not mentioned herein but known in the art.
  • the adhesive of the present invention has an ionic conductivity of above 10 "11 S/cm 2 , preferably above 10 ⁇ 9 S/cm 2 , such as above 10 ⁇ 7 S/cm 2 , and most preferably above 10 ⁇ 5 S/cm 2 .
  • the electrochemically weakable adhesive of the invention can further comprise polyethylene glycol.
  • the presence of polyethylene glycol in the adhesive composition contributes to the formation of stable, ion conducting, channels.
  • polyethylene glycol is present in the composition at an amount of at least 1 % by weight, preferably in an amount of at least 5%.
  • polyethylene glycol is present in an amount within the range of 5% to 10%.
  • the weight ratio of polyethylene glycol to ionic compound with a melting point of no more than 120 0 C is about 3:1 to about 1:3.
  • the weight ratio of polyethylene glycol to ionic compound with a melting point of no more than 120 0 C is 1:1.
  • the adhesive composition of the invention can further comprise a salt, i.e. an ordinary salt with a melting point of above 120 0 C, dissolved in the ionic compound with a melting point of no more than 120 0 C. The salt further improves the ionic conductive properties of the adhesive composition.
  • the salt can, e.g., be selected from the group consisting of alkali metal, alkaline earth and ammonium salts.
  • the salt includes an anion comprising at least one acidic proton, adding proton conducting functionality to the composition, e.g. bisulfite (HSO4 " ) , dihydrogen phosphate (H2PO4 " ) , hydrogen phosphate (HPO4 2 ⁇ ) , bicarbonate (HCO3 ⁇ ) or boric acid.
  • the salt is present in the adhesive in an amount of at least 1% by weight, preferably in an amount within the range of 5-10% by weight of the composition.
  • the adhesive composition comprises conductive- or non-conductive particles, preferably of nano and/or micro size.
  • the adhesive composition can comprise fibers, preferably of nano and/or micro size.
  • the particles and/or the fibers further contribute to the formation of ion conducting channels.
  • the particles are added to the composition in an amount of at least 1 % by weight of the composition.
  • Rod-like particles are preferably added within range of 1% - 10 % by weight of the total composition, while spherical or essentially spherical particles are preferably added within the range of 10 % - 25 %, most preferably within the range of 15 - 20% by weight of the total composition.
  • the fibers are added to the composition in an amount of at least 1%, more preferably within the range of 1% - 10% and most preferably within the range of 2% -5%.
  • the electrically weakable adhesive according to the invention is suitable for use in packaging and/or distribution of products.
  • the adhesive may, e.g., be used in the opening of a package.
  • a first and a second portion of a package, which portions form the opening of the package, might be provided with at least one conductive surface and the electrically weakable adhesive of the invention.
  • a voltage is applied across the adhesive whereby bonds in the adhesive is weakened and/or broken and the package can be opened.
  • the laminate of the present invention is particularly useful in packaging solutions, since it enables weakening of the adhesive bonds at low voltages and at short releasing times.
  • the ionic liquid of the invention enables the use of a wide range of materials of the conductive surfaces to which the adhesive is bound, e.g. printed conducting surfaces of graphite and/or conducting polymers. This is especially advantageous when the conductive surfaces are printed on ordinary packaging materials, such as paper, plastic or combinations thereof .
  • the invention further relates to a laminate structure comprising a first and a second electrically conducting surface and a layer of an electrically weakable adhesive composition arranged between said surfaces , which electrically weakable adhesive composition comprises an ionic compound with a melting point of no more than 120 0 C.
  • the electrically conducting surfaces are arranged at a distance from each other and the electrically weakable adhesive composition partly bridges said distance.
  • the electrically weakable adhesive composition can bridge the whole distance between the conducting surfaces. Alternatively, the distance is bridged by the electrically weakable adhesive composition and a second layer formed of an electrically conductive adhesive.
  • the thickness of the layer of the electrically weakable adhesive composition can be, e.g., 10-500 ⁇ m, such as within the range of 100-200 ⁇ m or within the range of 200 - 500 ⁇ m. Thinner layers, e.g. within the range of 10 - 200, are advantageous since the material consumption is decreased. However, thicker layers, e.g. within the range of 200 - 500 ⁇ m, can enable resealing of the laminate due to its sticky properties.
  • the high ion conductive properties of the adhesive according to the invention make it possible to have thick layers of the adhesive on the conductive surfaces and still obtain the weakening of the adhesive bonds at the application of a voltage.
  • the conducting surfaces of the laminate can be of any conducting material, e.g. metals.
  • the conducting surfaces comprise carbon, e.g. graphite.
  • the conducting surfaces are of conducting polymers. Carbon based materials, e.g. graphite, and conducting polymers can be easily printed on a non conducting surface and are therefore particularly suitable for use as conducting surfaces in packaging and distribution of products.
  • the use of the adhesive composition according to the invention facilitates the use of printed conducting surfaces.
  • the laminate structure of the invention further comprise a continuous web impregnated with an electrically weakable adhesive comprising an ionic compound with a melting point of no more than 120 0 C.
  • porous, continuous web impregnated with an ionic compound with a melting point of no more than 120 0 C form stable channels for the ions whereby the ion conductivity is increased and the laminate is easily delaminated at the application of a voltage to the adhesive.
  • an electrically weakable adhesive undesired short-circuiting of the laminate is avoided.
  • the thickness of the continuous web is preferably within the range of 10 -100 ⁇ m, most preferably within the range of 50 - 80 ⁇ m.
  • the porous, continuous web comprises natural and/or synthetic fibers. Fibrous materials are flexible and facilitate the manufacture of webs with a predetermined thickness. Moreover, the use of fibers makes it possible to optimize the porosity of the web to achieve the desired ion conductivity. In this way, lower voltages are needed in order to weaken the adhesive bonds.
  • the porous continuous web is of a fiberglass cloth, which is an easily manufactured, flexible material particularly suitable for the above purposes.
  • the web can also be of a porous paper. Paper requires quite low concentrations of the electrically weakable adhesive and is a relative inexpensive raw material .
  • the web is of an ion exchange textile.
  • ion exchange groups are grafted onto a non-woven textile. In this way, the ion conductive properties of the electrically weakable adhesive are further enhanced whereby lower voltages are needed in order to weaken the adhesive.
  • the ion exchange group grafted onto the non-woven textile can be of a strong or of a weak cat ion exchanger, such as, e.g., sulfonic acid, carboxylic acid, phosphoric acid, phenolic, arsenic or selenonic or of a strong or of a weak anion exchanger, such as, e.g., a quaternary amine, a tertiary amine, a secondary amine, or a primary amine.
  • the ion exchange group is of a cat ion exchanger, most preferably of a sulfonic acid.
  • the porous, continuous web has an ion conductivity similar to the one of the electrically weakable adhesive, e.g. an ion conductivity of above 10 ⁇ 9 S/cm 2 , preferably above 10 ⁇ 7
  • the porous continuous web has an ion conductivity of above 10 ⁇ 5 S/cm 2 , which would make it possible to break adhesive bonds at even lower voltages.
  • the laminate may further comprise a second and/or a third layer of an electrically weakable adhesive which adhesive comprises an ionic compound with a melting point of no more than 120 0 C, provided between the porous continuous web and one or both of the electrically conducting surfaces.
  • adhesive comprises an ionic compound with a melting point of no more than 120 0 C, provided between the porous continuous web and one or both of the electrically conducting surfaces.
  • a method of producing a laminate structure comprising the steps of providing a first and a second electrically conducting surface; applying a layer of an electrically weakable adhesive comprising an ionic compound with a melting point of no more than 120 0 C on one of the conducting surfaces and pressing the conducing surfaces together.
  • the method can also comprise a step of providing a second layer of a conducting, non-electrcally weakable, adhesive on the layer of an electrically weakable adhesive before the step of pressing the conducting surfaces together.
  • the method comprises the steps of providing a solution of an electrically weakable adhesive comprising an ionic compound with a melting point of no more than 120 0 C; impregnating a porous continuous web with said solution whereby an impregnated porous continuous web is achieved; drying said impregnated porous continuous web; placing said dried, impregnated porous continuous web between said first and second electrically conducting surfaces and pressing the electrically conducting surfaces together at an increased temperature.
  • the method of producing a laminate structure according to the invention facilitates the pre- manufacturing of a laminate that can be delaminated by the application of a voltage.
  • the pre-manufacturing of a porous web impregnated with an electrically weakable adhesive facilitates the handling of the adhesive.
  • the method according to the invention makes it easier to apply an even layer of the electrically weakable adhesive between the conductive surfaces and it facilitates the achievement of a predetermined distance between the conductive surfaces.
  • the use of a porous continuous web, impregnated with the electrically weakable adhesive composition makes it possible to press the laminate at higher pressures, since short-circuiting is prevented.
  • the invention further relates to a method for delaminating, i.e. disbonding, the laminate structure described above by applying a voltage across the electrically weakable adhesive composition.
  • the voltage applied may be either alternating or direct depending upon the desired manner of weakening of the electrically weakable adhesive.
  • the voltage may e.g.
  • the laminate with active surfaces, i.e. the conductive surfaces to which the adhesive is bound, of different materials with different electrode potentials, thereby forming an internal battery. If the two active surfaces are connected, e.g. by moving a switch to a position where it connects the two active surfaces, a closed circuit is formed and current will flow through the electrically weakable adhesive thereby causing the adhesive bond to break or to weaken.
  • active surfaces i.e. the conductive surfaces to which the adhesive is bound
  • active surfaces i.e. the conductive surfaces to which the adhesive is bound
  • the laminate i.e. the conductive surfaces to which the adhesive is bound, of different materials with different electrode potentials, thereby forming an internal battery. If the two active surfaces are connected, e.g. by moving a switch to a position where it connects the two active surfaces, a closed circuit is formed and current will flow through the electrically weakable adhesive thereby causing the adhesive bond to break or to weaken.
  • copper and graphite can be used as active surfaces with different potential
  • the invention further relates to a method for preparing an electrically weakable adhesive, comprising the steps of; dispersing a hydrophobic polymer in a water solution forming a dispersion of the polymer; dissolving a hydrophilic ionic compound having a melting point of no more than 120 0 C in the water phase of the solution; and evaporating the water; or dispersing a hydrophilic polymer in a non-polar solvent; dissolving a hydrophobic ionic compound having a melting point of no more than 120 0 C in the non-polar solvent .
  • the method of preparing an electrically weakable adhesive according to the invention can involve further steps, such as evaporation of the solvent, obvious to the skilled person.
  • further additives e.g. solvents and/or surface active materials e.g. soaps or surface active ionic liquids, not mentioned herein but used in the art to stabilize emulsions and dispersion, can also be added to the dispersions and/or solutions.
  • EMIM-ES l-ethyl-3-methyl imidazolium ethylsulfate
  • Lictite Super Epoxy a commercially available epoxy adhesive
  • Three samples were prepared, wherein EMIM-ES was added in an amount of 10%, 20% and 30% by weight of the total adhesive composition.
  • EMIM-ES was added to the binding part of the epoxy in each sample whereupon the hardener was added to the mixture.
  • the composition samples were used to glue aluminium foils together, whereby three laminates were manufactured. Thereafter, the electrical resistance was measured. Table 1 shows the amount EMIM-ES and the resistance for each sample. As can be seen in table 1, the resistance decreases with increasing ionic liquid concentration.
  • l-octyl-3-methylimidazolium chloride (OMI-Cl) and TiO2 particles, with a particle size of 2-3 ⁇ m was added to a commercially available hot melt adhesive (Thermelt 869, supplied by Limgrossen AB) in an amount of 17,6 % OMI-Cl and 20 % TiO2 by weight of the total adhesive composition.
  • the hot melt adhesive was melted in a steel can in a furnace and the additives were added stirring the composition in a blender machine. Thereafter, the adhesive composition was allowed to solidify. The thereby produced composition was used to glue aluminum foils together.
  • the adhesive composition was melted and applied onto two surfaces of aluminum foil whereupon the two aluminum foils were heated and pressed together. In this way, totally six laminates were prepared.
  • a 25 V potential difference was applied across three of the prepared laminates. All of the laminates delaminated, i.e. disbonded, within 5 minutes at the application of 25 V. A 10 V potential difference was applied across the other three laminates. Two of the laminates were delaminated within 5 minutes at the application of 10V.
  • EMIM-ES ECOENG 121, supplied by Solvent Innovation
  • DER 652-PMK65 commercially available epoxy adhesive
  • DOW Dicy (diacyanidamide) and 2-MI (2-methyleimidazole) were dissolved in the EMIM-ES, whereupon the EMIM-ES was added to the epoxy adhesive.
  • the ingredients were mixed for 30 minutes at room temperature. The components were present in the thereby prepared composition in accordance with table 2.
  • composition About 30 ml of the composition was poured onto a (1080) fibreglass web (150 mm by 200 mm, with a thickness of 60 ⁇ m, treated with aminosilane) .
  • the composition was distributed by a doctor blade on the fibreglass web and left to wet it for 30 seconds. After 30 seconds, the excess of the adhesive was scraped off.
  • the fibreglass web impregnated with the adhesive was hardened, hanging in an oven, for 5 minutes at 150 0 C. Thereafter, the impregnated fibreglass web was arranged between two aluminium foils with thicknesses of 40 ⁇ m. The laminate was pressed at about 8 bar and 170 0 C for 7 minutes.
  • EMIM-ES ECOENG 121, supplied by Solvent Innovation
  • the EVA-based adhesive was first heated into a liquid state, whereupon the EMIM-ES was applied stirring the adhesive composition.
  • the composition was applied at a thickness of about 150 ⁇ m between two aluminium foil electrodes. A 25 V potential difference was applied across the electrodes. Delamination was observed within 5 minutes.
  • the electrically weakable adhesive composition prepared in example 5 was used to glue two printed electrodes of carbon together.
  • the printed electrodes were prepared by screen printing Dupont Carbon 7102 in a manual screen printing machine on a double coated kraft board (CKB 185 gsm, supplied by Stora Enso Skoghall AB) .
  • the printed carbon was hardened in an oven at 120 0 C for 5 minutes.
  • the composition described in example 5 was applied on one of the printed carbon electrodes whereafter the electrodes were pressed together forming a laminate structure.
  • a reference laminate was prepared by gluing two aluminum foils together with the super epoxy adhesive without the addition of an ionic liquid.
  • the breaking load was investigated in a tensile testing machine. The maximum forces needed to break the adhesive bonds were measured.
  • Fig. 1 shows how the maximum breaking load varies with different amounts of ionic liquid in the adhesive. As can be seen in fig. 1, the maximum breaking load increases with an increased amount of BMI-Cl, but decreases with an increased amount of EMIM-ES.
  • the breaking load is less than the reference with a small amount of BMIM- Cl, but on the same level as the reference at a higher amount of BMIM-Cl (15 %) .
  • the breaking load is a lot higher than the reference with a small amount of EMIM-ES, (5 %) but lower than the reference with a high amount of EMIM-ES (15 %) .
  • EMIM-ES to the adhesive makes it possible to achieve a three-folded increase of the breaking load.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne une composition adhésive pouvant être fragilisée de façon électrochimique et possédant des propriétés adhésives pour assurer une liaison adhésive à une surface électroconductrice et des propriétés conductrices d'ions suffisantes pour permettre de fragiliser ladite liaison adhésive en appliquant une tension à travers la composition adhésive, où ladite composition comprend au moins un composé ionique en quantité suffisante pour lui attribuer lesdites propriétés conductrices d'ions, et où ledit composé ionique a un point de fusion inférieur à 120 ºC.
PCT/SE2007/050401 2006-06-05 2007-06-05 Composition adhésive pouvant être fragilisée de façon électrochimique WO2007142600A1 (fr)

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008150228A1 (fr) * 2007-06-05 2008-12-11 Stora Enso Ab Structure de stratifié utilisant un adhésif pouvant être fragilisé de manière électrochimique
WO2008150227A1 (fr) * 2007-06-05 2008-12-11 Stora Enso Ab Adhésif pouvant être fragilisé de manière électrochimique et structure stratifiée
WO2010093319A1 (fr) * 2009-02-10 2010-08-19 Lennart Wihk Dispositif destiné à être fixé sur la peau
WO2011159391A1 (fr) * 2010-06-15 2011-12-22 Fluidic, Inc. Pile métal-air à hydrophobie ajustée
CN104212394A (zh) * 2014-09-11 2014-12-17 中国科学院长春应用化学研究所 一种室温固化环氧树脂胶黏剂及其制备方法
US10800956B2 (en) 2015-02-27 2020-10-13 Henkel Ag & Co. Kgaa Debondable reactive hot melt adhesives
CN113136159A (zh) * 2021-04-27 2021-07-20 西南科技大学 一种通电可按需剥离的环氧结构胶黏剂的制备及使用方法
WO2021259594A1 (fr) 2020-06-22 2021-12-30 Henkel Ag & Co. Kgaa Composition adhésive pouvant être décollée électrochimiquement
EP4050040A1 (fr) 2021-02-26 2022-08-31 Henkel AG & Co. KGaA Composition adhésive durcissable monocomposant (1k)
EP4067401A1 (fr) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Composition adhésive durcissable à deux composants (2k)
WO2022218630A1 (fr) 2021-04-14 2022-10-20 Henkel Ag & Co. Kgaa Structure détachable à base d'un adhésif sensible à la pression à base de solvant (psa)
EP4332190A1 (fr) 2022-09-05 2024-03-06 Henkel AG & Co. KGaA Adhesif autocollant a base de solvant decollable (psa)

Citations (3)

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US5100494A (en) * 1989-09-05 1992-03-31 Hughes Aircraft Company Structural bonding and debonding system
WO1997042637A1 (fr) * 1996-05-08 1997-11-13 Rexam Graphics, Incorporated Polymeres electroconducteurs a surface anti-adhesives
WO2001005584A1 (fr) * 1999-07-14 2001-01-25 Eic Laboratories, Inc. Materiaux decollables electriquement

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100494A (en) * 1989-09-05 1992-03-31 Hughes Aircraft Company Structural bonding and debonding system
WO1997042637A1 (fr) * 1996-05-08 1997-11-13 Rexam Graphics, Incorporated Polymeres electroconducteurs a surface anti-adhesives
WO2001005584A1 (fr) * 1999-07-14 2001-01-25 Eic Laboratories, Inc. Materiaux decollables electriquement

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008150228A1 (fr) * 2007-06-05 2008-12-11 Stora Enso Ab Structure de stratifié utilisant un adhésif pouvant être fragilisé de manière électrochimique
WO2008150227A1 (fr) * 2007-06-05 2008-12-11 Stora Enso Ab Adhésif pouvant être fragilisé de manière électrochimique et structure stratifiée
WO2010093319A1 (fr) * 2009-02-10 2010-08-19 Lennart Wihk Dispositif destiné à être fixé sur la peau
WO2011159391A1 (fr) * 2010-06-15 2011-12-22 Fluidic, Inc. Pile métal-air à hydrophobie ajustée
US8808929B2 (en) 2010-06-15 2014-08-19 Cody A. FRIESEN Metal-air cell comprising an electrolyte with a room temperature ionic liquid and hygroscopic additive
CN104212394A (zh) * 2014-09-11 2014-12-17 中国科学院长春应用化学研究所 一种室温固化环氧树脂胶黏剂及其制备方法
US10800956B2 (en) 2015-02-27 2020-10-13 Henkel Ag & Co. Kgaa Debondable reactive hot melt adhesives
WO2021259594A1 (fr) 2020-06-22 2021-12-30 Henkel Ag & Co. Kgaa Composition adhésive pouvant être décollée électrochimiquement
EP4050040A1 (fr) 2021-02-26 2022-08-31 Henkel AG & Co. KGaA Composition adhésive durcissable monocomposant (1k)
WO2022179825A1 (fr) 2021-02-26 2022-09-01 Henkel Ag & Co. Kgaa Composition adhésive durcissable à un constituant (1k)
EP4067401A1 (fr) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Composition adhésive durcissable à deux composants (2k)
WO2022207300A1 (fr) 2021-03-30 2022-10-06 Henkel Ag & Co. Kgaa Composition adhésive durcissable à deux composants (2k)
WO2022218630A1 (fr) 2021-04-14 2022-10-20 Henkel Ag & Co. Kgaa Structure détachable à base d'un adhésif sensible à la pression à base de solvant (psa)
CN113136159A (zh) * 2021-04-27 2021-07-20 西南科技大学 一种通电可按需剥离的环氧结构胶黏剂的制备及使用方法
EP4332190A1 (fr) 2022-09-05 2024-03-06 Henkel AG & Co. KGaA Adhesif autocollant a base de solvant decollable (psa)
WO2024052121A1 (fr) 2022-09-05 2024-03-14 Henkel Ag & Co. Kgaa Adhésif sensible à la pression (psa) à base de solvant décollable

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